KR101217284B1 - Apparatus for removal of volatile organic compounds - Google Patents

Abstract

The present invention relates to a device for removing volatile organic compounds, and more particularly, to a device capable of removing harmful odors of volatile organic compounds by using a plasma discharged by applying a high voltage at a low temperature of atmospheric pressure, and removing odors. It is about.
The present invention is composed of an inlet, an outlet, a first partition, a second partition, a plasma discharge device, a power supply terminal and a ground terminal, and the plasma discharge device is composed of a conductor tube, a ground electrode, and a power supply electrode. It can be oxidized and removed continuously to decompose and oxidize a large amount of volatile organic compounds, and it is harmless even when it is released into the air to prevent contamination of air, and the structure of the device is relatively simple, so mass production is possible. As a result, energy efficiency is improved and operation is possible at low cost.

Description

Apparatus for removal of volatile organic compounds}

The present invention relates to a device for removing volatile organic compounds, and more particularly, to a device capable of removing harmful odors of volatile organic compounds by using a plasma discharged by applying a high voltage at a low temperature of atmospheric pressure, and removing odors. It is about.

Volatile organic compounds (hereinafter referred to as 'VOCs') include incomplete combustion of fuels, petroleum products, organic solvents, evaporation of paints (in use and storage), automobiles, petroleum refining and petrochemical manufacturing facilities, and , Gas station, laundry, paint manufacturing facility, printing ink manufacturing facility, small scale organic solvent use facility, road paving facility, printing and publishing facility, various painting facilities (automobile, ship, electric, electronic, metal products, wooden furniture, plastic, etc.) It is known as a major source of emissions, and it is found to be emitted from the natural environment (forest, soil, grassland, ocean, etc.). Not only are these VOCs detrimental to their own properties, they are also known to contribute to photochemical reactivity with nitrogen oxides as they are released into the atmosphere due to the increased use of motor vehicles, oils and organic solvents.

Therefore, when these VOCs are exposed to the atmosphere, they not only directly affect the human body, but also react with the atmosphere to produce compounds that destroy ozone. In addition, it is known that VOCs containing chlorofluoromethanes or chlorine among these VOCs absorb infrared rays or increase emission. Therefore, development and research of various devices for removing VOCs without release to the atmosphere are in progress.

To date, there are methods to remove these VOCs by greatly improving the process and equipment, which is the root cause of generating VOCs, and minimizing the occurrence of VOCs, and installing and removing additional VOCs removal equipment when VOCs are generated.

Among the above methods, the removal method by installing VOCs removal equipment is classified into a method of directly destroying and recovering VOCs itself.

Among the methods of destroying VOCs, there are oxidation and biofilters.

Among the oxidation methods, there is a method of oxidizing using heat, a catalyst, etc., but the method of oxidizing and destroying with heat and a catalyst has advantages in lowering maintenance costs or additional costs. There is a problem that additional secondary products are unexpectedly generated during the oxidation process and the efficiency of the energy used for the oxidation is lowered.

Among the methods of removing VOCs, there are methods of absorption, separation by adsorption condensation, adsorption, etc. This recovery method does not generate additional secondary products but it is expensive in parts and recovers VOCs. There is a problem of reprocessing a waste.

There is a method of removing VOCs by using plasma. The VOCs removal method using this plasma is a method of oxidizing or reducing VOCs by the plasma chemical reaction discharged by corona discharge. Looking more closely at the method using the plasma, the plasma is called a fourth material state, followed by a solid, liquid, and gas, with voltages ranging from thousands to tens of thousands of volts and milliamps to amperes across the cathode and anode electrodes. It can be discharged to generate discharge, and it is composed of electrons, ions and radicals, and their chemical action decomposes and oxidizes harmful components and odors of volatile organic compounds.

Accordingly, an object of the present invention is to provide an apparatus for removing a volatile organic compound capable of oxidizing a volatile organic compound containing harmful components into a harmless component and removing odors.

It is also an object of the present invention to provide a device for removing volatile organic compounds having a simple structure, good energy efficiency and low additional cost.

An object of the present invention as described above is a receiving portion 101 to form a predetermined space portion by the first partition 171 and the second partition 181 in the device 100 for removing volatile organic compounds; A plasma discharge device (200) installed to communicate the first partition wall (171) and the second partition wall (181); A power supply terminal (130) installed in the volatile organic compound removing device (100) and electrically connecting the applied power of the power supply unit (60) to the plasma discharge device (200); Is installed in the removal apparatus 100 of the volatile organic compound, and consists of a ground side terminal 140 for electrically connecting the ground side of the power supply unit 60 and the plasma discharge device 200, the plasma discharge device ( 200 includes a conductor tube 230; A ground side electrode 220 installed at an outer diameter of the conductor tube 230 and electrically connected to the ground side terminal 140 through a ground side wire 221; A power side electrode 210 provided inside the conductor tube 230 and electrically connected to the power side terminal 130 through a power side wire 211; It is achieved by configuring.

According to the present invention, the volatile organic compounds can be continuously oxidized and removed, so that a large amount of volatile organic compounds can be decomposed and oxidized, and even when released into the air, it is harmless to prevent air pollution.

In addition, the structure of the device is relatively simple, mass production is possible, energy efficiency is improved, and operation at low cost is possible.

1 is a schematic configuration diagram for experimenting with a volatile organic compound removing device of the present invention,
Figure 1a is a graph analyzing the concentration of MEK by changing the supply voltage to 4, 5, 6 kV,
Figure 1b is a graph analyzing the concentration of MEK by changing the amount of transport gas to 1000, 850, 650, 500sccm while maintaining a supply voltage of 4kV, MEK concentration of 51.8ppm,
2 is an internal perspective view of a volatile organic compound removing device according to an embodiment of the present invention,
3 is a cross-sectional view of a volatile organic compound removing device according to the present invention,
4 is a perspective view illustrating a plurality of plasma discharge devices according to an embodiment.

Hereinafter, with reference to the accompanying drawings will be described in detail the configuration of the present invention according to the preferred embodiment.

Figure 1 shows a schematic diagram for testing the volatile organic compound removal apparatus of the present invention.

Oxygen tank (10), nitrogen tank (20), ball flow meter (30), feed tube (40), constant temperature water tank (50), power supply (60), VOCs It consists of a removal device 100 and a collector 70.

Hereinafter, the configuration, the method, the analysis, and the results according to the experiment will be described.

① Composition and environment of experiment

The VOCs to be used for the experiment were Methyl Ethyl Ketone (MEK), which is widely used in detergents, as a representative of volatile organic compounds.

MEK, which is a VOCs generating material to be used, is accommodated in the bubbler 51 in the constant temperature water tank 50. The constant temperature water tank 50 includes the bubbler 51, and the water is contained in a bubbler (a bath). 51) to keep the temperature of caution constant.

The oxygen tank 10 and the nitrogen tank 20 maintain a atmospheric air state by a ball flow metter 30 which maintains a ratio of nitrogen and oxygen at 8: 2, and the mixed gas of nitrogen and oxygen is maintained. Serves as a carrier, and transfers the MEK contained in the bubbler 51 to the volatile organic compound removal device 100.

The transfer tube 40 is made of stainless steel, and the transfer tube 40 is a passage through which the mixed gas is moved. The transfer tube 40 is always exposed to the outside, so that the temperature of the constant temperature bath 50 is wound around the transfer tube 40 with a heating tape in order to keep the temperature of the transfer tube 40 and caution constant. The temperature was kept constant and the heating tape was kept constant by a separate temperature controller and thermocouple thermometer.

 As the conductor tube 230 of the volatile organic compound removing apparatus 100, a cylindrical alumina tube having an outer diameter of 6.0 mm / inner diameter of 4.0 mm was used. In the center of the conductor tube 230, the contact electrode 210 made of stainless steel having a diameter of 2.4 mm was installed, and the gap between the inner diameter of the conductor tube 230 and the outer diameter of the power source electrode 210 was 1.6 mm. Installed to be spaced apart.

The power supply side electrode 210 was electrically connected to the power supply side of the power supply unit 60 to generate a plasma.

The outer side of the conductor tube 230 is provided with a ground side electrode 230 for use as a ground, the ground side electrode 230 is wrapped and fixed in close contact with copper tape and copper wire or aluminum foil.

In order to prevent the electrode from being damaged by the heat generated by the high voltage during the experiment, it was cooled with nitrogen gas (40 L / min) from the outside.

The gap between the inside of the conductor tube 230 and the power supply side electrode 210 was kept constant, and the union 102 was used to prevent contact with the outside so that dilute volatile organic compounds were introduced therebetween.

In addition, the discharge side of the volatile organic compound removal device 100 to install the collector 70 to analyze the discharged gas to collect the discharge gas.

The internal pressure of the feed tube 40 was set to maintain 1 atm, and the nitrogen gas was in the range of 100 to 1000 sccm (the amount of gas (cm ³ ) released for 1 minute at 0 at 1 atm). The experiment was performed by changing the nitrogen: oxygen ratio to 8: 2 within 500sccm and changing the total flow rate of the mixed gas to 1000, 850, 650, and 500sccm.

 In addition, AC power supply and neon transformer were used as supply power for generating atmospheric pressure plasma. In case of AC power supply, the supply frequency was 30 ~ 40kHz and the voltage used was 4 ~ 6kV.

The time taken to collect the gas that passed through the volatile organic compound removal device that generates the atmospheric pressure plasma was used as an experiment variable, and the time to sample the MEK + N ₂ + O ₂ gas that passed through the volatile organic compound was 1 ~. The experiment was changed to 30 minutes.

The temperature of the constant temperature water bath 50 and the heating tape were kept the same, and the constant temperature was kept constant at about ± 2 ° C. at 30,35,40,60 ° C. according to the experiment.

② Method

In this experiment, the gas that passed through the volatile organic compound removal device was measured by gas chromatography. As a method of collecting, the sample was collected in a gas bag by using an absorbent tube and a sealed method. Collected by the method of harvesting.

This tube, which was used as a collection method using a solvent tube tube, was filled with a Tenax adsorbent in a tube about 100 inches long in a diameter of about 1/4 inch made of stainless steel. Capture is possible.

In the case of the above method, the front part of the adsorption tube tube was connected to the gas outlet portion, and the sampling pump was connected to the other side of the tube, and the sample was sampled for 5-30 minutes by suctioning at 100 mL per minute.

In the capture method using a gas bag, the total flow rate was fixed at about 2L, and the collection time was experimented differently according to the minute flow rate of N ₂ + O ₂ gas passing through the bubbler 51, and the collection time was up to about 2 ~. It lasted for 4 minutes.

The supply voltage was set at 4, 5 and 6 kV and run for 30 minutes each.

③ Analysis method

As an analytical method used to measure the concentration of MEK of the collected samples, gas chromatography (Gas Chromatograph, GC) was used for quantitative analysis of collected MEK. GC-FID method was used for the analysis. Both collection methods used in the experiment were measured by GC-FID analysis.

Samples collected in the gas bag can be measured in a simple manner by mixing the collected gas with other gases to be diluted during GC analysis.

In the case of the sample collected by the adsorption tube, the adsorption tube and the adsorbed sample in the adsorption tube should be separated and injected into the GC measuring instrument for GC analysis. This analysis is called thermal desorption (TD) analysis, which was also used in this experiment.

For GC, quantitative analysis was performed using GC-FID method. Perkin-Elmer's Clarus 500 model was used as the instrument, and the test environment was conducted at a temperature of 20 ° C and a humidity of 46-47% (RH).

④ Results

FIG. 1A is a graph analyzing the concentration of MEK by varying the supply voltage to 4, 5, and 6 kV. The horizontal axis represents applied voltage, and the vertical axis represents amount of detected MEK.

In this graph, the concentration of the sample without plasma reaction was 33.2 ppm and the lowest MEK concentration was observed at a supply voltage of 4 kV, and the concentration was about 27.8 ppm.

Figure 1b is a graph analyzing the concentration of MEK by changing the amount of transport gas to 1000, 850, 650, 500sccm while maintaining the supply voltage of 4kV, MEK concentration of 51.8ppm, the horizontal axis is a mixed gas of N ₂ + O ₂ The vertical axis represents the amount of KEK detected.

In this graph, the lowest concentration of MEK was detected at 500 ccm (42.5 ppm). As a result, the maximum inflow of volatile organic compounds corresponding to the size of the volatile organic compound removal device used in the experiment of the present invention was about 500 sccm. Was concluded.

As a result of the experiment, it was analyzed that the volatile organic compound removal device using plasma has an effect, and the configuration of the volatile organic compound removal device used in this experiment will be described in detail.

2 and 3 of the accompanying drawings show a perspective view and a cross-sectional view of the volatile organic compound removal device according to an embodiment of the present invention.

The apparatus 100 for removing volatile organic compounds includes an inlet 110, an outlet 120, a first partition 171, a second partition 181, a plasma discharge device 200, a power supply terminal 130, and a ground terminal. Consisting of 140,

The plasma discharge device 200 includes a conductor tube 230, a ground side electrode 220, and a power side electrode 210.

VOCs are introduced into the inlet 110, and the outlet 120 oxidizes and discharges the volatile organic compound by plasma discharge.

An accommodating part 101 is formed in the apparatus 100 for removing the volatile organic compound to form a predetermined space by the first partition 171 and the second partition 181. The first partition 171 and the The second partition wall 181 is provided with a hole (not shown) in communication with the inlet 110 and outlet 120, the front end and the rear end of the removal device 100 of the volatile organic compound in the hole The part is inserted and installed.

The power supply terminal 130 electrically connects the applied power of the power supply unit 60 (refer to FIG. 1) with the plasma discharge device 200, and penetrates the outside and the inside of the removal device 100 of the volatile organic compound. Is installed.

The ground terminal 140 is installed in the volatile organic compound removing device 100, and electrically connects the ground side of the power supply unit 60 with the plasma discharge device 200 to remove the volatile organic compound. It is installed through the outside and inside of the device 100.

Hereinafter, the plasma discharge device 200 will be described.

The conductor tube 230 is formed of an outer diameter and an inner diameter having a predetermined thickness, one end of the outer diameter is inserted into the hole of the first partition 171, the other end is a hole of the second partition 181 Inserted into and installed. In addition, the inner diameter of the conductor tube 230 is provided with a plasma electrode 240. That is, as shown in FIG. 3, a plurality of plasma electrodes 240 are installed on the inner diameter of the conductor tube 230 to protrude toward the power supply electrode 210, which will be described below, and have a sharp end. It is formed to have a predetermined slope from the side to the outlet 120 side.

The ground side electrode 220 is installed in close contact with the outer diameter of the conductor tube 230 and is electrically connected to the ground side terminal 140. The ground side electrode 220 and the battery side terminal 140 have a ground side. It is electrically connected using the wire 221.

The power supply side electrode 210 is installed to be spaced apart from the inside of the conductor tube 230 by a predetermined distance and is electrically connected to the power supply terminal 130 through the power supply wire 211.

In this configuration, the power supply side from the power supply unit 60 is supplied to the power supply electrode 210 through the power supply terminal 130 and the power supply wire 211, and the ground side of the power supply unit 60 is the ground terminal 140 and the ground side. It is connected to the ground-side electrode 220 connected to the conductor tube 230 through the wire 221, the high voltage of the power supply unit 60 is discharged by the corona phenomenon in the power supply side electrode 210.

While the plasma is discharged, the VOCs are introduced into the inlet 110 and discharged to the outlet 120, and the introduced VOCs are oxidized by the plasma. As a result of this oxidation, the VOCs of hazardous substances are converted into harmless substances and odors are reduced.

Plasma is discharged by the application of a high voltage, at which time a lot of heat can be generated, a configuration that reduces and discharges the generated heat is required.

Therefore, in order to reduce heat generated in the accommodating part 101 more efficiently, the accommodating part 101 includes a coolant inlet 150 and a coolant outlet 160 to supply the coolant to the accommodating part 101. And it may further include a configuration for discharging the warmed refrigerant. Such a configuration may further include a coolant inlet 150 provided in the accommodating part 101 and a coolant inlet 150 provided in the accommodating part 101 and a coolant outlet 160 through which the coolant is discharged. In addition, a heat exchanger for discharging heat and a compressor for circulating the refrigerant may be further installed.

A plurality of plasma discharge devices 200 may be provided between the first partition wall 171 and the second partition wall 181. FIG. 4 of the accompanying drawings shows a perspective view of the plurality of plasma discharge devices.

Looking at this configuration, a plurality of the plasma discharge device 200 is provided, is provided in front of the plurality of plasma discharge device 200 to distribute the power applied from the power supply-side wire 211 to the plurality of plasma discharge The plasma is provided at a rear end of the first support member 170 and the plurality of plasma discharge apparatuses 200 respectively supplying power to the apparatus 200 and supporting the power supply electrode 210 of the plasma discharge apparatus 200. It may be configured to further include a second support 180 for supporting the power supply side electrode 210 of the discharge device 200, respectively.

According to the present invention, the volatile organic compound removal apparatus can continuously oxidize and remove volatile organic compounds, so that a large amount of volatile organic compounds can be decomposed and oxidized, and the oxidized gas discharged is harmless to prevent air pollution. In addition, the structure of the device is relatively simple, mass production is possible, energy efficiency is improved, and operation at low cost is possible.

10: oxygen tank 20: nitrogen tank
30: ball flow meter 40: feed tube
50: constant temperature water tank 60: power supply
70: collecting part
100: volatile organic compound removal device
110: inlet 120: outlet
130: power supply terminal 140: grounding terminal
150: refrigerant inlet 160: refrigerant outlet
170: first support 171: first partition
180: second support 181: second bulkhead
200: plasma discharge device
210: power supply electrode 211: power supply wire
220: grounding electrode 221: grounding wire
230: conductor tube 240: plasma electrode

Claims (3)

In the apparatus 100 for removing a volatile organic compound having an inlet 110 for introducing a volatile organic compound and an outlet 120 for oxidizing and discharging the volatile organic compound by a plasma discharge,
An accommodating part 101 forming a predetermined space part by the first partition 171 and the second partition 181 in the apparatus 100 for removing the volatile organic compound;
A plasma discharge device (200) installed to communicate the first partition wall (171) and the second partition wall (181);
A power supply terminal (130) installed in the volatile organic compound removing device (100) and electrically connecting the applied power of the power supply unit (60) to the plasma discharge device (200);
Is installed in the removal device 100 of the volatile organic compound, consisting of a ground side terminal 140 for electrically connecting the ground side of the power supply unit 60 with the plasma discharge device 200,
The plasma discharge device 200
Conductor tube 230;
A ground side electrode 220 installed at an outer diameter of the conductor tube 230 and electrically connected to the ground side terminal 140 through a ground side wire 221;
A power side electrode 210 provided inside the conductor tube 230 and electrically connected to the power side terminal 130 through a power side wire 211;
Installed on the inner diameter of the conductor tube 230 and protrudes toward the power side electrode 210 is composed of a plurality of plasma electrodes 240 having a sharp end,
The plasma discharge device 200 is provided in plurality,
It is installed at the front end of the plurality of plasma discharge device 200 to distribute the power applied from the power supply-side wire 211 to supply power to the plurality of plasma discharge device 200, respectively, of the plasma discharge device 200 A first support 170 for supporting the power supply side electrode 210, respectively;
And a second support (180) installed at a rear end of the plurality of plasma discharge devices (200) to support the power supply electrode (210) of the plasma discharge device (200), respectively.
delete The method according to claim 1,
A coolant inlet 150 provided in the accommodation part 101 and into which a coolant flows;
The volatile organic compound removal device further comprises a refrigerant outlet (160) provided in the receiving portion 101 and the refrigerant is discharged.

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