KR101276611B1 - Device for optimizing a bonding temperature in bonding equipment and method therefor - Google Patents

Abstract

The present invention relates to a joining equipment having a joining temperature optimization device for optimizing the joining temperature when joining the joining object with a joining tool using an ultrasonic or thermocompression method, and a joining temperature optimization method using the same. Ultrasonic oscillator for converting and outputting the ultrasonic energy to the electrical energy of the ultrasonic frequency, Vibration tool for converting and amplifying the electrical energy applied from the ultrasonic oscillator to mechanical vibration energy and delivered to the bonding agent located between the bonding object, and the bonding agent side And a temperature detecting means for detecting an exothermic temperature generated by vibration energy in the binder, and a temperature detected by the temperature detecting means and a preset reference temperature, and the detected temperature is close to the reference temperature. Variably control the output of the ultrasonic oscillator so that A controller for storing a service control output.

Description

Bonding equipment having a junction temperature optimization device and a junction temperature optimization method using the same {DEVICE FOR OPTIMIZING A BONDING TEMPERATURE IN BONDING EQUIPMENT AND METHOD THEREFOR}

The present invention relates to a joining equipment having a joining temperature optimization device for optimizing the joining temperature when joining a polymer resin joining object with a joining tool using an ultrasonic or thermocompression method, and a joining temperature optimization method using the same.

Generally, there are an ultrasonic bonding method, a thermocompression bonding method, and the like as a method of bonding the polymer resin bonding object.

The ultrasonic bonding apparatus includes an ultrasonic oscillator for generating an ultrasonic frequency, and an ultrasonic horn converting ultrasonic waves into vibration energy to bond the bonding object. That is, when the ultrasonic vibration energy is transmitted to the bonding object through the horn, instantaneous frictional heat is generated in the bonding agent provided on the bonding surface of the bonding object. The bonding agent is dissolved due to the frictional heat, thereby bonding the bonding object.

The thermocompression bonding equipment is bonded to each other by applying heat and pressure to a polymer resin bonding object as a deposit, and may be formed in various structures according to the material and shape of the deposit. The heat fusion equipment generates heat by using power supplied from the outside, and uses the same to fuse the objects to be bonded to each other.

The ultrasonic bonding apparatus and the thermocompression bonding apparatus as described above use a polymer resin binder when bonding the bonding object, and a representative polymer resin binder may be an anisotropic conductive binder.

The bonding agent is a bonding material which simultaneously performs electrical connection between electrodes by conductive particles and mechanical connection by thermal curing of the polymer resin, based on the insulating polymer resin and the conductive particles dispersed in the polymer resin.

In general, fine particles of silver, gold, copper, nickel, carbon, metal coated, intrinsically conductive polymer or the like are used as conductive particles, and epoxy resin, polyimide, silicone, Acrylic, polyester or polysulfone resin is used. The types of conductive particles may be varied depending on the field of use, and non-conductive materials may be included for the purpose of reducing the thermal expansion coefficient.

The connection method between the bonding objects using the bonding agent is a lead free process, which is clean, simple and eco-friendly, and does not need to apply instant high temperature to the product (low temperature process). It is a stable process, it is possible to lower the cost of the process by using a low-cost substrate, such as a glass substrate or polyester flex, there is an advantage that the implementation of the ultra-fine electrode pitch (pitch) is possible by the electrical connection is made using the fine conductive particles.

Bonding agents having these advantages are suitable for display packaging such as smart cards, liquid crystal displays (LCDs), plasma display panels (PDPs), organic light emitting diodes (EL), computers, mobile phones, and communication systems. We are expanding our range of applications.

The most active field of bonding agent is display module mounting, which is used for outer lead bonding (OLB) used when connecting a flexible substrate to a glass substrate, and a bonding agent for PCB bonding for bonding a flexible substrate to a printed circuit board (PCB) substrate. Market is the largest.

In addition, the chip on glass (COG) bonding in which the driving circuit IC chip is directly connected to the glass substrate, and the chip on film (COF) bonding in which the chip is directly flip-chip connected to the flexible substrate are used for the extremely fine pitch connection. As the need arises, the importance of the binder is also rapidly increasing.

In the mounting technology of the bonding object using the bonding agent, the connection is basically completed by conduction by conductive particles between the electrode pads and thermal curing of the surrounding polymer resin using an ultrasonic wave or a thermocompression bonding process.

Since the thermosetting polymer of the binder has a higher temperature, the thermosetting reaction rate is faster, so that the bonding can be performed faster when the temperature is increased. However, it is very important to control the exact actual temperature of the binder during the bonding process because excessively high temperatures cause thermal deformation of the binder and degradation of the properties of the binder.

However, in the bonding equipment, as shown in FIG. 1, since the temperature of the bonding tool 5 can be measured by the control device 1 and the output thereof is adjusted, the internal temperature of the bonding object 10, that is, the bonding agent 15, is accurately measured. Difficult to know In addition, in order to know the internal temperature of the bonding agent 15, there was a limit to experiment one by one in the state of planting a thermometer in the bonding agent 15.

An object of the present invention has a bonding temperature optimization device that can optimize the bonding temperature for each bonding object by detecting the temperature of the bonding agent applied or disposed between the bonding objects when bonding with the bonding tool using ultrasonic or thermocompression bonding method. It is to provide a bonding equipment and a method for optimizing the junction temperature using the same.

The technical problems to be achieved by the present invention are not limited to the technical problems mentioned above.

Bonding equipment having a junction temperature optimization device of the present invention for realizing the above object, Ultrasonic oscillator for converting the commercial power applied from the outside into the electrical energy of the ultrasonic frequency and outputs; A vibration tool for converting and amplifying electrical energy applied from the ultrasonic wave oscillator into mechanical vibration energy and transferring the electrical energy to a bonding agent located between the bonding objects; Temperature detecting means applied to the bonding side and detecting an exothermic temperature generated due to vibration energy in the bonding agent; And a control unit for comparing the temperature detected by the temperature detecting unit with a set reference temperature, and variably controlling the output of the ultrasonic wave oscillator so that the detected temperature is close to the reference temperature, and storing the variable controlled output according to the time. It can include;

Specifically, the bonding agent, an insulating polymer resin; And conductive connection particles formed in the insulating polymer resin and in surface contact with at least one of the bonding objects.

The controller may vary the output by controlling at least one of the frequency, amplitude, and pulse width of the ultrasonic wave output from the ultrasonic wave oscillator.

Bonding equipment having another junction temperature optimization device of the present invention for realizing the above object, the power supply for converting the commercial power applied from the outside to the required voltage or current according to the control signal and outputs; A welding tool heated to a heating temperature set according to the power input from the power supply unit to pressurize and apply heat to the bonding agent applied between the bonding objects; Temperature detecting means applied to the bonding side and detecting an exothermic temperature generated due to vibration energy in the bonding agent; And comparing the temperature detected by the temperature detecting means with a set reference temperature, and controlling the heating temperature by controlling the power supplied to the welding tool so that the detected temperature is close to the reference temperature, and controlling the heating temperature. The controller may store a controlled power output.

Bonding temperature optimization method of the bonding equipment of the present invention for realizing the above object, the vibration tool converts the ultrasonic wave input from the outside into vibration energy, and applying the vibration energy to the bonding agent applied between the bonding objects; Detecting an exothermic temperature generated in the binder due to the vibration energy; Comparing the detected temperature with a set reference temperature; And variably controlling the output of the ultrasonic wave applied to the vibration tool such that the detected temperature approaches a reference temperature.

In detail, the controlling of the output may include variably controlling at least one of a frequency, an amplitude, and a pulse width of the ultrasonic wave.

In the comparing step, when the detected temperature is equal to the set reference temperature, the output value of the ultrasonic wave corresponding to the detected temperature may be set to an initial value, and the bonding output object is bonded by controlling the output of the ultrasonic wave with the set output value. It may further include.

Method for optimizing the bonding temperature of the other bonding equipment of the present invention for realizing the above object, the welding tool is heated to a heating temperature set according to the power applied from the outside to press the adhesive applied between the bonding objects; Detecting an exothermic temperature generated in the binder according to the pressurization; Comparing the detected temperature with a set reference temperature; And varying a heating temperature by controlling power supplied to the welding tool such that the detected temperature approaches a reference temperature.

Specifically, in the comparing step, when the detected temperature is equal to the set reference temperature, the output value corresponding to the heating temperature may be set as the initial control value.

The method may further include bonding the object to be joined by controlling a heating temperature with the stored output value.

As described above, in the present invention, by installing the temperature detecting means on the object to be bonded and bonding the sample once, an optimized output value for realizing the temperature of the desired bonding agent can be obtained, and the output value is used as it is in the subsequent bonding process. There is an advantage that it is possible to accurately bond the bonding object without the thermometer to the desired temperature.

1 is a view for explaining a temperature measuring method of a general bonding equipment.
2 is a view showing the junction temperature optimization device in the ultrasonic welding apparatus according to an embodiment of the present invention.
3 is a cross-sectional view showing the initial state and the bonding state of the bonding object according to an embodiment of the present invention.
4 is a flowchart illustrating a process of optimizing a junction temperature in the ultrasonic bonding apparatus of FIG. 2.
5 is a view showing a junction temperature optimization device in the bonding equipment according to another embodiment of the present invention.
6 is a flowchart illustrating a process of optimizing a junction temperature in the bonding apparatus of FIG. 5.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Like elements in the figures are denoted by the same reference numerals wherever possible. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail.

2 is a view showing an apparatus for optimizing the junction temperature in the ultrasonic bonding apparatus according to an embodiment of the present invention, the optimization apparatus is an ultrasonic wave generator 110, vibration tool 120, temperature detection means 130, display unit 140 ) And the controller 150.

The ultrasonic wave generator 110 converts commercial power (AC 110V or AC 220V) applied from the outside into electrical energy of an ultrasonic frequency and outputs the same. The ultrasonic oscillator 110 converts the commercial power of 50Hz to 60Hz input from the outside into an ultrasonic frequency of 15kHz to 40kHz and outputs the ultrasonic power.

The vibration tool 120 converts and amplifies the electrical energy applied from the ultrasonic wave generator 110 into mechanical vibration energy and transfers the electrical energy to the bonding agent 15 applied or disposed between the bonding objects 10. The vibration tool 120 is output from the converter 121 for converting the electrical energy applied from the ultrasonic oscillator 110 into mechanical vibration energy, the booster 123 for amplifying the amplitude of the mechanical vibration energy, and the booster 123 It consists of a horn (125) for amplifying and transferring the mechanical vibration energy to the bonding object (10).

The bonding object 10 may be a plurality of electronic components 11 and 12 as shown in FIG. 3, and each of the electronic components 11 and 12 may have electrodes 11-1 and 12-1, respectively. .

The bonding agent 15 is formed in the insulating polymer resin 15a and the insulating polymer resin 15a, and the conductive connecting particles 15b are in surface contact with at least one of the bonding objects 10 of the bonding object 10. It may include. The insulating polymer resin 15a is a thermosetting polymer resin or a thermoplastic polymer resin, and preferably a thermosetting polymer resin. The bonding agent 15 according to the present embodiment may be in the form of a film or a paste, and is preferably an anisotropic conductive film.

The polymer resin 15a is a resin that is cured at a temperature of 90 ° C to 300 ° C, preferably an epoxy resin, a polyimide resin, an acrylic resin, a polyester resin, a polysulfone resin, a polyimide resin, a polyester resin, or these Is a mixture of. If the polymer resin is a thermoplastic polymer resin rather than a thermosetting polymer resin, melting will occur, not curing by ultrasonic waves or heat. In addition, the connecting particles 15b are spherical metal materials formed before melting, and the average particle diameter may be 3 to 100 μm. The connecting particles 15b may be Sn, Sn / Bi-based, Sn / Zn-based, Sn / Ag-based, Sn / Ag / Cu-based, or a mixture thereof. These connecting particles 15b will melt when they are above a certain temperature (120 ° C.).

The temperature detecting unit 130 is disposed between the bonding objects 10 to directly detect the exothermic temperature generated by the bonding agent 15 due to the vibration energy. The temperature detecting unit 130 may be a thermocouple or a semiconductor sensor.

The display unit 140 may be configured as an LED (7-segment) or an LCD that displays at least one of a temperature detected by the temperature detection unit 130 and a waveform of electrical energy output from the ultrasonic wave generator 110. .

The controller 150 compares the temperature detected by the temperature detection unit 130 with the set reference temperature, and variably controls the output of the ultrasonic wave generator 110 so that the detected temperature is close to the reference temperature. In addition to storing the controlled output, if the detected temperature is the same as the reference temperature, the output of the ultrasonic wave generator 110 is reset to an initial control value. Herein, the controller 150 may vary the output by controlling at least one of the frequency, amplitude, and pulse width of the ultrasonic wave when the output of the ultrasonic wave generator 110 is variably controlled.

Here, the optimization apparatus includes an input unit 160 for inputting various setting values or commands, driving means (not shown) for moving the vibration tool 120 up and down according to a control signal of the controller 150, and The ultrasonic oscillator 110 may further include a memory device (not shown) for storing and reusing power change history over time. The memory device stores the output change history according to the time of the ultrasonic oscillator 110 at a specific junction object, and easily reproduces the desired temperature without detecting the temperature by using the stored output change history as it is when reworking the same junction object. can do.

When the bonding object 10 is bonded using the bonding agent 15 as shown in FIG. 3, the connecting particles 15b of the bonding agent 15 that are present between the electrodes of the bonding object bonding object 10 are Melted by the heat generated by the ultrasonic wave is fused by contact with each electrode of the object to be bonded 10. Of course, the polymer resin 15a is cured according to the heat generated. That is, when ultrasonic waves are applied to the bonding agent 15, curing of the polymer resin 15a and melting of the connecting particles 15c may be simultaneously performed.

The application of the ultrasonic waves means that ultrasonic vibrations are applied to the conductive binder 15, and the ultrasonic vibrations include vibrations with a predetermined pressure. Ultrasonic waves applied to the bonding agent 15 induce plastic deformation of the polymer resin contained in the bonding agent 15, and the plastic resin generates heat by itself. By the self-heating of the polymer resin according to the ultrasonic application, the temperature of the binder 15 is raised above the melting temperature and the curing temperature of the polymer resin. As described above, the bonding agent 15 is cured after melting the thermosetting polymer resin by ultrasonic application, and the connecting particles 15c are melted. When self-heating by the ultrasonic wave of the said bonding agent 15, melting | fusing point for stably melting the said connection particle 15b simultaneously with melting or hardening of the said polymer resin is 120-300 degreeC.

Here, since the thermosetting polymer resin of the bonding agent 15 increases in temperature, the thermosetting reaction rate is faster, so that bonding can be performed more quickly when the temperature increases. However, it is very important to control the exact actual temperature of the binder 15 during the bonding process because excessively high temperatures cause thermal deformation of the binder and degradation of the properties of the binder.

Accordingly, a temperature detecting means 130 such as a thermocouple is provided on the bonding agent 15 side to detect the temperature of the bonding agent 15 at the time of bonding. The controller 150 displays the temperature detected by the temperature detecting unit 130 in a number or graph on the display unit 140, and simultaneously compares the detected temperature with a set reference temperature, and detects the temperature as the reference temperature. The output of the ultrasonic wave generator 110 is controlled to be variable according to a set control program.

FIG. 4 is a flowchart illustrating a process of optimizing a junction temperature in the ultrasonic bonding apparatus of FIG. 2, and will be described with reference to the accompanying drawings.

First, the bonding object 10 is located on the support 101 positioned below the vibrating tool 120, and the temperature detecting means 130 for detecting the temperature of the bonding agent 15 between the bonding objects 10. This is arranged.

In this state, the ultrasonic wave generator 110 converts commercial power (AC 110V or AC 220V) applied from the outside into electrical energy of ultrasonic frequency. The ultrasonic oscillator 110 may convert the 50Hz to 60Hz commercial power input from the outside into an ultrasonic frequency of 15kHz to 40kHz and output the converted ultrasonic power.

The output of the ultrasonic wave generator 110 is converted and amplified into mechanical vibration energy by the vibration tool 120 and transferred to the bonding agent 15 applied between the bonding objects 10 (S11). That is, the electrical energy generated by the ultrasonic oscillator 110 is converted into mechanical vibration energy in the converter 121 of the vibration tool 120, and the amplitude is amplified through the booster 123. When the amplified vibration energy is transmitted 15,000 to 40,000 vibrations per second through the horn 125 to the bonding agent 15 of the bonding object 10, instantaneous frictional heat is generated at the bonding surface of the bonding object 10. The adhesive 15 is thermally cured by frictional heat, so that the bonding agent 15 and the electrode of the bonding object 10 have strong molecular bonds.

Subsequently, the temperature detecting unit 130 installed at the bonding agent 15 side detects the exothermic temperature generated by the bonding agent 15 due to the vibration energy and outputs it to the controller 150 (S12).

The controller 150 displays the temperature detected by the temperature detecting unit 130 through the display unit 140 and compares the detected temperature with a set reference temperature (S13). If the detected temperature is different from the set reference temperature, the controller 150 variably controls the output of the ultrasonic wave generator 110 according to the set control program such that the detected temperature approaches the reference temperature (S14 and S15). Herein, the controller 150 may vary the output by controlling at least one of the frequency, amplitude, and pulse width of the ultrasonic wave when the output of the ultrasonic wave generator 110 is variably controlled.

For example, when the detected temperature is lower than the set reference temperature, the controller 150 may increase the amplitude of the ultrasonic wave output from the ultrasonic wave generator 110 by a size corresponding to the error temperature, and the detected temperature may be higher than the set reference temperature. In this case, the amplitude of the ultrasonic waves output from the ultrasonic wave generator 110 may be reduced by a size corresponding to the error temperature.

As described above, in the present invention, when the temperature of the object to be bonded 10 is directly detected instead of the temperature of the vibrating tool 120 and the temperature of the object to be bonded coincides with a reference temperature which is a desired temperature (S14), the controller 150 ) Resets the output control value of the ultrasonic wave generator 110 to an initial value (S15).

Subsequently, the controller 150 controls the output of the ultrasonic wave generator 110 by using the output control value optimized in the step S15, thereby enabling the bonding object 10 to be accurately bonded at a desired temperature (S17).

5 is a view showing a junction temperature optimization device in the bonding equipment according to another embodiment of the present invention, the optimization device is a power supply unit 210, fusion tool 220, temperature detection means 230, display unit 240 And a controller 250.

The power supply unit 210 converts the commercial power (AC 110V or AC 220V) applied from the outside into the required voltage or current according to the control signal and outputs the converted voltage or current. The power supply unit 210 may selectively operate according to a predetermined control signal to supply power or to change an output current.

The welding tool 220 is heated to a high temperature according to the power applied from the power supply unit 210 to pressurize the bonding object 10 to be bonded to be thermally compressed. The welding tool 220 may include a welding tip 221 for thermocompression bonding the bonding object 10 and a heater 225 for heating the welding tip.

Here, the bonding agent 15 as shown in FIG. 3 may be applied or disposed between the bonding objects 10. The heat is transferred to the bonding agent 15 applied between the bonding objects 10 according to the pressure of the welding tool 220, and the connecting particles 15b in the bonding agent 15 are melted by the conducted heat to bond the bonding object ( Each electrode of 10) is fused in contact with the surface. Of course, the polymer resin cures according to the heat generated. That is, when heat is applied to the bonding agent 15, curing of the polymer resin and melting of the connecting particles 15b may be simultaneously performed.

The temperature detecting means 230 is disposed between the bonding objects 10 to directly detect the exothermic temperature generated by the bonding agent 15 by the conductive heat. The temperature detecting means 230 may be a thermocouple or a semiconductor sensor.

The display unit 240 may be configured as an LED (7-segment) or an LCD that displays at least one of a temperature detected by the temperature detecting unit 230 and a waveform of electrical energy output from the power supply unit 210. .

The controller 250 compares the temperature detected by the temperature detecting means 230 with the set reference temperature, and variably controls the output of the power supply 210 so that the detected temperature is close to the reference temperature. If it is equal to the reference temperature, the output of the power supply unit 210 is reset to the initial control value. Herein, when the control unit 250 variably controls the output of the power supply unit 210, the control unit 250 may control at least one of a current, a voltage, and on / off of the power source to vary the output. For example, the control unit 250 increases the current or voltage output from the power supply unit 210 to the welding tool 220 when the temperature detected from the bonding agent 15 is lower than the set reference temperature. This reduces the current or voltage output to the tool 220.

Here, the optimization apparatus includes an input unit 260 for inputting various setting values or commands, driving means 270 for moving the welding tool 220 up and down according to a control signal of the controller 250, and the welding. A memory device (not shown) may be further included to store and reuse a power change history over time of the tool 220. The memory device stores the output change history according to the time of the fusion tool 220 at a specific welding target, and when reworking the same welding target, the stored output change history can be used as it is to easily reproduce the desired temperature without detecting the temperature. Can be.

In this way, when the bonding object 10 is bonded using the bonding agent 15, the connection particles 15b of the bonding agent 15, which are present between the electrodes of the bonding object 10, are bonded according to the heat of conduction. Melted and fused in contact with each electrode of the object to be bonded 10. Of course, the polymer resin cures according to the heat generated. That is, when heat is applied to the bonding agent 15, curing of the polymer resin and melting of the connecting particles 15b may be simultaneously performed.

The application of heat means that an object kept at a high temperature in contact with the bonding agent 15 to heat the bonding agent 15, and the application of the heat includes a predetermined pressure. By the application of the heat, the temperature of the bonding agent 15 is raised above the melting temperature and the curing temperature of the polymer resin.

Thus, when the bonding object 10 is bonded by the bonding agent 15, the temperature of the bonding agent 15 is detected through the temperature detection means 230 arrange | positioned at the bonding agent 15 side. The controller 250 displays the temperature detected by the temperature detecting means 230 in a number or graph on the display unit 240, and simultaneously compares the detected temperature with a set reference temperature, and detects the temperature as the reference temperature. The output of the power supply 210 is controlled to be variable according to a set control program.

FIG. 6 is a flowchart illustrating a process of optimizing a junction temperature in the bonding apparatus of FIG. 5, and will be described with reference to the accompanying drawings.

First, the bonding object 10 is located on the support 201 located below the welding tool 220, and the temperature detecting means 230 for detecting the temperature of the bonding agent 15 between the bonding objects 10. This is arranged.

In such a state, the power supply unit 210 receives a commercial power source (AC 110V or AC 220V) from the outside, converts into a required voltage according to the control signal of the control unit 250 to the internal heater 225 of the welding tool 220 ). The welding tool 220 is heated to a high temperature according to the output of the power supply unit 210 (S21). Here, the output of the power supply unit 210 will follow the initial value set in the control unit 250.

As such, the fusion tool 220 is lowered and pressed to the bonding object 10 by a predetermined driving means 270 in a state of being heated to a predetermined temperature. In the bonding object 10, the connecting particles 15b of the bonding agent 15 are melted by heat conducted from the fusion tool 220, and the bonding agent 15 is thermally cured to thereby connect the connecting particles 15b of the bonding agent 15. ) And the electrode of the object to be bonded 10 is made a strong molecular bond (S22).

At this time, the temperature detecting means 230 installed on the bonding agent 15 side detects the exothermic temperature generated by the bonding agent 15 due to the conductive heat and outputs it to the controller 250 (S23).

The controller 250 displays the temperature detected by the temperature detecting unit 230 through the display unit 240 and compares the detected temperature with a set reference temperature (S24). If the detected temperature is different from the set reference temperature, the controller 250 variably controls the output of the power supply unit 210 according to the set control program such that the detected temperature approaches the reference temperature (S25 and S26). Herein, the controller 250 may vary the output by controlling at least one of current, voltage, and on / off when variably controlling the output of the power supply unit 210.

For example, when the detected temperature is lower than the set reference temperature, the controller 250 may increase the amount of current output from the power supply unit 210 by a magnitude corresponding to the error temperature, and when the detected temperature is higher than the set reference temperature, the power supply may be increased. The amount of current output from the supply unit 210 may be reduced by a size corresponding to the error temperature.

When the bonding object 10 is fused in the above, the fusion tool 220 is raised again by the driving means 270.

As described above, in the present invention, when the temperature of the object to be bonded 10 is directly detected instead of the temperature of the fusion tool 220, when the temperature of the object to be bonded 10 is equal to a reference temperature (S25), the controller 250 is used. ) Resets the output control value of the power supply unit 210 to an initial value (S26).

Thereafter, the controller 250 may control the output of the power supply unit 210 using the optimized output control value, thereby accurately bonding the bonding object 10 to a desired temperature (S28).

Thus, in the present invention, by installing the temperature detection means in the object to be bonded, and by bonding the sample once, it is possible to obtain an optimized output value for realizing the temperature of the desired bonding agent, the output value is used as it is in the subsequent bonding process thermometer It is possible to bond the freely joined object to a desired temperature.

Such a junction temperature optimization device and method are not limited to the configuration and manner of operation of the embodiments described above. The above embodiments may be configured such that various modifications may be made by selectively combining all or part of the embodiments.

10: bonding target 15: bonding agent
15a: polymer resin 15b: connection particles
110: ultrasonic wave generator 120: vibration tool
130: temperature detection means 140: display unit
150: control unit 210: power supply unit
220: fusion tool 225: heater
230: temperature detection means 250: control unit

Claims (9)

An ultrasonic oscillator for converting a commercial power applied from the outside into electric energy of an ultrasonic frequency and outputting the electric energy;
A vibration tool for converting and amplifying electrical energy applied from the ultrasonic wave oscillator into mechanical vibration energy and transferring the electrical energy to a bonding agent located between the bonding objects;
Temperature detecting means applied to the bonding side and detecting an exothermic temperature generated due to vibration energy in the bonding agent; And
A controller for comparing the detected temperature with the set reference temperature by the temperature detecting means and variably controlling the output of the ultrasonic oscillator so that the detected temperature is close to the reference temperature, and storing the variable controlled output according to time; Include,
The bonding agent, an insulating polymer resin; And conductive connection particles formed in the insulating polymer resin and in contact with at least one of the bonding objects.
delete The method according to claim 1,
The control unit is a bonding device having a junction temperature optimization device for varying the output by controlling at least one of the frequency, amplitude and pulse width of the ultrasonic wave output from the ultrasonic oscillator.
A power supply unit for converting a commercial power source applied from the outside into a required voltage or current according to a control signal and outputting the converted voltage or current;
A welding tool heated to a heating temperature set according to the power input from the power supply unit to pressurize and apply heat to the bonding agent applied between the bonding objects;
Temperature detecting means applied to the bonding side and detecting an exothermic temperature generated due to vibration energy in the bonding agent; And
The temperature detected by the temperature detecting means is compared with the set reference temperature, and the heating temperature is variably controlled by controlling the power supplied to the welding tool so that the detected temperature is close to the reference temperature. Bonding equipment having a junction temperature optimization device comprising a; control unit for storing the power output.
The vibration tool converts the ultrasonic waves input from the outside into vibration energy, and applying the vibration energy to the bonding agent applied between the bonding objects;
Detecting an exothermic temperature generated in the binder due to the vibration energy;
Comparing the detected temperature with a set reference temperature; And
And variably controlling the output of the ultrasonic wave applied to the vibration tool such that the detected temperature approaches a reference temperature.
In the comparing step, when the detected temperature is equal to the set reference temperature, the junction temperature optimization method in the bonding equipment to set the output value of the ultrasonic wave corresponding to the detected temperature to the initial value.
The method according to claim 5,
The variable control step, the junction temperature optimization method in the joining equipment for variable control of at least one of the frequency, amplitude, and pulse width of the ultrasonic wave.
delete The welding tool is heated to a heating temperature set according to the power applied from the outside to press the adhesive applied between the bonding object;
Detecting an exothermic temperature generated in the binder according to the pressurization;
Comparing the detected temperature with a set reference temperature; And
And varying a heating temperature by controlling a power supplied to the welding tool such that the detected temperature is close to a reference temperature.
The method according to claim 8,
In the comparing step, when the detected temperature is equal to the set reference temperature, the junction temperature optimization method in the bonding equipment to set the output value corresponding to the heating temperature as the initial control value.

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