KR101283484B1 - Pressure-sensitive adhesive tape for dicing semiconductor wafer - Google Patents

Abstract

PURPOSE: An adhesive tape for a semiconductor is provided to have excellent picking up performance in the thin semiconductor, to minimize generation of burrs, and to minimize defects of a product. CONSTITUTION: An adhesive tape for a semiconductor dicing comprises a base film (10), an adhesive film (20) formed on the base film, and a protection film (30) formed on the adhesive film. The base film is formed by mixing 5-200 parts by weight or 10-150 parts by weight of one polymer selected from a homopolypropylene resin, block copolymerized polypropylene, terpolypropylene, an ethylene resin, an ethylene-acid vinyl copolymer resin, or an ethylene-propylene copolymer resin, into 100 parts by weight of elastomer resin.

Description

Adhesive tape for semiconductor dicing {PRESSURE-SENSITIVE ADHESIVE TAPE FOR DICING SEMICONDUCTOR WAFER}

One embodiment of the present invention relates to an adhesive tape for semiconductor dicing.

The conventional tape for semiconductor dicing has used the radiation hardening type adhesive which loses adhesive force by radiation hardening. The tape for semiconductor dicing maintains high adhesive force before radiation hardening so that it does not scatter during dicing, and after dicing, the adhesive force is lost by radiation crosslinking, so that the die can be easily peeled from the tape when picking up the die. It has a function that makes it easy.

On the other hand, semiconductor wafers have been continuously thinned in recent years to meet the trend of light and thin in electric and electronic products. Therefore, when the semiconductor wafer is a thick film, the picking operation with the conventional dicing tape was not great, but the picking operation became difficult as the semiconductor wafer became thinner and thinner. The reason is that when the semiconductor wafer becomes thinner, the die bends during pick-up, and chipping of the semiconductor chip edges is liable to occur. Accordingly, the dicing blade also has to use a small cuff width. This is because there is a problem that the pickup performance is reduced if this is narrowed. Therefore, there is an urgent need for the development of semiconductor dicing tapes that can minimize chipping and increase pickup performance.

An embodiment of the present invention provides a pressure-sensitive adhesive tape for semiconductor dicing that can obtain excellent pick-up performance when die picking up a semiconductor wafer.

Adhesive tape for semiconductor dicing according to an embodiment of the present invention is a base film; An adhesive layer formed on the base film; The protective film formed on the pressure-sensitive adhesive layer, the base film is a homopolypropylene resin, block copolymer polypropylene, terpolypropylene, ethylene resin, ethylene-vinyl acetate copolymer resin, ethylene-propylene copolymer resin and mixtures thereof 100 parts by weight of any one selected from the group consisting of 5 to 200 parts by weight of the elastomer resin or 10 to 150 parts by weight of the elastomer resin is mixed and extruded at an extrusion temperature of 150 to 300 ℃ to form a thickness of 50 to 250 microns (micron) The elastomer resin is characterized in that at least one selected from the group consisting of synthetic rubber, ionomer resin, ethylene acrylic copolymer resin, ethylene methacryl copolymer resin and mixtures thereof.

The base film may be extruded at the extrusion temperature of 180 to 250 ℃.

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The base film may be formed to a thickness of 70 to 150 microns.

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The pressure-sensitive adhesive layer may be formed of one or more selected from the group consisting of acrylic, polyester, silicone, rubber, and mixtures thereof.

The pressure-sensitive adhesive layer may be formed of one or more selected from the group consisting of a thermosetting adhesive resin, a thermosetting agent, a radiation crosslinking oligomer and a monomer, a photoinitiator, a solvent, and a mixture thereof.

The protective film may be a film coated with a silicone-based or fluorine-based release resin.

The protective film may be formed of at least one selected from the group consisting of polyethylene terephthalate, polypropylene, polyethylene, polypropylene-ethylene, and mixtures thereof.

Adhesive tape for semiconductor dicing according to an embodiment of the present invention is excellent in pick-up performance even in a thin semiconductor wafer by modifying the hardness and elasticity of the base film, it is possible to minimize the chipping.

1 is a cross-sectional view showing an adhesive tape for semiconductor dicing according to an embodiment of the present invention.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, in which those skilled in the art can readily implement the present invention.

1 is a cross-sectional view showing an adhesive tape for semiconductor dicing according to an embodiment of the present invention.

As shown in FIG. 1, the adhesive tape for semiconductor dicing according to an embodiment of the present invention includes a base film 10, an adhesive layer 20, and a protective film 30.

The base film 10 has a transparency that can transmit ultraviolet rays, and the resin constituting the base film 10 may be used alone or in combination. The base film 10 is formed of a main resin and a modified resin. Examples of the polymer that can be used as the main resin include homopolypropylene resins, block copolymer polypropylenes, terpolypropylene, ethylene resins, ethylene-vinyl acetate copolymer resins, ethylene-propylene copolymer resins, and mixtures thereof. It may be either resin. Further, the polymer that can be used as the modified resin may be a synthetic rubber such as styrene ethylene butadiene styrene or an elastomer such as ionomer resin, ethylene acrylic copolymer resin or ethylene methacryl copolymer resin having excellent strength and elastomeric characteristics. Resin may be used, and these may be a composite processed film or a coextruded laminated film.

The base film 10 may be manufactured using a mono or coextrusion facility capable of non-stretching or biaxial stretching.

In addition, in the composition mixing ratio of the alloy resin for producing the base film 10, 5 to 200 parts by weight of the elastomer resin with respect to 100 parts by weight of the main resin may be used. Preferably, 10 to 150 parts by weight of the elastomer resin may be optimally used with respect to 100 parts by weight of the main resin. Here, when the amount of the elastomer resin is less than 5 parts by weight of the elastomer resin relative to 100 parts by weight of the main resin, the effect of imparting elasticity is less, so that the pick-up performance is improved and the chipping minimization effect is less. The amount of the elastomer resin is used in the main resin 100 When the amount is more than 200 parts by weight of the elastomer resin relative to the parts by weight, the thickness is uneven during extrusion, and the extrusion workability is deteriorated.

On the other hand, the pickup performance and the chipping performance is greatly affected by the minimization by the kind of elastomer used for the modification of the base film 10 constituting the adhesive tape for semiconductor dicing according to the present invention. That is, styrene ethylene butadiene styrene, which is a synthetic rubber, is effective in softening and providing elasticity of the base film 10 even with a small amount, but it may be difficult to control uniform thickness during extrusion, and the ionomer resin of ethylene acrylic acid is raped. As a resin with balanced physical properties and elasticity, it has excellent performance in minimizing pick-up performance and chipping. However, since the strength of the molten resin may be high, it may take a load during extrusion, thereby modifying the base film 10 using the resin. In order to adjust the weight, it is preferable to adjust suitably.

In addition, during the extrusion process of the alloy resin for manufacturing the base film 10, the temperature of the screw and the head is maintained in the range of 150 to 300 ℃. Preferably, during the extrusion process of the alloy resin, the temperature of the screw and head is preferably maintained at 180 to 250 ℃ range. That is, when the temperature of the screw and head is higher than 300 ° C. during the extrusion process of the alloy resin for manufacturing the base film 10, the uniform kneading effect is improved but the thickness control is deteriorated. If the temperature is lower than 150 ℃, the thickness control is better, but defects such as fish eyes are likely to occur.

In addition, the base film 10 may be subjected to physicochemical treatment, such as corona discharge treatment, primer treatment to improve the adhesion of the surface. Further, the surface tension after the physical and chemical treatment on the base film 10 is to have a surface tension of 40 dyne / cm ² to 75dyne / cm ^2. Preferably, after physical and chemical treatment on the base material film 10, the surface tension is most excellent when the surface adhesive strength in the range of 45 dyne / cm ² to 55dyne / cm ^2.

The thickness D1 of the base film 10 manufactured through the above process has a range of 50 micron to 250 micron. Preferably, the thickness D1 of the base film 10 may have a range of 70 micron to 150 micron. If the thickness D1 is less than 50 microns, the cutting depth may become unstable in the dicing process. If the thickness D1 exceeds 250 microns, a large amount of burrs may be generated in the dicing process. There is a fear that the expansion process may not be performed accurately because the elongation is low.

In addition, the base film is preferably excellent in the UV transmittance when using the ultraviolet curable pressure-sensitive adhesive portion, for example, may have a UV transmittance of 70% or more, preferably transparent 90% or more.

The pressure-sensitive adhesive layer 20 is formed on the base film 10, and is an adhesive capable of heat and radiation crosslinking. The pressure-sensitive adhesive layer 20 may be formed of at least one selected from the group consisting of acrylic, polyester, silicone, rubber, and mixtures thereof. More preferably, the pressure-sensitive adhesive layer 20 may use an acrylic pressure-sensitive adhesive. The pressure-sensitive adhesive layer 20 is formed of at least one selected from the group consisting of a thermosetting adhesive resin, a thermosetting agent, a radiation crosslinking oligomer and a monomer, a photoinitiator, a solvent, and a mixture thereof. In addition, when the pressure-sensitive adhesive layer 20 is formed using the acrylic pressure-sensitive adhesive, the pressure-sensitive adhesive composition may be formed using a comma knife coater, a slot die coater, a lip coater, a reverse comma knife coater, and a gravure coater. At this time, the thickness (D2) of the pressure-sensitive adhesive layer 20 is formed in the range of 3 micron to 50 micron. Preferably, the thickness D2 of the pressure-sensitive adhesive layer 20 is preferably 5 micron to 30 micron.

The protective film 30 is formed on the pressure-sensitive adhesive layer 20, a film coated with a silicone-based or fluorine-based release resin. The resin used in the protective film 30 may be one or more selected from the group consisting of polyethylene terephthalate, polypropylene, polyethylene, polypropylene-ethylene, and mixtures thereof. Preferably, the resin used in the protective film 30 is the best polyethylene terephthalate. In addition, a roll coat gravure coater, micro gravure coater, or the like may be used as a method of coating the protective film 30. Coating thickness (D3) of the protective film 30 is produced in this way preferably has a range of 0.1 micron to 1 micron.

Hereinafter, the present invention will be described in more detail with reference to examples and comparative examples according to the present adhesive tape for semiconductor dicing, but the scope of the present invention is not limited to the following examples.

Example  One

Production of base film (adhesive base material)

Main resin block copolymerized polypropylene 100 parts by weight, 50 parts by weight of elastomeric ionomer resin, 30 parts by weight of ethylene ethylacrylic acid copolymer resin was mixed and extruded under the conditions of extrusion temperature 200 to 250 ℃ (80 micron adhesive base film (10 )

Preparation of Adhesive Film

100 parts by weight of acrylic copolymer adhesive resin having a weight average molecular weight of 600,000, 5 parts by weight of isocyanate curing agent, 20 parts by weight of polyfunctional oligomer, 1.5 parts by weight of MDK-based photoinitiator were mixed and mixed for 15 minutes by degassing and release-processed 38 micron polyester film The coating was applied to a thickness of 20 microns on a dry basis, dried at 100 ° C. for 2 minutes, and then laminated with the prepared base film 10 to prepare an adhesive film for dicing.

Example  2

An adhesive base film was prepared in the same manner as in Example 1, except that 50 parts by weight of the ionomer resin in the production of the base film 10 for dicing was replaced with styrene ethylenebutadiene styrene.

Example  3

An adhesive base film was prepared in the same manner as in Example 1 except that the ionomer resin was 80 parts by weight without the ethylene ethylacrylic acid copolymer resin in the production of the dicing base film 10.

Example  4

An adhesive base film was prepared in the same manner as in Example 1 except that the ionomer resin in the production of the base film 10 for dicing was removed and 80 parts by weight of ethylene ethylacrylic acid copolymer resin was used.

Example  5

An adhesive base film was prepared in the same manner as in Example 4, except that the ethylene ethylacryl copolymer resin was replaced with the ethylene methylacrylate copolymer resin in the manufacturing of the dicing base film 10.

Example  6

An adhesive base film was prepared in the same manner as in Example 1, except that 80 parts by weight of styrene ethylene butadiene styrene resin was used instead of the ionomer resin and the ethylene ethyl acrylic acid copolymer resin during the production of the base film 10 for dicing. .

Comparative example  One

A pressure-sensitive adhesive base film was prepared in the same manner as in Example 1, except that 80 parts by weight of ethyl vinyl acetate copolymer resin was substituted for the ionomer resin and ethylene ethyl acrylic acid copolymer resin during the production of the base film 10 for dicing. It was.

Comparative example  2

The same method as in Example 1 except for replacing 50 parts by weight of ethyl vinyl acetate copolymer resin and 30 parts by weight of low density polyethylene instead of the ionomer resin and the ethylene ethyl acrylic acid copolymer resin during the production of the base film 10 for dicing. To prepare a pressure-sensitive adhesive base film.

The resin composition of the pressure-sensitive adhesive base film of Examples and Comparative Examples prepared above is summarized in Table 1 below. Here, in Table 1, A is a block copolymerized polypropylene resin, B is an ionomer resin, C is an ethylene ethyl acrylic acid copolymer resin, D is an ethylene methyl acrylate copolymer resin, and E is a styrene ethylene butadiene styrene resin. , F is an ethylenevinyl acetate resin, and G is a low density polyethylene resin.

sample A B C D E F G Example 1 100 50 30 0 0 0 0 Example 2 100 0 30 0 50 0 0 Example 3 100 80 0 0 0 0 0 Example 4 100 0 80 0 0 0 0 Example 5 100 0 0 80 0 0 0 Example 6 100 0 0 0 80 0 0 Comparative Example 1 100 0 0 0 0 80 0 Comparative Example 2 100 0 0 0 0 50 30

The physical properties of the film prepared as described above were measured in the following manner, and the results are shown in Table 2 below. Herein, item A 'in Table 2 indicates pickup performance evaluation, item B' means chipping occurrence number, and item C 'indicates burr generation number.

1. Mounting

The 8 inch semiconductor wafer was laminated with a roll at 60 ° C.

2. Dicing

Dicing was carried out using equipment (DFD 640, DISCO) with a die size of 7 × 8, 40,000 rpm, a speed of 120 mm / sec and a blade height of 60 microns.

3. UV irradiation

UV of 300mj / cm ² was irradiated after a dicing process.

4. Pick-up Performance Evaluation

Performance evaluation was performed by attaching to a die bonding machine. At this time, the instrument used Alphasem 9000 / SWISSLINE with 8 pins.

5. Evaluation of chipping suppression characteristics

The number of chips broken by 100 microns or more after dicing was measured under the above conditions.

6. Evaluation of Burr Suppression Characteristics

The number of burrs on the semiconductor chip after dicing was measured under the above conditions.

Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Comparative Example 1 Comparative Example 2 A ' O O O O O O △ x B ' 0 0 0 0 0 0 7 10 C ' 0 0 0 0 0 0 3 5

From Table 2, it can be seen that the pickup properties after dicing for Examples 1 to 6 are superior to Comparative Examples 1 and 2 which do not use an ionomer resin or an ethylene ethylacrylic acid copolymer resin. In addition, it can be seen that the number of chipping occurrences and the number of burr generations that may appear during dicing for Examples 1 to 6 do not appear at all as opposed to Comparative Examples 1 and 2, which do not use ionomer resins or ethylene ethylacrylic acid copolymer resins. Can be.

Therefore, the tape for semiconductor dicing of this embodiment is excellent in pick-up performance even in a thin semiconductor wafer, and can minimize the occurrence of chipping and burrs. Furthermore, if the tape for semiconductor dicing is applied to a semiconductor wafer, product deterioration may be minimized.

What has been described above is just one embodiment for carrying out the adhesive tape for semiconductor dicing according to the present invention, the present invention is not limited to the above embodiment, as claimed in the following claims, the gist of the present invention Without departing from the technical spirit of the present invention to the extent that any person of ordinary skill in the art to which the present invention pertains various modifications can be made.

10: base film 20: pressure-sensitive adhesive layer
30: protective film

Claims (10)

A base film;
An adhesive layer formed on the base film; And
It includes a protective film formed on the pressure-sensitive adhesive layer,
The base film is any one of 100 parts by weight of an elastomer selected from the group consisting of homopolypropylene resin, block copolymer polypropylene, terpolypropylene, ethylene resin, ethylene-vinyl acetate copolymer resin, ethylene-propylene copolymer resin and mixtures thereof 5 to 200 parts by weight of resin or 10 to 150 parts by weight of the elastomer resin is mixed and extruded at an extrusion temperature of 150 to 300 ° C. to form a thickness of 50 to 250 microns, and the elastomer resin is a synthetic rubber or ionomer resin. And at least one selected from the group consisting of ethylene acrylic copolymer resins, ethylene methacryl copolymer resins, and mixtures thereof. delete The method of claim 1,
The base film is an adhesive tape for semiconductor dicing is extruded at the extrusion temperature 180 to 250 ℃. delete delete The method according to claim 1 or 3,
The base film is a pressure-sensitive adhesive tape for semiconductor dicing formed to a thickness of 70 to 150 microns. The method of claim 1,
The pressure-sensitive adhesive layer is an adhesive tape for semiconductor dicing formed of at least one selected from the group consisting of acrylic, polyester, silicone, rubber and mixtures thereof. The method of claim 1,
The pressure-sensitive adhesive layer is a pressure-sensitive adhesive tape for semiconductor dicing formed of at least one selected from the group consisting of a thermosetting adhesive resin, a thermosetting agent, a radiation crosslinking oligomer and a monomer, a photoinitiator, a solvent and a mixture thereof. The method of claim 1,
The protective film is an adhesive tape for semiconductor dicing which is a film coated with a silicone-based or fluorine-based release resin. 10. The method of claim 9,
The protective film is an adhesive tape for semiconductor dicing formed of at least one selected from the group consisting of polyethylene terephthalate, polypropylene, polyethylene, polypropylene-ethylene and mixtures thereof.

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