KR101271172B1 - Conductive composition and electrode for touch panel - Google Patents

Abstract

Silver, a binder resin and a hardening | curing agent, The said binder resin is an epoxy resin, The said hardening | curing agent is provided with the electrically conductive composition which is a radical type photoinitiation compound, a peroxide type compound, or a combination of at least 1 sort (s).

Description

Electroconductive composition and the electrode for touch panels manufactured from the same {CONDUCTIVE COMPOSITION AND ELECTRODE FOR TOUCH PANEL}

It relates to a conductive composition and an electrode for a touch panel produced therefrom.

Various electronic devices essentially include conductive components, which must be highly tacky and maintain high conductivity when connected with other conductive or non-conductive components. Therefore, research has been conducted to simultaneously provide excellent adhesiveness and conductive properties to the conductive paste composition for producing conductive parts. On the other hand, they require a high temperature in the manufacturing process, there is a difficulty in the process.

One embodiment of the present invention is to provide a conductive composition that is excellent in adhesion to various substrates, and can implement low electrical resistance properties.

Another embodiment of the present invention is to provide an electrode for a touch panel manufactured from the conductive composition.

One embodiment of the present invention comprises a silver, a binder resin and a curing agent, the binder resin is an epoxy resin, the curing agent provides a conductive composition is a radical-based photopolymerization initiating compound, a peroxide-based compound or at least one combination thereof do.

The binder resin may further include a polyester resin.

The conductive composition is 100 parts by weight of silver; 0.5 to 25 parts by weight of an epoxy resin; 0.1 to 14.5 parts by weight of polyester resin; And 0.01 to 7.5 parts by weight of a curing agent.

The radical photopolymerization initiation compound is benzophenone, benzyl dimethyl ketal, 2,2'-azobis (2-methylpropionitrile), 1-hydroxycycloletgilphenyl ketone, 2-hydroxy-2-methyl-1- Phenylpropan-1-one, 1- [4- (2-hydroxyethoxy) -phenyl] -2-hydroxy-2-methyl-1-propan-1-one, 2-methyl-1- [4- (Methylthio) phenyl] -2-morpholinopropane-1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone, 2,2-dimethoxy-1, 2-diphenylethanone, 4- (2-hydroxyethoxy) phenyl- (2-hydroxy-2-propyl) ketone, 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide, bis (2 , 6-dimethoxybenzoyl) -2,4,4-trimethylpentylphosphineoxide, bis (2,4,6-trimethylbenzoyl) -phenylphosphineoxide or combinations thereof.

The peroxide curing agent is acetylacetone peroxide, cyclohexanone peroxide, methylcyclohexanone peroxide, methyl ethyl ketone peroxide, 1,1-bis (t-butylperoxy) cyclohexane, 1,1-bis ( t-hexylperoxy) cyclohexane, 1,1-bis (t-hexylperoxy) -3,3,5-trimethylcyclohexane, n-butyl 4,4-bis (t-butylperoxy) valerate, 1,1-bis (t-butylperoxy) -3,3,5-trimethylcyclohexane, 2,2-bis (t-butylperoxy) butane, 2,2-bis (4,4-di-t Butyl peroxycyclohexyl) propane, t-butyl hydroperoxide, cumene hydroperoxide, diisopropylbenzene hydroperoxide, t-hexyl hydroperoxide, p-methane hydroperoxide, 1,1,3,3 Tetramethylbutyl hydroperoxide, t-butyl cumyl peroxide, Dt-butyl peroxide, α, α'-bis (t-butylperoxy) diisopropylbenzene, dicumyl peroxide, 2,5- Methyl-2,5-bis (t-butylperoxy) hexane, 2,5-dimethyl-2,5-bis (t-butylperoxy) hex-3-cin, t-butylperoxy-3,5, 5-trimethyl hexanoate, α, α'-bis (neodecanoylperoxy) isopropylbenzene, cumyl peroxyneodecanoate, 1-cyclohexyl-1-methylethyl peroxy neodecanoate, 1- Cyclohexyl-1-methylethyl peroxy-2-ethylhexanoate, 2,5-dimethyl-2,5-bis (2-ethylhexanoylperoxy) hexane, 2,5-dimethyl-2,5-bis (Benzoylperoxy) hexane, m-toluoyl peroxide, benzoyl peroxide, isobutyryl peroxide, lauroyl peroxide, stearol peroxide, succinic acid peroxide, 3,3,5, -trimethylhexanoyl peroxide Oxide, di-2-ethoxyethyl peroxy peroxide, diisopropyl peroxy peroxide, di-3-methoxybutyl peroxide, di-n-propyl peroxy dicarbonate, di-2-ethylhexyl peroxy Dicarbonate, bis (3-methyl-3- Methoxybutyl) peroxy dicarbonate, bis (4-t-butylcyclohexyl) peroxy dicarbonate, t-butyl peroxy acetate, t-butyl peroxy 2-ethylhexyl monocarbonate, lauryl peroxide, t- Butyl peroxy isobutyrate, t-butyl peroxy laurate, t-butyl peroxy neodecanoate, t-butyl peroxy 2-ethyl hexanoate, t-butyl peroxy pivalate, t-butyl peroxy benzo T-butyl peroxy m-toluate, t-butyl peroxy m-benzoate, t-hexyl peroxy isopropyl monocarbonate, t-hexyl peroxy neodecanoate, t-hexyl peroxy 2-ethyl hexanoate, t-hexyl peroxy pivalate, t-hexyl peroxy benzoate, 1,1,3,3-tetramethylbutyl peroxy neodecanoate, 1,1,3,3-tetra Methylbutyl peroxy 2-ethyl hexanoate, or a combination thereof.

Specifically, the epoxy resin may be bisphenol-A or bisphenol-F type or a hydrogenated polymer resin thereof.

The epoxy resin may be one in which a side chain obtained by ring-opening polymerization of caprolactone is introduced into the repeating unit.

The weight average molecular weight of the epoxy resin may be 10,000 to 100,000.

The weight average molecular weight of the polyester resin may be 3,000 to 50,000.

The conductive composition may further include a solvent.

The solvent may be a ketone solvent, an alcohol solvent, a glycol ether solvent, an ester solvent, or a combination of at least one thereof.

The silver has an average particle size of 0.1 to 10㎛.

The silver may be contained in a mixture of silver and alloyable metals, metal nanoparticles, metal salts, organometallic compounds, or a combination thereof.

The curing temperature of the conductive composition may be 40 ℃ to 400 ℃.

Another embodiment of the present invention provides an electrode for a touch panel manufactured from the conductive composition.

The conductive composition may have excellent adhesion with various substrates and implement low electrical resistance characteristics.

Hereinafter, embodiments of the present invention will be described in detail. However, it should be understood that the present invention is not limited thereto, and the present invention is only defined by the scope of the following claims.

In one embodiment of the present invention, there is provided a conductive composition comprising silver, a binder resin and a curing agent.

The binder resin may be an epoxy resin.

The said hardening | curing agent is a radical type photoinitiator compound, a peroxide type compound, or a combination of at least 1 sort (s) of these.

The conductive composition is a conductive component such as an electronic device, a semiconductor device, or an IT device, and may be used as a composition for forming a component such as an electrode, a support member, and wire bonding. For example, the conductive composition may be used for forming an electrode of a touch panel.

The binder resin may further include a polyester resin.

Hereinafter, each component of the said conductive composition is explained in full detail.

The silver (Ag) may be used in the form of a powder. Silver (Ag) used as a known conductive composition can be used without limitation. For example, the spherical powder, the plate-shaped powder, or a mixture of the two having optimal resistance values may be used in consideration of the resistance characteristics of the conductive wires. The average diameter of the silver (Ag) particles may be about 0.1 to 10㎛, preferably 1 to 5㎛.

The silver (Ag) may be used as a mixture of metals alloyable with silver, metal nanoparticles thereof, metal salts, organometallic compounds or combinations thereof. Examples of metals alloyable with silver are Au, Pd, Pt, Cu and Al, and the like, and may also include alloys of these metals, and may be salts or organometallic compounds that are reduced to these metals upon firing.

The epoxy resin may be used without limitation, a material known as an epoxy resin generally used as a binder of the conductive composition. For example, a polymer having a structural unit of bisphenol-A type, a polymer having a structural unit of bisphenol-A and bisphenol-F type, a polymer having a structural unit of bisphenol-A and bisphenol-S type, hydrogenated ( hydrogenated) polyhydroxyether polymers having a-glycol, such as bisphenol-A and / or bisphenol-F and / or bisphenol-S, brominated epoxy, Phosphorus-based epoxy, caprolactone-modified epoxy, or combinations of at least one thereof. Moreover, although a side chain can also be introduce | transduced into a structural unit repeated as needed, for example, a caprolactone can be introduce | transduced by ring-opening-polymerization. The weight average molecular weight of the epoxy resin may be about 10,000 to about 100,000, preferably about 50,000 to about 70,000.

It may be desirable to minimize the content of the epoxy resin in terms of the amount of the resin in consideration of the electrical properties of the conductive composition. However, the epoxy resin may be included in an amount of about 0.5 to about 25 parts by weight, and preferably about 3 to about 10 parts by weight, relative to 100 parts by weight of silver to secure adhesion and reliability with the substrate.

The polyester resin can be used without limitation, a material known as a polyester resin generally used as a binder of the conductive composition. Such polyester resins include saturated polyester resins and unsaturated polyester resins, and both may be used in combination. Polyester resin is made by condensation reaction of polyhydric alcohol and polyhydric organic acid, and does not limit the specific structure. The weight average molecular weight of the polyester resin may be 3,000 to 50,000, preferably 5,000 to 10,000.

The polyester resin may be included in an amount of about 0.1 to about 14.5 parts by weight, and preferably about 1 to about 6 parts by weight, relative to 100 parts by weight of silver.

Radical-based photopolymerization initiation compounds that can be used as the curing agent can be used without any known photoinitiator generally, for example, benzophenone, benzyldimethylke, 2,2'-azobis (2-methylpropionitrile ), 1-hydroxycycloretylphenyl ketone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1- [4- (2-hydroxyethoxy) -phenyl] -2-hydroxy 2-methyl-1-propane-1-one, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropane-1-one, 2-benzyl-2-dimethylamino-1 -(4-morpholinophenyl) -butanone, 2,2-dimethoxy-1,2-diphenylethanone, 4- (2-hydroxyethoxy) phenyl- (2-hydroxy-2-propyl ) Ketone, 2,4,6-trimethylbenzoyl-diphenyl-phosphineoxide, bis (2,6-dimethoxybenzoyl) -2,4,4-trimethylpentylphosphineoxide, bis (2,4,6 -Trimethylbenzoyl) -phenylphosphine oxide or a combination thereof.

Peroxide-based curing agents that can be used as the curing agent may be used without limitation, generally known peroxide-based curing agent, for example, acetylacetone peroxide, cyclohexanone peroxide, methylcyclohexanone peroxide, methyl ethyl ketone Peroxide, 1,1-bis (t-butylperoxy) cyclohexane, 1,1-bis (t-hexylperoxy) cyclohexane, 1,1-bis (t-hexylperoxy) -3,3, 5-trimethylcyclohexane, n-butyl 4,4-bis (t-butylperoxy) valerate, 1,1-bis (t-butylperoxy) -3,3,5-trimethylcyclohexane, 2,2 -Bis (t-butylperoxy) butane, 2,2-bis (4,4-di-t-butylperoxycyclohexyl) propane, t-butyl hydroperoxide, cumene hydroperoxide, diisopropylbenzene hydride Loperoxide, t-hexyl hydroperoxide, p-methane hydroperoxide, 1,1,3,3-tetramethylbutyl hydroperoxy , t-butyl cumyl peroxide, Dt-butyl peroxide, α, α'-bis (t-butylperoxy) diisopropylbenzene, dicumyl peroxide, 2,5-dimethyl-2,5-bis (t -Butylperoxy) hexane, 2,5-dimethyl-2,5-bis (t-butylperoxy) hex-3-cin, t-butylperoxy-3,5,5-trimethyl hexanoate, α, α'-bis (neodecanoylperoxy) isopropylbenzene, cumyl peroxyneodecanoate, 1-cyclohexyl-1-methylethyl peroxy neodecanoate, 1-cyclohexyl-1-methylethyl peroxy 2-ethylhexanoate, 2,5-dimethyl-2,5-bis (2-ethylhexanoylperoxy) hexane, 2,5-dimethyl-2,5-bis (benzoylperoxy) hexane, m- Toluoyl peroxide, benzoyl peroxide, isobutyryl peroxide, lauroyl peroxide, stearol peroxide, succinic acid peroxide, 3,3,5, -trimethylhexanoyl peroxide, di-2-ethoxyethyl Peroxy peroxide, diisopropyl peroxy peroxsai , Di-3-methoxybutyl peroxide, di-n-propyl peroxy dicarbonate, di-2-ethylhexyl peroxy dicarbonate, bis (3-methyl-3-methoxybutyl) peroxy dicarbonate, bis (4-t-butylcyclohexyl) peroxy dicarbonate, t-butyl peroxy acetate, t-butyl peroxy 2-ethylhexyl monocarbonate, lauryl peroxide, t-butyl peroxy isobutyrate, t-butyl per Oxylaurate, t-butyl peroxy neodecanoate, t-butyl peroxy 2-ethyl hexanoate, t-butyl peroxy pivalate, t-butyl peroxy benzoate, t-butyl peroxy m-tolu Toluate, t-butyl peroxy m-benzoate, t-hexyl peroxy isopropyl monocarbonate, t-hexyl peroxy neodecanoate, t-hexyl peroxy 2-ethyl hexanoate, t-hexyl Peroxy pivalate, t-hexyl peroxy benzoate, 1,1,3,3-tetramethylbutyl peroxy neodecanoe Agent, can be 1,1,3,3-tetramethylbutyl peroxy-2-ethylhexanoate, or any combination thereof.

The content of the curing agent may be included in about 0.01 to about 7.5 parts by weight of the curing agent relative to 100 parts by weight of silver, preferably from about 0.1 to about 3 parts by weight.

The conductive composition may be prepared in the form of a paste further including a solvent. The solvent is, for example, cyclohexanone, methyl ethyl ketone, methyl isobutyl ketone, acetone and derivatives thereof as ketone solvent, methanol, ethanol, buntanol, benzyl alcohol and derivatives thereof as alcohol solvent, Ethylene glycol, diethylene glycol, propylene glycol, dipropylene glycol and derivatives thereof as glycol ether solvents, ethyl lactate, dibasic esters and derivatives thereof as ester solvents, the use of one particular solvent It is also possible to use a mixture of the solvents mentioned in consideration of the printing characteristics and the drying characteristics without limiting.

The amount of the solvent may be used 8 to 25 parts by weight relative to 100 parts by weight of silver (Ag).

The conductive composition having the formulation as described above can exhibit excellent adhesion with a substrate such as a transparent conductive substrate or film while using a low resin content due to the epoxy resin and the polyester resin having excellent adhesion with various substrates. Due to its low electrical resistance characteristics, it has excellent reliability. In addition, the conductive composition can adjust the curing temperature according to the curing agent decomposition temperature, relatively low plastic curing is possible.

The conductive composition may be applied to or printed on a conductive or non-conductive film or substrate, and then heated and / or cured to form a conductive pattern having excellent adhesion and conductivity.

The conductive composition may have a curing temperature of 40 ℃ to 400 ℃. When manufactured in a low temperature type it may be from 60 ℃ to 150 ℃, when manufactured in a high temperature type may be 150 ℃ to 300 ℃. Since the starting temperature of the curing agent varies from room temperature to high temperature, it is possible to freely mix the curing temperature according to the desired curing temperature conditions.

Hereinafter, specific embodiments of the present invention will be described. However, the embodiments described below are merely for illustrating or explaining the present invention in detail, and thus the present invention is not limited thereto.

Example

Example  1 to 18

To prepare a composition according to the composition ratio (% by weight) described in Table 1 and Table 2.

The components used in this example are as follows.

Silver powder: Silver powder with an average diameter of particles of 1.5 mu m, 2.0 mu m and 5.0 mu m

Epoxy Resin: Bisphenol-A

Polyester resin: Noru Chemical, Chemstol-3355

Curing Agent: Benzoyl Peroxide

Solvent: Ethyl Carbitol Acetate and Butyl Cellulsolve Acetate in 1: 1 Weight Ratio

Specimen Manufacturing

Each conductive composition prepared according to the composition of Table 1 on the ITO-PET film substrate using a trial composed of SUS (400 mesh), wire diameter 23 μm, emulsion 12 μm and Shore A hardness 80 at 60 mm / sec. After preparing the specimen by printing, the specimen was prepared by drying at 150 ° C. for 30 minutes using IR Oven.

Property evaluation

Screen printability rating:

Patterns of length 10 cm, width 100 um, 80 um, 60 um, and 50 um were printed, respectively, and measured whether the pattern contracted or spread during printing. Each was evaluated after 1, 10, 50, 100, 200 and 300 consecutive prints.

When shrinkage or spread of 15% or more occurs, the defect is judged to be excellent in the case of shrinkage or spread of less than 15%, and the results are described in Table 1 below.

O: Excellent

X: bad

Wire resistance rating:

Both ends of the printed specimen having a width of 100 μm and a length of 10 cm were measured in the line resistance using an insulation resistance measuring instrument, and are shown in Table 1 below.

Resistivity

After printing and drying a 2cm * 1cm rectangular shape, the sheet resistance is measured using four probes, the thickness is measured using a micrometer, and then calculated using the following formula.

Specific resistance, ρ [Ωcm] = sheet resistance [Ω / □] * thickness (cm)

Peelability:

Print a 2cm * 1cm rectangular shape and dry it with a knife to make a square of 100 squares with horizontal and vertical 1mm intervals. Lay the tape (3M Company 670) on it and stick it, and pull it out at 45 ° angle. After desorption, the number of specimens 1 mm apart from each other attached to the tape was counted, and the adhesion was evaluated.

Excellent when the number of removed specimens, such as tape, is zero: O

If the number of detached specimens, such as tape, is more than one, evaluate as bad: X

Weatherability:

After the print dried sample was maintained at 85 ° C./85% high temperature and high humidity for 5 days, the peelability evaluation was performed under the same conditions as the above peelability evaluation.

division Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Example 8 Example 9 Conductivity
Paste
Furtherance Epoxy resin 6.3 g 6.8 g 7.2 g 6.3 g 6.8 g 7.2 g 6.3 g 6.8 g 7.2 g Polyester resin - - - - - - - - Hardener 1.7 g 1.8 g 1.9 g 1.7 g 1.8 g 1.9 g 1.7 g 1.8 g 1.9 g solvent 21.6 g 16.1 g 10.5 g 21.6 g 16.1 g 10.5 g 21.6 g 16.1 g 10.5 g Defoaming agent 0.4 g 0.4 g 0.4 g 0.4 g 0.4 g 0.4 g 0.4 g 0.4 g 0.4 g Silver powder
(1.5 μm) 70.0 g 75.0 g 80.0 g - - - - - - Silver powder
(2 μm) - - 70.0 g 75.0 g 80.0 g - - - Silver powder
(5.0 μm) - - - - - - 70.0 g 75.0 g 80.0 g Evaluation results Screen printability 1 time O O O O O O O O O 10 times O O O O O O O O O 50 times O O O O O O O O O 100 times
O O O O O O O O O 200 times O O O O O O O O O 300 times O O O O O O O O O Wire resistance 0.5 Ω Resistivity 2.0 * 10-5 (Ω㎝) Peelability O O O O O O O O O Weatherability O O O O O O O O O

division Example 10 Example 11 Example 12 Example 13 Example 14 Example 15 Example 16 Example 17 Example 18 Conductivity
Paste
Furtherance Epoxy resin 5.0 g 5.4 g 5.8 g 5.0 g 5.4 g 5.8 g 5.0 g 5.4 g 5.8 g Polyester resin 1.3 g 1.4 g 1.4 g 1.3 g 1.4 g 1.4 g 1.3 g 1.4 g 1.4 g Hardener 1.7 g 1.8 g 1.9 g 1.7 g 1.8 g 1.9 g 1.7 g 1.8 g 1.9 g solvent 21.6 g 16.1 g 10.5 g 21.6 g 16.1 g 10.5 g 21.6 g 16.1 g 10.5 g Defoaming agent 0.4 g 0.4 g 0.4 g 0.4 g 0.4 g 0.4 g 0.4 g 0.4 g 0.4 g Silver powder
(1.5 μm) 70.0 g 75.0 g 80.0 g - - - - - Silver powder
(2 μm) - - - 70.0 g 75.0 g 80.0 g - - - Silver powder
(5.0 μm) - - - - - - 70.0 g 75.0 g 80.0 g Evaluation results Screen printability 1 time O O O O O O O O O 10 times O O O O O O O O O 50 times O O O O O O O O O 100 times O O O O O O O O O 200 times O O O O O O O O O 300 times O O O O O O O O O Wire resistance 2.0Ω Resistivity 5.0 * 10-5 (Ωcm) Peelability O O O O O O O O O Weatherability O O O O O O O O O

The present invention is not limited to the above embodiments, but may be manufactured in various forms, and a person skilled in the art to which the present invention pertains has another specific form without changing the technical spirit or essential features of the present invention. It will be appreciated that the present invention may be practiced as. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

Claims (14)

(1) a mixture of (i) silver and (ii) a metal alloyable with silver, metal nanoparticles, metal salts, organometallic compounds, or combinations thereof;
(2) binder resins;
(3) curing agents; And
(4) defoamers;
Lt; / RTI >
The metal is Au, Cu, Pd, Pt, or a combination thereof,
The binder resin is an epoxy resin, and the epoxy resin is a polyhydroxyether polymer having an alpha-glycol at its end, and a hydrogenated alpha-glycol group. Polyhydroxyether type (polyhydroxyether) having a polymer, bromine-based epoxy, phosphorus-based epoxy, caprolactone-modified epoxy or a combination of at least one thereof,
The curing agent is a radical photopolymerization start compound, a peroxide compound or a combination of at least one thereof
Conductive composition. The method of claim 1,
Wherein the binder resin further comprises a polyester resin
Conductive composition. The method of claim 2,
100 parts by weight of the mixture of (i) silver and (ii) metal alloyable with silver, metal nanoparticles, metal salts, organometallic compounds, or combinations thereof;
0.5 to 25 parts by weight of the epoxy resin;
0.1 to 14.5 parts by weight of the polyester resin; And
0.01 to 7.5 parts by weight of the curing agent
Conductive composition. The method of claim 1,
The radical photopolymerization initiation compound is benzophenone, benzyl dimethyl ketal, 2,2'-azobis (2-methylpropionitrile), 1-hydroxycycloletgilphenyl ketone, 2-hydroxy-2-methyl-1- Phenylpropan-1-one, 1- [4- (2-hydroxyethoxy) -phenyl] -2-hydroxy-2-methyl-1-propan-1-one, 2-methyl-1- [4- (Methylthio) phenyl] -2-morpholinopropane-1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone, 2,2-dimethoxy-1, 2-diphenylethanone, 4- (2-hydroxyethoxy) phenyl- (2-hydroxy-2-propyl) ketone, 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide, bis (2 A conductive composition which is, 6-dimethoxybenzoyl) -2,4,4-trimethylpentylphosphineoxide, bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide, or a combination thereof. The method of claim 1,
The peroxide curing agent is acetylacetone peroxide, cyclohexanone peroxide, methylcyclohexanone peroxide, methyl ethyl ketone peroxide, 1,1-bis (t-butylperoxy) cyclohexane, 1,1-bis ( t-hexylperoxy) cyclohexane, 1,1-bis (t-hexylperoxy) -3,3,5-trimethylcyclohexane, n-butyl 4,4-bis (t-butylperoxy) valerate, 1,1-bis (t-butylperoxy) -3,3,5-trimethylcyclohexane, 2,2-bis (t-butylperoxy) butane, 2,2-bis (4,4-di-t Butyl peroxycyclohexyl) propane, t-butyl hydroperoxide, cumene hydroperoxide, diisopropylbenzene hydroperoxide, t-hexyl hydroperoxide, p-methane hydroperoxide, 1,1,3,3 Tetramethylbutyl hydroperoxide, t-butyl cumyl peroxide, Dt-butyl peroxide, α, α'-bis (t-butylperoxy) diisopropylbenzene, dicumyl peroxide, 2,5- Methyl-2,5-bis (t-butylperoxy) hexane, 2,5-dimethyl-2,5-bis (t-butylperoxy) hex-3-cin, t-butylperoxy-3,5, 5-trimethyl hexanoate, α, α'-bis (neodecanoylperoxy) isopropylbenzene, cumyl peroxyneodecanoate, 1-cyclohexyl-1-methylethyl peroxy neodecanoate, 1- Cyclohexyl-1-methylethyl peroxy-2-ethylhexanoate, 2,5-dimethyl-2,5-bis (2-ethylhexanoylperoxy) hexane, 2,5-dimethyl-2,5-bis (Benzoylperoxy) hexane, m-toluoyl peroxide, benzoyl peroxide, isobutyryl peroxide, lauroyl peroxide, stearol peroxide, succinic acid peroxide, 3,3,5, -trimethylhexanoyl peroxide Oxide, di-2-ethoxyethyl peroxy peroxide, diisopropyl peroxy peroxide, di-3-methoxybutyl peroxide, di-n-propyl peroxy dicarbonate, di-2-ethylhexyl peroxy Dicarbonate, bis (3-methyl-3- Methoxybutyl) peroxy dicarbonate, bis (4-t-butylcyclohexyl) peroxy dicarbonate, t-butyl peroxy acetate, t-butyl peroxy 2-ethylhexyl monocarbonate, lauryl peroxide, t-butyl Peroxy isobutyrate, t-butyl peroxy laurate, t-butyl peroxy neodecanoate, t-butyl peroxy 2-ethyl hexanoate, t-butyl peroxy pivalate, t-butyl peroxy benzoate t-butyl peroxy m-toluate, t-butyl peroxy m-benzoate, t-hexyl peroxy isopropyl monocarbonate, t-hexyl peroxy neodecanoate, t-hexyl peroxy 2 Ethyl hexanoate, t-hexyl peroxy pivalate, t-hexyl peroxy benzoate, 1,1,3,3-tetramethylbutyl peroxy neodecanoate, 1,1,3,3-tetramethyl A conductive composition that is butyl peroxy 2-ethyl hexanoate, or a combination thereof. delete The method of claim 1,
The epoxy resin is a conductive composition wherein the side chain of the ring-opening polymerization of caprolactone is introduced into the repeating unit. The method of claim 1,
The weight average molecular weight of the epoxy resin is 10,000 to 100,000 conductive composition. The method of claim 2,
The weight average molecular weight of the polyester resin is 3,000 to 50,000 conductive composition. The method of claim 1,
The conductive composition further includes a solvent,
The said solvent is a ketone solvent, an alcohol solvent, a glycol ether solvent, an ester solvent, or these at least 1 sort (s) of these electrically conductive compositions. The method of claim 1,
The silver has an average particle size of 0.1 to 10㎛ conductive composition. delete The method of claim 1,
The conductive composition whose curing temperature of the said conductive composition is 40 degreeC-400 degreeC. The electrode for touch panels manufactured from the conductive composition of any one of Claims 1-5, 7-11, and 13.