KR101217698B1 - Laser processing method and laser processing apparatus using sequential multi-focusing - Google Patents

Laser processing method and laser processing apparatus using sequential multi-focusing Download PDF

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KR101217698B1
KR101217698B1 KR1020100078827A KR20100078827A KR101217698B1 KR 101217698 B1 KR101217698 B1 KR 101217698B1 KR 1020100078827 A KR1020100078827 A KR 1020100078827A KR 20100078827 A KR20100078827 A KR 20100078827A KR 101217698 B1 KR101217698 B1 KR 101217698B1
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South Korea
Prior art keywords
object
laser
method
crack
focusing
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KR1020100078827A
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Korean (ko)
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KR20120016457A (en
Inventor
정영대
성천야
김형욱
이감명
김환
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주식회사 이오테크닉스
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046Automatically focusing the laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067Dividing the beam into multiple beams, e.g. multifocusing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54Glass

Abstract

A laser processing method and a laser processing apparatus are disclosed. The disclosed laser processing method comprises the steps of sequentially forming a plurality of condensing points having a predetermined depth from a surface of a workpiece by focusing a plurality of laser beams inside the workpiece; And moving the laser beams in the first direction to form a plurality of crack rows in a thickness direction of the object inside the object to be processed.

Description

Laser processing method and laser processing apparatus using sequential multi-focusing}

The present invention relates to a laser processing method and a laser processing apparatus, and more particularly, to a laser processing method and a laser processing apparatus using sequential multi focusing.

Conventionally, when cutting a processing object such as a semiconductor wafer or a glass substrate using a laser, the surface of the processing object is irradiated with laser light having a wavelength absorbed by the processing object and cut by absorption of the laser light. The object to be processed is cut by advancing heat melting from the side toward the back surface. However, in such a cutting method, the periphery of the region to be cut out of the surface of the workpiece is also melted. Therefore, when a semiconductor element etc. are formed in the surface of a to-be-processed object, there exists a possibility that the semiconductor element around this cut | disconnected area may melt at the time of cutting | disconnection of a to-be-processed object.

Recently, in order to prevent the surface of the object to be damaged, the focus of the laser light inside the object to be processed using an ultra short or ultra short pulse laser light such as ps (pico second) or fs (femto second) with high power. A method of cutting an object by forming an internal crack by mechanically breaking and mechanically breaking the object to which the internal crack is formed has been developed. Here, the formation of the internal crack is due to the multiphoton absorption by the laser light of ultrashort or ultrashort pulses.

On the other hand, when the thickness of the object to be processed is thick when focusing the laser light into a workpiece formed of a transmissive material such as sapphire or glass to form a crack, a plurality of internal crack rows are formed therein in the thickness direction of the object to be processed. It should be easy to cut. In order to form a plurality of internal crack layers, a focus control method or a multi focus method using a birefringent material has been conventionally used.

1A and 1B are views for explaining a method of forming a plurality of crack rows inside a workpiece by using a focus adjustment method. First, referring to FIG. 1A, a laser beam 30 of ultra-short or ultra-short pulses emitted from a laser light source (not shown) is focused on the lower part of the object 10 by using the lens 20, and the laser is focused. When the light 30 is moved along the cutting schedule line of the object 10, a first crack row 41 is formed in the lower portion of the object 10. Next, referring to FIG. 1B, the laser light 30 is focused on an upper portion of the object to be processed using the lens 20, and then the laser light 30 is moved along a cutting schedule line, so that a second crack is generated. A row 42 is formed above the first crack row 41. However, such a focus adjustment method has a problem in that the laser processing apparatus must be repeatedly moved by the number of the internal crack rows 41 and 42.

2 is a view for explaining a method of forming a plurality of crack rows (61, 62) in the object to be processed using a multi-focus method using a birefringent material. Referring to FIG. 2, when the laser light emitted from the laser light source passes through the predetermined birefringent material 50, first and second laser lights 51 and 52 having different focal lengths are generated to process the object 10. It will focus on the inside. For example, the first laser light 51 is focused on the lower part in the object 10, and the second laser light 52 is focused on the upper part in the object 10. In this case, when the laser lights 51 and 52 are moved along a cutting schedule line of the object 10, the first and second laser lights 51 and 52 may be formed on the lower part and the upper part of the object 10. The first and second internal crack rows 61 and 62 are formed at the same time. However, in this multi-focus system, since the first and second internal crack rows 61 and 62 are formed at the same time, the second crack row 62, which is an upper crack, scatters the first laser light 51, thereby making it a lower crack. There is a disadvantage that it interferes with the formation of the two crack rows (61).

An embodiment of the present invention provides a laser processing method and a laser processing apparatus using sequential multi focusing.

Laser processing method according to an embodiment of the present invention,

Forming a plurality of condensing points having a predetermined depth from the surface of the object to be sequentially arranged with respect to a first direction by focusing a plurality of laser beams inside the object to be processed; And

And forming a plurality of crack rows corresponding to the light collecting points within the object by moving one of the laser beams and the object to be processed in the first direction.

Here, the focusing points may be arranged in front of the first direction as they are located deeper from the surface of the object to which the laser light is incident.

The crack rows may be formed by multiple photon absorption at the light collection points. Each of the laser beams may have a pulse width of 1 ns (nano second) or less, and a peak power density at the focusing points may be 1 × 10 8 W / cm 2 or more.

The object to be processed may include a sapphire substrate or a glass substrate.

Cracks may not be formed on a surface of the object to be processed in which the crack rows are formed. Meanwhile, a surface crack corresponding to the crack train closest to the surface of the workpiece may be formed on the surface of the workpiece to which the crack rows are formed. Here, the surface cracks may be 1 μm or less in width.

After forming the crack rows, the method may further include cutting the object to be processed by an external stress.

The laser processing method includes: separating laser light emitted from a light source into the plurality of laser lights by an optical separator; Injecting the laser beams into a reflecting mirror rotatably installed via a focusing lens; And focusing the plurality of laser beams reflected from the reflection mirror inside the processing object.

The distance between the focusing points may be adjusted by at least one of the distance between the optical splitter and the focusing lens and the rotation angle of the reflection mirror.

The optical splitter may include a diffractive optical element (DOE), and the focusing lens may include a telecentric lens.

Laser processing method according to another embodiment of the present invention,

Separating the laser light emitted from the light source into a plurality of laser lights through an optical separator;

Injecting the laser beams into a reflecting mirror rotatably installed via a focusing lens;

Focusing the laser beams reflected from the reflection mirror into an object to be formed to form a plurality of light collecting points sequentially arranged in a first direction with a predetermined depth from the surface of the object; And

And moving one of the laser beams and the object to be processed in the first direction to form a plurality of crack rows corresponding to the light collecting points within the object.

Laser processing apparatus according to another embodiment of the present invention,

A light source emitting laser light;

An optical separator for separating the laser light emitted from the light source into a plurality of laser lights;

A focusing lens for focusing the laser beams emitted from the optical separator;

It is rotatably installed, the reflection mirror for reflecting the laser beam passing through the focusing lens to focus on the interior of the object; includes;

A plurality of condensing points having a predetermined depth from the surface of the object to be processed and sequentially arranged with respect to the first direction are formed.

By moving one of the laser processing apparatus and the object to be processed in the first direction, a plurality of crack rows corresponding to the light collecting points may be formed inside the object to be processed.

According to the embodiment of the present invention, since the lower crack row is formed before the upper crack row within the object to be processed, scattering of laser light due to the upper crack row can be prevented. In addition, since a plurality of crack rows are formed inside the object to be processed while the laser processing device moves once, the processing time can be greatly shortened.

1A and 1B are views for explaining a method of forming a plurality of crack rows inside a workpiece by using a focus adjustment method.
FIG. 2 is a view for explaining a method of forming a plurality of crack rows inside a workpiece by using a multi-focus method using a birefringent material.
3 shows a laser processing apparatus according to an embodiment of the present invention.
FIG. 4 illustrates a case in which the distance between the optical separator and the focusing lens is changed in the laser processing apparatus shown in FIG. 3.
FIG. 5 illustrates a case in which the rotation angle of the reflection mirror is changed in the laser processing apparatus shown in FIG. 3.
FIG. 6 is a view for explaining a process of forming a plurality of crack trains inside an object to be processed using the laser processing apparatus according to the embodiment of the present invention shown in FIG. 3.
FIG. 7 is a cross-sectional view of crack trains formed in the object to be processed by FIG. 6 as viewed in a moving direction of the laser processing apparatus. FIG.
8A and 8B illustrate a process of cutting an object to be processed in which crack rows are formed by an external stress shown in FIG. 7.
9 shows a laser processing method according to another embodiment of the present invention.
FIG. 10 is a cross-sectional view showing cracks formed on the inside of the workpiece and cracks formed on the surface of the workpiece by FIG. 9.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the drawings, like reference numerals refer to like elements, and the size and thickness of each element may be exaggerated for clarity of explanation.

3 shows a laser processing apparatus according to an embodiment of the present invention.

Referring to FIG. 3, the laser processing apparatus 100 according to the exemplary embodiment of the present invention may include a light source 110, an optical separator 120, a focusing lens 130, and a reflecting mirror 140 that emit laser light L. It includes. The optical splitter 120 is disposed to be spaced apart from the light source 110 in front of the laser light source L emitted from the light source 110 to the first, second and third laser lights L1, L2, and L3. Will be separated. On the other hand, the optical splitter 120 may be separated into a variety of laser light, for example two or four or more laser lights. The optical splitter 120 may include a diffractive optical element (DOE). The first, second and third laser lights L1, L2, and L3 separated by the optical separator 120 may have a pulse width of about 1 ns (nano second) or less, respectively. The peak power density in S2, S3) may be about 1 × 10 8 W / cm 2 or more. The pulp width and peak power density of the laser lights L1, L2, and L3 may be conditions for generating multiple photon absorption, which will be described later, inside the object 10.

The focusing lens 130 is spaced apart in front of the optical separator 120 to focus a plurality of laser lights L1, L2, and L3 emitted from the image separator 120, respectively. The focusing lens 130 may include, for example, a telecentric lens. Here, the optical separator 120 and the focusing lens 130 are installed to be movable to adjust the distance A between the optical separator 120 and the focusing lens 130. The reflection mirror 140 is installed in front of the focusing lens 130 to reflect the laser light (L1, L2, L3) passing through the focusing lens 130 to focus on the inside of the object 10. Here, the object to be processed 10 by the laser processing apparatus 100 may be a substrate of a transparent material. For example, the object to be processed 10 may be a sapphire substrate or a glass substrate, or may be a substrate of various materials.

The laser lights L1, L2, and L3 reflected by the reflection mirror 140 are focused inside the object 10 to form a plurality of condensing points S1, S2, and S3. In the present exemplary embodiment, the light collecting points S1, S2, and S3 have predetermined depths from the surface 10a of the object to which the laser lights L1, L2, and L3 are incident, and are arranged in the first direction (101 in FIG. 6). ) Are arranged sequentially. Here, the first direction is a processing direction, and means a moving direction of the laser processing apparatus 100 or a moving direction of the object to be processed 10. Specifically, the first, second, and third condensed light in the depth direction of the object 10 corresponding to the first, second, third laser light (L1, L2, L3) inside the object 10. The points S1, S2 and S3 are formed sequentially. Here, the third condensing point S3 located at the deepest depth from the surface 10a of the object is arranged in front of the first direction (101 in FIG. 6), and the surface of the object ( The first condensing point S1 positioned at the lowest depth from 10a) is arranged at the rearmost side with respect to the first direction 101.

As such, the first, second, and third condensing points S1, S2, and S3 in which the first, second, and third laser lights L1, L2, and L3 are focused are formed in the object 10. In this case, multiphoton absorption may occur at the condensing points S1, S2, and S3 to form cracks. Multiphoton absorption is a phenomenon that occurs when the intensity of laser light is very large. That is, even if the material is transparent, if the intensity of the laser light is made very large, the material causes absorption. This phenomenon is called multiphoton absorption. In the present embodiment, the pulse widths of the first, second and third laser lights L1, L2, and L3 are approximately 1 ns or less, respectively, and the peak power densities at the converging points S1, S2, and S3 are approximately. Multiphoton absorption may occur at conditions of 1 × 10 8 W / cm 2 or higher.

As described above, in the present exemplary embodiment, a plurality of light collecting points S1, S2, and S3 are formed inside the object 10 by a plurality of laser lights L1, L2, and L3, and the light collecting points S1, As S2 and S3 are located deeper from the surface 10a of the object to be processed, they are arranged in front of the first direction (101 in FIG. 6), thereby preventing scattering of the laser light due to the upper crack row as described later. .

Meanwhile, when the distance A between the optical splitter 120 and the focusing lens 130 is changed or the rotation angle B of the reflective mirror 140 is changed, the inside of the object 10 is processed. Distance between the condensing points (S1, S2, S3) to be formed, specifically, the distance between the condensing points (S1, S2, S3) in the thickness direction of the object 10 and the first direction (101 in FIG. 6) The distance between the condensing points (S1, S2, S3) can be adjusted at a desired interval.

4 illustrates a case where the distance between the optical separator 120 and the focusing lens 130 is changed in the laser processing apparatus 100 shown in FIG. 3. 4 exemplarily illustrates a case where the distance between the optical separator 120 and the focusing lens 130 is reduced from A to A1. As shown in FIG. 4, when the distance between the optical splitter 120 and the focusing lens 130 is reduced from A to A1, the first and second condensing points S1 and the second condensing point along the thickness direction of the object 10 are processed. The distance between S2) and the distance between the second and third converging points S2 and S3 are reduced from h1 and h2 to h'1 and h'2, respectively. The distance between the first and second condensing points S1 and S2 and the distance between the second and third condensing points S2 and S3 in the first direction (101 in FIG. 6), which is the machining direction, are respectively represented by d1 and d2 to d'1 and d'2.

FIG. 5 illustrates a case in which the rotation angle of the reflective mirror 140 is changed in the laser processing apparatus 100 shown in FIG. 3. 5 illustrates a case in which the rotation angle of the reflection mirror 140 is increased from B to B1. As shown in FIG. 5, when the rotation angle of the reflection mirror 140 is increased from B to B1, the distance between the first and second condensing points S1 and S2 along the thickness direction of the object 10 is processed. The distance between the second and third converging points S2 and S3 is reduced from h1 and h2 to h ″ 1 and h ″ 2, respectively. The distance between the first and second converging points S1 and S2 and the distance between the second and the third condensing points S2 and S3 in the first direction (101 in FIG. 6) are respectively d1 and d2. increase to d "1 and d" 2.

As described above, when at least one of the distance A between the optical splitter 120 and the focusing lens 130 and the rotation angle B of the reflective mirror 140 is changed, the thickness direction of the object 10 is processed. The distance between the light collecting points S1, S2, and S3 and the distance between the light collecting points S1, S2 and S3 in the first direction (101 of FIG. 6) may be adjusted to a desired distance.

6 is a view for explaining a process of forming a plurality of crack rows (151, 152, 153) inside the object to be processed 10 using the laser processing apparatus 100 according to an embodiment of the present invention.

Referring to FIG. 6, the laser processing apparatus 100 is moved in a first direction 101 in a state where a plurality of light collecting points (S1, S2, and S3 of FIG. 3) are formed inside the object 10. As described above, when the laser processing apparatus 100 is moved along a cutting line in a state in which a plurality of condensing points S1, S2, and S3 are formed in the object 10, the object 10 may be disposed within the object 10. First, second, and third crack rows 151, 152, and 153 corresponding to the first, second, and third light collecting points S1, S2, and S3 are formed along the thickness direction of the object 10. In this case, the first crack row 151 is formed at the lowest depth from the surface 10a of the object 10, and the third crack row 153 is the surface 10a of the object 10. From the deepest position. In the present exemplary embodiment, since the third condensing point S3 is arranged in front of the first direction 101, which is the moving direction of the laser processing apparatus 100, the third crack row 153 is disposed. First, the second and first crack rows 152 and 151 are sequentially formed. Accordingly, the third laser light L3 for forming the third crack row 153 may be accurately positioned at a desired position inside the object 10 without being scattered by the second and first crack rows 152 and 151. 3 condensing point S3 can be formed. In this embodiment, since the laser processing apparatus 100 moves only once, the first, second, and third crack rows 151, 152, 153 may be simultaneously formed, thereby greatly reducing the processing time. Meanwhile, in the above embodiment, the case in which the laser processing apparatus 100 forms the first, second, and third crack rows 151, 152, and 153 inside the object 10 while moving in the first direction 101 has been described. However, when the laser processing apparatus 100 is stopped, the processing object 10 moves in the first direction 101 so that the first, second and third crack rows 151, 152, 153 inside the processing object 10. It is also possible to form

FIG. 7 is a cross-sectional view of the crack trains 151, 152, and 153 formed in the object 10 by the method illustrated in FIG. 6 as viewed in the moving direction 101 of the laser processing apparatus. 8A and 8B illustrate a process of cutting the object 10 in which the first, second, and third crack rows 151, 152, and 153 formed in FIG. 7 are formed by an external stress. 6A and 6B illustrate a process of cutting an object by applying an external stress to the object on which the internal crack row and the scribing line are formed. Meanwhile, in the above embodiment, a plurality of crack rows 151, 152, 153 are formed only inside the object 10, and FIGS. 6A and 6B of the surface 10a of the object 10 have internal crack rows and scribing lines formed therein. The process of cutting an object by applying an external stress to the object is shown. 8A and 8B, after the first, second and third crack rows 151, 152, 153 are formed in the object 10 and then external stress is applied to the object 10, FIG. 8A is shown. As described above, cracks connecting the first, second and third crack rows 151, 152 and 153 are generated, and when the external stress persists, the object 10 is cut around the crack as shown in 8b. Meanwhile, in the above-described embodiment, the case where the plurality of crack rows 151, 152, 153 are formed only inside the object 10 and no crack is formed on the surface 10a of the object 10 has been described.

9 shows a laser processing method according to another embodiment of the present invention. 10 is a cross-sectional view showing the interior of the object to be processed by the method shown in FIG. 9. Hereinafter, a description will be given focusing on differences from the above-described embodiment.

9 and 10, the laser processing apparatus 100 (FIG. 3) or the processing target object 10 are moved in the first direction (101 in FIG. 6) so that the first, second, and First, second, and third crack columns 151, 152, and 153 are formed by the third laser lights L1, L2, and L3. Here, the third, second and first crack rows 163, 162, 161 are sequentially formed with respect to the first direction (101 in FIG. 6), and the first, second, and first parts in the depth direction of the object 10 are processed. Three crack rows 161, 162, 163 are formed sequentially. In addition, in the present exemplary embodiment, the surface cracks 164 may be formed to correspond to the first crack rows 161 formed at the lowest depth from the surface 10a of the object 10. The surface crack 164 may be formed by changing the distance between the first crack train 161 and the surface 10a of the object 10, the pulse width of the first laser light 161, and the like. Such surface cracks 164 may have a width of approximately 1 μm or less.

By the surface cracks 164, the object 10 may be more easily cut. On the other hand, the surface crack 164 having a width of 1 μm or less does not affect the semiconductor element or the like stacked on the object 10.

While the invention has been shown and described with reference to certain preferred embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the scope of the invention as defined by the appended claims.

10 ... workpiece 10a ... surface of workpiece
S1, S2, S3 ... first, second, third condensing point
L ... laser light L1, L2, L3 ... 1st, 2nd, 3rd laser light
A ... distance between optical splitter and focusing lens
B ... angle of rotation of the reflecting mirror
100 ... laser processing unit 110 ... light source
120 ... optical splitter 130 ... focusing lens
140 ... Reflective Mirror
151,161 .. First Crack Row 152,162 ... Second Crack Row
153,163 ... Third crack row 164 ... Surface crack

Claims (25)

  1. Separating the laser light emitted from the light source into a plurality of laser lights by an optical separator;
    Injecting the laser beams into a reflecting mirror rotatably installed via a focusing lens;
    Focusing the laser beams reflected from the reflection mirror into an object to be formed, thereby forming a plurality of light collecting points having predetermined depths from a surface of the object to be sequentially arranged with respect to a first direction; And
    And forming a plurality of crack rows corresponding to the light collecting points within the object by moving one of the laser beams and the object to be processed in the first direction.
    And the converging points are arranged further forward with respect to the first direction as they are located deeper from the surface of the object to which the laser light is incident.
  2. delete
  3. The method of claim 1,
    And said crack rows are formed by multiple photon absorption generated at said light collection points.
  4. The method of claim 1,
    Each of the laser beams has a pulse width of 1 ns (nano second) or less.
  5. The method of claim 4, wherein
    The peak power density at the light collecting points is 1 × 10 8 W / cm 2 or more.
  6. The method of claim 1,
    The processing object is a laser processing method comprising a sapphire substrate or a glass substrate.
  7. The method of claim 1,
    And a crack is not formed on a surface of the object to be processed in which the crack rows are formed.
  8. The method of claim 1,
    And a surface crack corresponding to the crack train closest to the surface of the workpiece, on the surface of the workpiece to which the crack rows are formed.
  9. The method of claim 1,
    The surface crack is a laser processing method having a width of 1㎛ or less.
  10. The method of claim 1,
    And forming the crack rows and then cutting the object by external stress.
  11. delete
  12. The method of claim 1,
    The distance between the focusing points is controlled by at least one of the distance between the optical splitter and the focusing lens and the rotation angle of the reflecting mirror.
  13. The method of claim 1,
    The optical separator comprises a diffractive optical element (DOE).
  14. The method of claim 1,
    The focusing lens comprises a telecentric lens.
  15. Separating the laser light emitted from the light source into a plurality of laser lights through an optical separator;
    Injecting the laser beams into a reflecting mirror rotatably installed via a focusing lens;
    Focusing the laser beams reflected from the reflection mirror inside the object to form a plurality of condensing points having a predetermined depth from the surface of the object and arranged sequentially in a first direction; And
    And forming a plurality of crack rows corresponding to the converging points within the object to be processed by moving one of the laser beams and the object to be processed in the first direction.
  16. The method of claim 15,
    And the converging points are arranged further forward with respect to the first direction as they are located deeper from the surface of the object to which the laser light is incident.
  17. The method of claim 15,
    Each of the laser beams has a pulse width of 1 ns (nano second) or less, and a peak power density at the converging points is 1 × 10 8 W / cm 2 or more.
  18. The method of claim 15,
    And forming the crack rows and then cutting the object by external stress.
  19. A light source emitting laser light;
    An optical separator for separating the laser light emitted from the light source into a plurality of laser lights;
    A focusing lens for focusing the laser beams emitted from the optical separator;
    It is rotatably installed, the reflection mirror for reflecting the laser beam passing through the focusing lens to focus on the interior of the object; includes;
    Forming a plurality of light-converging points having a predetermined depth from the surface of the object and sequentially arranged with respect to a first direction,
    The distance between the focusing point is controlled by at least one of the distance between the optical splitter and the focusing lens and the rotation angle of the reflecting mirror.
  20. The method of claim 19,
    And any one of the laser processing apparatus and the object to be processed moves to the first direction to form a plurality of crack rows corresponding to the light collecting points within the object to be processed.
  21. The method of claim 19,
    And the converging points are arranged further forward with respect to the first direction as they are located deeper from the surface of the object to which the laser light is incident.
  22. The method of claim 19,
    Each of the laser beams has a pulse width of 1 ns (nano second) or less, and a peak power density at the focusing points is 1 × 10 8 W / cm 2 or more.
  23. delete
  24. The method of claim 19,
    The optical separator comprises a diffraction optical system (DOE) laser processing apparatus.
  25. The method of claim 19,
    The focusing lens includes a telecentric lens.
KR1020100078827A 2010-08-16 2010-08-16 Laser processing method and laser processing apparatus using sequential multi-focusing KR101217698B1 (en)

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KR20060113454A (en) * 2005-04-27 2006-11-02 사이버 레이저 가부시끼가이샤 Cutting method of plate-like body and laser processing machine
JP2009190069A (en) * 2008-02-15 2009-08-27 Cyber Laser Kk Machining method and device for transparent substrate by laser
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