KR101226472B1 - Apparatus for identification and monitoring blind spot in equipment - Google Patents

Apparatus for identification and monitoring blind spot in equipment Download PDF

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Publication number
KR101226472B1
KR101226472B1 KR1020120102742A KR20120102742A KR101226472B1 KR 101226472 B1 KR101226472 B1 KR 101226472B1 KR 1020120102742 A KR1020120102742 A KR 1020120102742A KR 20120102742 A KR20120102742 A KR 20120102742A KR 101226472 B1 KR101226472 B1 KR 101226472B1
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KR
South Korea
Prior art keywords
housing
blind area
camera module
mirror
stainless steel
Prior art date
Application number
KR1020120102742A
Other languages
Korean (ko)
Inventor
김재민
이정호
이상신
박규성
박근배
Original Assignee
주식회사 썬닉스
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Priority to KR1020120102742A priority Critical patent/KR101226472B1/en
Application granted granted Critical
Publication of KR101226472B1 publication Critical patent/KR101226472B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking

Abstract

In the present specification, an angle-adjustable stainless steel mirror, a camera module, and an illumination unit are installed in a housing, and can be visually checked from the front such as a rear part of a high temperature process chamber. The present invention relates to a blind area identification and monitoring device inside a device that can visually identify a blind area inside a device that is not present and improve alarm and surveillance functions by capturing and storing the blind area through the camera module when an abnormality is detected. To this end, the blind area identification and monitoring apparatus inside the equipment according to an embodiment of the present disclosure, the process chamber is disposed, the housing is formed of a transparent material of which part is quartz glass so that the inside can be observed from the outside; A mirror mounted inside the housing and reflecting a blind spot in the housing which is not visible to the naked eye from the outside, and formed of a stainless steel material; A camera module mounted inside the housing, temporarily photographing a blind area in the housing and temporarily storing the blind area in a buffer, wherein the camera module is formed of stainless steel; A lighting unit detachably mounted to the mirror inside the housing and having an external material formed of stainless steel; And when the abnormality of the process chamber is detected, some image information before a preset time based on the time when the abnormality is detected among the image information temporarily stored in the buffer, and image information captured in real time after the abnormality detection is stored in the storage unit. It includes a control unit for storing.

Description

Apparatus for identification and monitoring blind spot in equipment

The present specification relates to a blind area identification and monitoring device inside a device, and more particularly, to a mirror, a camera module, and an illumination unit of an angle-adjustable stainless steel, installed inside a housing, to process a high temperature process. Improve the alarm and surveillance by visually checking the blind area inside the equipment that cannot be visually seen from the front, such as the back of the process chamber, and capturing and storing the blind area through the camera module when an abnormality is detected. The present invention relates to a blind area identification and monitoring device inside a device.

In general, in many semiconductor equipment, such as thermal oxidation equipment, metal organic chemical vapor deposition (MOCVD) equipment, a high temperature process chamber is located inside the housing.

If all sides of the housing are formed of a transparent material, all parts of the hot process chamber can be identified. However, when some surfaces of the housing are formed of an opaque material, a part of the high temperature process chamber may not be visually discernible from the outside.

In addition, a part or area that cannot be visually identified in such equipment is defined as a blind spot.

In addition, when a problem occurs in the blind area in the semiconductor equipment, there is a problem that the inspector or the user can quickly identify the problem and cannot see the problem.

In addition, when a problem occurs in the blind area in the semiconductor equipment, in order to identify the problem, the inspector must directly enter the inside of the housing to check the blind area, but it is difficult to perform this during the high temperature air process.

Korean registration number 20-0119300

An object of the present specification, when an abnormality is detected in the blind area in the semiconductor equipment, through the camera module having a case of stainless steel (stainless steel) material that is not easily deformed even at a high temperature installed in the blind area inside the housing, It is to provide a blind area identification and monitoring device inside the equipment capable of capturing and storing the blind area before and after a predetermined time on the basis of the detected time point, and provide alarm information to the inspector.

Another object of the present specification is to install a mirror made of stainless steel that is not easily deformed even at the high temperature inside the housing, blind area identification and monitoring device inside the equipment that can visually check the blind area from the outside of the housing To provide.

Another object of the present specification is to install a lighting unit made of stainless steel, which is not easily deformed even at the high temperature, inside the housing so that the blind area inside the equipment can accurately check the blind area from the outside of the housing in a bright lighting state. An identification and monitoring device is provided.

An apparatus for identifying and monitoring a blind area within an apparatus according to an embodiment of the present specification includes a housing in which a process chamber is disposed and formed of a transparent material, part of which is quartz glass, so that the inside can be observed from the outside; A mirror mounted inside the housing and reflecting a blind spot in the housing which is not visible to the naked eye from the outside, and formed of a stainless steel material; A camera module mounted inside the housing, temporarily photographing a blind area in the housing and temporarily storing the blind area in a buffer, wherein the camera module is formed of stainless steel; A lighting unit detachably mounted to the mirror inside the housing and having an external material formed of stainless steel; And when the abnormality of the process chamber is detected, some image information before a preset time based on the time when the abnormality is detected among the image information temporarily stored in the buffer, and image information captured in real time after the abnormality detection is stored in the storage unit. It may include a control unit for storing.

As an example related to the present specification, the mirror may include a support part; A reflector reflecting a blind area of the process chamber; And a connection part connecting the support part and the reflection part.

As an example related to the present specification, the support part may be fixed to an inner side wall or a bottom surface of the housing.

As an example related to the present specification, the reflector may have a planar reflecting surface.

As an example related to the present specification, the connection part may include a hinge to enable angle adjustment of the reflector.

As an example related to the present specification, the camera module may be installed to be detachably attached to the mirror or the lighting unit.

As an example related to the present specification, the lighting unit may be formed in a bar shape and include a plurality of LEDs formed at predetermined intervals on a substrate.

As an example related to the present specification, when the process chamber malfunctions, the controller generates alarm information, outputs the generated alarm information, or transmits the generated alarm information to an external server or a terminal of a registered inspector through a communication unit. Can be.

The blind area identification and monitoring apparatus inside the equipment according to the embodiment of the present specification, when an abnormality is detected in the blind area in the semiconductor equipment, a case made of stainless steel that is not easily deformed even at a high temperature installed in the blind area inside the housing. Provides a blind area identification and monitoring device inside the equipment that can capture and store the blind area before and after a preset time based on the time when the abnormality is detected, and provide alarm information to the inspector through a camera module having a camera module. As a result, even if a problem occurs in the blind area, it is easy to grasp and improve the convenience of the inspector.

In addition, the blind area identification and monitoring apparatus inside the equipment according to an embodiment of the present specification, by installing a stainless steel mirror inside the housing that is not easily deformed even at the high temperature, the blind area from the outside of the housing with the naked eye You can check with

In addition, the blind area identification and monitoring apparatus inside the equipment according to an embodiment of the present specification, by installing a stainless steel lighting unit that is not easily deformed even at the high temperature inside the housing, thereby maintaining the blind area in a bright light state The blind area can be identified accurately.

1 is a view showing the configuration of the blind area identification and monitoring apparatus inside the equipment according to an embodiment of the present disclosure.
2 to 4 is a perspective view of the blind area identification and monitoring apparatus inside the equipment according to an embodiment of the present disclosure.

It is to be noted that the technical terms used herein are merely used to describe particular embodiments, and are not intended to limit the present invention. It is also to be understood that the technical terms used herein are to be interpreted in a sense generally understood by a person skilled in the art to which the present invention belongs, Should not be construed to mean, or be interpreted in an excessively reduced sense. In addition, when the technical terms used herein are incorrect technical terms that do not accurately express the spirit of the present invention, they should be replaced with technical terms that can be understood correctly by those skilled in the art. In addition, the general terms used in the present invention should be interpreted according to a predefined or prior context, and should not be construed as being excessively reduced.

Also, the singular forms "as used herein include plural referents unless the context clearly dictates otherwise. In the present application, the term "comprising" or "comprising" or the like should not be construed as necessarily including the various elements or steps described in the specification, Or may be further comprised of additional components or steps.

Furthermore, terms including ordinals such as first, second, etc. used in this specification can be used to describe various elements, but the elements should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings, wherein like reference numerals refer to like or similar elements throughout the several views, and redundant description thereof will be omitted.

In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail. It is to be noted that the accompanying drawings are only for the purpose of facilitating understanding of the present invention, and should not be construed as limiting the scope of the present invention with reference to the accompanying drawings.

1 is a view showing the configuration of the blind area identification and monitoring apparatus inside the equipment according to an embodiment of the present disclosure.

As shown in FIG. 1, the blind area identification and monitoring device 10 includes a housing 100, a mirror 200, a camera module 300, an illumination unit 400, and a control unit 500. Not all components of the blind area identification and monitoring device 10 shown in FIG. 1 are essential components, and the blind area identification and monitoring device 10 is implemented by more components than those shown in FIG. The blind area identification and monitoring apparatus 10 may be implemented by fewer components.

The blind area identification and monitoring device 10 may be applied to (or used) semiconductor equipment, high temperature equipment, and equipment (for example, the process chamber 20, etc.) in which a blind area is formed in an enclosed space. Can be.

In addition, in the semiconductor equipment, the temperature inside the process chamber 20 may rise to approximately 1,500 ° C to 2,000 ° C. In addition, the outside of the process chamber 20, the temperature may rise to approximately 300 ℃ to 800 ℃ by the radiant heat.

Thus, the blind area identification and monitoring device 10 is constructed (or formed) of stainless steel material which is not deformed at approximately 800 ° C.

The housing 100 forms the overall appearance of the equipment.

In addition, the housing 100 is formed in a rectangular parallelepiped or cylindrical shape. In this case, the housing 100 is not limited to the rectangular parallelepiped or cylindrical shape, but may be formed in various forms according to the design of the designer.

In addition, the process chamber 20, the mirror 200, the camera module 300, the lighting unit 400, the control unit 500, and the like are disposed in the housing 100.

In addition, the housing 100, the part observed with the naked eye is composed of a transparent material. In this case, the transparent material constituting the housing 100 may be quartz glass. Here, the quartz glass is produced by melting silicon dioxide (SiO 2 ) of high purity having impurities of several hundred ppm or less at high temperature (for example, about 2,000 ° C. or more). Moreover, the said quartz glass has the softening temperature about 1,600 degreeC or more, and has the strength superior to general glass by 117,000 kg / cm <2> of compressive strengths, 510 kg / cm <2> of tensile strengths, 5.5 MOS hardness, etc.

As described above, the housing 100 is not deformed even when the radiant heat is 300 ° C. to 800 ° C., and is formed to be transparent so that the blind area can be visually confirmed.

The mirror 200 is formed in various sizes that can be accommodated in the housing 100.

In addition, the mirror 200 is formed of a stainless steel material that does not easily deform even at high temperatures.

As such, by using the mirror 200 made of stainless steel, the blind region identification and monitoring apparatus 10 may be applicable to semiconductor equipment, high temperature equipment, and closed equipment, in which heat and heat are frequently generated. .

In addition, the camera module 300 may be located inside the mirror 200. That is, the camera module 300 may be located in a hole or a groove formed in the mirror 200.

2 to 4, the mirror 200 includes a support 210, a reflector 220, and a connection 230. Not all components of the mirror 200 shown in FIG. 2 are essential components, and the mirror 200 may be implemented by more components than those shown in FIG. 2, or by fewer components. The mirror 200 may be implemented.

The support part 210 supports the reflector 220.

In addition, the support part 210 may be fixedly coupled to a side wall (or an inner side wall) or a bottom surface of the housing 100. Here, the support portion 210, the coupling hole (not shown) is formed, it may be screwed firmly to the inner surface of the housing 100. Therefore, the support part 210 can maintain a state that is strongly coupled to external impact.

The reflector 220 is formed in a planar reflecting surface shape.

In addition, the reflector 220 reflects the blind area, which cannot be visually seen from the outside, such as the rear surface of the process chamber 20.

In addition, the reflector 220 may be angle adjusted in the horizontal direction and / or vertical direction.

In addition, the reflector 220 may be controlled by the controller 500 or an external server (not shown). For example, the reflector 220 may be moved up and down through a motor (not shown) and / or a roller (not shown) connected to the reflector 220 under control of the controller 500 or the external server. The angle adjustment in the direction may be controlled. In this case, the motor is supported by the connection part 230 (or the support part 210).

The connection part 230 connects the support part 210 and the reflector 220 to each other.

In addition, the connecting portion 230, the hinge may be formed so that the angle of the reflective portion 220 can be adjusted.

The camera module 300 is formed inside the housing 100. In this case, the camera module 300 is supported by the mirror 200 and / or a part of the lighting unit 400, and is easily installed (or disposed) through the connection member 301.

In addition, the camera module 300 may be installed in a hole or a groove formed in the mirror 200. As described above, the camera module 300 may be installed at any position within the housing 100 capable of photographing the blind area.

In addition, the outer material of the camera module 300 is formed of a stainless steel material that does not easily deform even at high temperatures. Here, the lens of the camera module 300 is formed of an optical material that does not easily deform even at high temperatures.

In addition, the camera module 300 captures an image (or image information) of the blind area under the control of the controller 500. In this case, the image information captured by the camera module 300 is temporarily stored in a buffer (not shown) included in the blind area identification and monitoring apparatus 10.

In addition, the camera module 300 includes one or more cameras for capturing image information such as still images or moving images.

In addition, the camera module 300 may be an image sensor such as a CCD device and a CMOS device.

In addition, the camera module 300, also called an IP camera or digital CCTV, may support resolutions such as HD (1280 × 720), Full HD (1920 × 1080), 5 Mega (2560 × 2048), and the like. .

In addition, the camera module 300 may support a general camera. In this case, the general camera may be configured to mount a heat shield cover (or Teflon cover) to the general camera for thermal cutoff so that the general camera can be used even at a high temperature.

In addition, the camera module 300 encodes the captured image information (eg, including the blind area) through a preset codec method.

In addition, the camera module 300 may control the PTZ of the camera module 300 based on a control packet (or control signal) generated by the controller 500 and / or a control packet transmitted by the external server. Controls the (pan, tilt, zoom) function.

In addition, the camera module 300, a rail (not shown) installed outside the mirror 200 and / or the lighting unit 400 so as to move the outside of the mirror 200 and / or the lighting unit 400. Through the control of the control unit 500 and / or the external server may be moved on the rail. Here, the rail, according to the shape of the mirror 200 and / or the lighting unit 400, may be configured in a variety of forms, such as rectangular, circular, oval, and polygonal.

The lighting unit 400 is formed inside the housing 100. In this case, the lighting unit 400 may be connected (or supported) to one side of the mirror 200.

In addition, the lighting unit 400, as shown in FIG. 2, is configured in the form of a bar (bar), and is easily installed (or disposed) through the connection member 401.

In addition, the lighting unit 400 includes a plurality of LEDs (Light Emitting Diodes) that are formed (or arranged) at predetermined intervals on the substrate.

In addition, the outer material of the lighting unit 400 is formed of a stainless steel material that does not easily deform even at high temperatures.

In addition, the lighting unit 400 controls at least one operation (eg, on / off operation) of the plurality of LEDs by the control of the controller 500 and / or the external server.

The controller 500 performs an overall control function of the blind area identification and monitoring apparatus 10.

In addition, the controller 500 controls the operations of the camera module 300 and / or the lighting unit 400. That is, the controller 500 generates a control signal for controlling the operation of the camera module 300 and / or the lighting unit 400, and based on the generated control signal, the camera module 300 and And / or controls the operation of the lighting unit 400.

In addition, when the process chamber 20 malfunctions, the control part 500 may be a portion of the equipment (for example, the process chamber 20) corresponding to the blind area (or equipment in which the blind area is formed). When a problem (or failure) of the process chamber is detected, such as when a problem occurs, the preset time based on a time point at which the abnormality is detected among images captured by the camera module 300 and temporarily stored in the buffer. The image information after the time when the abnormality is detected, including previous image information and the time when the abnormality is detected, is stored in a storage unit (not shown) or transmitted to the external server through a communication unit (not shown).

For example, when the process chamber 20 malfunctions, the controller 500 may be configured to store the image information (for example, including the blind area) taken by the camera module 300 and temporarily stored in the buffer. Store the image information in the storage unit 20 minutes before the preset time (for example, 1:40 ~ 2 pm) based on the time when the process chamber 20 malfunctioned (for example, 2 pm) The image information (eg, including the blind area) captured by the camera module 300 from a time point at which the process chamber 20 malfunctions is set in real time for one hour (for example, 2 pm O'clock to 3pm) to store in the storage.

The storage unit may include a flash memory type, a hard disk type, a multimedia card micro type, a card type memory (eg, SD or XD memory), a magnetic Memory, Magnetic Disk, Optical Disk, Random Access Memory (RAM), Static Random Access Memory (SRAM), Read-Only Memory (ROM), Electrically Erasable Programmable Read-Only Memory (EEPROM), Programmable Read- Only memory) may include at least one storage medium. In addition, the blind area identification and monitoring apparatus 10 may operate a web storage that performs a storage function of a storage unit on the Internet, or may operate in connection with the web storage.

In addition, the communication unit is communicatively connected with any component inside or any at least one terminal (eg, including the external server) through the wired / wireless communication network. Here, the wireless Internet technology includes a wireless LAN (WLAN), a Wi-Fi, a wireless broadband (Wibro), a World Interoperability for Microwave Access (Wimax), a High Speed Downlink Packet Access, IEEE 802.16, Long Term Evolution (LTE), Wireless Mobile Broadband Service (WMBS), and the like. In addition, short-range communication technologies include Bluetooth, Radio Frequency Identification (RFID), Infrared Data Association (IrDA), Ultra Wideband (UWB), ZigBee, and Near Field Communication (NFC). ) May be included. In addition, the wired communication technology may include USB communication, Ethernet, serial communication, optical / coaxial cable, RS-232 communication, RS-485 communication, RS-422 communication, and the like.

The controller 500 may generate alarm information when the abnormality is detected, output the generated alarm information through a display unit, or output the generated alarm information through the communication unit. Or transmit to the terminal of the registered tester. Here, the terminal of the examiner may be a smart phone, a portable terminal, a telematics terminal, a mobile terminal, a personal computer, a notebook computer, Digital Broadcasting Terminal, Personal Digital Assistant (PDA), Wibro Terminal, Internet Protocol Television (IPTV) Terminal, AVN (Audio Video Navigation) Terminal, Portable Multimedia Player (PMP), Navigation Terminal (Vehicle Navigation) The terminal may be any one of various terminals such as a navigation terminal.

The display unit includes a liquid crystal display (LCD), a thin film transistor liquid crystal display (TFT LCD), an organic light-emitting diode (OLED), and a flexible display. It may include at least one of a 3D display, an e-ink display.

Here, the control unit 500, the storage unit, the display unit, and the communication unit may be formed in one additional housing (not shown). In addition, the additional housing in which the control unit 500, the storage unit, the display unit, and the communication unit are formed may be disposed on one surface (or the rear surface) of the mirror 200 as illustrated in FIG. 4. , Attachment / form). In addition, the additional housing is formed of a stainless steel material that does not easily deform even at high temperatures.

As described above, the embodiment of the present disclosure, when an abnormality is detected in the blind area in the semiconductor equipment, through the camera module having a case made of stainless steel that is not easily deformed even at a high temperature installed in the blind area inside the housing, Problems in the blind area are provided by providing a blind area identification and monitoring device inside the equipment capable of capturing and storing the blind area before and after a preset time based on a time when an abnormality is detected and providing alarm information to an inspector. Can be easily identified even if a problem occurs, thereby improving the convenience of the inspector.

In addition, in the embodiment of the present specification, as described above, a stainless steel mirror which is not easily deformed even at the high temperature may be installed inside the housing, and the blind area may be visually checked from the outside of the housing.

In addition, by installing a lighting unit made of stainless steel that is not easily deformed even at a high temperature inside the housing, it is possible to accurately identify the blind area by maintaining the blind area in a bright lighting state.

The present invention may be embodied in many other specific forms without departing from the spirit or essential characteristics thereof. Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be construed according to the following claims, and all technical ideas falling within the scope of the same shall be construed as falling within the scope of the present invention.

10: blind area identification and monitoring device
20: process chamber 100: housing
200: mirror 300: camera module
400: lighting unit 500: control unit
210: support portion 220: reflection portion
230: connecting portion 301, 401: connecting member

Claims (8)

A housing in which a process chamber is disposed, the housing being formed of a transparent material, part of which is quartz glass so that the inside can be observed from the outside;
A mirror mounted inside the housing and reflecting a blind spot in the housing which is not visible to the naked eye from the outside, and formed of a stainless steel material;
A camera module mounted inside the housing, temporarily photographing a blind area in the housing and temporarily storing the blind area in a buffer, wherein the camera module is formed of stainless steel;
A lighting unit detachably mounted to the mirror inside the housing and having an external material formed of stainless steel; And
When the abnormality of the process chamber is detected, some image information before a preset time based on the time when the abnormality is detected among the image information temporarily stored in the buffer and image information captured in real time after the abnormality detection are stored in the storage unit. A control unit;
The camera module includes:
It is installed to be detachable to the mirror or the lighting unit, and moves to a specific position on the rail provided on the outside of the mirror and the lighting unit under the control of the control unit,
The lighting unit,
It is formed in the form of a bar (bar), and includes a plurality of LEDs formed at regular intervals on the substrate operated by the control of the controller,
The control unit,
When the process chamber malfunctions, generates alarm information, outputs the generated alarm information, or transmits the generated alarm information to an external server or a terminal of a registered inspector through a communication unit. monitor.
The method according to claim 1,
The mirror is,
A support;
A reflector reflecting a blind area of the process chamber; And
And a connecting portion connecting the supporting portion and the reflecting portion.
The method according to claim 2,
The support portion
A blind area identification and monitoring device inside the equipment, characterized in that it is fixed to the inner side wall or the bottom surface of the housing.
The method according to claim 2,
The reflector includes:
Apparatus for identifying and monitoring blind areas inside a device, characterized in that the reflecting plane of the plane is formed.
The method according to claim 2,
The connecting portion
A blind area identification and monitoring device inside the equipment, characterized in that it comprises a hinge to allow the angle adjustment of the reflector.
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KR1020120102742A 2012-09-17 2012-09-17 Apparatus for identification and monitoring blind spot in equipment KR101226472B1 (en)

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Application Number Priority Date Filing Date Title
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050121594A (en) * 2004-06-22 2005-12-27 삼성전자주식회사 Semiconductor manufacturing equipment
KR20120036762A (en) * 2010-10-08 2012-04-18 제너럴 일렉트릭 캄파니 Gasifier monitor and control system
KR101168872B1 (en) * 2011-11-28 2012-07-27 주식회사 썬닉스 Apparatus for identification blind spot in equipment using mirror

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050121594A (en) * 2004-06-22 2005-12-27 삼성전자주식회사 Semiconductor manufacturing equipment
KR20120036762A (en) * 2010-10-08 2012-04-18 제너럴 일렉트릭 캄파니 Gasifier monitor and control system
KR101168872B1 (en) * 2011-11-28 2012-07-27 주식회사 썬닉스 Apparatus for identification blind spot in equipment using mirror

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