KR101296222B1 - Imprint Apparatus And Method for Imprinting Using the Same - Google Patents

Abstract

The present invention relates to an imprint apparatus and an imprint method using the same, which minimizes the presence of particles and air traps between the film and the stamp-substrate assembly so that uniform pressurization is made, thereby forming a uniform residual film. An imprint apparatus according to the present invention comprises: a chamber portion in which a chamber is formed; A stage installed in the chamber of the chamber, the substrate-resin-stamp assembly loaded on an upper surface thereof; A static electricity generating member installed on the upper side of the stage so as to be relatively movable, and electrically adsorbing and removing particles from the substrate on a substrate-resin-stamp assembly placed on an upper surface of the stage by being electrically connected to an external power source; A film applied to the upper surface of the substrate-resin-stamp assembly loaded on the stage to pressurize the substrate-resin-stamp assembly, and installed to relatively move horizontally on the upper side of the stage; And an air trap removing member which is in close contact with the upper surface of the film covered on the upper surface of the sieve and removes the air layer remaining between the film and the substrate-resin-stamp composite while the film moves relative to the stage.

Description

Imprint Apparatus And Method for Imprinting Using the Same}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an imprint apparatus and an imprint method used for manufacturing a flat panel display element, and more particularly, to an imprint apparatus for patterning a substrate for a flat panel display element and an imprint method using the same.

In a conventional semiconductor manufacturing process or a manufacturing process for flat panel display devices, patterning for selectively exposing a substrate for selective etching or deposition is performed by an exposure process using a photoresist or photomask. . However, there is a problem that the exposure machine is expensive and the surrounding process is very complicated, so that a process of replacing the exposure process is emerging, and in recent years, an imprint for patterning using a flat stamp has been in the spotlight.

The imprint apparatus performing the imprint process loads a substrate coated with a resin inside the chamber, bonds the stamp onto the substrate, and then applies a predetermined pressing force to the stamp and the substrate so that the surface of the substrate is etched. And transferring the pattern of the non-etched region and curing the pattern transferred to the substrate side.

The pressurization process of the imprint process has a great influence on the residual film and the pattern formation. In general, as the pressing force increases, the thickness of the residual film decreases, the pattern of the high aspect ratio can be transferred, and the uniform pressing force over the entire area serves to increase the uniformity of the residual film. Uniform residual film is the most important variable in the subsequent residual removal process (dry and wet).

Conventional imprint apparatuses can be classified into mechanical pressurization, fluid pressurization, film pressurization and the like according to the method of pressing the substrate and the stamp together. Mechanical pressurization is a method in which the substrate and the stamp are bonded to each other and then pressurized the substrate and the stamp by a mechanical force, and the fluid pressurization type uses a fluid as disclosed in Korean Patent Publication No. 0906445 (registered on June 30, 2009). By pressing the insulating layer and the stamper of the substrate to each other. In addition, the film pressurization type is a method of pressing the substrate and the stamp and then covering the film thereon and injecting air or nitrogen gas to pressurize at the pressure, and thus, the configuration is very simple and easily obtains the desired pressure.

However, when pressing the stamp-substrate assembly using the film pressurized imprint apparatus as described above, particles exist between the stamp-substrate assembly and the film or air traps remain between the film and the surface. Air layer formed) may be present, in which case a problem arises in that an uneven residual film is formed due to uneven pressure.

The present invention is to solve the above problems, an object of the present invention is to minimize the presence of particles and air trap between the film and the stamp-substrate bonded to achieve a uniform pressure, thereby forming a uniform residual film An imprint apparatus and an imprint method using the same are provided.

According to one category of the present invention for achieving the above object, the chamber portion is formed; A stage installed in the chamber of the chamber, the substrate-resin-stamp assembly loaded on an upper surface thereof; A static electricity generating member installed on the upper side of the stage so as to be relatively movable, and electrically adsorbing and removing particles from the substrate on a substrate-resin-stamp assembly placed on an upper surface of the stage by being electrically connected to an external power source; An imprint apparatus is provided comprising a film covered on an upper surface of a substrate-resin-stamp assembly loaded on the stage to pressurize the substrate-resin-stamp assembly.

According to one aspect of the present invention, the imprint apparatus of the present invention is installed to relatively move horizontally on the upper side of the stage, and closely adheres to the upper surface of the film covered on the upper surface of the substrate-resin-stamp assembly. It may further comprise an air trap removing member for removing the air layer remaining between the substrate-resin-stamp composite and the film while moving relative.

According to another category of the present invention, there is provided an imprinting method using an imprint apparatus, comprising the steps of: (a) loading a substrate-resin-stamp composite onto a stage in the chamber portion with the chamber portion open; (b) closing the chamber portion; (c) adsorbing particles on the substrate-resin-stamp assembly by moving the electrostatic generating member relative to the upper side of the substrate-resin-stamp assembly; (d) adhering a film to an upper surface of said substrate-resin-stamp composite; (e) injecting gas into the chamber to press the substrate-resin-stamp assembly through the film; And, (f) curing the resin pattern transferred onto the substrate by the stamp.

According to one aspect of the imprinting method according to the present invention, the substrate-resin-stamp adhesive and the film are moved by relatively moving the air trap removing member in close contact with the upper surface of the film between the steps (d) and (e). It is preferable to further perform the step of removing the air layer remaining in between.

According to this invention, the film can be removed from the upper surface of the substrate-resin-stamp assembly using the electrostatic generating member before the film is brought into close contact with the substrate-resin-stamp assembly. It may be brought into close contact with the stamp adherent to provide a uniform pressing force over the entire surface when performing the imprint process.

In addition, the air trap remaining between the substrate-resin-stamp composite and the film can be removed by using the air trap removing member while the substrate-resin-stamp composite and the film are in close contact. It is possible to provide an overall uniform pressing force between the resin-stamp binder and the film.

Therefore, the remaining film of the resin can be uniformly formed on the surface of the substrate, thereby minimizing the occurrence of defects and improving the quality of the product.

1 is a plan view schematically showing the configuration of an imprint apparatus according to an embodiment of the present invention.
2A and 2B are sectional views taken along the line II of FIG. 1, FIG. 2A shows an open state of the chamber, and FIG. 2B shows a closed state of the chamber.
3 is a cross-sectional view taken along the line II-II of FIG. 1.
Figure 4 is a view similar to Figure 3, a cross-sectional view showing a particle removal process using an electrostatic generating member.
FIG. 5 is a view similar to FIG. 3, illustrating a particle removal process using an air trap removing member.
6 is a flowchart sequentially illustrating an imprint method according to a preferred embodiment of the present invention.

Hereinafter, exemplary embodiments of an imprint apparatus and an imprint method using the same according to the present invention will be described in detail with reference to the accompanying drawings.

First, referring to FIGS. 1 to 3, an imprint apparatus according to a preferred embodiment of the present invention is provided with a chamber portion 10 in which a chamber 13 is formed, and is installed in a chamber 13 of the chamber portion 10 and has an upper surface. And a stage 20 on which the substrate-resin-stamp coalescing body (hereinafter referred to as material) 1 is loaded, and on the upper side of the stage 20 so as to be movable relative to particles. An electrostatic generating member 30 which is adsorbed and removed, a film 50 which is covered on an upper surface of the material 1 loaded on the stage 20 and becomes a medium for uniformly pressing the material 1, and the material An air trap that closely contacts the upper surface of the film 50 covered by the upper surface of (1) and removes an air trap remaining between the material 1 and the film 50 while moving relative to the stage 20. It consists of a configuration including a removal member (40).

The stamp constituting the material 1 is a component that transfers a desired pattern to a resin applied on the substrate (for example, a substrate of a flat panel display device), which is to be transferred to a lower surface in contact with the resin. The pattern is engraved. The material 1 may be formed by attaching a stamp to a substrate after the resin is applied to the substrate from the outside of the chamber part 10. Alternatively, a separate resin coating device may be formed in a state where the substrate is seated on the stage 20. May be applied onto the substrate and then stamped thereon to form a coalescing of the substrate-resin-stamp.

The chamber part 10 is composed of an upper chamber case 11 and a lower chamber case 12 configured to be movable relative to the upper chamber case 11 in the up and down direction under the upper chamber case 11. do. Each of the upper chamber case 11 and the lower chamber case 12 has a chamber 13 in which the lower and upper surfaces are open, respectively, when the upper chamber case 11 and the lower chamber case 12 are coupled to each other. To form a closed space. Between the contact surface of the upper chamber case 11 and the lower chamber case 12, it is preferable that a sealing material 15 made of a flexible material such as rubber or silicon to prevent the leakage of air. The upper chamber case 11 or the lower chamber case 12 is closed or opened while moving in the vertical direction by a separate driving device made of a ball screw or a pneumatic cylinder. Although not shown in the drawing, the chamber unit 10 is connected to a vacuum pump (not shown) in a conventional manner and configured to convert the chamber 13 into a vacuum or atmospheric pressure state by driving the vacuum pump. . In addition, although not shown in the drawing, the chamber part 10 is connected to an external gas supply device and receives a gas for pressurizing the film from the gas supply device.

The imprint operation is performed while the upper chamber case 11 and the lower chamber case 12 are closed, and in the open state, the material 1 is loaded on the stage 20 or the material 1 is placed on the stage 20. Unloading and loading and unloading of the film 50 is in progress.

The stage 20 is a part on which the material 1 is placed and supported. The stage 20 is formed of a flat surface to provide sufficient flatness, and vacuum adsorbs the material 1 so that the material 1 does not move. A plurality of vacuum holes (not shown) may be formed. The stage 20 is configured to move up and down a predetermined distance by the elevating driver 25. The lifting driving unit 25 may be configured using a known linear motion system such as a pneumatic cylinder or a ball screw motor.

The electrostatic generating member 30 is formed in an elongated bar shape, and both ends thereof are configured to horizontally reciprocate along a pair of guide members 60 installed at both sides of the chamber 13 in the chamber part 10. Although not shown in the drawings, a driving device for horizontally reciprocating the static electricity generating member 30 along the guide member 60 may be a linear motion system using a linear motor, a linear motion system using a motor-ballscrew, or a pulley. And a linear motion system using a belt-motor and a well-known linear motion system such as a pneumatic cylinder can be used.

The electrostatic generating member 30 is connected to an external power source, and has an electrical property when a voltage is applied from the outside, and thus the electrostatic generating member 30 is spaced apart from the upper surface of the material 1 by a predetermined interval. When passing, the particles on the material 1 stick to the electrostatic generating member 30 so that the particles can be removed.

The air trap removing member 40 is configured to horizontally reciprocate on the upper side of the film 50 to move in close contact with the upper surface of the film 50 and the lower surface of the material 1 and the lower surface of the film 50. The air trap remaining in the air (air trap) is pushed out to remove the action. Both ends of the air trap removing member 40 are also connected to the guide member 60 and preferably configured to move horizontally while being guided by the guide member 60.

The air trap removing member 40 may be made of a long rectangular bar or the like, but may also be configured using a roller that moves in rolling along the upper surface of the film 50 as in this embodiment. The driving device for horizontally reciprocating the air trap removing member 40 may also be configured using a well-known linear motion system similar to the driving device of the electrostatic generating member 30.

The air trap removing member 40 is preferably configured to be able to adjust the vertical height according to the thickness of the material (1). For example, the air trap removing member 40 is installed to move up and down a predetermined distance by a pneumatic cylinder (not shown) installed on a block (not shown) that is movable along the guide member 60, When the thickness of the material 1 is relatively thin, it moves downward, and when the thickness of the material 1 is relatively thick, it moves upward and the height can be adjusted.

The film 50 has a width in the horizontal direction greater than the size of the chamber part 10 in the drawings (see FIGS. 2A and 2B), so that both ends of the film 50 are closed when the upper chamber case 11 and the lower chamber case 12 are closed. The sealing material 15 is fixed while maintaining a constant tension. The film 50 is supplied replaced with a new one every imprint process by a film feeder (not shown).

The method of imprinting the etched and non-etched regions on the substrate of the material 1 using the imprint apparatus of the present invention configured as described above comprises the following steps.

First, referring to FIG. 6, in the imprint method of the present invention, the material 1 is loaded onto the stage 20 in the chamber part 10 with the chamber part 10 open, and an upper side of the material 1 is provided. In step S1 of loading the film 50 into the air (S1), closing the chamber part 10 (S2), and moving the electrostatic generating member 30 to the upper side of the material 1 relative to the material (1). Adsorbing and removing the particles on the upper surface of the material 50 (S3), adhering the film 50 to the upper surface of the material 1 (S4), and removing the air trap member 40 from the upper surface of the film 50 Relatively removing the air layer remaining between the upper surface of the material 1 and the film 50 (S5), and injecting gas into the chamber part 10 to inject the gas into the film 50. Pressing the material 1 through the imprinting step (S6), and curing the resin pattern transferred on the substrate by the stamp (S7).

The process of performing the imprint method of the present invention in each step will be described in more detail as follows.

First, as shown in FIG. 2A, the material 1 is loaded on the stage 20 in a state where the upper chamber case 11 and the lower chamber case 12 of the chamber part 10 are opened. And the film 50 is supplied to the upper side of the material 1 on the said stage 20 (step S1). The film 50 may be supplied before the material 1 is loaded onto the stage 20. In this case, the film 50 and the stage 20 may be provided to secure a space for the material 1 to be loaded. Make sure you have enough clearance.

Subsequently, the upper chamber case 11 or the lower chamber case 12 moves upward and downward to close the chamber portion 10 (step S2). At this time, both ends of the film 50 are fixed by the sealing material 15 between the upper chamber case 11 and the lower chamber case 12.

When the chamber part 10 is closed, a vacuum pump (not shown) operates to bring the inside of the chamber part 10 into a vacuum state.

Then, a voltage is applied to the electrostatic generating member 30, and the electrostatic generating member 30 moves horizontally to the opposite side through the space between the film 50 and the material 1 as shown in FIG. S3). At this time, the particles present on the upper surface of the material 1 is stuck to the static electricity generating member 30 by static electricity. Of course, if particles are also deposited on the lower surface of the film 50 in this process, the particles of the film 50 can also be removed by sticking to the electrostatic generating member 30.

When the particles are removed from the upper surface of the material 1 by the electrostatic generating member 30 as described above, as shown in FIG. 5, the stage 20 is raised by the operation of the lifting driving unit 25, so that the material 1 ) Is attached to the film 50 (step S4). Subsequently, the air trap removing member 40 moves horizontally along the upper surface of the film 50 while being in close contact with the upper surface of the film 50, and remains between the upper surface of the material 1 and the film 50. The air is pushed out of the air trap and removed (step S5).

Then, the gas for the imprint process (for example, air or nitrogen gas) is supplied into the chamber of the chamber part 10 (step S6). The film 50 pressurizes the material 1 while being pressurized by the pressure of the gas supplied into the chamber 13. At this time, since the particles are almost completely not present on the upper surface of the material (1) and the air trap is also removed between the material (1) and the film 50, the film 50 is the entire surface of the material (1) Pressurize to a uniform pressure over). Thus, the remaining film formation of the resin transferred to the substrate is made uniform.

After performing the imprint process by pressing the film 50 as described above, the UV curing apparatus (not shown) irradiates ultraviolet rays (UV) on the upper side of the stage 20 or the heating apparatus heats the material 1 A curing process of curing is performed (step S7).

When the curing is completed after a certain time, the chamber part 10 is opened, and a series of processes are completed while the film 50 and the material 1 are unloaded.

Meanwhile, in the above-described embodiment, the static electricity generating member 30 and the air trap removing member 40 are illustrated as horizontally moving in one direction only, but the particle removal and air are reciprocated once or several times as necessary. You can also perform trap removal.

Embodiments of the imprint apparatus and the imprint method according to the present invention described above are presented for illustrative purposes only to help understanding of the present invention, but the present invention is not limited thereto, and those skilled in the art to which the present invention pertains Various modifications and implementations may be made within the scope of the technical idea as set forth in the appended claims.

1: Material (substrate-resin-stamp coalescing body) 10: Chamber part
11: upper chamber case 12: lower chamber case
13: chamber 15: sealing material
20: stage 25: lifting drive unit
30: static electricity generating member 40: air trap removing member
50: film 60: guide member

Claims (8)

A chamber portion 10 in which a chamber is formed;
A stage 20 installed in the chamber of the chamber part 10 and having a substrate-resin-stamp assembly loaded on an upper surface thereof;
It is installed on the upper side of the stage 20 so as to be relatively movable, and electrically connected to an external power source to adsorb and remove particles by static electricity on a substrate-resin-stamp assembly placed on an upper surface of the stage 20. An electrostatic generating member 30;
And a film (50) covering the top surface of the substrate-resin-stamp assembly loaded on the stage (20) to press the substrate-resin-stamp assembly. The method of claim 1, wherein the imprint apparatus is installed so as to horizontally move relative to the upper side of the film 50, in close contact with the upper surface of the film 50 covered on the upper surface of the substrate-resin-stamp assembly And an air trap removing member (40) for removing the air layer remaining between the substrate-resin-stamp assembly and the film (50) while moving relative to the stage (20). The apparatus of claim 2, wherein the imprint apparatus further includes a lifting unit configured to lift and lower the air trap removing member 40 between a first position contacting the film 50 and a second position spaced apart from the film 50. Imprint apparatus, characterized in that. The imprint apparatus according to claim 2, wherein the air trap removing member (40) is a roller for rolling along the upper surface of the film (50). According to claim 2, wherein a pair of guide members 60 for guiding the horizontal movement of the electrostatic generating member 30 and the air trap removing member 40 in both sides of the chamber portion 10 is installed side by side An imprint apparatus characterized by the above-mentioned. (a) loading the substrate-resin-stamp assembly onto the stage 20 in the chamber portion 10 with the chamber portion 10 open;
(b) closing the chamber portion 10;
(c) adsorbing and removing particles on the substrate-resin-stamp assembly by moving the electrostatic generating member 30 relative to the upper side of the substrate-resin-stamp assembly;
(d) adhering a film to an upper surface of said substrate-resin-stamp composite;
(e) injecting gas into the chamber part 10 to pressurize the substrate-resin-stamp assembly through the film 50; And,
(f) hardening a resin pattern transferred onto said substrate by said stamp. An imprinting method using the imprint apparatus according to any one of claims 1 to 5, characterized by the above-mentioned. The substrate-resin-stamp assembly and the film of claim 6, wherein the air trap removing member 40 is relatively moved between the steps (d) and (e) in a state of being in close contact with the upper surface of the film 50. And further removing the remaining air layer in between. 8. The thickness of the substrate-resin-stamp assembly according to claim 7, wherein the air trap removing member 40 is moved upwards or downwards before the air trap removing member 40 is brought into close contact with the upper surface of the film 50. And adjusting the height of the air trap removing member (40) to correspond to the imprint method.

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