KR101239665B1 - Conductive complex and anisotropic conductive adhesive using the same - Google Patents

Abstract

The present invention includes an alloy filler, a polymer matrix that is not cured at the melting point of the alloy filler, and a polysiloxane-metal oxide composite mixed with the polymer matrix and combined with a metal oxide to form a metal oxide group, wherein the polysiloxane- Disclosed are a conductive composite having an epoxy group bonded to both ends of the metal oxide composite, and an anisotropic conductive adhesive using the same.

According to the present invention, since the conductive composite has conductivity and high heat dissipation characteristics, the heat dissipation pad for LED lighting, EMI shielding film and sheet, conductive paste for PCB manufacture, and heat dissipation material and shielding material for electronic components requiring heat dissipation.

Low Melting Alloy Filler, Polysiloxane, Heat Resistant

Description

Conductive complex and anisotropic conductive adhesive using the same

The present invention relates to a conductive composite, and more particularly, to a conductive composite exhibiting heat dissipation and high dispersion characteristics by mixing polysiloxane and a metal oxide composite using the same with a low melting point alloy filler having conductivity, and an anisotropic conductive adhesive using the same. .

Solder is generally used for soldering of electronic components, but technology has been developed to avoid lead since lead has a harmful effect on the environment.

As part of this, in recent years, environmentally friendly adhesives that do not contain lead components, more specifically, electrically conductive adhesives (ECA) have been developed and used.

The electrically conductive adhesive does not contain lead, which is not only environmentally friendly, but also has the advantage of high integration and high density of electronic components such as semiconductor chips and discrete components in accordance with the demand for high speed, large capacity, and miniaturization of electronic devices. have.

As such, the conductive adhesive is mainly used for highly integrated electronic components. Recently, the development of portable computers such as computers, portable terminals capable of playing music, DMB, video, and laptops has been accelerated. The semiconductor device is mounted inside the electronic device, which is being miniaturized as described above. A large amount of heat may be generated when the product is used due to the high integration and large capacity of the circuit. The heat generated as described above may not only degrade the function of the semiconductor device but also cause malfunctions of peripheral devices and deterioration of the substrate.

As described above, the conductive connecting agent such as the conductive adhesive contains the conductive component and the adhesive component cured by heat. However, such a conductive connecting agent does not include heat dissipation characteristics, so it is not possible to effectively dissipate heat generated from an electronic component, and there is a problem of using a separate heat dissipation material.

Accordingly, an object of the present invention is to solve the problems of the prior art as described above, to provide a conductive composite having conductivity and heat dissipation characteristics and an anisotropic conductive adhesive using the same.

Technical problems to be achieved by the present invention are not limited to the above-mentioned technical problems, and other technical problems not mentioned above will be clearly understood by those skilled in the art from the following description. Could be.

According to a feature of the present invention for achieving the object as described above, the conductive composite according to the present invention comprises a low melting point alloy filler; A polymer matrix in which hardening is incomplete at the melting point of the low melting alloy filler; It is characterized in that it comprises a polysiloxane-metal oxide composite which is mixed with the polymer matrix or used instead of the polymer matrix and is combined with a metal oxide to form a metal oxide group.

Epoxy groups are further bonded to both ends of the polysiloxane-metal oxide composite.

The epoxy group is 1-cyclopropyl-3-ethenyl-1,1,3,3-tetramethyl-disiloxane (1-cyclopropyl-3-ethenyl-1,1,3,3-tetramethyl-Disiloxane); 2- (3-buten-1-yl) -2-trimethylsilyl-oxirane (2- (3-buten-1-yl) -2- (trimethylsilyl) -Oxirane) or glycidyl methacrylate ) Is either.

The polysiloxane-metal oxide composite is a conductive composite, characterized in that represented by the formula (3).

(3)

In Formula 3, R ₁ , R ₂ , R ₃ , R ₄ , R ₆ , R ₇ , R ₈ , R ₉ , R ₁₀ are each independently hydrogen, an aliphatic hydrocarbon group having 1 to 50 carbon atoms , An aromatic hydrocarbon group having 6 to 50 carbon atoms, a hydroxyl group or a halogen group which may have a substituent, and R ₅ is an aliphatic hydrocarbon group having 1 to 50 carbon atoms which may have a substituent, or an aromatic hydrocarbon having 6 to 50 carbon atoms, which may have a substituent. The group is -O-, -COO- or -CO- with or without bonding, and l, m and n are each independently an integer of 1-100. X is a metal oxide group.

The metal of the metal oxide group is any one of copper, iron, zinc, silver, aluminum, platinum, manganese, cobalt, nickel, titanium, lead or cadmium.

The polysiloxane-metal oxide composite represented by Formula 3 is a conductive composite, characterized in that prepared by coordinating the polysiloxane and the metal oxide of the formula (1).

[Formula 1]

In Formula 1, R ₁ , R ₂ , R ₃ , R ₄ , R ₅ , R ₆ , R ₇ , R ₈ , R ₉ , R ₁₀ , l, m, n are as described in Formula 3 above.

The polysiloxane of Chemical Formula 1 is prepared by reacting a compound of Chemical Formula 2 with R ₅ NR ₉ R ₁₀ .

[Formula 2]

In Formula 2, R ₁ , R ₂ , R ₃ , R ₄ , R ₅ , R ₆ , R ₇ , R ₈ , R ₉ , R ₁₀ , l, m, n are as described in Formula 3 above.

At least one of a flux, a surface active agent, and a curing agent is added to the conductive adhesive.

According to another feature of the invention, the paste is made of a conductive composite according to the above description.

According to another feature of the invention, a film is made of the conductive composite according to the above description.

The anisotropic conductive adhesive according to another feature of the present invention is at least one or more adhesive layers composed of a polymer matrix, at least one or more polysiloxane-metal oxide composite having a heat dissipation property or at least one of a polysiloxane-metal oxide composite and a polymer matrix mixed Consists of a heat dissipation layer, at least one side of the adhesive layer and the heat dissipation layer may include a low melting alloy filler, the polymer matrix is characterized in that the curing is not completed at the melting point of the low melting alloy filler.

The adhesive layer and the heat dissipation layer are alternately stacked.

Both ends of the polysiloxane-metal oxide composite further include an epoxy group.

The epoxy group is 1-cyclopropyl-3-ethenyl-1,1,3,3-tetramethyl-disiloxane (1-cyclopropyl-3-ethenyl-1,1,3,3-tetramethyl-Disiloxane); 2- (3-buten-1-yl) -2-trimethylsilyl-oxirane (2- (3-buten-1-yl) -2- (trimethylsilyl) -Oxirane) or glycidyl methacrylate Is either.

The polysiloxane-metal oxide composite is represented by the following formula (3).

(3)

In Formula 3, R ₁ , R ₂ , R ₃ , R ₄ , R ₆ , R ₇ , R ₈ , R ₉ , R ₁₀ are each independently hydrogen, an aliphatic hydrocarbon group having 1 to 50 carbon atoms , An aromatic hydrocarbon group having 6 to 50 carbon atoms, a hydroxyl group or a halogen group which may have a substituent, and R ₅ is an aliphatic hydrocarbon group having 1 to 50 carbon atoms which may have a substituent, or an aromatic hydrocarbon having 6 to 50 carbon atoms, which may have a substituent. The group is -O-, -COO- or -CO- with or without bonding, and l, m and n are each independently an integer of 1-100. X is a metal oxide group.

The present invention provides a conductive composite in which a low melting alloy filler having a conductive property and a polysiloxane-metal oxide composite having high heat dissipation characteristics are mixed. As described above, the conductive composite according to the present invention has conductivity and high heat dissipation characteristics, and thus may be used as a heat dissipation material and shielding material for LED lighting heat dissipation pads, EMI shielding films and sheets, PCB conductive pastes, and electronic components. .

Hereinafter, a preferred embodiment of the conductive composite and anisotropic conductive adhesive using the same according to the present invention will be described in detail.

First, the conductive adhesive will be briefly described. The conductive adhesive is composed of a polymer matrix and conductive particles, and is cured at a relatively low temperature to be conductive by physical / mechanical contact of the conductive particles by curing shrinkage. Has characteristics. At this time, the conductive particles are a portion which enables substantially electrical conduction, and the polymer matrix serves to physically fix the electronic component to a circuit board or the like. The conductive adhesive includes an isotropic conductive adhesive having conductivity in all directions, and an anisotropic conductive adhesive having insulation in the horizontal direction and conductive in the vertical direction. In particular, anisotropic conductive adhesives are used for mounting electronic components such as semiconductors, for example, flat panel display elements such as LCDs, PDPs, and ELs.

At this time, the conductive particles inside the electrically conductive adhesive are contracted as the polymer matrix is cured to form an energization path in the polymer matrix. As a result, the bumps of the electronic component and the lands of the circuit board are electrically connected by the energization path. .

The conductive adhesive described above is unstable in electrical properties compared to the chemical bonding state of general soldering because the conductive is made by the physical contact between the conductive particles and / or the terminals. Therefore, to solve this problem, the conductive composite according to the present invention includes a low melting point alloy filler. The low-melting alloy filler refers to conductive particles that can be melted in a state where the polymer matrix is not hardened. The low-melting alloy filler forms a metallic bond between terminals and has high contact resistance and excellent electrical and thermal properties. It may have impact strength and bond strength.

The low melting point alloy filler is formed of a relatively low melting point alloy, specifically, tin (Sn), indium (In), bismuth (Bi), copper (Cu), zinc (Zn), lead (Pb), cadmium (Cd) And alloys made of metals such as gallium (Ga), silver (Ag), and thallium (Tl).

The low melting point alloy filler is formed of a metal and an alloy having a lower melting point than a melting point of 183 ° C and a melting point of 183 ° C, which is largely a melting point of 63Sn-37Pb. -52 In, Sn-57Bi, In-3Ag, In-34Bi, Bi-45Sn-0.33Ag, Sn-57Bi-1Ag, Sn-6Zn-6Bi (all composition ratios), the metal or alloy shown in Table 1, etc. are mentioned. . Table 1 also shows the melting point of each metal and each alloy.

Metal (composition ratio) Melting point (캜) Sn Bi In CD Ga Zn Tl 24 76 16 8 92 20 95 5 25 100 29.8 16 33 51 61 34 66 72.4 17 57 26 79 42 44 14 93 26 53.5 20.5 103 48 52 117 75 25 127.7 43 57 139 62 38 144 100 156.4 57 43 170 67 33 176

As the latter, Sn, Bi, Tl, Sn-3.5Ag, Sn-3Ag-0.5Cu (all composition ratios), the metal and alloy shown in Table 2 are mentioned, for example. Table 2 also shows the melting point of each metal and each alloy.

Metal (composition ratio) Melting point (캜) Sn Bi In Zn Ag Cu Sb Ge 91 9 199 93 0.5 3 3.5 215 92 5 3 216 95.75 3.5 0.75 218 94 3 3 218 96.5 3 0.5 220 96.5 3.5 221 99.3 0.7 227 65 25 10 233 92.7 3 3.2 1.1 240 77.2 20 2.8 175-186 89 3 8 189-199 90.5 7.5 2 190-216 90.8 5 3.5 0.7 198-213 91.8 4.8 3.4 200-216 93.4 4 2 0.5 0.1 202-217 94.25 3 2 0.75 205-217 93.5 3 3.5 208-217 96.3 3.2 0.5 217-218 95.5 4 0.5 217-219 97.25 2 0.75 217-219 95.5 3.8 0.7 217-220 95 4 One 217-220 93.6 4.7 1.7 217-220 96.2 2.5 0.8 0.5 217-225 95.5 0.5 4 217-350 98 2 221-226 97 0.2 2 0.8 226-228 95 5 232-240

The low melting alloy filler has a volume ratio of 10% to 60%, preferably approximately 40% in the conductive composite. If the volume ratio of the low-melting alloy filler is less than 10%, there is a possibility of opening due to no electrical conduction in the polymer matrix. If the low-melting alloy filler exceeds 60%, the low-melting alloy filler and the polymer are densely arranged. This is because the mixed state of the matrix is uneven and there is a possibility that short-circuiting with adjacent terminals occurs. Of course, the low melting point alloy filler 32 is not limited to the above-described range, and may have a volume ratio of less than 10% or 60% or more in the conductive adhesive 30 by adjusting the initial distance between the electronic product and the substrate.

Flux may be added to remove the oxide film formed on the surface of the low melting point alloy filler and the electrode terminal described above. The flux is, for example, a reducing agent such as a resin, an inorganic acid, an amine, an organic acid, and serves to remove surface foreign substances such as oxides on the surface of the molten alloy filler and convert them into soluble or fusible compounds. In addition, the foreign material is removed to cover the surface of the alloy filler is cleaned to prevent oxidation again.

It is preferable that the said flux has a boiling point higher than melting | fusing point of an alloy filler, and lower than the highest temperature at the time of the heat processing performed in order to join a terminal mutually. It is preferable that it is 3-20 weight%, and, as for the content rate of the flux in the said conductive composites, it is more preferable that it is 3-10 weight%. Here, when the content of flux exceeds 20% by weight, voids are likely to occur, which is a cause of deterioration of the joining characteristics at the joints, which is not preferable. When the content is less than 3% by weight, the surface of the alloy filler, the surface of the land or the terminal And the ability to reduce foreign substances on the surface of the electrode pad, such as oxides, may be deteriorated, resulting in deterioration of the bonding properties of the joints caused by the residual oxide film.

As described above, the flux may be used to remove the oxide film formed on the surface of the low melting alloy filler. In addition, the present invention includes mixing a polysiloxane to a low melting alloy filler to remove the oxide film formed on the surface of the low melting alloy filler. As such, when the polysiloxane is mixed with the low melting alloy filler, the reducing property of the conductive composite may be enhanced.

In the present invention, a polysiloxane represented by the following Chemical Formula 1 is provided as a polysiloxane mixed with the polymer matrix.

[Formula 1]

In Formula 1, R ₁ , R ₂ , R ₃ , R ₄ , R ₆ , R ₇ , R ₈ , R ₉ , R ₁₀ are each independently hydrogen, an aliphatic hydrocarbon group having 1 to 50 carbon atoms , An aromatic hydrocarbon group having 6 to 50 carbon atoms, a hydroxyl group or a halogen group which may have a substituent, and R ₅ is an aliphatic hydrocarbon group having 1 to 50 carbon atoms which may have a substituent, or an aromatic hydrocarbon having 6 to 50 carbon atoms, which may have a substituent. The group is -O-, -COO- or -CO- with or without bonding, and l, m and n are each independently an integer of 1-100.

In addition, in Formula 1, at least one of R ₁ , R ₂ , R ₃ , R ₄ , R ₅ , R ₆ , R ₇ , R ₈ , R ₉ , and R ₁₀ has 1 to 50 carbon atoms including one or more double bonds. It is preferred to be selected from aliphatic hydrocarbon groups. For example, examples of the simple compound included in Formula 1 include compounds in which R1 and R8 are hydrogen, R ₂ , R ₃ , R ₄ , R ₆ , R ₉ , R ₁₀ is a methyl group, and R ₇ is a vinyl group. . In addition to this, at least one of R ₁ , R ₂ , R ₃ , R ₄ , R ₅ , R ₆ , R ₇ , R ₈ , R ₉ , R ₁₀ contains a vinyl group, and the remainder is methyl, ethyl, butyl, phenyl, etc. All of the compounds having various functional groups can be included here.

The compound represented by Chemical Formula 1 described above can increase the affinity with the inorganic fillers and thus have the advantage of having high heat dissipation characteristics and dispersion characteristics when forming coordination bonds with the metal oxide.

The polysiloxane represented by Chemical Formula 1 may be prepared by reacting a compound of Chemical Formula 2 with R ₅ NR ₉ R ₁₀ having an amide group.

[Formula 2]

In Formula 2, R ₁ , R ₂ , R ₃ , R ₄ , R ₅ , R ₆ , R ₇ , R ₈ , R ₉ , R ₁₀ , l, m, n are as described in Formula 1.

The polysiloxane copolymer compound represented by Chemical Formula 2 is composed of various siloxane monomers, siloxane monomers in which double bonds are introduced, and the like, for example, using a catalyst such as TMAS (tetramethylammonium siloxane oleate). It can be obtained by making it react for 2 to 4 hours in nitrogen atmosphere.

The reaction for preparing the formula (1) is to use an addition reaction to the Si-H bond of the polysiloxane, to introduce an amide bond having a strong electronegativity. More specifically, the amide compound corresponding to the quantitative value of the Si-H bond in the compound of formula (2) is 1-10 hours at about 80-95 ° C, preferably about 90 ° C, in the presence of a platinum-based catalyst dedicated to the addition of silicon, Preferably, the reaction may be carried out for 3-5 hours, and the reaction product may be depressurized to prepare a polysiloxane into which an amide group has been introduced. The compound represented by the formula (1) obtained thereby can maintain the bond with the metal oxide more stably. Therefore, after the metal oxide is bonded to the compound of Formula 1, it is possible to have higher heat dissipation and dispersion characteristics.

Next, in the present invention, the polymer matrix is preferably mixed with the polysiloxane-metal oxide composite represented by the following general formula (3).

(3)

In Formula 3, R ₁ , R ₂ , R ₃ , R ₄ , R ₅ , R ₆ , R ₇ , R ₈ , R ₉ , R ₁₀ , l, m, n are the same as described in Formulas 1 and 2 above. X is a metal oxide group (metal oxide).

The compound represented by Chemical Formula 3 is mixed with the polymer matrix so that the conductive composite has stronger heat dissipation characteristics. And this can be obtained through the coordination bond of the polymer polysiloxane and the metal oxide represented by the formula (1). The reaction was performed by adding an excess metal oxide to the polysiloxane represented by Formula 1, stirring at 500-3,000 rpm for 10-30 hours at room temperature, and then dissolving the reaction product in an organic solvent such as toluene using a centrifuge and a filter. It may be carried out through the process of removing the unreacted metal oxide through filtration.

Since the polysiloxane-metal oxide composite obtained through such a process has high heat dissipation and dispersing characteristics, the polysiloxane-metal oxide composite is mixed with the polymer matrix so that the conductive composite can have higher heat dissipation and dispersing characteristics. If the metal is directly bonded to the polysiloxane for heat dissipation, a short circuit may occur when used in electronic products. Therefore, in this embodiment, the metal oxide is prevented by binding to the polysiloxane through the coordination bond.

Meanwhile, the metal of the metal oxide group of the compound represented by Chemical Formula 3 may be selected from various metals, for example, copper, iron, zinc, silver, aluminum, platinum, manganese, cobalt, nickel, titanium, lead, or cadmium. Can be selected.

In addition, since the paste and film manufactured using the conductive composite described above have conductivity and high heat dissipation characteristics, a heat dissipation pad for LED lighting, an EMI shielding film and sheet, a conductive paste for PCB, and a heat dissipation material for electronic components that require heat dissipation and It can be used as a shielding material.

For reference, in the present invention, an epoxy group is bonded to the end of the polysiloxane so that the polysiloxane and the polysiloxane-metal oxide composite including the same are chemically bonded in the process of being mixed with the polymer matrix. For example, R <_1> and R <_8> of the said General formula (3) should just contain an epoxy group.

Specifically, the polysiloxane-metal oxide may be mixed with the additive when the volume ratio is 0-30%, but when mixed with the polymer matrix, the polysiloxane-metal oxide is R ₁ in the polysiloxane-metal oxide as described above. It is preferable to mix with R <_8> in the form which stuck an epoxy group. The epoxy group is bonded to the terminal of the polysiloxane to improve the compatibility of the polysiloxane and the low melting alloy filler.

The monomer having an epoxy group bonded here is 1-cyclopropyl-3-ethenyl-1,1,3,3-tetramethyl-disiloxane (1-cyclopropyl-3-ethenyl-1,1,3,3-tetramethyl -Disiloxane); 2- (3-buten-1-yl) -2-trimethylsilyl-oxirane (2- (3-buten-1-yl) -2- (trimethylsilyl) -Oxirane) or glycidyl methacrylate ) Is either. Of course, in addition to the monomers listed above, a monomer having an epoxy group may be applied. When the monomer having such an epoxy group is mixed with the low melting alloy filler in a state of being bonded to the terminal of the polysiloxane, the compatibility of both is improved, and the chemical bonding of the polysiloxane and the low melting alloy filler can be well achieved.

Meanwhile, in the above description, the polysiloxane-metal oxide composite is mixed with the polymer matrix to make the conductive adhesive of the present invention, but it is not necessary to do so. Since the polysiloxane-metal oxide composite itself has the characteristics of a polymer matrix, the conductive composite of the present invention may be made by using only the polysiloxane-metal oxide composite instead of the polymer matrix without mixing with a separate polymer matrix. In this case, as described above, the polysiloxane-metal oxide composite should include an epoxy group.

For reference, look at the type of the polymer matrix. The polymer matrix may be at least one selected from the group consisting of a thermoplastic resin, a thermosetting resin, and a photocurable resin.

The thermoplastic resin may be a vinyl acetate resin, polyvinyl butyral resin, vinyl chloride resin, styrene resin, vinyl methyl ether resin, greptyl resin, ethylene-vinyl acetate copolymer resin, styrene-butadiene copolymer resin, Polybutadiene resin, polyvinyl alcohol resin, and the like.

As the thermosetting resin, epoxy resins, urethane resins, acrylic resins, silicone resins, phenolic resins, melamine resins, alkyd resins, urea resins and unsaturated polyester resins can be used.

The conductive composite described above was in a form in which a low melting alloy filler as conductive particles and a polysiloxane-metal oxide composite as a heat dissipating material were mixed. However, the configuration of the anisotropic conductive adhesive is also possible using this type of conductive composite.

Specifically, the anisotropic conductive adhesive according to the present invention is composed of at least one adhesive layer and at least one heat dissipation layer, wherein the adhesive layer is composed of a polymer matrix, and the heat dissipation layer is composed of only a polysiloxane-metal oxide composite having heat dissipation characteristics. Alternatively, the polysiloxane-metal oxide composite and the polymer matrix may be mixed.

The low melting point alloy filler may be included in at least one of the adhesive layer and the heat dissipation layer. Here, the adhesive layer and the heat dissipation layer may have a form in which a plurality of layers are alternately stacked.

For reference, the conductive composite may contain a surface active agent, a curing agent, or the like as a material other than the low melting point alloy filler, polysiloxane, and flux.

The surface active agent may be, for example, i) glycols such as ethylene glycol or glycerin, ii) organic acids such as maleic acid or adipic acid, iii) amine compounds such as amines, amino acids, organic acid salts of amines, halogen salts of amines or I) It is an inorganic acid, an inorganic acid salt, etc., and plays a role of dissolving and removing foreign substances such as oxide on the surface of the molten conductive particles and the surface of the terminal.

It is preferable that the said surface active agent has a boiling point higher than melting | fusing point of an alloy filler, and evaporates at the temperature lower than the highest temperature at the time of the heat processing performed in order to join between terminals. It is preferable that it is 3-20 weight%, and, as for the content rate of the surface active agent in the said conductive composites, it is more preferable that it is 3-10 weight%. When the surface active agent is less than 3% by weight, surface foreign matter removal ability such as oxide on the surface of the conductive particles, the surface of the land, and the surface of the electrode pad is reduced, resulting in deterioration of the bonding properties of the joint, and more than 20% by weight. If it is, voids are likely to occur, which causes deterioration of the bonding characteristics at the joint.

And the curing agent to promote the curing of the polymer matrix contained in the conductive composite, there is a diaminodiphenyl sulfone (DDS). It is preferable that a hardening | curing agent becomes the content rate in a conductive composite the same as that of the surface active agent demonstrated above.

The scope of the present invention is not limited to the embodiments described above, but may be defined by the scope of the claims, and those skilled in the art may make various modifications and alterations within the scope of the claims It is self-evident.

Claims (15)

An alloy filler; A polymer matrix in which hardening is incomplete at the melting point of the alloy filler; A polysiloxane-metal oxide composite mixed with the polymer matrix and combined with a metal oxide to form a metal oxide group; And It includes a flux having a boiling point higher than the melting point of the alloy filler and lower than the temperature at which the curing of the polymer matrix is completed, A conductive composite having an epoxy group bonded to both ends of the polysiloxane-metal oxide composite. delete The method of claim 1, The epoxy group is 1-cyclopropyl-3-ethenyl-1,1,3,3-tetramethyl-disiloxane (1-cyclopropyl-3-ethenyl-1,1,3,3-tetramethyl-Disiloxane); 2- (3-buten-1-yl) -2-trimethylsilyl-oxirane (2- (3-buten-1-yl) -2- (trimethylsilyl) -Oxirane) or glycidyl methacrylate The conductive composite, characterized in that any one of. The method of claim 3, wherein The polysiloxane-metal oxide composite is a conductive composite, characterized in that represented by the formula (3). (3)

In Formula 3, R ₁ , R ₂ , R ₃ , R ₄ , R ₆ , R ₇ , R ₈ , R ₉ , R ₁₀ are each independently hydrogen, an aliphatic hydrocarbon group having 1 to 50 carbon atoms , An aromatic hydrocarbon group having 6 to 50 carbon atoms, a hydroxyl group or a halogen group which may have a substituent, and R ₅ is an aliphatic hydrocarbon group having 1 to 50 carbon atoms which may have a substituent, or an aromatic hydrocarbon having 6 to 50 carbon atoms, which may have a substituent. The group is -O-, -COO- or -CO- with or without bonding, and l, m and n are each independently an integer of 1-100. X is a metal oxide group. 5. The method of claim 4, The metal of the metal oxide group is a conductive composite, characterized in that any one of copper, iron, zinc, silver, aluminum, platinum, manganese, cobalt, nickel, titanium, lead or cadmium. 6. The method of claim 5, The polysiloxane-metal oxide composite represented by Formula 3 is a conductive composite, characterized in that prepared by coordinating the polysiloxane and the metal oxide of the formula (1). [Formula 1]

In Formula 1, R ₁ , R ₂ , R ₃ , R ₄ , R ₅ , R ₆ , R ₇ , R ₈ , R ₉ , R ₁₀ , l, m, n are as described in Formula 3 above. The method of claim 6, The polysiloxane of Chemical Formula 1 is prepared by reacting a compound of Chemical Formula 2 with R ₅ NR ₉ R ₁₀ . [Formula 2]

In Formula 2, R ₁ , R ₂ , R ₃ , R ₄ , R ₅ , R ₆ , R ₇ , R ₈ , R ₉ , R ₁₀ , l, m, n are as described in Formula 3 above. The method of claim 7, wherein The conductive composite is characterized in that at least one or more of a surface active agent and a curing agent is added to the conductive composite. A paste made of the conductive composite according to any one of claims 1 and 3 to 8. A film made of the conductive composite according to any one of claims 1 and 3 to 8. delete delete delete delete delete