KR101288390B1 - Lamp with Ultra Violet Light Emitting Diode - Google Patents

Abstract

The present invention relates to a lamp using an ultraviolet light emitting diode, and to provide a lamp using an ultraviolet light emitting diode that can be used efficiently, durable, environmentally friendly and semi-permanent. Lamp using the ultraviolet light emitting diode of the present invention includes a PCB substrate, UVLED chip, diffuser plate, radiation angle lens, converter and housing, the diffusion plate and the radiation angle lens is sanded with a predetermined pattern. UVLED chips are mounted on any one surface of a PCB substrate and a plurality of UV light emitting diodes emitting ultraviolet light are formed as chips. The diffusion plate is formed to be spaced apart from the UVLED chip in a direction in which ultraviolet rays are emitted, thereby diffusing the ultraviolet light of the point light source emitted by the UVLED chip into the ultraviolet light of the surface light source. The radiation angle lens is formed to be spaced apart from the diffusion plate in a direction in which ultraviolet rays are emitted to extend the radiation angle at which the ultraviolet rays of the surface light source are radiated. The converter converts AC power to DC power suitable for driving UVLED chips. The housing encloses the PCB substrate, UVLED chip, diffuser plate, radial lens and converter.

Description

Lamp with Ultra Violet Light Emitting Diode

The present invention relates to a lamp, and more particularly, to a lamp using an ultraviolet light emitting diode having a sterilization and exposure function using an ultraviolet light emitting diode (UVLED).

Sunlight is composed of visible, ultraviolet and infrared light. Ultraviolet rays play a beneficial role in synthesizing and disinfecting vitamin D in the body, and also cause skin aging, skin cancer, drying, dermatitis, fine lines, blemishes, and freckles. Ultraviolet rays transmitted directly from the sun to the earth are classified into three types: UV-A (315-380 nm), UV-B (280-315 nm), and UV-C (10-280 nm). Ultraviolet light in the form of UV-A damages plants, UV-B light can cause damage to plant tissues and human skin cancer, and UV-C light can burn bacteria and viruses to kill them. .

UV sterilization and exposure lamps are generally used Hg lamps. However, the light emitted through the Hg lamp exhibits multiple spectra with a wide wavelength band. To select the required wavelength among the multiple spectra, a filter must be used so that only the corresponding wavelength band is transmitted and the remaining wavelength bands are not transmitted. The filter is formed by applying or coating a substance to the irradiated region, which is a complicated process. In addition, the Hg lamp generates a lot of heat, and as time goes by, the usage of the Hg lamp causes a problem that the material used as the filter melts and falls or the color of the light receiving part is changed. There is a problem that can be caused. In addition, Hg lamps have a life span of 1,000 hours to 20,000 hours (generally 2,000 hours), requiring periodic lamp replacement, and a long on / off cycling response time for luminescent operation. There is a problem to wait a certain time after turning on.

Accordingly, an object of the present invention is to solve the problems of the prior art as described above, and to provide a lamp using a highly efficient and robust ultraviolet light emitting diode.

Another object of the present invention is to provide a lamp using an ultraviolet light emitting diode that can be used environmentally and semi-permanently.

In order to achieve the above object, the present invention includes a PCB substrate, a UVLED chip, a diffusion plate, a radiation angle lens, a converter and a housing, wherein the diffusion plate and the radiation angle lens is sanded with a predetermined pattern. A lamp using an ultraviolet light emitting diode is provided. UVLED chips are mounted on any one surface of the PCB substrate and formed of a plurality of ultraviolet light emitting diodes that emit ultraviolet light. The diffusion plate is formed to be spaced apart from the diffusion plate in a direction in which the ultraviolet light is emitted to diffuse the ultraviolet light of the point light source emitted by the UV LED chip into the ultraviolet light of the surface light source. The radiation angle lens is formed to be spaced apart from the diffusion plate in a direction in which the ultraviolet rays are emitted to extend the radiation angle at which the ultraviolet rays of the surface light source are radiated. The converter converts AC power to DC power suitable for driving UVLED chips. The housing surrounds the PCB substrate, UVLED chip, diffuser plate, radial lens and converter.

In the lamp using the ultraviolet light emitting diode according to the present invention, the diffusion plate and the radiation angle lens may have a rectangular pattern pattern.

In the lamp using the ultraviolet light emitting diode according to the present invention, the UVLED chip, the diffusion plate and the radiation angle lens may be installed symmetrically in both directions of the PCB substrate to emit the ultraviolet rays.

In the lamp using the ultraviolet light emitting diode according to the present invention, the UVLED chip can emit the same wavelength.

In the lamp using the ultraviolet light emitting diode according to the present invention, the UVLED chip can emit different wavelengths.

In the lamp using the ultraviolet light emitting diode according to the present invention, the UVLED chip may be mounted on the PCB substrate in a series structure, parallel structure or a series-parallel structure.

In the lamp using the ultraviolet light emitting diode according to the present invention, the diffusion plate and the radiation angle lens may be integrally formed.

In the lamp using the ultraviolet light emitting diode according to the present invention, the housing may be formed in a concave-convex structure or a fin structure.

The present invention uses an ultraviolet LED chip that emits a single spectrum rather than an Hg lamp in a lamp with sterilization and exposure function, such lamp does not require a filter to filter out only a single spectrum, and on / off cycling response for light emission operation. The efficiency is very high due to the short time, and it is packaged by semiconductor packaging technology so that it is hard to be broken and is robust.

In addition, since the heavy metal regulatory material is not used in the lamp, it is eco-friendly and the life of the UV light emitting diode is 100,000 hours (generally 50,000 hours), so it can be used semi-permanently.

1 is a view showing a lamp using an ultraviolet light emitting diode according to an embodiment of the present invention.
2 to 7 are views showing the pattern of the diffusion plate and the radiation angle lens in the lamp of FIG.
FIG. 8 is a view illustrating a sanding process of a diffuser plate and a radiation angle lens in the lamp of FIG. 1.
9 is a view showing a housing in the lamp of FIG.

Hereinafter, with reference to the accompanying drawings, preferred embodiments of the present invention for achieving the above object will be described in detail. In the following description, only parts necessary for understanding the operation according to the embodiment of the present invention will be described, it should be noted that the description of other parts will be omitted so as not to distract from the gist of the present invention.

The terms and words used in the present specification and claims should not be construed as limited to ordinary or dictionary meanings and the inventor is not limited to the meaning of the terms in order to describe his invention in the best way. It should be interpreted as meaning and concept consistent with the technical idea of the present invention. Therefore, the embodiments described in the specification and the drawings shown in the drawings are only one of the most preferred embodiments of the present invention, and do not represent all of the technical idea of the present invention, which can be replaced at the time of the present application It should be understood that there may be various equivalents and variations.

1 is a view showing a lamp using an ultraviolet light emitting diode according to an embodiment of the present invention. 2 to 7 are views showing the pattern of the diffusion plate and the radiation angle lens in the lamp of FIG. FIG. 8 is a view illustrating a sanding process of a diffuser plate and a radiation angle lens in the lamp of FIG. 1. 9 is a view showing a housing in the lamp of FIG.

Lamp 10 using an ultraviolet light emitting diode according to an embodiment of the present invention, as shown in Figures 1 to 9, the PCB substrate 100, UVLED chip 200, diffuser plate 300, the radiation angle lens ( 400, the converter 500, and the housing 600, the diffusion plate 300 and the radial lens 400 are sanded with a predetermined pattern.

When power is applied to the lamp 10, the plurality of UVLED chips 200 mounted on the PCB substrate 100 emits ultraviolet rays, and the emitted ultraviolet rays reach the diffusion plate 300. At this time, the ultraviolet light of the point light source emitted from the UVLED chip 200 is diffused into the ultraviolet light of the surface light source in the diffuser plate 300, and the divergence angle is extended through the radiation angle lens 400 to the outside. As such, the ultraviolet rays of the surface light source emitted to the outside perform sterilization and exposure functions on the object.

The PCB substrate 100 may be mounted with a plurality of UVLED chips 200 arranged on one surface thereof, and a structure for generating heat on the other surface thereof. In addition, the UVLED chips 200 are spaced apart at predetermined intervals in the direction of emitting ultraviolet rays to form the diffusion plate 300 and the radiation angle lens 400. The housing 600 is formed to seal the spaced space between the PCB substrate 100 and the diffusion plate 300 and to support the diffusion plate 300 and the radial lens 400. In this case, the PCB substrate 100 may be formed of an epoxy resin substrate, a composite base material substrate, a flexible base material substrate, a ceramic base material substrate, and a metal corrugated base, depending on the material. Material) can be divided into substrates. In addition, the PCB substrate 100 may be classified into a rigid substrate (RIGID PCB), a flexible substrate (FLEXIBLE PCB) and a rigid substrate (RIGID-FLEXIBLE PCB) according to its characteristics. A printed circuit pattern, which is a passage for transmitting an electrical signal, is formed on the PCB substrate 100, and the UVLED chip 200 is mounted on the PCB substrate 100 according to the formed printed circuit pattern.

The UVLED chip 200 is mounted on any one surface of the PCB substrate 100, and a plurality of UV light emitting diodes emitting UV light are formed as chips. In this case, the UVLED chip 200 is a semiconductor device manufactured by forming an ultraviolet light emitting diode in the form of a semiconductor chip, and the UVLED chip 200 is a position and arrangement structure of the UVLED chip 200 according to a printed circuit pattern of the PCB substrate 100. It can be arranged in a vertical structure, the left and right random structure and the number of the UVLED chip 200 can be added or subtracted so that the overall output can be adjusted according to the power of the output UVLED chip 200. In addition, the UVLED chip 200 may be mounted in a series structure, a parallel structure, or a serial / parallel structure according to the printed circuit pattern of the PCB substrate 100. This may be selected according to the designer's intention for the most effective UVLED chip 200 arrangement with respect to the sterilization and exposure of the lamp 10.

The UVLED chip 200 may be classified into a chip emitting long wavelength (UV-A), medium wavelength (UV-B) and short wavelength ultraviolet (UV-C) according to the wavelength emitted by the UVLED chip 200. UV-A has a wavelength of 320-360 nm, UV-B has a wavelength of 280-320 nm, and UV-C has a wavelength of 250-280 nm.

The plurality of UVLED chips 200 are arranged according to the printed circuit pattern of the PCB substrate 100 to form an array of UVLED chips 200. The UVLED chip 200 array may uniformly arrange the UVLED chips 200 emitting the same wavelength or mix the UVLED chips 200 emitting the different wavelengths. In this case, when a plurality of UVLED chips 200 emitting the same wavelength are uniformly arranged, only some of the plurality of UVLED chips 200 arranged on the PCB substrate 100 are driven to be sterilized and exposed. Power can be saved or the intensity of the wavelength can be adjusted. In addition, when a plurality of UVLED chips 200 emitting different wavelengths are arranged to be mixed, only the UVLED chips 200 emitting the necessary wavelengths among the plurality of UVLED chips 200 arranged on the PCB substrate 100. Can be driven. Since the target to be sterilized at each wavelength is different, it can be selected according to the intention of the designer according to the sterilization target.

Meanwhile, the UVLED chip 200 may be manufactured in a SMD (surface mounted device) type or a TO-CAN type according to a packaging structure. In this case, the UVLED chip 200 is preferably used as a sealing material for packaging to use a material capable of securing thermal stability while protecting the embedded UVLED, for example, a silicon-based UV encapsulant. In particular, the UV-encapsulation material of the UV-A band of the silicon-based UV encapsulant may be used an UV encapsulation material having a light transmittance of 80% or more, a refractive index of 1.4 or more, and an adhesion of 130 or more. UV LEDs of the UV-B band may be used an ultraviolet encapsulation material having a light transmittance of 80% or more, a refractive index of 1.45 or more, and an adhesion of 140 or more. In the UV-C band UVLED, an ultraviolet encapsulation material having a light transmittance of 70% or more, a refractive index of 1.5 or more, and an adhesiveness of 140 or more may be used.

The diffusion plate 300 is formed to be spaced apart from the UVLED chip 200 in a direction in which ultraviolet light is emitted, thereby diffusing the ultraviolet light of the point light source emitted by the UVLED chip 200 into the ultraviolet light of the surface light source. That is, the UVLED chip 200 emits the ultraviolet light of the point light source, and the ultraviolet light of the point light source diffuses into the ultraviolet light of the surface light source as it passes through the diffusion plate 300. A diffusion pattern is formed in the diffusion plate 300, and ultraviolet rays of a point light source incident on the diffusion plate 300 are diffused into ultraviolet rays of the surface light source according to the diffusion pattern. The diffusion plate 300 may form various diffusion patterns, and ultraviolet rays are diffused according to the diffusion pattern formed on the diffusion plate 300. In this case, the diffusion plate 300 may be manufactured using a synthetic quartz (Fused quartz or Fused silica), a glass (glass) material in order to prevent ultraviolet diffusion characteristics and deterioration. The diffusion pattern formed on the diffusion plate 300 and the diffusion plate 300 may be formed using any one of laser processing, scratching, and etching methods.

The radiation angle lens 400 is formed to be spaced apart from the diffusion plate 300 in a direction in which ultraviolet rays are emitted to extend the radiation angle at which ultraviolet rays of the surface light source are radiated. As such, the radiation angle lens 400 extends the angle at which ultraviolet rays are radiated to widen the irradiation area of ultraviolet rays. In this case, the radiation angle lens 400 may be manufactured using synthetic quartz, glass polymer, Teflon, special acrylic, or special plastic material to prevent deterioration thereof. In addition, the radial lens 400 may be formed using a laser processing, coating, deposition, scratch, etching method and the like.

The diffusion plate 300 and the radiation angle lens 400 are sanded with a predetermined pattern. In this case, the predetermined pattern of the diffusion plate 300 and the radiation angle lens 400 is to allow the light to be emitted to the outside as much as possible. The role of the diffusion plate 300 and the radiation angle lens 400 in which the diffusion pattern is formed is changed into a surface light source as the point light source emitted from the UVLED chip 200 passes through the diffusion plate 300, and then the diffusion plate 300 again. The light passing through the) passes through the radiation angle lens 400 to widen the irradiation area. In order to maximize the sterilization and exposure function of the lamp 10, the light emitted from the lamp 10 should be evenly distributed. To this end, the illuminance distribution result according to the pattern of the diffuser plate 300 and the radiation angle lens 400 varies according to the shape and pitch size of the pattern, as shown in FIGS. 2 to 7. As a result of illuminance distribution according to the pattern, the illuminance distribution is better in the case of the square type pattern than the circular type. Therefore, the diffusion plate 300 and the radiation angle lens 400 may have a pattern of a square type in order to maximize the sterilization and exposure function of the lamp 10. As shown in FIG. 8, the diffusion plate 300 and the radial lens 400 have a more even distribution of roughness when sanded, thereby sanding the diffusion plate 300 and the radial lens 400. . In this case, (a) in FIG. 8 shows a case where sanding is not performed, and (b) shows a case where sanding is performed.

Meanwhile, the diffusion plate 300 and the radiation angle lens 400 may be integrally formed. In particular, the diffusion plate 300 and the radiation angle lens 400 may be manufactured, respectively, but it is preferable that the diffusion plate 300 and the radiation angle lens 400 are integrally manufactured in order to reduce the number of parts and to lower the price. In this case, when the diffusion plate 300 and the radiation angle lens 400 are integrally manufactured, the diffusion plate 300 and the radiation angle lens 400 may be formed by forming a diffusion pattern on a synthetic quartz material.

The converter 500 converts AC power into DC power suitable for driving the UVLED chip 200. In this case, the converter 500 may be divided into a form included in the inside of the lamp 10 and a form outside the lamp 10. When the converter 500 is included in the lamp 10, the lamp 500 may be replaced as a single body when the lamp 10 is replaced. However, when the converter 500 is outside the lamp 10, the converter 10 may be replaced with the lamp 10. When replacing, it should be a structure for mounting a separate converter (500).

The housing 600 encloses the PCB substrate 100, the UVLED chip 200, the diffusion plate 300, the radiation angle lens 400, and the converter 500. Specifically, when looking at the cross section of the lamp 10, the UVLED chip 200 is mounted on the PCB substrate 100 of the center portion, the diffusion plate 300 and the radial lens 400 is located on the upper portion. The converter 500 is embedded under the PCB substrate 100. As such, the housing 600 supports the PCB substrate 100, the UVLED chip 200, the diffusion plate 300, and the radial lens 400, and has a semi-circular structure or UVLED array packaging so that the converter 500 can be built therein. As a suitable square shape, preferably made of an aluminum material excellent in heat dissipation characteristics, but is not necessarily limited thereto. The housing 600 may be formed of an uneven structure or a fin structure. This is to widen the contact area with the outside air in order to facilitate heat dissipation of the housing 600. In addition, the housing 600 may apply a paint or coating material to the surface in order to increase the heat dissipation effect.

On the other hand, the above-described lamp 10 relates to the structure of the cross-sectional irradiation lamp 10 in which the irradiation direction is one direction, on the other hand, the lamp 10 of the present invention is UVLED chip 200, diffusion plate 300 ) And the radiation angle lens 400 may be symmetrically installed in both directions of the PCB substrate 100 to emit a UV light. This is the form used when irradiating ultraviolet light in both directions or in all directions.

Next, the advantages of the sterilization and exposure method using the lamp 10 according to the embodiment of the present invention as described above will be described.

The UVLED chip 200 is a UV light emitting diode manufactured in the form of a semiconductor chip. Accordingly, there are the following advantages.

Conventional UV-based mercury lamps must use filters to select the required wavelength from the multiple spectra and eliminate the remaining wavelengths. On the other hand, the lamp 10 according to the embodiment of the present invention emits only one spectrum, and because it is possible to emit only the spectrum necessary for the characteristics of the UVLED semiconductor chip, it is not necessary to use a filter. For this reason, the sterilization and exposure method using the lamp 10 according to the embodiment of the present invention does not disperse its power like a mercury lamp according to the prior art, and thus, is more efficient than a mercury lamp.

As described above, the mercury lamp should be filtered to emit only the desired wavelength, so that the sterilization and exposure apparatus using the mercury lamp coats the interior using a thin coating material for filtering. In addition, since the sterilization and exposure apparatus using a mercury lamp generates a lot of heat, the coating materials of the thin film may melt in the sterilization and exposure apparatus to fall into debris and change the color of the light-receiving portion when used for a long time. On the other hand, the lamp 10 using the UVLED does not cause the above-described problem.

Mercury lamps are fragile glass and are inconvenient to handle. UVLEDs, on the other hand, are semiconductors and packaged with semiconductor technology, making them very robust.

Mercury lamps contain mercury and are subject to sanctions and environmental concerns under the Restriction of Hazardous Substances Directive (RoHS), but UVLEDs are environmentally friendly because they do not contain heavy metal regulatory substances.

Mercury lamps have a lifetime of 1,000 to 20,000 hours at 70% output. Typically, mercury lamps have a lifetime of about 2000 hours. UVLEDs, on the other hand, typically have a lifetime of 50,000 hours and may have a lifetime of 100,000 hours. This can be said to have a semi-permanent life.

On / off cycling for turning on the power and for light to emit light also slows the response for mercury lamps, but UVLEDs have the advantage of responding immediately.

The above terms are terms set in consideration of functions in the present invention, which may vary depending on the intention or custom of the producer, and the definitions should be made based on the contents throughout the specification. In addition, in describing the embodiments of the present invention, a lamp using an ultraviolet light emitting diode having a specific shape and structure has been described with reference to the accompanying drawings. However, the present invention may be variously modified and changed by those skilled in the art. And modifications should be construed as falling within the protection scope of the present invention.

10: lamp 100: PCB substrate
200: UV LED chip 300: diffuser plate
400: radial lens 500: converter
600: housing

Claims (8)

PCB substrate;
A plurality of UVLED chips mounted on one surface of the PCB substrate and formed of a chip having an ultraviolet light emitting diode emitting ultraviolet rays;
A diffusion plate formed to be spaced apart from the UVLED chip in a direction in which the ultraviolet light is emitted, and diffusing the ultraviolet light of the point light source emitted by the UVLED chip into the ultraviolet light of the surface light source;
A radiation angle lens formed to be spaced apart from the diffusion plate in a direction in which the ultraviolet rays are emitted to extend the radiation angle at which the ultraviolet rays of the surface light source are radiated;
A converter for converting AC power to DC power to supply the UVLED chip to drive the UVLED chip;
A housing surrounding the PCB substrate, the UVLED chip, the diffusion plate, the radiation angle lens, and the converter;
/ RTI >
The diffuser plate and the radiation angle lens is a lamp using a UV light emitting diode, characterized in that the sanding process having a pattern pattern of the rectangular type. The method of claim 1,
The diffusion plate and the radiation angle lens is a lamp using an ultraviolet light emitting diode, characterized in that a plurality of rectangular pattern pattern is arranged in rows and columns. The method of claim 2,
The UVLED chip, the diffusion plate and the radiation angle lens are installed in both directions of the PCB substrate symmetrical to the ultraviolet light emitting diode, characterized in that to emit the ultraviolet light. 4. The method according to any one of claims 1 to 3,
The UVLED chip is a lamp using an ultraviolet light emitting diode, characterized in that emitting the same wavelength. 4. The method according to any one of claims 1 to 3,
The UVLED chip is a lamp using an ultraviolet light emitting diode, characterized in that it emits different wavelengths. 4. The method according to any one of claims 1 to 3,
The UVLED chip is a lamp using an ultraviolet light emitting diode, characterized in that mounted on the PCB substrate in series or parallel structure or parallel structure. 4. The method according to any one of claims 1 to 3,
The diffusion plate and the radiation angle lens is a lamp using an ultraviolet light emitting diode, characterized in that formed integrally. 4. The method according to any one of claims 1 to 3,
The housing is a lamp using an ultraviolet light emitting diode, characterized in that formed in a concave-convex structure or a fin structure.

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