KR101281342B1 - 발광용품 어레이 및 이의 제조 방법 - Google Patents

발광용품 어레이 및 이의 제조 방법 Download PDF

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Publication number
KR101281342B1
KR101281342B1 KR1020087014289A KR20087014289A KR101281342B1 KR 101281342 B1 KR101281342 B1 KR 101281342B1 KR 1020087014289 A KR1020087014289 A KR 1020087014289A KR 20087014289 A KR20087014289 A KR 20087014289A KR 101281342 B1 KR101281342 B1 KR 101281342B1
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KR
South Korea
Prior art keywords
array
optical element
optical
led die
optical elements
Prior art date
Application number
KR1020087014289A
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English (en)
Korean (ko)
Other versions
KR20080069244A (ko
Inventor
캐서린 에이. 리더데일
티모시 디. 플레처
폴 에스. 러그
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 쓰리엠 이노베이티브 프로퍼티즈 컴파니 filed Critical 쓰리엠 이노베이티브 프로퍼티즈 컴파니
Publication of KR20080069244A publication Critical patent/KR20080069244A/ko
Application granted granted Critical
Publication of KR101281342B1 publication Critical patent/KR101281342B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
    • G02B19/0028—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed refractive and reflective surfaces, e.g. non-imaging catadioptric systems
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
    • G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
    • G02B19/0061—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
    • G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
    • G02B19/0061—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED
    • G02B19/0066—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED in the form of an LED array
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0093—Wafer bonding; Removal of the growth substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
KR1020087014289A 2005-11-22 2006-11-17 발광용품 어레이 및 이의 제조 방법 KR101281342B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US73889605P 2005-11-22 2005-11-22
US60/738,896 2005-11-22
PCT/US2006/044777 WO2007061895A1 (fr) 2005-11-22 2006-11-17 Reseaux d'articles luminescents et procede de fabrication de ceux-ci

Publications (2)

Publication Number Publication Date
KR20080069244A KR20080069244A (ko) 2008-07-25
KR101281342B1 true KR101281342B1 (ko) 2013-07-02

Family

ID=38067536

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087014289A KR101281342B1 (ko) 2005-11-22 2006-11-17 발광용품 어레이 및 이의 제조 방법

Country Status (6)

Country Link
US (1) US7573073B2 (fr)
EP (1) EP1952450A1 (fr)
KR (1) KR101281342B1 (fr)
CN (1) CN101313417B (fr)
TW (1) TW200729560A (fr)
WO (1) WO2007061895A1 (fr)

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US7594845B2 (en) * 2005-10-20 2009-09-29 3M Innovative Properties Company Abrasive article and method of modifying the surface of a workpiece
WO2008064068A2 (fr) * 2006-11-17 2008-05-29 3M Innovative Properties Company Diode led rendue plane avec extracteur optique
EP2092576A1 (fr) * 2006-11-17 2009-08-26 3M Innovative Properties Company Composition de liaison optique pour source lumineuse à diodes électroluminescentes
JP4561732B2 (ja) * 2006-11-20 2010-10-13 トヨタ自動車株式会社 移動体位置測位装置
WO2008063884A1 (fr) * 2006-11-20 2008-05-29 3M Innovative Properties Company Composition de liaison optique pour source de lumière del
US20090050921A1 (en) * 2007-08-23 2009-02-26 Philips Lumileds Lighting Company Llc Light Emitting Diode Array
US20090154137A1 (en) * 2007-12-14 2009-06-18 Philips Lumileds Lighting Company, Llc Illumination Device Including Collimating Optics
US20090166654A1 (en) * 2007-12-31 2009-07-02 Zhiyin Gan Light-emitting diode with increased light efficiency
DE102008035255B4 (de) 2008-07-29 2021-10-07 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements
US8803967B2 (en) 2009-07-31 2014-08-12 Mesa Imaging Ag Time of flight camera with rectangular field of illumination
TW201137960A (en) * 2010-04-20 2011-11-01 Raydium Semiconductor Corp Integrated circuit wafer dicing method
US8269235B2 (en) * 2010-04-26 2012-09-18 Koninklijke Philips Electronics N.V. Lighting system including collimators aligned with light emitting segments
JP5216113B2 (ja) * 2011-02-24 2013-06-19 フェニックス電機株式会社 発光装置
DE102011080179A1 (de) * 2011-08-01 2013-02-07 Osram Ag Wellenlängenkonversionskörper und Verfahren zu dessen Herstellung
WO2013085874A1 (fr) 2011-12-05 2013-06-13 Cooledge Lighting Inc. Commande de distribution d'intensité lumineuse à partir d'un réseau de sources de lumière ponctuelles
US9053952B2 (en) * 2012-09-28 2015-06-09 Apple Inc. Silicon shaping
ITTO20120988A1 (it) 2012-11-14 2014-05-15 Light In Light S R L Sistema di illuminazione artificiale per simulare un'illuminazione naturale
JP6568062B2 (ja) * 2013-07-18 2019-08-28 ルミレッズ ホールディング ベーフェー 発光デバイスのウェファのダイシング
US9451247B2 (en) 2013-11-25 2016-09-20 Ul Llc Camera test apparatus
EP3092522B1 (fr) 2014-01-08 2019-08-14 Signify Holding B.V. Sortie de mélange de couleurs pour sources à led à forte luminosité
CN107342354B (zh) * 2017-06-28 2019-08-20 深圳市环基实业有限公司 一种ic封装工艺
WO2024018291A1 (fr) 2022-07-22 2024-01-25 Centitvc - Centro De Nanotecnologia E Materiais Técnicos Funcionais E Inteligentes Panneau en pierre naturelle ayant des propriétés d'éclairage de surface et procédé de fabrication respectif
EP4310392A1 (fr) 2022-07-22 2024-01-24 CENTITVC - Centro de Nanotecnologia e Materiais Tecnicos, Funcionais e Inteligentes Panneau en pierre naturelle ayant des propriétés d'éclairage de surface et procédé de fabrication respectif

Citations (4)

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KR20020035819A (ko) * 2002-04-25 2002-05-15 주식회사 포스기술 방수, 방진 구조를 가진 방열판 겸용 반사면을 구비한발광소자 매트릭스 모듈 및 그 형성방법
KR20050061909A (ko) * 2003-12-19 2005-06-23 주식회사 코스텍시스 전자기기용 발광다이오드 모듈
US6942360B2 (en) * 2003-10-01 2005-09-13 Enertron, Inc. Methods and apparatus for an LED light engine
KR20050090928A (ko) * 2004-03-10 2005-09-14 서울반도체 주식회사 색 필름 및 이를 이용한 발광 다이오드 모듈

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US7118438B2 (en) 2003-01-27 2006-10-10 3M Innovative Properties Company Methods of making phosphor based light sources having an interference reflector
US7070300B2 (en) * 2004-06-04 2006-07-04 Philips Lumileds Lighting Company, Llc Remote wavelength conversion in an illumination device
US20060091412A1 (en) 2004-10-29 2006-05-04 Wheatley John A Polarized LED
US7329982B2 (en) 2004-10-29 2008-02-12 3M Innovative Properties Company LED package with non-bonded optical element
US7330319B2 (en) 2004-10-29 2008-02-12 3M Innovative Properties Company High brightness LED package with multiple optical elements
US7404756B2 (en) 2004-10-29 2008-07-29 3M Innovative Properties Company Process for manufacturing optical and semiconductor elements
US7304425B2 (en) 2004-10-29 2007-12-04 3M Innovative Properties Company High brightness LED package with compound optical element(s)
US20060091411A1 (en) 2004-10-29 2006-05-04 Ouderkirk Andrew J High brightness LED package
US7169031B1 (en) 2005-07-28 2007-01-30 3M Innovative Properties Company Self-contained conditioning abrasive article
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US7594845B2 (en) 2005-10-20 2009-09-29 3M Innovative Properties Company Abrasive article and method of modifying the surface of a workpiece

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020035819A (ko) * 2002-04-25 2002-05-15 주식회사 포스기술 방수, 방진 구조를 가진 방열판 겸용 반사면을 구비한발광소자 매트릭스 모듈 및 그 형성방법
US6942360B2 (en) * 2003-10-01 2005-09-13 Enertron, Inc. Methods and apparatus for an LED light engine
KR20050061909A (ko) * 2003-12-19 2005-06-23 주식회사 코스텍시스 전자기기용 발광다이오드 모듈
KR20050090928A (ko) * 2004-03-10 2005-09-14 서울반도체 주식회사 색 필름 및 이를 이용한 발광 다이오드 모듈

Also Published As

Publication number Publication date
US20070176192A1 (en) 2007-08-02
CN101313417B (zh) 2011-04-20
CN101313417A (zh) 2008-11-26
TW200729560A (en) 2007-08-01
WO2007061895A1 (fr) 2007-05-31
EP1952450A1 (fr) 2008-08-06
KR20080069244A (ko) 2008-07-25
US7573073B2 (en) 2009-08-11

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