KR101276706B1 - surface treatment compostion of substrate for packaging electronic components and adhesion and packaging method using the same - Google Patents

Abstract

The present invention discloses a surface treatment agent capable of improving the adhesion properties of a packaging substrate for packaging electronic components using dopamine, and a surface treatment method and an electronic components packaging method using the same. Adhesives for packaging electronic components used in the present invention are prepared by dissolving a certain concentration of dopamine in a buffer solution, for example Tris, and dissolving a certain amount of sodium periodate. The surface treating agent for an electronic component packaging substrate is brought into contact with the surface treatment material for a predetermined time, and then contacted with the material or object to be bonded using an existing adhesive, and finally bonded by thermocompression or ultrasonic treatment. According to the present invention, not only the bonding strength is improved but also the time required for the surface treatment is greatly reduced.

Description

Surface treatment compostion of substrate for packaging electronic components and adhesion and packaging method using the same}

TECHNICAL FIELD The present invention relates to the field of adhesives, and more particularly, to a substrate surface treatment agent capable of packaging electronic components such as, for example, a touch screen panel using dopamine, and a method of bonding and packaging electronic components using the same. It is about.

Touch screens allow for more intuitive, faster and direct interaction with users in a variety of applications, and the range of use is expanding very rapidly. Panels used in such touch screens have been changed from glass to polymer materials such as polyethylene terephthalate (PET) having advantages such as low cost, low weight, and impact resistance. The electrical signal of the touch screen is transmitted to the flexible circuit board through the transparent electrode, silver paste, anisotropic conductive adhesive (ACA). However, at present, there is a problem in that the bonding strength between the polymer substrate and the anisotropic conductive adhesive is very low, and research to improve it is being conducted.

Mussel (mussel), a kind of shellfish, can be seen to adhere well to various surfaces of oil and inorganic materials as well as wet surfaces and generally non-adhesive surfaces. Analyzing the protein on the mussel's attached surface reveals that 3,4-dihydroxy-L-phenylalanine (DOPA) and lysine amino acids are large. have. It is known that DOPA has strong covalent or noncovalent interactions with substrates. This characteristic of DOPA comes from the catechol group of DOPA, and the characteristics of lysine amino acids that enhance these properties come from the amine group. Therefore, dopamine having a structure of Formula 1 having a catechol group of DOPA and an amine group of lysine amino acids at the same time may mimic the adhesive of mussel as a mimic of the adhesive material made from the mussel.

Formula 1

Such dopamine is converted into a polydopamine comprising the structure of Formula 2 by polymerization:

(2)

It has recently been reported that dopamine can function as a coating material that can be coated on various surfaces, and more recently, polydopamine functional groups can have high interfacial bonding force as they interact with functional groups of specific adhesive materials. The fact is known.

Representative patent documents related to the adhesive properties of dopamine may be mentioned Japanese Patent Publication No. 2010-144148 (published on July 7, 2010) and Japanese Patent Publication No. 2010-144155 (published on July 7, 2010).

Japanese Laid-Open Patent Publication No. 2010-144148 (published on July 7, 2010) discloses a method of increasing the adhesion of a plated substrate by forming a polydopamine thin film on the surface of the plated substrate. The method disclosed in this Japanese Laid-Open Patent Document forms a polydopamine thin film on the surface of the plated substrate by contacting the dopamine solution with the surface of the plated substrate, and the functional group and the functional group of the adhesive interact in the polydopamine thin film formed on the surface of the plated substrate. It is to increase the adhesiveness by making it.

Japanese Laid-Open Patent Publication No. 2010-144155 (published on July 7, 2010) discloses a method for bonding a polyacetal resin molded article using dopamine. The method disclosed in this Japanese Laid-Open Patent Document forms a polydopamine thin film on the surface of the polyacetal resin molded body by contacting a dopamine solution to the surface of the polyacetal resin molded body, It includes increasing the adhesiveness by allowing the functional group and the functional group of the adhesive to interact.

All of the methods disclosed in these Japanese Patent Laid-Open Patent Documents form a polydopamine thin film on a material or an object to be bonded, and then increase the adhesive properties by interaction of a functional group in the polydopamine with a functional group in the adhesive. Surface treatment methods and conditions for surface or polyacetal resins are specified. However, these methods not only have limitations in adhesion properties but also require considerable time for adhesion itself. For example, it takes about 12 hours to coat polydopamine with a thickness of 20 nm on an object or object to be bonded.

The present invention has been made to solve the problems of the prior art, the object of the present invention by using a dopamine, for example, by forming a polydopamine on the surface of a material having a poor bonding properties with the existing adhesive, such as a touch screen panel The present invention provides a method for forming a polydopamine layer and an adhesive method capable of maximizing bonding properties between adhesives and greatly reducing the time required for forming a polydopamine layer in consideration of product productivity problems.

In order to achieve the above and other objects, according to one aspect of the present invention,

Provided is a substrate surface treatment agent for packaging electronic components, including dopamine, a buffer, and an oxidant.

In the present invention, the oxidizing agent is an important factor for increasing the reaction rate, and the higher the oxidizing power, the faster the reaction rate. Non-limiting examples of such oxidants include sodium perioate, dimethyldioxirane, potassium permanganate, hydrogen peroxide, trifluoroperacetic acid, N-methyl A morpholine N-oxide, an oxone, etc. may be mentioned, and among these, sodium perioate having a structure of the following chemical formula having high oxidizing power is particularly preferably used. :

In a preferred embodiment according to one aspect of the invention, the dopamine is used at a concentration of 2 to 50 mg / ml, preferably 10 to 20 mg / ml. At this time, 7.5-10.5 are suitable as pH conditions. When the dopamine concentration and pH conditions deviate from the above conditions, the peeling bond strength is lowered to obtain the desired bond strength (see the graph of FIG. 1).

In a preferred embodiment according to one aspect of the invention, the sodium periodate is preferably used in 0.5 to 1.5 equivalents relative to dopamine. When sodium periodate is used less than 0.5 equivalents to dopamine, there is no change in coating thickness with time, and even when used in excess of 1.5 equivalents, a proportional relationship of coating thickness with time cannot be obtained. See graph of 3).

In a preferred embodiment according to one aspect of the invention, buffers may be used without particular limitation, and Tris is particularly suitably used in the embodiments of the invention.

According to another aspect of the present invention,

(a) dissolving dopamine of formula 1 in a buffer to produce a solution capable of forming polydopamine comprising formula 2 on a surface;

(b) simultaneously or after said step (a), dissolving an oxidizing agent in said polydopamine treatment solution;

(c) contacting the surface treatment material with the solution resulting from step (b);

(d) contacting the surface-treated material using the existing adhesive material, the method comprising adhering the surface-treated material resulting from step (c) with the existing adhesive material:

Formula 1

(2)

In a preferred embodiment according to another aspect of the present invention, sodium perioate having a structure of the following formula is used as the oxidizing agent:

In a preferred embodiment according to another aspect of the present invention, for example, ITO or PET substrate may be used as the material to be bonded.

In a preferred embodiment according to another aspect of the invention, the dopamine is used at a concentration of 2 to 50 mg / ml, preferably 10 to 20 mg / ml. At this time, 7.5-10.5 are suitable as pH conditions. When the dopamine concentration and pH conditions deviate from the above conditions, the peeling bond strength is lowered to obtain the desired bond strength (see the graph of FIG. 1). In addition, the sodium periodate is preferably used in 0.5 to 1.5 equivalents relative to dopamine. When sodium periodate is used less than 0.5 equivalents to dopamine, there is no change in coating thickness with time, and even when used in excess of 1.5 equivalents, a proportional relationship of coating thickness with time cannot be obtained. See graph of 3).

In a preferred embodiment according to another aspect of the present invention, a buffer may be used without particular limitation, and Tris is particularly suitably used in the embodiment of the present invention.

Another aspect of the present invention,

(a) contacting the polymer substrate with a dopamine solution in which sodium periodate is dissolved; And

(b) bonding the anisotropic conductive adhesive on the polymer substrate and then thermally compressing or ultrasonicating the same to provide a method of packaging an electronic component.

In a preferred embodiment according to another aspect of the invention, in step (a), dopamine is used at a concentration of 10 to 20 mg / ml, pH conditions are 7.5 to 10.5, and sodium periodate is directed to dopamine 0.5 to 1.5 equivalents.

In a preferred embodiment according to another aspect of the present invention, thermocompression or sonication may be used in a method widely used in the art, which will be variously appreciated by those skilled in the art.

In an even more preferred embodiment according to another aspect of the present invention, the conditions for bonding the anisotropic conductive adhesive is the internal temperature of the anisotropic conductive adhesive during thermocompression bonding and sonication is 100 ℃ to 180 ℃ and the time is 1 second to 25 seconds to be.

According to the present invention, not only the bonding properties between the substrate and the adhesive, which are poor in bonding properties, such as a touch screen panel, but also the surface treatment time of the substrate is greatly reduced.

Figure 1 is a bar graph showing the results of changing the pH value and the concentration of dopamine in the treatment conditions of dopamine. Through this graph, the peel strength (or the bond strength up to 450 gf / cm when the concentration of dopamine is 2 to 50 mg / ml, preferably 10 to 20 mg / ml, and when the pH is about 8.5 to about 9.5) It is confirmed that the peel adhesion strength can be improved.
2 is a graph showing the relationship between thickness and bonding force. From this graph, it can be seen that the adhesion on the PET / ITO surface is improved to 500 gf / cm or more even though only 5 nm of coating (10 minutes) was achieved, while the adhesion was close to zero before treatment. In 5 minutes of coating, the bonding force on the surface of PET can be confirmed that more than 500gf / cm.
FIG. 3 is a graph showing the results of adding sodium periodate as an oxidizing agent to dopamine in an equivalent weight (0, 0.5 equivalent, 1.0 equivalent and 1.5 equivalent). From this graph, it can be seen that the coating thickness is continuously increased with time when 0.5 equivalent and 1 equivalent of sodium periodate are added. In particular, when 1.0 equivalent of sodium periodate was added, the coating time to a thickness of 20 nm was greatly reduced from the conventional 12 hours to 40 minutes.

Hereinafter, the present invention will be described by the following examples. The following examples are only for illustrating the present invention, but the present invention is not limited to the following examples.

Examples 1-5

Dopamine having the structure of Formula 1 was completely dissolved in Tris (trizma base) buffer at 10 mM condition titrated to pH 8.5 at a concentration of 10 mg / ml, and then sodium periodate having the structure of Formula 2 was Equivalent addition was carried out to dissolve (see Scheme 1 below).

Formula 1

(2)

Scheme 1

Then, 12 sets of ITO-elevated PET specimens and bare PET specimens were added to the solution in which the dopamine and sodium periodate were dissolved, and stirred for 5 minutes, 10 minutes, 20 minutes, 40 minutes, and 1 hour, respectively. Coated. Thereafter, a 25 μm thick acrylic ACF slitting 2 mm in width on a dopamine-coated ITO / PET substrate was temporarily bonded by thermocompression bonding at 1 MPa, 70 ° C., and 2 sec. This bonding was performed on the polyimide substrate in which copper wiring was formed by thermocompression bonding on 2 MPa, 150 degreeC, and 10 second conditions.

Peel bond strength on the surface of PET / ITO, which was subjected to the 90 ° peel adhesion strength test as a test of the adhesion of the manufactured package, is shown in the graph of FIG. 1 according to the concentration and pH of dopamine, As shown in the graph of Figure 2, the treatment rate for each equivalent of the sodium periodate used is shown in Figure 3. Individual conditions are also presented in these figures.

Through the graph of Figure 1, the peel strength of the bond to 450 gf / cm when the concentration of dopamine 2 ~ 50 mg / ml, preferably 10 ~ 20 mg / ml and when the pH is about 8.5 to about 9.5 (Or peel adhesion strength) can be improved. From the graph of FIG. 2, it can be seen that the adhesion on the PET / ITO surface is improved to 500 gf / cm or more even when only 5 nm of coating (10 minutes) is made, while the adhesion is close to zero before the treatment. . In the coating of 5 minutes, the bonding force on the surface of PET can be confirmed that more than 500gf / cm. Through the graph of Figure 3, it can be seen that the coating thickness increases continuously with time when the sodium periodate is added in 0.5 equivalent, 1 equivalent. In particular, when 1.0 equivalent of sodium periodate was added, the coating time to a thickness of 20 nm was greatly reduced from the conventional 12 hours to 40 minutes.

Claims (17)

A substrate surface treatment agent for packaging electronic components comprising dopamine, a buffer, and an oxidant. The method of claim 1, wherein the oxidizing agent is sodium perioate, dimethyldioxirane, potassium permanganate, hydrogen peroxide, trifluoroperacetic acid, N- A substrate surface treatment agent for an electronic component package, characterized in that it is one or two or more mixtures from the group consisting of methyl morpholine N-oxide and oxone. The substrate surface treating agent of claim 1, wherein the oxidizing agent is sodium periodate having a structure of the following formula:

The substrate surface treating agent for packaging an electronic component according to claim 2, wherein the dopamine concentration is 2 to 50 mg / ml. The substrate surface treatment agent for packaging an electronic component according to claim 4, wherein the dopamine concentration is 10 to 20 mg / ml. 6. The substrate surface treating agent of claim 5, wherein the equivalent of sodium periodate is 0.5 to 1.5 equivalents based on dopamine. 7. The substrate surface treating agent for packaging an electronic component according to claim 5 or 6, wherein the pH of the buffer is 7.5 to 10.5. The substrate surface treatment agent according to claim 1, wherein the dopamine is dissolved in the buffer to obtain polydopamine. (a) dissolving dopamine of formula 1 in a buffer to produce a solution capable of forming polydopamine comprising formula 2;
(b) simultaneously or after said step (a), dissolving an oxidizing agent in said polydopamine treatment solution;
(c) contacting the surface treatment material with the solution resulting from step (b);
(d) contacting the surface-treated material with the anisotropic conductive adhesive, comprising contacting the surface treated material produced in step (c) with the anisotropic conductive adhesive:
Formula 1

(2)

10. The method of claim 9, wherein the buffer used in step (a) is Tris. The method of claim 9, wherein the oxidizing agent used in step (b) is sodium perioate, dimethyldioxirane, potassium permanganate, hydrogen peroxide, trifluoroperacetic acid. (trifluoroperacetic acid), N-methylmorpholine N-oxide (N-methylmorpholine N-oxide) and oxone (oxone) from the group consisting of one or more characterized in that the mixture. 10. The method of claim 9 wherein the oxidant is sodium periodate of the formula:

The method of claim 9, wherein the material to be bonded is an ITO or PET substrate. The oxidizing agent according to any one of claims 9 to 13, wherein in step (a), the concentration of dopamine used is 10-20 mg / ml, the pH is 7.5-10.5, and the oxidizing agent used in step (b). The equivalent of 0.5 to 1.5 equivalents based on the dopamine method. (a) contacting the polymer substrate with a dopamine solution in which sodium periodate is dissolved;
(b) bonding the anisotropic conductive adhesive on the polymer substrate and then thermocompressing or sonicating the electronic component. The method according to claim 15, wherein the concentration of dopamine used in step (a) is 10 to 20 mg / ml, pH is 7.5 to 10.5, and the equivalent of sodium periodate is 0.5 to 1.5 equivalents to dopamine. How to. The method of claim 15 or 16, wherein the conditions for bonding the anisotropic conductive adhesive is an internal temperature of the anisotropic conductive adhesive during thermocompression bonding and sonication is 100 ℃ to 180 ℃ and the time is 1 second to 25 seconds .

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