KR101240419B1 - Cluster type evaporation device for manufacturing of OLED - Google Patents

Abstract

The present invention relates to a cluster type deposition apparatus for mass-producing an organic light emitting device, wherein a substrate to be processed is positioned at an upper portion thereof, and a deposition material is accommodated at a predetermined thickness in a lower portion thereof. A deposition chamber having a larger opening area, wherein the deposition material distributed in the tray is heated and evaporated by a heat source generator to deposit on the substrate to be processed; A substrate loading portion including a plurality of substrates to supply the substrates to the deposition chamber; A tray supply unit provided with a plurality of trays to supply a tray having a predetermined thickness of deposition material to the deposition chamber; The deposition chamber, the substrate loading portion to be loaded and the tray supply portion are provided to be opened and closed with respect to their periphery, respectively, bringing in a plurality of substrates from the substrate loading portion to be loaded into the deposition chamber or It is characterized in that it comprises a conveyance chamber for carrying out, and carrying out or carrying out the individual trays by carrying out the individual trays from the tray supply unit, thereby providing the effect of mass production of the organic light emitting device.

Description

Cluster type evaporation device for mass-production of organic light emitting device

The present invention relates to a deposition apparatus for manufacturing an organic light emitting device, and more particularly to a cluster type deposition equipment for mass production of an organic light emitting device.

In general, an organic light emitting device (OLED) refers to a self-emitting deposition material that emits light by using an electroluminescence phenomenon that emits light when a current flows through a fluorescent organic compound.

The display device using the organic light emitting device can be driven at low voltage, can be made into a thin film, and has a wide viewing angle and fast response speed, unlike the general LCD, the image quality does not change even when viewed from the side, and afterimages remain on the screen. In addition, the small screen has an advantageous price competitiveness due to the image quality and simple manufacturing process than the LCD, attracting attention as a next-generation display device.

Evaporation equipment for manufacturing organic light emitting devices is an absolutely necessary equipment for making displays of TVs or mobile phones or producing lighting equipment using organic light emitting devices.

Deposition equipment for manufacturing an organic light emitting device is a device used to form a thin film by depositing a deposition material, such as organic material on the substrate to be processed, is a key equipment for the production of an organic light emitting device.

As a deposition equipment for manufacturing an organic light emitting device, a vacuum evaporation system is mainly used. That is, the organic light emitting device is mainly deposited in the deposition chamber by a thermal deposition process.

1 illustrates a conventional deposition apparatus for manufacturing a conventional organic light emitting device, as shown in the upper portion of the deposition chamber 10, a substrate S is disposed, and an evaporation source 20 is installed at a lower portion of the evaporation source. The deposition material 22a in powder form contained in the crucible 22 in the 20 is evaporated in the deposition chamber 10, and thus a thin film is deposited while being solidified by touching the surface of the upper substrate to be processed S.

Here, the crucible 22 containing the vapor deposition material 22a is installed in the evaporation source 20, and the hot wire device 24 is provided around the crucible 22 to supply electricity to the hot wire device 24. As a result, the heating wire is heated by resistance to emit a lot of radiant heat. The crucible 22 is heated by the radiant heat to evaporate the deposition material 22a therein.

On the other hand, in order to control the thickness of the thin film deposited on the substrate S to be processed, the shutter 30 is opened or closed between the feature substrate S and the evaporation source 20. That is, the shutter 30 is opened when the deposition material is deposited on the substrate S, and when the deposition material deposition is completed or suspended, the shutter 30 is closed so that the deposition material is no longer the substrate S. It is responsible for preventing the deposition on the surface.

However, in the deposition apparatus for manufacturing an organic light emitting device using the deposition process, the crucible 22 is heated by supplying electricity to the heating device 24 to heat the resistance, so that a large amount of electrical energy is consumed as well as the crucible ( Since the temperature increase rate of 22) is lowered, the efficiency of the deposition process is lowered, and the heating temperature of the crucible 22 is relatively slowed, so that it is not easy to match the evaporation amount of the deposition material 22a.

In addition, the continuous deposition is performed while a large amount of deposition material 22a is filled in the crucible 22, so that among the deposition materials contained in the crucible 22, among the deposition materials 22a positioned above and below, As a result, the deposition material positioned at the lower portion is continuously degraded by the heating apparatus 24, and thus the deposition characteristics due to the deterioration are degraded. Thus, there is a problem that the film uniformity is reduced during deposition on the substrate S to be processed.

In addition, even when the deposition process does not proceed, the evaporation material is continuously evaporated to waste expensive evaporation material, there is also a problem that is not economical.

The present invention has been made in view of the above problems, and provides a tray having a wide cross-sectional area of the bottom surface and a larger opening area than the bottom surface, wherein the deposition material is distributed at a uniform height on the tray. It is an object of the present invention to provide a deposition apparatus for manufacturing an organic light emitting device which allows the deposition material contained in the tray to be deposited on the substrate to be processed while being instantaneously heated by a heat source such as a laser.

In other words, by heating the deposition material in the tray with a heat source such as a laser to reduce the electrical energy consumption, increase the tray heating rate instantaneously to improve the efficiency of the deposition process, and to control the heating temperature of the tray relatively easy By precisely controlling the amount of evaporation of the deposition material, the purpose is to provide a deposition apparatus for manufacturing an organic light emitting device that can be more efficiently made to deposit the deposition material on the substrate to be processed.

In addition, according to the present invention, by simultaneously heating the deposition material contained in the tray with a heat source such as a laser and simultaneously evaporating at once, the deposition material does not remain in the tray to prevent deterioration of deposition characteristics due to deterioration. Accordingly, an object of the present invention is to provide a deposition apparatus for manufacturing an organic light emitting device for improving film uniformity during deposition on a substrate to be processed.

In addition, by supplying the amount of deposition material required for the deposition process to the tray and heating and evaporating at a time, if the deposition process is not in progress, the evaporation of the deposition material is not made, the expensive deposition material It is another object of the present invention to provide a deposition apparatus for manufacturing an organic light emitting device that does not waste, thereby improving the economical efficiency.

On the other hand, the present invention is to supply the deposition material to the tray to a uniform height to deposit the deposition material evenly on the substrate, to further improve the film uniformity of the organic light emitting device manufacturing deposition equipment for manufacturing the substrate uniformity There is also a purpose to provide.

In another aspect, the present invention provides a deposition apparatus for manufacturing an organic light emitting device for supplying two or more different deposition materials to the tray, and then selectively evaporate each deposition material, so that different deposition materials are sequentially deposited on the substrate to be processed. There is also a purpose to provide.

In particular, the present invention has a main object to provide a mass-produced organic light emitting device by providing the deposition equipment for manufacturing the organic light emitting device in a cluster type.

The cluster type deposition apparatus for mass-producing an organic light emitting device according to the present invention for achieving the above object, the substrate to be processed is positioned on the upper portion, the deposition material is accommodated distributed in a predetermined thickness on the lower portion, the deposition material is accommodated A deposition chamber having an opening area which is greater than or equal to a cross-sectional area of the bottom surface, wherein the deposition material distributed in the tray is heated and evaporated by a heat source generator to deposit on the substrate to be processed; A substrate loading portion including a plurality of substrates to supply the substrates to the deposition chamber; A tray supply unit provided with a plurality of trays to supply a tray having a predetermined thickness of deposition material to the deposition chamber; The deposition chamber, the substrate loading portion to be loaded and the tray supply portion are provided to be opened and closed with respect to their periphery, respectively, bringing in a plurality of substrates from the substrate loading portion to be loaded into the deposition chamber or And a conveyance chamber for carrying in or taking out individual trays from the tray supply unit and carrying them in or out of the deposition chamber.

Here, it is preferable that one or more deposition chambers are provided in the circumferential side of the said transfer chamber so that opening and closing is possible.

In this case, it is preferable that at least one tray supply part for supplying the tray to one deposition chamber is provided on the circumferential side of the transfer chamber so as to be openable and openable.

In addition, it is preferable that a processing substrate loading unit for loading a processing substrate on which the deposition is completed in the deposition chamber is provided on the circumferential side of the transfer chamber so as to be openable and openable.

On the other hand, the deposition chamber, the tray supply unit and the transfer chamber is composed of one module, at least one module is provided, the modules may be connected by a buffer chamber may be composed of a multi-stage module.

In this case, when the module is configured in multiple stages, the substrate processing unit may be opened and closed at a periphery of the transfer chamber of the module located at the front end of the modules of the multiple stages, and the rear end of the modules of the multiple stages may be provided. It is preferable that a processing substrate loading part for loading and closing the processing substrate on which the deposition is completed is installed on the periphery of the transfer chamber of the module to be opened and closed.

On the other hand, the tray supply unit, it is preferable that the tray is provided in communication with the deposition material supply unit for distributing the deposition material in a uniform thickness.

As described above, according to the present invention, there is provided a tray having a wider cross-sectional area of the bottom surface and having a larger opening area than the bottom surface, and after the deposition material is distributed at a uniform height on the tray, As the instantaneous heating with the heat source, the deposition material contained in the tray is simultaneously vaporized and deposited on the substrate to be treated, thereby providing an effect of improving the deposition efficiency.

That is, as the deposition material contained in the tray is heated by a heat source such as a laser, the electrical energy consumption is reduced, the temperature rise rate of the tray is instantaneously increased, the efficiency of the deposition process is improved, and the heating temperature of the tray is relatively easy to be deposited. By being able to accurately control the amount of evaporation of the material, the deposition of the deposition material on the substrate to be processed becomes more efficient.

In addition, according to the present invention, as the deposition material contained in the tray as a heat source such as a laser is instantaneously heated and simultaneously evaporated at once, the deposition material is not left in the tray, thereby preventing deterioration of deposition characteristics due to deterioration. This also provides the effect of improving film uniformity upon deposition onto the substrate to be treated.

In addition, as the amount of deposition material required for the deposition process is distributed in the tray and heated and evaporated at one time, when the deposition process does not proceed, evaporation of the deposition material is not performed, thereby expensive waste of deposition material. Can be prevented, resulting in economic efficiency.

On the other hand, in the present invention, the deposition material is evenly distributed on the tray, and the deposition material is evenly deposited on the substrate, thereby further improving film uniformity of the substrate.

In addition, the present invention is that after the two or more kinds of deposition material is distributed in the tray separately, each deposition material is selectively evaporated, it is possible to sequentially deposit other deposition material on the substrate to be processed in one step Effects are also provided.

In particular, according to the present invention, the deposition equipment for manufacturing an organic light emitting device is formed in a cluster type, thereby providing the effect that mass production of the organic light emitting device is possible.

1 is a cross-sectional view showing a schematic configuration of a deposition apparatus for manufacturing a conventional organic light emitting device.
Figure 2a and Figure 2b is a cross-sectional view showing the configuration of the deposition apparatus for manufacturing an organic light emitting device according to the first embodiment of the present invention.
3 is a perspective view illustrating a state in which various patterns are formed in a tray applied to a deposition apparatus for manufacturing an organic light emitting device according to a first embodiment of the present invention.
4A to 4C are perspective views illustrating respective shapes of trays applied to a deposition apparatus for manufacturing an organic light emitting device according to a second embodiment of the present invention.
5 is a cross-sectional view of a deposition apparatus for manufacturing an organic light emitting device according to a second embodiment of the present invention.
6 is a cross-sectional view of a deposition apparatus for manufacturing an organic light emitting device according to a third embodiment of the present invention.
FIG. 7 is a perspective view illustrating a configuration of an alignment device in FIG. 6. FIG.
8A to 8E are plan views sequentially illustrating a relationship in which each receiving portion of the tray is selectively vertically aligned with the heat source generating portion by the alignment device of FIG.
Figure 9 is a plan view according to a fourth embodiment showing a relationship in which the deposition equipment for manufacturing an organic light emitting device of the present invention is formed in a cluster type.
10 is a planar configuration diagram according to a modification of FIG. 9.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

<First Embodiment>

2A and 2B are cross-sectional views illustrating a construction of a deposition apparatus for manufacturing an organic light emitting device according to the first embodiment of the present invention. FIG. 2A is a cross-sectional view of a tray not being raised, and FIG. 2B is a tray lifted to perform a deposition process. It is sectional drawing of a state to advance.

For reference, in describing the first embodiment of the present invention, the same parts as in the related art will be described with the same reference numerals, and repeated description thereof will be omitted.

As shown, the deposition apparatus for manufacturing an organic light emitting device according to the first embodiment of the present invention includes a deposition chamber 10 in which the interior is in a vacuum state.

The substrate S is disposed on the deposition chamber 10 to deposit the deposition material 112, such as an organic material, and the vapor deposition material 112 is evaporated by heating by a heat source. The evaporation source 100 for depositing a thin film on the surface of S) is provided.

The evaporation source 100 includes a tray 110 having a constant width in which the deposition material 112 is distributed at a uniform height, and a heat source generator 130 for supplying and heating a heat source to the tray 110.

Here, the tray 110 is located inside the deposition chamber 10, and the deposition material 112 is uniformly distributed at a predetermined thickness and accommodated. The tray 110 has a wide cross-sectional area such that the deposition material 112 is accommodated over a large area. It is formed, and the opening area is formed the same or larger with respect to this base surface.

The heat source generating unit 130 supplies the heat source to the tray 110 and heats the same, thereby evaporating the deposition material 112 supplied and distributed to the tray 110 so that the vaporized deposition material is evaporated. In order to be deposited on, the heat source may be provided to heat the tray 110, the location may be installed anywhere inside or outside the deposition chamber 10.

However, as in the first embodiment of the present invention, the heat source generator 130 is installed below the deposition chamber 10, so that the heat source generated from the heat source generator 130 is the bottom of the tray 110. It is desirable to ensure even delivery to the. In this case, the heat source generator 130 may be installed inside the lower side of the deposition chamber 10, or may be installed outside the lower side of the deposition chamber 10 as shown in FIGS. 2A and 2B. When the unit 130 is installed outside the lower side of the deposition chamber 10, the transparent window is disposed at one lower side of the deposition chamber 10 so that the heat source generated from the heat source generator 130 may pass through the deposition chamber 10. It is preferable that (12) be formed.

In addition, the heat source generating unit 130 is a device for generating a heat source such as laser, high frequency, E-BEAM, IR BEAM HEATER to provide a heat source for instantaneous heating rather than providing a heat source for resistance heating of the tray 110 It is desirable to apply.

On the other hand, the tray 110 is supported by the lifting means 120 in the deposition chamber 10, it is configured to be raised and lowered by the lifting means 120.

That is, as the tray 110 containing the deposition material is lifted up and down, the deposition material 112 is controlled to be more efficiently deposited by adjusting a distance from the substrate S to be processed.

Here, the lifting means 120 may be any lifting means known in the art, including a hydraulic cylinder or pneumatic cylinder or a motor and a ball screw or linear motor.

Referring to the process of depositing a thin film on the substrate (S) to be processed using the deposition apparatus for manufacturing an organic light emitting device having the above configuration as follows.

First, the tray 110 is introduced into the deposition chamber 10 in a state in which the deposition material 112 is supplied and contained in the accommodation space of the tray 110 at a predetermined thickness. By adjusting the distance from the substrate S to be processed.

At this time, according to the characteristics of the deposition material 112 contained in the tray 110 to set the optimum interval with the substrate to be processed (S), operating the lifting means 120 to maintain the set interval by the tray 110 and the blood The distance from the processing substrate S is adjusted.

Next, power is applied to the heat source generator 130 installed outside the deposition chamber 10 so that the heat source is generated in the heat source generator 130, and the heat source is a transparent window () of the deposition chamber 10. 12) to evenly heat the bottom of the tray 110.

Therefore, the bottom surface of the tray 110 is instantaneously heated, so that the deposition material 112 distributed at a uniform height in the receiving space of the tray 110 is simultaneously vaporized at once. It is deposited on the surface of the processing substrate S.

In this case, the tray 110 is formed with the same or larger opening area than the bottom cross-sectional area of the accommodating space in which the deposition material 112 is accommodated, and the entire deposition material 112 contained in the tray 110 evaporates at the same time. As a result, the evaporation rate is increased. In addition, a heat source for heating the bottom of the tray 110 to evaporate the deposition material 112 is applied to the laser, high frequency, E-BEAM, IR BEAM HEATER, etc., so that the instantaneous heating compared to the conventional resistance heating method As a result, the temperature increase rate of the tray 110 is also increased, so that the evaporation of the deposition material 112 is quickly performed.

In particular, the deposition material 112 contained in the receiving space of the tray 110 is distributed in a state that is spread in a thin thickness bar, the entire deposition material 112 at the same time at the same time according to the heating of the tray 110 As the evaporation is performed, the deposition material which does not evaporate does not remain, and thus, degeneration is not performed due to deterioration, which prevents the deterioration of film uniformity and expensive because no deposition material remains to be evaporated even during non-processing. It is also possible to prevent the loss of deposited material.

As such, when the thin film deposition process for the substrate S according to the evaporation of the deposition material 112 contained in the tray 110 is completed, the tray 110 is lowered by the elevating means 120 and then moved to the outside. After pulling out, another tray 110 containing the other deposition material 112 is introduced into the deposition chamber 10 and lifted by the elevating means 120, and then the deposition process may be continuously performed.

On the other hand, in the tray 110 applied to the first embodiment of the present invention, it is very important that the deposition material 112 is distributed in a thin and uniform thickness in a large area.

That is, as the heat source is applied to the tray 110, the deposition material 112 distributed in a large area must be deposited on the surface of the substrate S to be simultaneously vaporized at once and simultaneously. If one part is thick and the other part is thin, the deposition material is distributed in a non-uniform thickness as a whole, the thin film is not evenly deposited on the surface of the substrate to be processed (S), which causes a defect, the tray ( It is very important that the deposition material 112 is supplied to the 110 so as to be distributed in a uniform thickness.

Thus, in order to distribute the deposition material 112 uniformly to a predetermined thickness in the receiving space of the tray 110, as shown in Figures 3a to 3d, a predetermined interval and a predetermined height inside the receiving space of the tray 110 Is preferably formed.

Here, as shown in FIG. 3A, partition walls 110a having a predetermined height may be formed in the accommodation space of the tray 110 at regular intervals in the vertical, horizontal, and horizontal directions based on the center thereof. At this time, it is preferable that the partitions 110a are gradually longer in length toward the outer edge thereof.

In addition, the pattern, as shown in Figure 3b, may be formed in the receiving space of the tray 110, the partition wall (110b) of a predetermined height at a predetermined interval in a diagonal direction with respect to the center thereof. At this time, it is preferable that the partitions 110b have a length that gradually increases toward the outer edge thereof.

In addition, the pattern, as shown in Figure 3c, may be formed in the receiving space of the tray 110, the partition wall (110c) of a predetermined height to form a circular shape based on the center thereof. Even in this case, the partitions 110c are preferably formed to gradually increase in length toward the outer edge.

For reference, the pattern is not limited to the one formed in the shape shown in FIGS. 3A to 3C, and the pattern may be formed in any shape as long as it is formed only at the same height.

Meanwhile, as illustrated in FIG. 3D, when the tray 110 is viewed in a plan view, the partition wall 110d may be formed such that a plurality of honeycomb structures are aligned. Of course, although not shown separately in this case, the partition wall may be formed so that a plurality of circular or triangular or more polygonal structures are formed to be aligned.

As such, the deposition material 112 is formed in the accommodation space of the tray 110 in a state where patterns having a predetermined interval and a predetermined height are formed according to the arrangement of the partition walls 110a, 110b, 110c, and 110d in the accommodation space of the tray 110. ), After the post-processing, the deposition material is distributed at a uniform height as a whole in the receiving space of the tray 110.

Here, the post-process is supplied to the storage space of the tray 110 to overflow the deposition material 112, and then push the upper surface with a separate blade (not shown) to uniform height over the entire area of the tray 110 The deposition material 112 may be distributed. In this case, when the deposition material 112 distributed in the receiving space of the tray 110 is pushed by the blade, the deposition material 112 is formed by the partition walls 110a, 110b, 110c, and 110d forming a pattern, respectively. Since the state of distribution in a separate space is maintained, the deposition material distributed in one space is not transferred to another space by the partition walls 110a, 110b, 110c, and 110d, so that the same height can be maintained. The overall uniformity is achieved.

In addition, the post process may shake the tray 110 by vibrating it as a vibrator (not shown), so that the deposition material may be distributed at a uniform height over the entire area of the tray 110. Even in this case, when the tray 110 is vibrated by the vibrator, the deposition material 112 is maintained in a separate space by the partition walls 110a, 110b, 110c, and 110d forming the pattern. As the deposition material distributed in one space is not transferred to another space, the same height can be maintained, thereby achieving a state uniformly distributed at an overall height.

Second Embodiment

4A to 4C are perspective views illustrating respective shapes of trays applied to the deposition apparatus for manufacturing an organic light emitting device according to the second embodiment of the present invention.

As shown, in the deposition apparatus for manufacturing an organic light emitting device according to the second embodiment of the present invention, a tray formed with at least two deposition material receiving portion by a partition wall so that at least two or more deposition materials are distributed and accommodated separately 110.

That is, when the thin film is deposited on the substrate S in order to manufacture the organic light emitting device, not only a single deposition material is deposited but also several deposition materials are sequentially deposited. According to the second embodiment, an organic light emitting device for providing a tray 110 for separately receiving two or more different deposition materials, and sequentially depositing separate deposition materials contained in the tray 110 on the substrate S to be processed. It provides a deposition equipment for manufacturing.

For reference, in describing the second embodiment of the present invention, the same parts as in the prior art and the first embodiment will be described with the same reference numerals, and repeated descriptions thereof will be omitted.

First, as shown in FIG. 4A, the accommodation space is divided into two parts by the partition wall 110-1 that divides the central portion in a straight line, and is divided into the first accommodation portion 113a and the second accommodation portion 113b. Tray 110 may be provided.

In this case, any deposition material is distributed in the first accommodating part 113a and other deposition material is distributed in the second accommodating part 113b. For reference, different kinds of deposition materials will be described for convenience of description by referring to deposition materials of type A, species, disease, and type.

In addition, as shown in Figure 4b, the receiving space is divided into four by the partition wall (110-2) partitioning from the central portion in the left and right direction, the first receiving portion (114a) and the second receiving portion (114b) ) And a tray 110 divided into a third accommodating part 114c and a fourth accommodating part 114d may be provided.

In this case, the first accommodating part 114a is distributed to accommodate the first deposition material, the second accommodating part 114b is distributed to accommodate the evaporation material of the species, and the third accommodating part 114c is used to collect the diseased material. The deposition material is distributed to accommodate the distribution material, and the fourth accommodation part 114d is distributed to accommodate the deposition material of the kind.

On the other hand, as shown in Fig. 4c, the receiving space is divided into four by the partition portion 110-3 partitioning the center portion in the diagonal direction, the first accommodation portion 115a and the second accommodation portion 115b. ) And a tray 110 divided into a third accommodating part 115c and a fourth accommodating part 115d may be provided.

In this case, the first accommodating part 115a is distributed to accommodate the first deposition material, the second accommodating part 115b is distributed to accommodate the evaporation material of the species, and the third accommodating part 115c is used to distribute the diseased material. The deposition material is distributed to accommodate the distribution material, and the fourth accommodation part 115d is distributed to accommodate the deposition material of the kind.

For reference, in the second exemplary embodiment of the present invention, as shown in FIGS. 4A to 4C, the tray 110 in which the receiving space is divided into two or four portions by the partition walls 110-1, 110-2, and 110-3 is taken as an example. Although illustrated, the tray 110 having a receiving portion of three or more portions may be provided according to the formation of the partition wall. That is, as long as the tray 110 having a minimum accommodation space is divided into two by the partition wall to contain different kinds of deposition materials, any one may be applied to the second embodiment of the present invention.

On the other hand, as described above, when the receiving space is formed in at least two or more portions, and the tray 110 in which different kinds of deposition materials are distributed is applied, each of the deposition materials can be distributed at a uniform height in each receiving portion. It is preferable that the pattern by a partition is formed for every accommodating part.

Herein, the same or similar to the pattern described in the first embodiment may be applied. In this case, since the operation and effect are the same, a detailed description thereof will be omitted.

As such, when the receiving space is formed in at least two equal parts, and the different deposition materials are sequentially deposited on the substrate S by applying the tray 110 in which different kinds of deposition materials are distributed, the tray The heat source generator for supplying and heating the heat source to the 110 is preferably formed by the number corresponding to the number of the accommodating portions of the tray 110.

For example, as shown in Figure 5, when the tray 110 is divided into two receiving spaces, the heat source generating unit (130a, 130b) is also formed of two deposition materials 112a, 112b distributed in each receiving space ) May be caused to heat each of the heat source generators 130a and 130b.

Referring to the process of depositing a thin film on the substrate (S) by using the deposition apparatus for manufacturing an organic light emitting device according to the second embodiment of the present invention.

First, the tray 110 is introduced into the deposition chamber 10 in a state in which different kinds of deposition materials are distributed and distributed in a uniform thickness in the partitioned receiving space of the tray 110, and then the lifting means. It raises and lowers by 120, and adjusts the space | interval with the to-be-processed substrate S. FIG.

Here, the tray 110 is divided into two parts into the first accommodating portion 113a and the second accommodating portion 113b by the partition wall 110-1, and the first accommodating portion 113a is firstly deposited. In one example, the material 112a is formed by distributing a heterogeneous deposition material 112b in the second accommodating part 113b, and the heat source generating parts 130a and 130b are formed in the first accommodating part 113a of the tray 110. The first heat source generator 130a for supplying the heat source to the second source and the second heat source generator 130b for supplying the heat source to the second accommodating part 113b will be described as an example.

Next, power is applied to the first heat source generator 130a among the heat source generators provided outside the deposition chamber 10 so that the heat source is generated in the first heat source generator 130a. The bottom surface of the first accommodating portion 113a of the tray 110 is uniformly heated by passing through the transparent window 12 of the deposition chamber 10.

Accordingly, the bottom surface of the first accommodating part 113a of the tray 110 is heated immediately, and the first grade deposition material is distributed at a uniform height in the first accommodating part 113a of the tray 110. 112a) is simultaneously evaporated and deposited on the surface of the substrate S to be processed.

As such, when the deposition of the first type deposition material 112a distributed in the first accommodating part 113a of the tray 110 is completed, power is applied to the second heat source generator 130b and the second heat source generator ( The heat source is generated at 130b), and the heat source passes through the transparent window 12 of the deposition chamber 10 to evenly heat the bottom surface of the second accommodating portion 113b of the tray 110.

Therefore, the bottom surface of the second accommodating portion 113b of the tray 110 is heated at an entire area, and thus, a heterogeneous deposition material having a uniform height distributed in the second accommodating portion 113b of the tray 110 ( 112b) is simultaneously evaporated and deposited on the surface of the substrate S to be processed.

As described above, even in a deposition process in which two or more different deposition materials 112a and 112b are sequentially deposited on the substrate S, the same operation and effect as in the first embodiment are achieved. The description will be omitted.

&Lt; Third Embodiment >

The third embodiment of the present invention is a modified embodiment of the above-described second embodiment, in which the tray 110 having a plurality of accommodation portions is sequentially disposed by one heat source generator 130 so that different kinds of deposition materials are distributed. By heating, different types of deposition materials are sequentially deposited on the substrate S to be processed.

That is, in the second embodiment of the present invention, a heat source generator is provided according to the number of each receiver of the tray 110 so that the heat source generator 130 heats the receiver to sequentially evaporate each deposition material. In the third embodiment of the present invention, only one heat source generator 130 is provided to sequentially heat each receiving portion of the tray 110 so that the deposition materials are sequentially evaporated.

6 is a cross-sectional view of a deposition apparatus for manufacturing an organic light emitting device according to a third embodiment of the present invention, FIG. 7 is a partial perspective view illustrating an operation relationship of an alignment device in FIG. 6, and FIGS. 8A to 8E are FIGS. This is a plan view showing the vertical alignment relationship between the heat source generating unit and the tray as the alignment device of the aligning device is aligned.

For reference, in describing the third embodiment of the present invention, the same parts as in the first and second embodiments will be described with the same reference numerals, and repeated descriptions thereof will be omitted. .

As illustrated in FIGS. 6 and 7, a heat source generator 130 is provided on the lower outside of the deposition chamber 10 to generate heat sources such as laser, high frequency, E-BEAM, IR BEAM HEATER, and the like. .

On the other hand, the lower side of the deposition chamber 10 is provided with a tray 110 is heated by the heat source generated from the heat source generator 130 to evaporate the deposition material distributed in the receiving space.

As described in the second embodiment, the tray 110 is divided into at least two parts by partition walls to form a plurality of accommodating portions, and different kinds of deposition materials are distributed in each accommodating portion.

Here, the tray 110 has a receiving space of the first accommodating part 114a, the second accommodating part 114b, the third accommodating part 114c and the fourth accommodating part by the partition wall 110-2. 114d), wherein the first accommodating part 114a has a first grade deposition material, the second accommodating part 114b has a heterogeneous evaporation material, and the third accommodating part 114c has a bottle type deposition material, and the fourth accommodating part has a fourth accommodating part. An example of the distribution of the seed deposition material in 114d will be described as an example (see FIG. 4B).

The tray 110 comprised in this way is supported by the alignment apparatus 200 for horizontally moving this tray 110 to an X-axis and a Y-axis.

The alignment apparatus 200 not only supports the tray 110 but also selectively moves the tray 110 horizontally along the X and Y axes, so that the first accommodation part 114a and the second of the tray 110 are moved. The receiving part 114b, the third accommodating part 114c, and the fourth accommodating part 114d selectively form the same vertical line as the heat source generating part 130 so that only the corresponding deposition material distributed in the accommodating part is heated and evaporated. It is responsible for the function, so that a detailed description of the function will be described later.

The alignment apparatus 200 includes a first frame 210 in which a tray 110 is supported and installed, and a heat source passage hole 212 is formed at a central portion thereof to allow a heat source generated from the heat source generator 130 to pass therethrough. And a second frame 220 which is supported and installed in the X-axis direction for horizontal movement, and the second frame 220 is supported and installed in a Y-axis direction for horizontal movement. It is configured to include a guide rail 230.

That is, the guide rail 230 is supported and installed by the support 232 installed in the vertical direction from the bottom of the deposition chamber 10, the second frame 220 with respect to the guide rail 230 in the Y-axis direction The first frame 210 is supported and installed horizontally in the X-axis direction with respect to the second frame 220.

In addition, the tray 110 is supported and installed with respect to the first frame 210. At this time, the tray 110 is supported and installed with respect to the first frame 210 by the lifting cylinder 240. Lifting may be performed with respect to 210.

The first frame 210 has a heat source through-hole 212 having a constant diameter formed at a central portion thereof, and rectangular frames are formed at the front, rear, left, and right sides of the heat source through-hole 212, respectively. First, the first driving motor 214 is provided on the upper surface portions of both frames facing each other in parallel. First pinion gears 216 are arranged on the axes of the first driving motors 214, respectively, and parallel to the first frame 210 in which the first pinion gears 216 are positioned in the second frame 220. The first rack gear 222 corresponding to the first pinion gear 216 is formed on both upper surfaces of the frame on which both frames are seated and supported.

Accordingly, the first pinion gears 216 move forward or backward on the first rack gear 222 of the second frame 220 according to the forward and reverse rotation of the first driving motors 214. The first frame 210 may be horizontally moved in the X-axis direction with respect to 220.

On the other hand, in the second frame 220, the second drive motor 224 is installed on the upper surface portion of the other frame perpendicular to the frame formed with the first rack gear 222. Second pinion gears 226 are also arranged on the shafts of the second driving motors 224, and second rack gears 234 corresponding to the second pinion gears 226 on the upper surface of the guide rail 230, respectively. Is formed.

Accordingly, the second pinion gears 226 move forward or backward on the second rack gear 234 of the guide rail 230 according to the forward and reverse rotation of the second driving motors 224. ), The second frame 220 can be horizontally moved in the Y-axis direction.

As such, the first frame 210 is selectively horizontally moved along the X and Y axes in accordance with the forward and reverse rotations of the first and second driving motors 214 and 224. In addition, the tray 110 supported and installed on the upper portion of the first frame 210 may also be selectively horizontally moved along the X and Y axis directions.

Referring to the process of depositing a thin film on the substrate (S) to be processed using the deposition apparatus for manufacturing an organic light emitting device according to the third embodiment of the present invention having the above configuration as follows.

First, the tray 110 is introduced into the deposition chamber 10 in a state in which deposition materials of different species are distributed and contained in a uniform thickness in the partitioned receiving space of the tray 110.

In this case, when the vapor deposition material distributed in any one of the accommodating portions 114a, 114b, 114c, and 114d of the tray 110 is sequentially deposited on the substrate S to be processed, the accommodating The alignment apparatus 200 is operated to be positioned on the same vertical line as the additional heat source generator 130.

For example, as shown in FIG. 8A, in the initial state in which the heat source generating unit 130 forms the same vertical line at the center of the tray 110, the first accommodating part 114a among the accommodating parts of the tray 110. In the case where the first deposition material distributed in the first layer is to be deposited on the substrate S, as shown in FIG. 8B, the first driving motor 214 and the second driving motor of the alignment device 200 may be formed. 224 is selectively rotated such that the first accommodating part 114a of the tray 110 is positioned on the same vertical line as the heat source generating part 130.

Next, a heat source is generated in the heat source generator 130, and the heat source passes through the transparent window 12 of the deposition chamber 10 to evenly heat the bottom of the first accommodating portion 114a of the tray 110. To do that.

At this time, the heat source generated by the heat source generator 130 controls the wavelength to heat only the bottom of the first accommodating part 114a, and the bottom of the adjacent second accommodating part to the fourth accommodating part 114b, 114c, and 114d. It is preferable not to heat silver.

Accordingly, the bottom surface of the first accommodating portion 114a of the tray 110 is heated immediately, and thus, the first deposition material having a uniform height is distributed in the first accommodating portion 114a of the tray 110. At the same time, it is evaporated and deposited on the surface of the substrate S.

As such, when deposition of the first deposition material distributed in the first accommodating part 114a of the tray 110 is completed, the first driving motor 214 and the second driving motor 224 of the alignment device 200 are again. Is selectively rotated so that the next receiving portion of the second to fourth receiving portions 114b, 114c, and 114d of the tray 110 is located on the same vertical line as the heat source generating portion 130 (FIG. 8B). To FIG. 8E)

Next, a heat source is generated in the heat source generating unit 130, and the heat source passes through the transparent window 12 of the deposition chamber 10 to receive the next accommodating part of the tray 110 (second accommodating part to fourth accommodating part). Heat the bottom of one receiving part evenly).

Accordingly, the bottom of the next housing portion (the one accommodation portion of the second accommodation portion or the fourth accommodation portion) of the tray 110 is heated in an instantaneous area, and thus the next accommodation portion of the tray 110 (the second accommodation portion). Evaporation materials of different species which are distributed at a uniform height in one of the first to fourth accommodating parts) are simultaneously evaporated and deposited on the surface of the substrate S to be processed.

By operating the alignment device 200 in this manner, the corresponding receiving part is positioned in the same vertical line as the heat source generating part 130, and then another deposition material of different species is sequentially deposited on the substrate S to be processed. .

In this case, as the tray 110 is raised by operating the lifting cylinder 240 to support and install the tray 110 with respect to the first frame 210, the deposition process for the substrate S to be processed is efficient. It can also be adjusted at intervals that can be made.

Meanwhile, as the tray 110 in which different kinds of deposition materials are distributed is moved to the X-axis and the Y-axis by the alignment device 200, the substrate S is also processed as in the tray 110. There is further provided a substrate S alignment device for moving the substrate S in order to move in the X-axis and Y-axis, or to adjust a distance between the tray 110 and an efficient deposition process. May be

As described above, even during the deposition process of sequentially depositing a plurality of different deposition materials on the substrate S to be processed, the same effects as in the first and second embodiments will be obtained. Repeated description thereof will be omitted.

The deposition apparatus for manufacturing the organic light emitting device according to the above <first embodiment> to <third embodiment> may be formed in a cluster type for mass production of the organic light emitting device as follows.

<Fourth Embodiment>

As shown in FIG. 9, the cluster type deposition apparatus 500 for mass-producing an organic light emitting device according to the fourth embodiment of the present invention includes at least one deposition chamber 10 according to the first to third embodiments. It includes more.

That is, a substrate to be processed is positioned at an upper portion, and a deposition material is distributed and accommodated in a lower portion of the substrate, and a tray having an opening area equal to or larger than the cross-sectional area of the bottom surface on which the deposition material is accommodated is located. The distributed deposition material includes a deposition chamber 10 in which deposition is performed on the target substrate while being heated and evaporated with a heat source supplied by a heat source generator.

Since the deposition process of the substrate to be processed using the deposition chamber 10 has been described in detail above, a repeated description thereof will be omitted.

In addition, the fourth embodiment of the present invention includes a substrate loading part 510 having a plurality of substrates to be processed to supply the substrates to the deposition chamber 10.

Here, the substrate to be processed is a substrate and a mask, etc. are bonded to each other, a plurality of substrates are loaded on the substrate loading unit 510 in a state in which they are stacked in alignment, and a transfer chamber in which a plurality of substrates to be processed is described later according to an operation signal. Imported into 530.

As described above, when a plurality of substrates to be processed are loaded into the transfer chamber 530, the substrates to be loaded in the stacked state in the substrate loading unit 510 are transferred to the transfer chamber 530. The stacking state is rearranged so as to be fetched, and an operation relationship for such alignment may be implemented by a known configuration, and thus the detailed description thereof is omitted here.

In addition, the fourth embodiment of the present invention includes a tray supply unit 520 having a plurality of trays to supply trays in which deposition materials are distributed to a predetermined thickness to the deposition chamber 10.

Here, the tray supply unit 520 is loaded in a state in which a plurality of trays in which deposition materials are distributed in a uniform thickness are stacked and aligned, and each tray is loaded into a transfer chamber 530 which will be described later according to an operation signal.

In this case, when the individual trays are brought into the transfer chamber 530, the stacked trays are stacked in the tray supply unit 520, and the stacked state of the trays is rearranged so that the next tray is brought into the transfer chamber 530. Since the operating relationship for the alignment may also be implemented by a known configuration, the detailed description thereof is omitted here.

On the other hand, the tray supply unit 520 is preferably installed in communication with the deposition material supply unit 522 for distributing the deposition material in a uniform thickness on each tray.

That is, it is preferable that the deposition material supply unit 522 distributes the deposition material with a uniform thickness for each tray, and then supplies the same to the tray supply unit 520 so that the deposition materials are aligned.

In addition, in the cluster type deposition apparatus 500 for mass-producing an organic light emitting device according to the fourth embodiment of the present invention, the deposition chamber 10, the substrate loading part 510, and the tray supply part 520 are respectively peripheral edges thereof. It is installed so as to be open and close relative to each other, the individual substrates to be loaded from the substrate loading portion 510 to be carried in or out of the deposition chamber 10, and the individual trays from the tray supply portion 520 It further includes a transfer chamber 530 to be carried in or out to the deposition chamber 10 by carrying in.

That is, the conveyance chamber 530 has a circular or polygonal shape and has an empty space therein, and the deposition chamber 10, the substrate loading portion 510, and the tray on the circumferential side of the conveyance chamber 530. The supply part 520 is provided so that opening and closing is possible.

Here, it is preferable that the processing substrate loading unit 540 for loading the processing substrate on which the deposition is completed in the deposition chamber 10 is further provided on the circumferential side of the transfer chamber 530 to open and close.

Meanwhile, one or more deposition chambers 10 may be installed on the circumferential side of the transfer chamber 530. That is, as shown in FIG. 9, two deposition chambers 10 may be installed around one transfer chamber 530, in which case the deposition process is performed on two substrates at the same time. Mass production of the light emitting device becomes possible.

In addition, at least one or more tray supply units 520 may be installed in one deposition chamber 10 at the circumferential side of the transfer chamber 530. That is, as shown in Figure 9, two tray supply unit 520 for supplying a tray may be provided in one deposition chamber 10, in which case one substrate to be treated in succession two deposition materials It is possible to deposit in a short time.

For example, in a state in which one of the substrates to be loaded into one of the deposition chambers 10 is supplied, a tray in which the first deposition material is distributed is supplied from one tray supply unit to deposit the first deposition material on the substrate. Subsequently, by receiving a tray in which the different kinds of deposition materials are distributed from another tray supply unit, depositing the different kinds of deposition materials on the substrate to be processed, it is possible to continuously deposit two different kinds of deposition materials.

For reference, although two deposition chambers 10 are installed around one transfer chamber 530 as an example, one or more deposition chambers 10 may be installed around the transfer chamber 530. Could be.

In addition, although two tray supply units 520 are provided to supply the trays to one deposition chamber 10 above. For example, the trays in which different deposition materials are distributed in each deposition chamber 10 are stacked. One or more tray supply units 520 may be installed.

The operation relationship of the organic light emitting device mass production cluster type deposition equipment 500 having the above configuration will be described.

First, one of a plurality of substrates to be stacked on the substrate loading unit 510 is loaded into the transfer chamber 530, and the substrates thus loaded are again deposited into a deposition chamber ( Imported into 10).

In addition, any tray among the plurality of trays stacked on the tray supply unit 520 is carried into the transfer chamber 530, and the tray thus loaded is carried into the deposition chamber 10 again.

When the substrate on which the substrate and the deposition material are distributed is loaded into the deposition chamber 10, the tray is heated by a heat source generator to deposit a thin film on the substrate while evaporating the deposition material.

The processing substrate having completed the thin film deposition as described above may be carried out by the transfer chamber 530 again through the processing substrate loading unit 540.

Here, when one or more deposition chambers 10 are provided on the circumferential side of the transfer chamber 530, since the deposition process as described above can be made in several places at the same time, it becomes possible to mass-produce the organic light emitting device.

On the other hand, in the case of depositing various kinds of deposition material on the substrate to be processed, the tray is sequentially supplied from the supply units 520 of the trays in which different deposition materials are distributed to the deposition chamber 10 in which the substrate is to be placed. After the deposition process is completed, the deposition material is continuously deposited, and the deposition process is completed. Then, the deposition-processed processing substrate may be carried out to the processing substrate loading unit 540 by the transfer chamber 530.

On the other hand, the cluster type deposition apparatus 500 having the above configuration, the deposition chamber 10, the tray supply unit 520 and the transfer chamber 530 is composed of one module, at least one such module is provided However, as shown in FIG. 10, the modules may be connected by the buffer chamber 550 to form a multistage module.

In the case where the module is configured in multiple stages, the substrate loading part 510 may be opened and closed on the periphery of the transfer chamber of the module located at the front end of the modules of the multiple stages. It is preferable that a processing substrate loading unit 540 for loading a processing substrate on which the deposition is finally completed is installed on the periphery of the transfer chamber of the module located in the opening and closing manner.

As such, when the module is configured in multiple stages, it is very useful to deposit various kinds of deposition materials on a substrate to be processed.

For example, in a multi-stage module, any one of the substrates to be deposited in the first and / or second kinds of deposition materials in the module located at the front end, and the diseased and / or final deposition material is deposited in the module located at the rear end. And various kinds of deposition materials can be deposited.

For reference, in the exemplary embodiment of the present invention, it was shown that only two modules (cluster type deposition equipment for mass production of organic light emitting devices) are connected and installed by the buffer chamber 550, but the modules are connected by a plurality of buffer chambers. It can be connected and installed in multiple stages, in this case, the processing substrate loading unit 510 is installed on the module at the front end, and the processing substrate loading unit 540 only needs to be installed on the module at the rear end.

Technical ideas described in the embodiments of the present invention as described above may be implemented independently, or may be implemented in combination with each other. In addition, the present invention has been described through the embodiments described in the drawings and the detailed description of the invention, which is merely exemplary, and those skilled in the art to which the present invention pertains have various modifications and equivalent other embodiments. It is possible. Accordingly, the technical scope of the present invention should be determined by the appended claims.

S: substrate to be processed 10: deposition chamber
110: tray 110a, 110b, 110c, 110d: bulkhead
110-1,110-2,110-3: partition wall 112: deposition material
120: lifting means 130: heat source generating unit
200: alignment device 210: first frame
212: heat source through-hole 214: first drive device
216: first pinion gear 220: second frame
222: first rack gear 224: second drive device
226: second pinion gear 230: guide rail
232: support 234: second rack gear
510: substrate to be processed 520: tray supply
522: deposition material supply unit 530: conveyance chamber
540: processing substrate loading unit 550: buffer chamber

Claims (7)

A substrate is disposed on an upper portion of the substrate, and a lower portion of the substrate includes a deposition material having a predetermined thickness. A deposition chamber in which a deposition material is heated and evaporated by a heat source generator to deposit on the substrate to be processed;
A substrate loading portion including a plurality of substrates to supply the substrates to the deposition chamber;
A tray supply unit provided with a plurality of trays to supply a tray having a predetermined thickness of deposition material to the deposition chamber;
The deposition chamber, the substrate loading portion to be loaded and the tray supply portion are provided to be opened and closed with respect to their periphery, respectively, bringing in a plurality of substrates from the substrate loading portion to be loaded into the deposition chamber or In the cluster type deposition apparatus for mass production of organic light-emitting device comprising a transport chamber for carrying out, and carrying in or out of the individual trays by importing individual trays from the tray supply unit,
At the periphery of the transfer chamber, one or more deposition chambers are provided to be opened and closed,
The cluster type deposition apparatus for mass-producing organic light emitting device according to claim 1, wherein at least one tray supply unit for supplying the tray to one deposition chamber is installed to be opened and closed.
delete delete The method of claim 1,
The cluster type deposition apparatus for mass-produced organic light emitting device according to claim 1, wherein a processing substrate loading part for loading a processing substrate in which the deposition is completed in the deposition chamber is opened and closed.
The method of claim 1,
The deposition chamber, the tray supply unit and the transfer chamber is composed of one module, at least one module is provided, the organic light emitting device mass production characterized in that the modules are connected by a buffer chamber composed of a multi-stage module Cluster type deposition equipment. 6. The method of claim 5,
If the module is configured in multiple stages,
Of the modules of the multi-stage, the substrate processing unit is provided to be opened and closed on the periphery of the transfer chamber of the module located at the front end,
The cluster type deposition apparatus for mass-producing organic light-emitting device of claim 1, wherein a processing substrate loading unit for loading a processing substrate having a final deposition is installed at a periphery of a transfer chamber of a module located at a rear end thereof.
The method according to any one of claims 1 or 4 to 6,
The tray supply unit, the cluster type deposition apparatus for mass-producing organic light emitting device, characterized in that installed in communication with the deposition material supply unit for distributing the deposition material in a uniform thickness.

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