KR101237869B1 - Method for manufacturing working stage with CNT antistatic treatment and the working stage with CNT antistatic treatment - Google Patents
Method for manufacturing working stage with CNT antistatic treatment and the working stage with CNT antistatic treatment Download PDFInfo
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- KR101237869B1 KR101237869B1 KR20100103637A KR20100103637A KR101237869B1 KR 101237869 B1 KR101237869 B1 KR 101237869B1 KR 20100103637 A KR20100103637 A KR 20100103637A KR 20100103637 A KR20100103637 A KR 20100103637A KR 101237869 B1 KR101237869 B1 KR 101237869B1
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- South Korea
- Prior art keywords
- work stage
- carbon nanotubes
- oxide
- antistatic
- metal material
- Prior art date
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/18—After-treatment, e.g. pore-sealing
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4581—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber characterised by material of construction or surface finish of the means for supporting the substrate
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/18—After-treatment, e.g. pore-sealing
- C25D11/24—Chemical after-treatment
- C25D11/246—Chemical after-treatment for sealing layers
Abstract
The present invention relates to a work stage surface antistatic treatment method of a metal material and the work stage surface is antistatic, the work stage surface antistatic treatment method of a metal material according to a preferred embodiment of the present invention, a work stage of a metal material Anodizing the surface to form a plurality of oxide surface holes, inserting carbon nanotubes into the respective oxide surface holes, curing the carbon nanotubes, and curing the carbon nanotubes, Sealing the work stage surface.
Description
The present invention relates to an antistatic treatment method on a surface of a work stage and to a work stage on which an surface is antistatically treated, and more particularly, to a stage applicable to an antistatic treatment stage such as semiconductor manufacturing equipment, a display device, and a test device. An antistatic treatment method for a surface and a work stage in which the surface is antistatically treated.
The work stage used in the semiconductor manufacturing apparatus is a wafer substrate to be seated, usually made of metal and ceramic materials. In the semiconductor manufacturing apparatus using the work stage, after the handler fixes the wafer substrate and moves to the work stage, tribostatic static electricity occurs between the work stage and the wafer substrate when the wafer substrate is placed on the work stage.
In addition, a work stage used in a dispenser for a flat panel display (FPD) generally adsorbs a display substrate in a vacuum manner. The work stage in this case is also usually made of a metallic material, and when the display substrate is adsorbed on the work stage or when the display substrate which was fixed to the adsorption is detached from the work stage, charging occurs in the work stage, so that the display It is charged to the substrate. In recent years, as the display substrate is enlarged, the amount of charging increases, so that the problem of electrostatic charging increases.
A plurality of electronic components such as semiconductor devices are disposed on the wafer substrate and the display substrate. Therefore, when static electricity is generated, it may be applied to the electronic component and transferred to the internal circuit. This, in turn, will seriously damage the reliability of the electronic components. In addition, there is a problem in that particles are attached to the substrate or the substrate is broken when the substrate is lifted up due to the electrostatic charging.
Conventionally, in order to prevent the charging of the static electricity, an ionizer is installed in the work stage to neutralize the charging potential. In this case, however, lift-up is not possible, and the ion wind of the ionizer does not reach, and even when lift-up occurs, static electricity generated between the work stage and the substrate is generated instantaneously, such as a discharge occurs before the ion wind reaches a place where neutralization is required. The problem of peeling charge caused by
In order to solve this problem, in order to prevent the static electricity of the work stage can be coated with a fluorine resin (aka, Teflon coating). Since the fluorine resin has a small adsorption energy with other substances, excellent non-tackiness, and a small coefficient of friction, the fluorine resin has a small correlation with the glass substrate, and thus a small amount of static electricity generated by peeling.
In this case, since the normal fluorine component has insulation, the teflon coating contains a charged material in the fluorine component. In other words, the work stage was subjected to Teflon coating to prevent the generation of static electricity in the work stage.
However, the Teflon coating method is relatively expensive to manufacture. In particular, in the case of the dispenser, as the size of the display substrate is increased, the size of the work stage is also increased, so that the manufacturing cost is inevitably higher.
In addition, since the hardness of the fluorine itself is low, the hardness of the coating film made of fluorine is low, and scratches easily occur. As a result, it is difficult to maintain flatness of the scratched portion, which causes particles to occur.
In addition, since fluorine has an insulating property, a conductive filler such as carbon black or a conductive polymer should be added to have an antistatic sheet resistance. However, carbon black has a problem in that dust is generated as a spherical shape. Weakness is poor, an excess binder must be used, and there is a problem in that thin film formation is difficult.
In addition, in order to supplement the low hardness of the fluorine, anodizing treatment is required to undergo a separate coating process afterwards, thereby increasing the process cost and manufacturing time.
The present invention is to solve various problems including the above problems, while minimizing the generation of static electricity on the surface meeting the substrate of the stage, the manufacturing cost is reduced, the sheet resistance can be properly adjusted, the friction coefficient is low An object of the present invention is to provide an antistatic treatment method for a stage surface having improved wear resistance.
Another object of the present invention is to provide an antistatic treatment method for a work stage surface in which the process is simple and rapid processing is performed.
Accordingly, the method of antistatic treatment of a work stage surface of a metal material according to a preferred embodiment of the present invention comprises the steps of: anodizing a work stage surface of a metal material to form a plurality of oxidized surface holes; Inserting at least a portion of the carbon nanotubes in the core, curing the carbon nanotubes, and sealing the work stage surface after the carbon nanotubes curing.
In this case, the step of inserting the carbon nanotubes into the oxidized surface hole may be made by electrolytically adsorbing a solution containing the carbon nanotubes. Alternatively, the step of inserting the carbon nanotubes into the oxide surface hole may be performed by electrostatic coating of the solution containing the carbon nanotubes.
The work stage surface preferably has a sheet resistance of 10 6 to 10 9 Ω / sq.
Further, in the step of forming oxide surface holes on the surface of the work stage, each of the oxide surface holes is preferably 30nm to 900nm in diameter, 100nm to 900nm in depth.
On the other hand, prior to inserting the carbon nanotubes into the respective oxide surface holes, the step of preheating the work stage surface to a temperature of 50 ℃ to 100
According to another aspect of the present invention, there is provided an antistatic treatment method for a work stage surface of a metal material, the method comprising: anodizing a work stage surface of a metal material to form a plurality of oxidized surface holes; Coating the carbon nanotubes on the anodized work stage surface, curing the carbon nanotubes, and sealing the work stage surface after curing the carbon nanotubes so as to cover the carbon nanotubes. .
According to another aspect of the present invention, a work stage having an antistatic surface may include a work stage body made of a metal material capable of anodizing, and formed on a surface of the work stage body, wherein the anode oxide and carbon nanotube of the metal material may be formed. An antistatic layer made of a mixture and a protective layer formed on the surface of the antistatic layer.
In this case, the anodic oxide may have a diameter of 30 nm to 900 nm, a depth of 100 nm to 900 nm, and a plurality of oxide surface holes, and the carbon nanotube may be inserted into the oxide surface hole.
The antistatic layer may further include a carbon nanotube layer including a mixed layer of the carbon nanotubes and the anode oxide mixed therein, and carbon nanotubes formed on an upper surface of the mixed layer.
On the other hand, the protective layer is made of a mixed material of boehmite and carbon nanotubes, the antistatic layer may further comprise a boehmite material.
According to the present invention, by coating an antistatic material including carbon nanotubes, the generation of static electricity in the work stage is reduced, the coefficient of friction is lowered, and the wear resistance is excellent.
In addition, since a separate coating process is unnecessary to form the antistatic layer, the process cost is reduced and the process time is shortened.
1 is a flowchart of an antistatic treatment method of a stage surface according to a preferred embodiment of the present invention.
2A to 2D are cross-sectional views showing the steps of the antistatic treatment method of the stage surface of FIG. 1, and FIG. 2A is a cross-sectional view showing the step of forming an oxide surface hole on the work stage surface.
2B is a cross-sectional view illustrating a step of inserting carbon nanotubes into the oxide surface holes.
Figure 2c is a cross-sectional view showing the step of curing the carbon nanotubes.
2D is a cross-sectional view illustrating the step of sealing the work stage surface.
3A to 3C are cross-sectional views illustrating modified examples of FIG. 2B, respectively.
4 is a cross-sectional view illustrating a work stage with an antistatic surface according to a preferred embodiment of the present invention.
5 is a cross-sectional view showing a work stage with an antistatic surface according to another embodiment of the present invention.
Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.
1 is a flowchart showing each step of the antistatic treatment method for a stage surface according to a preferred embodiment of the present invention.
As shown in FIG. 1, the antistatic treatment method of the stage surface of the present invention comprises the steps of forming an oxidized
Each step will be described in detail with reference to FIGS. 2A to 2D. First, as shown in FIG. 2A, anodizing the surface of the
The
On the
The most representative metal material for anodizing is aluminum (Al), and other metal materials such as magnesium (Mg), zinc (Zn), titanium (Ti), tantalum (Ta), hafnium (Hf), and niobium (Nb) Anodizing is also done. Recently, the anodizing treatment of magnesium and titanium materials is also increasingly used. Therefore, the metal material of the present invention is aluminum (Al), magnesium (Mg), zinc (Zn), titanium (Ti), tantalum (Ta), hafnium (Hf), niobium (Nb), magnesium (Mg), and titanium ( Ti) material and the like.
In this invention, an aluminum alloy is demonstrated to an example. Aluminum material is light, has a certain strength, and has excellent workability.
Anodizing is performed on the upper surface of the
In this case, anodizing on aluminum alloys to treat the
There are various electrolyte solutions used in the anodizing process, and for example, sulfuric acid and sulfuric acid such as sodium hydroxide may be used.
A plurality of oxide surface holes 22 (pores) are formed in the
In this step, the concentration of sodium hydroxide is 20% to 50%, the supply voltage is DC 5V to 200V, and the supply current is 1 to 5A, and may be energized for 10 to 200 minutes.
By adjusting conditions such as the concentration of sodium hydroxide, supply voltage, supply current, and supply time, the size (D) and depth (L) of the surface oxide holes 22 may be adjusted. The antistatic effect, durability, and surface hardness can be adjusted according to the size and depth of the oxidized surface holes 22.
In the step of forming the oxidized surface holes 22 on the surface of the
On the other hand, although not shown, it is preferable to go through a pretreatment process for the anodizing process before the anodizing process. In this case, the pretreatment step may require a degreasing step, a neutralization step, and the like, and may further include a washing step between the steps.
After forming the oxide surface holes 22, as shown in FIG. 2B,
Carbon nanotubes (CNT) form a tube by combining one carbon with a hexagonal honeycomb pattern with other carbon atoms. Indicates.
The
As illustrated in FIG. 2B, the
In addition, the
In addition, the
In addition, although not shown, carbon nanotubes may be inserted into only a portion of the oxide surface hole.
On the other hand, the
In this case, the
The sheet resistance of the
The carbon nanotube solution may include a binder. The binder may be an acrylic, urethane, polyester, epoxy, polyimide, melamine, conductive polymer or organic / inorganic hybrid binder. The binder may be a thermosetting resin or a photocurable resin.
Inserting the
Inserting the
In the present invention, as the method of inserting the
In the case of the conventional antistatic coating of fluorine material, since the hardness of the fluorine is weak, the thickness of the fluorine coating layer is bound to be thick. Due to the thickness, the antistatic effect is reduced. However, in the case of the present invention, the
After inserting the
The curing step is to heat the coating site to 70 ℃ to 200 ℃ according to the type of the binder by an ultraviolet heater (IR heater) or dry heater (Dry heater), by maintaining it for a predetermined time (for example, 30 minutes) Can be done. When the
After curing the
Sealing treatment is to seal the oxide surface holes 22 and the
As an example, the surface oxide holes are filled with aluminum oxide hydrate by a hydration sealing process. This is because Al 2 O 3 formed by anodizing changes to boehmite, and Al 2 O 3 contains crystal water and its volume expands and is sealed by blocking the
On the other hand, the pH can be controlled in the range of 5.5 to 6.5 in hydration sealing, because boehmite formation is strongly affected by pH, because if the pH is lower than 5.5, the sealing degree drops sharply and treatment under 4 should be avoided. to be.
Meanwhile, the step of preheating the surface of the
In the preheating step, in order to improve the coating power of the
According to the present invention, the
4 is a cross-sectional view illustrating an
The
The
To this end, the
By adjusting the size and depth of the oxidized surface holes, it is possible to control the antistatic effect, durability and surface hardness.
The
In this case, the
The
Accordingly, the
In addition, since the
5 is a cross-sectional view illustrating a modification of FIG. 4. As shown in FIG. 5, the
The
The
In the boehmite material, Al 2 O 3 formed by anodizing is changed, Al 2 O 3 contains crystal water, its volume expands, and is sealed by blocking an oxide surface hole, or aluminum oxide is oxidized. 2 O 3 · H 2 O may be bulky to block the oxide surface hole.
The
10, 100, 1000: job stage
20: oxide film
22: oxide surface hole
30: carbon nanotube
40: protective layer
110: work stage body
200: antistatic layer
Claims (12)
Inserting at least a portion of carbon nanotubes into each of the oxide surface holes;
Curing the carbon nanotubes; And
After hardening the carbon nanotubes, sealing the work stage surface;
Work stage surface antistatic treatment method of a metal material comprising a.
And inserting the carbon nanotubes into the oxidized surface hole, electrostatically adsorbing the solution containing the carbon nanotubes.
And inserting the carbon nanotubes into the oxidized surface hole, by electrostatic coating the solution including the carbon nanotubes.
Coating carbon nanotubes on the anodized work stage surface to cover the respective oxide surface holes;
Curing the carbon nanotubes; And
After hardening the carbon nanotubes, sealing the work stage surface;
Work stage surface antistatic treatment method of a metal material comprising a.
The work stage surface antistatic treatment method of a metal material, characterized in that the surface resistance of 10 6 to 10 9 Ω / sq.
And forming oxide surface holes on the work stage surface, each of the oxide surface holes having a diameter of 30 nm to 900 nm and a depth of 100 nm to 900 nm.
Prior to inserting carbon nanotubes into the respective oxide surface holes, the work stage of the metal material further comprises preheating the work stage surface to a temperature of 50 ° C. to 100 ° C. for 20 minutes to 1 hour. Surface antistatic treatment method.
An antistatic layer formed on a surface of the work stage, the antistatic layer comprising a mixture of anodic oxide and carbon nanotubes formed by anodizing the metal constituting the work stage body; And
To include; a protective layer formed on the surface of the antistatic layer,
The anodic oxide has a diameter of 30nm to 900nm, a depth of 100nm to 900nm includes a plurality of oxide surface holes,
And the carbon nanotubes are inserted into the oxidized surface holes.
The antistatic layer includes a carbon nanotube layer comprising carbon nanotubes and a mixture of carbon nanotubes and anodized oxide, and carbon nanotubes formed on an upper surface of the mixed layer.
The protective layer is made of boehmite material,
And the antistatic layer further comprises a boehmite material.
An encapsulation layer formed on the surface of the work stage, the metal material forming the work stage body being anodized and having a mixture of anodic oxide having a plurality of oxide surface holes and boehmite material blocking the oxide surface holes; And
An antistatic layer formed on a surface of the encapsulation layer and having a mixture of carbon nanotubes and boehmite material;
Surface antistatic work stage comprising a.
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KR20100103637A KR101237869B1 (en) | 2010-10-22 | 2010-10-22 | Method for manufacturing working stage with CNT antistatic treatment and the working stage with CNT antistatic treatment |
PCT/KR2011/007627 WO2012053774A2 (en) | 2010-10-22 | 2011-10-13 | Method for performing an antistatic treatment on a surface of a work stage, and work stage to the surface of which an antistatic treatment is applied according to the method |
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KR20100103637A KR101237869B1 (en) | 2010-10-22 | 2010-10-22 | Method for manufacturing working stage with CNT antistatic treatment and the working stage with CNT antistatic treatment |
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US9771481B2 (en) * | 2014-01-03 | 2017-09-26 | The Boeing Company | Composition and method for inhibiting corrosion of an anodized material |
CN113512744A (en) * | 2021-06-30 | 2021-10-19 | 西南电子技术研究所(中国电子科技集团公司第十研究所) | Protection method of high-corrosion-resistance airborne aluminum-based LRM module |
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JP2007109732A (en) * | 2005-10-11 | 2007-04-26 | Mitsubishi Electric Corp | Manufacturing method of element substrate and substrate holding device |
US20090169870A1 (en) * | 2007-12-27 | 2009-07-02 | Essilor International (Compagnie Generale D'optique) | Carbon Nanotube-Based Curable Coating Composition Providing Antistatic Abrasion-Resistant Coated Articles |
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