KR101237533B1 - Active Impedance Matching Chip and RF transmission apparatus and, it's VSWR control process - Google Patents

Abstract

The present invention provides an active impedance matching chip for smoothly transmitting radio waves between an RF transmitting and receiving device and an RF signal transmitting device through an antenna and an RF cable, which are core devices of a communication device and a broadcasting device, and the active impedance. The present invention relates to a standing wave ratio monitoring and automatic control method of an RF transceiver using an active impedance matching chip that can easily monitor standing wave ratio defects of an RF transceiver by a matching chip and a standing wave ratio controller.
According to the present invention, a signal transmitted from an RF input unit and a signal reflected from the RF output unit may remove a DC component from a first DC block capacitor and a second DC block capacitor to pass a passive impedance matching pad. The second coupler (Coupler) is passed to the rear end of the passive impedance matching pad to pass the analog sine wave by coupling the signal transmitted from the second DC block capacitor (coupling), and in the standing wave controller (VSWR Controller) By comparing the incident wave and the reflected wave coupled from the second coupler and outputting the voltage value VD2, the preset reference voltage and the voltage value VD2 are transferred to the first variable capacitor section and the second variable capacitor section respectively to change the capacitor value. An active impedance matching chip is characterized by adjusting the standing wave ratio of the impedance matching pad 100.
The active impedance matching chip according to the present invention uses a technique for matching characteristic impedances between antennas, RF cables, transmission lines (microstrips, strip lines), and RF components, and the components generated when mounting RF components on a PCB. Improving impedance mismatch can improve performance (VSWR) and product reliability (on site operation). In addition, the active impedance matching chip according to the present invention can significantly improve propagation transmission by preventing impedance mismatching between key components in the transmission and reception unit and the RF signal transmission unit of a communication device, and consists of a chip. Product reliability and mass production will be improved. In case of developing one-chip as a matching chip component by combining with other devices and applying it to actual communication device products, it will be possible to develop the transceiver and RF signal transmission part of communication device. By shortening the development period and improving the production yield, it is possible to increase the competitiveness of the product.
In addition, the standing wave ratio monitoring and automatic control method of the RF transceiver using the active impedance matching chip according to the present invention can easily monitor the standing wave ratio failure of the RF transceiver by the active impedance matching chip and the standing wave ratio controller. Through adjustment, the output signal generated from the active impedance matching chip is transmitted to the RF output unit and the feedback is sequentially repeated to adjust the standing wave ratio of the system.

Description

Active Impedance Matching Chip and RF transmission apparatus and, it's VSWR control process

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an active impedance matching chip for facilitating propagation between an RF transmission and reception device and an RF signal transmission device through an antenna and an RF cable, which are core devices of a communication device and a broadcast device.

In addition, the present invention can simply monitor the standing wave ratio defect of the RF transceiver by the active impedance matching chip and the standing wave ratio controller, and transfers the output signal generated by the active impedance matching chip to the RF output unit through voltage adjustment. The present invention relates to a standing wave ratio monitoring and automatic control method of an RF transceiver using an active impedance matching chip that can adjust the standing wave ratio of a system by sequentially repeating the process.

In general, the RF transmitter and receiver and the RF signal transmission unit of the communication device is made by combining a plurality of parts, and the signal transmission characteristics between each component is different, so in order to facilitate radio transmission, humans directly in the development and mass production stages R, L Each impedance must be matched using, C.

That is, as shown in Figure 1, in the RF transmitting and receiving unit 70 of the conventional communication device, the signal received from the antenna 1 is transmitted to the antenna port 3 through the RF cable 2, the antenna port ( 3) is transmitted to the antenna input port 5 of the RF transmitting and receiving unit 70 through a connecting cable (4) connected to, and the RF transmitting and receiving unit 70 through the separate signal processing process to the RF output port (7) Will output a signal. In addition, the signal received through the RF input port 6 is wirelessly transmitted through the antenna 1 again through an internal signal processing process.

In this case, the RF transmitter / receiver 70 includes a plurality of DC block capacitors 10, a duplex 20, a low noise amplifier (LNA) 50, and a drive amplifier (DA) 60 on a printed circuit board. ), Isolator (30), high power amplifier (HPA) (40), etc. are soldered by manual (iron) or automatic (magnetic insert) to produce a variety of characteristics changes depending on the work environment or workability of the operator And rework (tuning to adjust characteristics). In particular, due to miss matching at the input of the duplex 20, a phenomenon in which the signal transmitted from the antenna is reflected in the duplex 20 occurs. Therefore, the mismatch between the duplex 20, the low noise amplifier 50, the low noise amplifier 50, and the drive amplifier 60 must be adjusted through tuning.

In other words, if the impedance matching is insufficient, quality defects such as oscillation or unamplification due to poor matching between components (antenna, duplex, LNA, filter, amplifier, mix, etc.) appear. 2, the same phenomenon occurs when the RF cable 2 is directly connected to the antenna input port 5 of the RF transmitter / receiver 70.

In order to improve this, the applicant has proposed a patent registration No. 883398 (name of the invention: impedance matching chip and RF transmission and reception unit and RF signal transmission unit using the same) (hereinafter referred to as 'prior invention').

In the preceding invention, by designing a unidirectional or bidirectional impedance matching chip consisting of a DC block capacitor 10, a frequency adjusting circuit 110, a radio wave characteristic adjusting circuit 120, etc., the core of the transceiver and the RF signal transmitting unit of the communication device Improving propagation is greatly improved by preventing impedance mismatch between components in advance.

For example, as illustrated in FIG. 3A, a unidirectional impedance matching chip is provided with a DC block capacitor 10 for removing inflow of DC components at both ends, and the DC block capacitor 10 is disposed at the DC block capacitor 10. A reflection wave adjustment circuit 130 for adjusting return loss and standing wave ratio VSWR is connected in series, and a frequency adjustment circuit for setting a center frequency in accordance with system requirements between the reflection wave adjustment circuit 130 is provided. 110 is connected in series, and the propagation characteristic adjusting circuit 120 is connected in parallel between the DC block capacitor 10 and the reflected wave adjusting circuit 130.

In addition, the propagation characteristic adjusting circuit 120 determines the propagation loss, the return loss, and the standing wave ratio VSWR.

In addition, the bidirectional impedance matching chip, as shown in Figure 3b, is provided with a DC block capacitor (10) to remove the flow of DC components at both ends, the system between the DC block capacitor (10) The frequency adjusting circuit 110 for setting the center frequency in accordance with the requirements is connected in series, and the propagation characteristic adjusting circuit 120 is connected in parallel between each DC block capacitor 10 and the frequency adjusting circuit 110.

However, the prior invention has improved the reliability and mass production of the product, there was a problem that can not be prepared for the failure of standing wave ratio (VSWR) when applied in the actual field.

However, the unidirectional and bidirectional impedance matching chip proposed in the above-described invention is a passive device, which is to be distinguished from the active device proposed in the present invention (to prevent confusion), and is described in the following description of the present invention. In the description, the unidirectional and bidirectional impedance matching chip of the present invention will be referred to as a passive impedance matching pad .

On the other hand, S / W algorithms between systems when integrating and fusion between complex systems such as 2G PCS, 3G WCDMA, WiBro, DMB, and 4G LTE, as well as broadband impedance matching for smooth energy transfer between RF sub-systems This is an important issue. Broadband Impedance Matching Module and Chip that can solve RF Signal (Energy Transfer) between RF System, RF Sub-System or RF Components by Using Broadband Impedance Matching Circuit Product development was required.

The present invention is to solve the above problems, the present invention improves the propagation between the core components in the antenna and RF cable and the transceiver and RF signal transmission unit of the communication device, the reliability and mass production of the product After installing the equipment with the impedance matching chip manufactured in the chip type in consideration of the field, it provides the function to monitor and automatically adjust the standing wave (VSWR) defects occurring during the operation of the equipment. The purpose is.

In the active impedance matching chip according to the present invention, the signal transmitted from the RF input unit and the signal reflected from the RF output unit are passive impedance matching pads by removing DC components from the first DC block capacitor and the second DC block capacitor. And a second coupler coupled to a passive impedance matching pad, and a second coupler for coupling only a signal transmitted from a second DC block capacitor to pass an analog sine wave at a rear end of the passive impedance matching pad. The VSWR controller outputs a voltage value VD2 by comparing the incident wave and the reflected wave coupled from the second coupler, and the preset reference voltage and the voltage value VD2 are transmitted to the first variable capacitor part and the second variable capacitor part, respectively. Adjusting the standing wave ratio of the passive impedance matching pad 100 by changing the capacitor value as a technical feature .

The active impedance matching chip according to the present invention uses a technique for matching characteristic impedances between antennas, RF cables, transmission lines (microstrips, strip lines), and RF components, and the components generated when mounting RF components on a PCB. Improving impedance mismatch can improve performance (VSWR) and product reliability (on site operation).

In addition, the active impedance matching chip according to the present invention can significantly improve propagation transmission by preventing impedance mismatching between key components in the transmission and reception unit and the RF signal transmission unit of a communication device, and consists of a chip. Product reliability and mass production will be improved. In case of developing one-chip as a matching chip component by combining with other devices and applying it to actual communication device products, it will be possible to develop the transceiver and RF signal transmission part of communication device. By shortening the development period and improving the production yield, it is possible to increase the competitiveness of the product.

In addition, the standing wave ratio monitoring and automatic control method of the RF transceiver using the active impedance matching chip according to the present invention can easily monitor the standing wave ratio failure of the RF transceiver by the active impedance matching chip and the standing wave ratio controller. Through adjustment, the output signal generated from the active impedance matching chip is transmitted to the RF output unit and the feedback is sequentially repeated to adjust the standing wave ratio of the system.

1 is a block diagram of an RF transmitting and receiving unit used in a conventional communication device,
Figure 2 is a block diagram directly connected to the antenna input port of the RF cable RF transmitter and receiver in Figure 1,
3A is a block diagram of a passive unidirectional impedance matching pad;
3B is a block diagram of a passive bidirectional impedance matching pad;
4A is a block diagram schematically illustrating an embodiment of implementing an active impedance matching chip using the impedance matching pad of FIG. 3A or 3B;
4B is a schematic block diagram of another embodiment of implementing an active impedance matching chip using the impedance matching pad of FIG. 3A or 3B;
5A is a block diagram schematically illustrating a first embodiment of an active impedance matching chip equipped with a standing wave ratio controller in the present invention;
5B is a block diagram schematically illustrating a second embodiment of an active impedance matching chip equipped with a standing wave ratio controller in the present invention;
5c is a block diagram schematically illustrating a third embodiment of an active impedance matching chip equipped with a standing wave ratio controller in the present invention;
5D is a block diagram schematically illustrating a fourth embodiment of an active impedance matching chip equipped with a standing wave ratio controller in the present invention;
6A is a block diagram schematically illustrating an embodiment of an RF transceiver for which an active impedance matching chip according to the present invention is applied;
Figure 6b is a block diagram schematically showing another embodiment of the RF transceiver device to which the active impedance matching chip according to the present invention;
7 is a flowchart schematically illustrating a process of controlling a standing wave ratio in an active impedance matching chip of an RF transceiver using an active impedance matching chip according to the present invention.

Preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The active impedance matching chip according to the present invention can be applied to all communication circuits using RF signals, and the unidirectional impedance matching pads or signals in which the signal is transmitted in only one direction through some circuit changes are bilateral. Specific electronic devices (diodes, capacitors, amplifiers, power detectors, etc.) may be electrically designed on the bidirectional impedance matching pads transmitted in the direction.

In order to understand the operation of the circuit implemented in the RF transceiver of the active impedance matching chip according to the present invention, the operation principle of the passive impedance matching pad, which is the registered right of the present applicant, will be briefly described with reference to FIGS. 4A and 4B.

First, the RF transceiver of FIG. 4A includes a first block capacitor (10) for removing DC components from a signal transmitted from an input terminal and a signal reflected from an output terminal, and a first capacitor (211). Passive Impedence Matching Pad (100) for impedance matching the signal, and a second DC capacitor (241) for removing the DC component from the signal processed by the passive impedance matching pad 100 to pass to the output terminal again. The first capacitor to the second capacitor 251 converts the value of the capacitor according to the signal transmitted from the first capacitor 211 and the signal reflected from the second capacitor 241 and transfers the value of the capacitor to the passive impedance matching pad. It is comprised including any one or more of -254).

For example, when setting a fixed value according to a capacitor value measured in advance in the installation step as shown in FIG. 4A, the first capacitor 251 for the incident wave and the second capacitor 252 for the reflected wave are used. In the case of using an externally adjustable variable capacitor as shown in FIG. 4B, the third capacitor 253 for the incident wave and the fourth capacitor 254 for the reflected wave are used.

In this case, the passive impedance matching pad 100 includes a frequency adjusting circuit for setting the center frequency, a propagation characteristic adjusting circuit for adjusting the insertion loss, and a return loss as shown in FIGS. 3A and 3B. ) And a reflected wave adjustment circuit for adjusting the standing wave ratio (VSWR), and the detailed description thereof is omitted since it was introduced in Patent Registration No. 883398, which is a registered right of the applicant.

On the other hand, for automatic control, an active impedance matching chip for measuring and comparing incident and reflected waves and controlling feedback of voltage values is required.

To this end, in the present invention, as shown in Figs. 5A to 5D, four types of active impedance matching chips 200, 200a, 200b (by omitting or adding some circuit elements (amplifiers, power detectors, etc.) ( 200c) is proposed.

First, the active impedance matching chip 200 illustrated in FIG. 5A couples signals transmitted from the first DC capacitor 211 and the second DC capacitor 241 to the front and rear ends of the passive impedance matching pad 100. (Coupling) is provided with a first coupler (Coupler) 212 and the second coupler (Coupler) 242 respectively passing only the analog sine wave, the signal coupled from the coupler is a standing wave ratio controller (VSWR Controller) 300 The standing wave controller 300 compares the signals of the incident wave and the reflected wave, and controls the first variable capacitor unit 220 and the second variable capacitor unit 230 to transmit them to the passive impedance matching pad 100. The standing wave ratio (VSWR) can be adjusted automatically.

In this case, the first coupler 212 and the second coupler 242 are provided with a first amplifier 213 and a second amplifier 243 for amplifying an incident signal or a reflected signal, respectively, and the first amplifier 213. ) And the signal amplified by the second amplifier 243 are converted into voltage values in the first power detector 214 and the second power detector 214 and transferred to the standing wave ratio controller 300. do.

Of course, the amplifier may be omitted in the large signal as shown in FIG. 5B.

In addition, the first variable capacitor unit 220 and the second variable capacitor unit 230 is a small low-voltage varactor diode (Varactor) is a capacitor value (C) is changed according to the voltage value transmitted from the standing wave ratio controller 300 Diode).

The varactor diode changes the thickness of the depletion layer by the magnitude of the reverse voltage applied to the barrier capacitance (capacitance caused by the presence of the depletion layer) of the pn junction to add or subtract the value of the capacitance. As the electronic device, the voltage dependence of the capacitance value is determined by the impurity concentration distribution of the junction, and is mainly used for the electronic tuning of televisions and FM radios or the tuning device with an automatic frequency control (AFC) circuit.

In this case, as shown in FIG. 5C, by omitting the first amplifier 213 and the first power detector 214, a circuit may be configured to control the standing wave ratio by comparing the reflected wave with the reference voltage without input of the incident wave. As shown in FIG. 5D, both the first and second amplifiers 213 and 243 and the first and second power detectors 214 and 244 are omitted to implement measurement of incident and reflected waves in an external circuit. Chip size can also be minimized.

The voltage standing wave ratio (VSWR) is an index indicating a reflection amount of energy input to a circuit or a system, and means a ratio of a minimum value and a maximum value of an input surface standing wave, and how large the standing wave is. Indicative.

In addition, the standing wave refers to a stationary wave generated when the traveling wave merges with the returned wave reflected on a certain boundary, and is proportional to the amount of reflection, and thus, VSWR is used as another indicator of the amount of reflection at the circuit input terminal.

In this case, the standing wave ratio = (1 + reflection coefficient) / (1-reflection coefficient), and if there is no reflection, the ratio is 1 because there is no perfect standing wave with perfect matching. With the best value and very large reflections (full total reflection), the VSWR will go to an infinite value.

In addition, the standing wave ratio controller 300 has a comparison circuit for comparing the incident wave and the reflected wave therein, and outputs the voltage values (VD1, VD2) according to the result to convert the capacitor value of the varactor diode, The technical matters used in the art are well known in the art, and according to the present invention, since the new standing wave ratio controller and the impedance matching chip are implemented in a circuit, a new effect is omitted.

Accordingly, in the present invention, the signal received from the RF input unit 210 generates an incident wave in the passive impedance matching pad 100 through a predetermined signal processing process, and in the standing wave ratio controller (VSWR Controller) 300, Comparing the reflected wave generated from the RF output unit 240, the standing wave ratio is calculated, and the capacitor value is controlled by voltage to automatically improve the standing wave.

On the other hand, Figure 6a shows an embodiment of an RF transmission and reception apparatus implemented with an active impedance matching chip according to the present invention.

In this case, in the RF transceiver, the duplexer 20, the isolator 30, the isolator 30, the high power amplifier 40, the high power amplifier 40, the RF input port, the duplexer 20, the low noise amplifier 50, low noise An active impedance matching chip 200 is provided between the amplifier 50, the driving amplifier 60, the driving amplifier 60, and the RF output port, respectively, and the duplexer 20, the isolator 30, and the duplexer 20 The signal of the impedance matching chip 200 provided between the low noise amplifiers 50 is controlled by a standing wave ratio controller (VSWR Controller).

That is, in the RF transmitter / receiver in which the active impedance matching chip 200 according to the present invention is implemented, the incident wave from which the signal received from the antenna 1 is transmitted to the low noise amplifier 50 through the duplexer 20 and the low noise amplifier ( The standing wave ratio is calculated by receiving the reflected wave generated in 50), and the output signal is generated according to the calculated result and then transferred to the low noise amplifier 50 through the active impedance matching chip 200 to control the standing wave ratio.

That is, the standing wave ratio controller 300 receives the incident wave transmitted to the duplexer 20 through the high power amplifier 40 and the isolator 30, and receives the reflected wave generated from the duplexer 20 to calculate the standing wave ratio. The output signal is generated according to the calculated result and transferred to the duplexer 20 through the active impedance matching chip 200 to control the standing wave ratio of the RF transceiver.

On the other hand, Figure 6b shows another embodiment of the RF transceiver for implementing an active impedance matching chip according to the present invention, two antennas (1) (1a) is provided to enable bi-directional transmission and reception.

In this case, the RF transceiver includes a duplexer 20 and an isolator 30, an isolator 30, a high output amplifier 40, a high output amplifier 40, a second low noise amplifier 50a, and a second low noise. An active impedance matching chip 200 is provided between the amplifier 50a and the second duplexer 10a, respectively, and the duplexer 20, the low noise amplifier 50, the low noise amplifier 50, and the driving amplifier 60 on the receiving side are provided. An active impedance matching chip 200 is also provided between the driving amplifier 60 and the second high output amplifier 40a, the second high output amplifier 40a, and the second duplexer 20a, respectively, and the duplexer 20 and the isolator. 30, impedance matching provided between the duplexer 20 and the low noise amplifier 50, the second duplexer 20a and the second low noise amplifier 50a, the second duplexer 20a and the second high output amplifier 40a. The signal of the chip 200 is controlled by a VSWR controller 300.

That is, the standing wave ratio controller 300 calculates standing wave ratios through incident and reflected waves transmitted through the elements of the transmitting side and the receiving side, generates an output signal according to the calculated result, and again generates an active impedance matching chip ( By passing through the duplexer 20 or the second duplexer 20a through the 200, the standing wave ratio of the RF transceiver is controlled.

In the RF transmitter / receiver including the active impedance matching chip as shown in FIG. 7, the standing wave ratio of the system is controlled through a feedback process as follows.

First, when the RF signal received through the antenna 1 is transmitted to the RF input unit 210 by a cable (S10), the signal transmitted from the RF input unit 210 is a predetermined signal in the active impedance matching chip 200 Through the process of generating the incident wave (S20).

The incident wave is converted into an incident wave power voltage PDI through the first power detector 214 (S21).

In addition, the incident wave is transmitted to the RF output unit 240 (S30), and the reflected wave generated from the RF output unit 240 is reflected wave power voltage (2) at the second power detector 244 through the active impedance matching chip 200 PDR) (S31).

In this case, the standing wave ratio controller 300 compares the comparison value due to the deviation of the incident wave power voltage PDI and the reflected wave power voltage PDR with a preset stored value (S40), and if the comparison value is less than or equal to the preset value, The set reference voltages VD1 and VD2 are maintained as they are (S41). When the comparison value is equal to or greater than the set value, the capacitor values of the first varactor diode 220 and the second varactor diode 230 are changed by adjusting VD1 and VD2. (S42).

The setting value, which determines whether the feedback is determined by comparing the incident wave power voltage PDI and the reflected wave power voltage PDR, is determined in advance in the manufacturing stage according to the system. In one embodiment of the present invention, the PDR / PDI is 0.1 or less. In this case, the standing wave ratio is determined to be normal and VD1 and VD2 are maintained as it is. If the PDR / PDI is 0.1 or more, the standing wave ratio is judged to be bad and the VD1 and VD2 are adjusted.

Therefore, in the present invention, the active impedance matching chip 200 and the standing wave ratio controller 300 can easily monitor the standing wave ratio defect of the RF transceiver, and the active impedance matching chip 200 through the adjusted VD1 and VD2. It is possible to adjust the standing wave ratio of the RF transceiver by sequentially transmitting the output signal generated by the RF output unit 240 to the feedback (S50) to be repeated sequentially.

As described above, the present invention is manufactured in a simple chip form and implemented in a system, thereby enabling broadband impedance matching to facilitate signal transmission due to base station integration between mobile communication systems, and impedance matching in broadband up / down converters. In addition, broadband impedance matching is possible for impedance matching between different frequencies according to the integration of broadband antennas (DMB, CDMA, PCS, WCDMA, WiBro, WLAN, LTE).

1,1a: antenna 2: RF cable
3: antenna port 4: connection cable
5: antenna input port
10,10a: DC block capacitor 20: duplexer
30: isolator 40: high power amplifier (HPA)
40a: second high power amplifier 50: low noise amplifier (LNA)
50a: second low noise amplifier 60: drive amplifier (DA)
100: Passive Impedence Matching Pad
100a: unidirectional impedance matching pad 100b: bidirectional impedance matching pad
200, 200a, 200b, 200c: active impedance matching chip
210: RF input unit 211: first DC block capacitor
212: first coupler (Coupler) 213: first amplifier (AMP)
214: first power detector
220: first varactor diode 230: second varactor diode
240: RF output unit 241: second DC block capacitor
242: second coupler (Coupler) 243: second amplifier (AMP)
244: second power detector
251 to 254: first to fourth capacitors
300: standing wave ratio controller (VSWR Controller)

Claims (10)

The signal transmitted from the RF input unit and the signal reflected from the RF output unit are transmitted to a passive impedance matching pad by removing DC components from the first DC block capacitor and the second DC block capacitor. ,
A second coupler (Coupler) is provided at the rear end of the passive impedance matching pad to couple only the analog sine wave by coupling the signal transmitted from the second DC block capacitor.
The VSWR controller outputs a voltage value VD2 by comparing the incident wave and the reflected wave coupled from the second coupler, and transmits the preset reference voltage and the voltage value VD2 to the first variable capacitor part and the second variable capacitor part, respectively. And adjusting the standing wave ratio of the passive impedance matching pad 100 by changing the capacitor value.
The method of claim 1,
The first variable capacitor unit and the second variable capacitor unit active impedance matching, characterized in that consisting of a small low voltage varactor diode (Varactor Diode) is changed in accordance with the voltage value transmitted from the standing wave ratio controller chip.
Transmitting the RF signal received through the antenna to the RF input unit by a cable (S10);
Generating an incident wave from the signal transmitted from the RF input unit through a predetermined signal processing process in an active impedance matching chip (S20);
Converting the incident wave into an incident wave power voltage PDI through a first power detector (S21);
Transmitting the incident wave to an RF output unit (S30);
Converting the reflected wave generated at the RF output unit into the reflected wave power voltage PDR at the second power detector through an active impedance matching chip (S31);
Comparing the comparison value by the deviation between the incident wave power voltage PDI and the reflected wave power voltage PDR in the standing wave ratio controller (S40);
Maintaining the preset reference voltages VD1 and VD2 when the comparison value is smaller than the set value (S41);
Changing the capacitor value of the varactor diode by adjusting VD1 and VD2 when the comparison value is larger than the set value (S42);
Adjusting the standing wave ratio by transferring the output signal generated from the active impedance matching chip to the RF output unit through the adjusted VD1 and VD2 (S50);
Standing wave ratio monitoring and automatic control method of the RF transceiver using an active impedance matching chip comprising a.
The method of claim 3,
The set value in step S40 of determining whether or not the feedback is determined by comparing the incident wave power voltage PDI and the reflected wave power voltage PDR is determined that the standing wave ratio is normal when the PDR / PDI is 0.1 or less, and thus VD1 and VD2 are left unchanged. If the PDR / PDI is 0.1 or more, the standing wave ratio monitoring and automatic control method of the RF transceiver using an active impedance matching chip characterized in that it is determined that the standing wave ratio is bad.

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