KR101260960B1 - Device for inspecting section of substrate inspection method using the same - Google Patents

Device for inspecting section of substrate inspection method using the same Download PDF

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KR101260960B1
KR101260960B1 KR1020110041528A KR20110041528A KR101260960B1 KR 101260960 B1 KR101260960 B1 KR 101260960B1 KR 1020110041528 A KR1020110041528 A KR 1020110041528A KR 20110041528 A KR20110041528 A KR 20110041528A KR 101260960 B1 KR101260960 B1 KR 101260960B1
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substrate
cut surface
camera
illumination means
light
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KR20120123912A (en
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김기호
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주식회사 케이엔제이
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/958—Inspecting transparent materials or objects, e.g. windscreens
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1306—Details
    • G02F1/1309—Repairing; Testing

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  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

본 발명은 기판의 절단면 검사장치 및 방법에 관한 것으로서, 보다 상세하게는 카메라와 기판과 조명수단을 일직선상에 배치하여 기판의 두께를 통과한 광으로부터 절단면의 결함을 검사할 수 있는 기판의 절단면 검사장치 및 방법에 관한 것이다.
본 발명에 의한 기판의 절단면 검사장치는 기판의 두께방향 일측에 배치되는 카메라; 및 상기 기판의 두께방향 타측에 배치되는 조명수단;을 포함하며, 상기 기판의 절단면을 사이에 두고, 상기 카메라와 조명수단의 중심축은 일직선이 되도록 배치된다. The present invention relates to an apparatus and method for inspecting a cut surface of a substrate, and more particularly, to an apparatus and a method for inspecting a cut surface of a substrate, in which a camera, a substrate, and a lighting means are arranged in a straight line, Apparatus and method.
The apparatus for inspecting a cut surface of a substrate according to the present invention comprises: a camera disposed on one side in a thickness direction of a substrate; And illumination means disposed on the other side in the thickness direction of the substrate, the center axis of the camera and the illumination means being arranged in a straight line with a cut surface of the substrate interposed therebetween.

Description

기판의 절단면 검사장치 및 방법{DEVICE FOR INSPECTING SECTION OF SUBSTRATE INSPECTION METHOD USING THE SAME}BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a device for inspecting a cut surface of a substrate,

본 발명은 기판의 절단면 검사장치 및 방법에 관한 것으로서, 보다 상세하게는 카메라와 기판과 조명수단을 일직선상에 배치하여 기판의 두께를 통과한 광으로부터 절단면의 결함을 검사할 수 있는 기판의 절단면 검사장치 및 방법에 관한 것이다. The present invention relates to an apparatus and method for inspecting a cut surface of a substrate, and more particularly, to an apparatus and a method for inspecting a cut surface of a substrate, in which a camera, a substrate, and a lighting means are arranged in a straight line, Apparatus and method.

도 1을 참조하면, 평판 디스플레이 패널은 원판유리에서 필요한 크기로 절단하여 사용한다. 도 2와 같이 일반적으로 커팅휠(100)을 이용하여 기판을 절단하게 된다. Referring to FIG. 1, a flat panel display panel is cut to a required size in a disk glass and used. As shown in FIG. 2, the cutting wheel 100 is generally used to cut the substrate.

도 2에서 도면부호 10은 절단면이고, 20은 커팅휠(100)의 침투영역이고, d1은 커팅휠(100)의 침투깊이이다. In FIG. 2, reference numeral 10 denotes a cutting plane, 20 a penetration area of the cutting wheel 100, and d1 a penetration depth of the cutting wheel 100.

그러나 커팅휠(100)이 수명이 다한 경우에는 커팅이 정확히 되지 못하고 불량이 발생하게 된다. 따라서 커팅이 정확히 되는지 모니터링하기 위해서는 절단면을 검사해야 하는데, 기판이 얇고 면적이 커서 검사하기가 곤란하다. However, if the cutting wheel 100 has reached the end of its life, the cutting can not be accurately performed and a defect may occur. Therefore, it is necessary to inspect the cut surface in order to monitor whether or not the cutting is correctly performed. It is difficult to inspect the cut surface because the substrate is thin and large in area.

도 3은 절단면을 나타낸 것으로서, 제1침투영역(20a)은 커팅휠(100)이 설정된 침투깊이로 침투한 것이고, 제2침투영역(20b)은 커팅휠(100)이 설정된 침투깊이보다 더 깊게 침투한 것이며, 제3침투영역(20c)은 커팅휠(100)이 설정된 침투깊이보다 더 얇게 침투한 것이다. 따라서 제2침투영역(20b) 및 제3침투영역(20c)은 불량인 것이다. 3 shows a cutaway view in which the first penetration area 20a penetrates the set penetration depth of the cutting wheel 100 and the second penetration area 20b is set so that the cutting wheel 100 is deeper And the third penetration area 20c penetrates the cutting wheel 100 more thinly than the set penetration depth. Therefore, the second penetration area 20b and the third penetration area 20c are defective.

이와 같이 불량을 모니터링하기 위하여 종래에도 절단면 검사장치가 개시되었다. In order to monitor defects as described above, a cutting inspection apparatus has been disclosed.

도 4를 참조하면, 종래의 검사장치(100)는 기판(1)의 절단면(10)의 일측에 카메라(110)와 렌즈(120)를 위치시키고, 역시 기판의 절단면(10) 일측에 경사지게 조명수단(130)을 배치한다. 즉, 조명수단(130)에서 조사된 광이 절단면(10)을 통해 반사된 후 카메라(110)로 입사되는데, 이로부터 획득된 이미지를 분석하여 커팅휠의 침투 깊이가 일정한지 여부를 검사하는 것이다. 4, a conventional inspection apparatus 100 includes a camera 110 and a lens 120 placed on one side of a cut surface 10 of a substrate 1, Means 130 are arranged. That is, the light irradiated by the illumination means 130 is reflected through the cut surface 10 and then incident on the camera 110. The image obtained from the reflected light is analyzed to check whether the penetration depth of the cutting wheel is constant .

그러나 이와 같이 절단면으로부터 반사된 광을 이용하여 절단면을 검사하는 경우, 커팅휠의 침투 영역이 부각되지 않아 침투 깊이를 명확히 분별할 수 없다는 문제점이 있다. However, when the cut surface is inspected using the light reflected from the cut surface as described above, there is a problem that the penetration depth of the cutting wheel can not be clearly discriminated because the penetration area of the cut wheel is not highlighted.

본 발명은 상술한 문제점을 해결하기 위하여 안출된 것으로서, 본 발명의 목적은 카메라와 기판과 조명수단을 일직선상에 배치하여 기판의 두께를 통과한 광으로부터 절단면의 결함을 검사할 수 있는 기판의 절단면 검사장치 및 방법을 제공함에 있다. SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems, and it is an object of the present invention to provide a method of inspecting a defect of a cut surface from light passing through a thickness of a substrate by arranging a camera, And an inspection apparatus and method.

위와 같은 기술적 과제를 해결하기 위하여 본 발명에 의한 기판의 절단면 검사장치는 기판의 두께방향 일측에 배치되는 카메라; 및 상기 기판의 두께방향 타측에 배치되는 조명수단;을 포함하며, 상기 기판의 절단면을 사이에 두고, 상기 카메라와 조명수단의 중심축은 일직선이 되도록 배치된다. According to an aspect of the present invention, there is provided an apparatus for inspecting a cut surface of a substrate, the apparatus comprising: a camera disposed on one side of a thickness direction of the substrate; And illumination means disposed on the other side in the thickness direction of the substrate, the center axis of the camera and the illumination means being arranged in a straight line with a cut surface of the substrate interposed therebetween.

또한 상기 기판의 절단면 외측에는 상기 카메라가 배치되고, 상기 기판의 절단면의 반대면 외측에는 상기 조명수단이 배치되는 것이 바람직하다.It is preferable that the camera is disposed outside the cut surface of the substrate, and the illumination means is disposed outside the cut surface of the substrate.

또한 상기 조명수단은 상기 기판에 입사되는 광이 상기 기판의 두께보다 큰 폭으로 조사되도록 하는 것이 바람직하다. It is preferable that the illumination means irradiate the light incident on the substrate with a width larger than the thickness of the substrate.

본 발명에 의한 기판의 절단면 검사방법은 1) 기판의 절단면의 반대면에 광을 조사하는 단계; 및 2) 상기 기판의 두께를 통과하여 상기 절단면을 빠져 나오는 광을 촬상하여 절단면의 이미지를 획득하는 단계;를 포함한다. A method of inspecting a cut surface of a substrate according to the present invention comprises the steps of: 1) irradiating light on the opposite side of a cut surface of a substrate; And 2) imaging light passing through the thickness of the substrate and exiting the cut surface to obtain an image of the cut surface.

또한 상기 1)단계는 상기 기판에 입사되는 광이 상기 기판의 두께보다 큰 폭으로 조사되는 것이 바람직하다. In addition, it is preferable that the light incident on the substrate is irradiated at a width greater than the thickness of the substrate.

본 발명에 따르면, 카메라와 기판과 조명수단을 일직선상에 배치하여 기판의 두께를 통과한 광을 획득하여 절단면의 결함을 검사할 수 있는 효과가 있다. According to the present invention, the camera, the substrate, and the illumination means are disposed on a straight line to acquire the light having passed through the thickness of the substrate, and the defect on the cut surface can be inspected.

따라서 절단면의 결함을 부각시켜 정확한 검사를 할 수 있게 된다. Therefore, defects on the cut surface can be emphasized and accurate inspection can be performed.

도 1 및 도 2는 기판의 절단공정을 나타낸 것이다.
도 3은 기판의 절단면을 나타낸 것이다.
도 4 내지 도 7은 본 발명에 의한 검사장치의 구성 및 사용상태를 나타낸 것이다.
도 8은 본 발명에 의한 검사장치를 이용하여 획득된 절단면 영상이다. 1 and 2 show a cutting process of a substrate.
3 is a cross-sectional view of the substrate.
4 to 7 show the configuration and use state of the inspection apparatus according to the present invention.
8 is a sectional image obtained using the inspection apparatus according to the present invention.

이하, 첨부된 도면을 참조하여 본 발명에 의한 검사장치의 구성 및 작용을 설명한다. Hereinafter, the configuration and operation of the inspection apparatus according to the present invention will be described with reference to the accompanying drawings.

도 5 및 도 6을 참조하면, 본 발명에 의한 검사장치(200)는 기판(1)의 두께방향의 일측에 카메라(210)와 렌즈(220)를 배치하고, 타측에 조명수단(230)을 배치한다. 본 실시예에서 상기 카메라(210)는 라인CCD카메라이다. 5 and 6, the inspection apparatus 200 according to the present invention includes a camera 210 and a lens 220 disposed on one side of the substrate 1 in the thickness direction thereof and a lighting unit 230 . In the present embodiment, the camera 210 is a line CCD camera.

보다 구체적으로 설명하면, 상기 카메라(210)와 렌즈(220)는 절단면(10)측에 배치하고, 조명수단(230)은 절단면의 반대측에 배치한 것을 알 수 있다. More specifically, the camera 210 and the lens 220 are disposed on the side of the cut surface 10, and the illumination means 230 is disposed on the opposite side of the cut surface.

특히, 상기 카메라(210)와 렌즈(220)와 조명수단(230)과 기판(1)의 중심축은 일직선이 되도록 배치된 것을 알 수 있다. In particular, it can be seen that the center axis of the camera 210, the lens 220, the illumination means 230, and the substrate 1 are arranged in a straight line.

또한 기판(1)은 기립상태로 고정하고, 상기 카메라(210)와 조명수단(220)은 상하방향으로 스텝운동하면서 기판의 절단면 전체 영역을 순차적으로 검사한다. In addition, the substrate 1 is fixed in a standing state, and the camera 210 and the illuminating means 220 sequentially examine the whole area of the cut surface of the substrate while moving stepwise in the vertical direction.

도 7을 참조하여 본 발명에 의한 검사장치의 작동상태 및 검사방법을 설명한다. The operation state and inspection method of the inspection apparatus according to the present invention will be described with reference to FIG.

도시된 바와 같이, 조명수단(230)은 절단면(10)의 반대면을 통해 광을 기판의 두께방향으로 입사시킨다. 입사된 광(L1)은 기판(1)의 내부에서 전반사가 되어 절단면(10)을 통해 출사된다. 출사된 광(L2)은 렌즈(220)를 통해 카메라(210)로 입사되고, 이로부터 절단면(10)의 이미지를 획득할 수 있게 된다. As shown, the illumination means 230 allows light to enter the thickness direction of the substrate through the opposite surface of the cut surface 10. The incident light L1 is totally reflected within the substrate 1 and is emitted through the cut surface 10. The emitted light L2 is incident on the camera 210 through the lens 220, from which it is possible to obtain an image of the cut surface 10.

한편, 조명수단(230)의 광조사폭은 기판(1)의 두께보다 크게 하는 것이 전반사에 유리하다. On the other hand, the light irradiation width of the illumination means 230 is made larger than the thickness of the substrate 1, which is advantageous for total reflection.

도 8은 본 발명에 의한 검사장치(200)를 이용하여 획득된 절단면 이미지이다. 도시된 바와 같이, 본 발명에 의한 검사장치를 이용하여 획득된 이미지는 휠 침투영역(20) 및 침투깊이를 정확히 알 수 있다. 이와 같이 정확히 알 수 있는 휠 침투깊이가 일정한 경우, 정상적으로 절단된 것으로 판단할 수 있고, 이와 달리 휠 침투 깊이가 불규칙한 경우, 비정상적으로 절단된 것으로 판단된다. FIG. 8 is a cross-sectional image obtained using the inspection apparatus 200 according to the present invention. As shown in the figure, the image obtained using the inspection apparatus according to the present invention can accurately recognize the wheel penetration area 20 and the penetration depth. If the depth of penetration of the wheel can be accurately determined, it can be judged that the wheel has been cut normally. Otherwise, if the wheel penetration depth is irregular, it is judged that the wheel is cut abnormally.

200: 검사장치 210: 카메라
220: 렌즈 230: 조명수단200: inspection apparatus 210: camera
220: Lens 230: Lighting means

Claims (5)

기판의 절단면이 형성된 일측면 외측에 배치되는 카메라; 및
상기 기판을 사이에 두고 상기 카메라와 마주보도록 상기 기판의 타측면 외측에 배치되며, 상기 카메라와 중심축이 일직선이 되도록 배치되는 조명수단;을 포함하며,
상기 조명수단은 상기 기판의 타측면을 통해 상기 기판의 두께방향 내부로 광을 입사시키고,
입사된 상기 광은 상기 기판의 내부에서 전반사하면서 두께방향으로 통과하며,
상기 카메라는 상기 절단면이 형성된 일측면을 통해 출사된 광을 이용하여 상기 절단면의 이미지를 획득하는 것을 특징으로 하는 기판의 절단면 검사장치.

A camera disposed on one lateral side of the substrate on which the cut surface is formed; And
And illumination means disposed outside the other side of the substrate so as to face the camera with the substrate interposed therebetween, the illumination means being arranged so that the camera and the central axis are aligned with each other,
Wherein the illumination means is arranged to introduce light into the thickness direction of the substrate through the other side surface of the substrate,
The incident light passes through in the thickness direction while totally reflecting within the substrate,
Wherein the camera acquires an image of the cut surface using light emitted through a side surface of the cut surface.

삭제delete 제1항에 있어서,
상기 조명수단은 상기 기판에 입사되는 광이 상기 기판의 두께보다 큰 폭으로 조사되도록 하는 것을 특징으로 하는 기판의 절단면 검사장치.
The method according to claim 1,
Wherein the illumination means illuminates the substrate with light having a width greater than the thickness of the substrate.
1) 기판의 절단면이 형성된 일측면 외측에 카메라를 배치하고, 상기 기판을 사이에 두고 상기 카메라와 마주보도록 상기 기판의 타측면 외측에 조명수단을 배치하는 단계;
2) 상기 기판의 타측면을 통해 상기 기판의 두께방향 내부로 광을 입사시키는 단계; 및
3) 상기 기판의 내부를 전반사하면서 두께방향으로 통과하여 상기 절단면이 형성된 일측면을 통해 출사된 광을 이용하여 상기 절단면의 이미지를 획득하는 단계;를 포함하는 것을 특징으로 하는 기판의 절단면 검사방법.
1) disposing a camera on one lateral side of the substrate where the cut surface is formed, and placing illumination means outside the other side of the substrate so as to face the camera with the substrate interposed therebetween;
2) introducing light into the thickness direction of the substrate through the other side of the substrate; And
And 3) obtaining an image of the cut surface by using light emitted through one side of the substrate while passing through the thickness direction of the substrate while totally reflecting the inside of the substrate.
제4항에 있어서,
상기 1)단계는 상기 기판에 입사되는 광이 상기 기판의 두께보다 큰 폭으로 조사되는 것을 특징으로 하는 기판의 절단면 검사방법.

5. The method of claim 4,
Wherein the light incident on the substrate is irradiated at a width greater than the thickness of the substrate.

KR1020110041528A 2011-05-02 2011-05-02 Device for inspecting section of substrate inspection method using the same KR101260960B1 (en)

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US20020154298A1 (en) 2001-04-24 2002-10-24 International Business Machines Corporation Method of inspecting an edge of a glass disk for anomalies in an edge surface
JP2005162588A (en) 2003-11-28 2005-06-23 Samsung Corning Precision Glass Co Ltd Apparatus for inspecting cut surface of glass substrate
US20060244959A1 (en) * 2005-04-28 2006-11-02 Scan Technology Co., Ltd. Inspecting apparatus and method for foreign matter

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US20020154298A1 (en) 2001-04-24 2002-10-24 International Business Machines Corporation Method of inspecting an edge of a glass disk for anomalies in an edge surface
JP2005162588A (en) 2003-11-28 2005-06-23 Samsung Corning Precision Glass Co Ltd Apparatus for inspecting cut surface of glass substrate
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