KR101212826B1 - Electronic component package, cover body for such electronic component package, cover material for such cover body and method for manufacturing such cover material - Google Patents

Abstract

Before the lid is soldered to the case of the electronic component package, even if degassing treatment for heating and removing moisture is performed, warpage is less likely to occur, and the lid is less likely to cause damage to the case during soldering. Cover material and the like are provided.

The lid | cover body of this invention and the lid | cover material used as the raw material are laminated | stacked on the base material layer 2 formed with the low thermal expansion metal, and one surface of this base material layer 2, and contain Ni-6.Omass%. An intermediate metal layer 3 formed of a Cu-Ni alloy or a Cu-Ag alloy containing 0.05 to 10 mass% of Ag, and a brazing filler metal layer formed of a silver lead alloy containing silver as a main component, 4) is provided.

Low thermal expansion metal, base material layer, package, cover member, cover body, cover material, nickel alloy, silver lead alloy, intermediate metal layer, electronic component precision, degassing treatment

Description

ELECTRONIC COMPONENT PACKAGE, COVER BODY FOR SUCH ELECTRONIC COMPONENT PACKAGE, COVER MATERIAL FOR SUCH COVER BODY AND METHOD FOR MANUFACTURING SUCH COVER MATERIAL}

The present invention relates to a package for an electronic component, in which an opening of a case for storing an electronic component is sealed by a lid, a lid, and a lid of the lid.

In a package for storing various electronic components such as a semiconductor element and a piezoelectric vibrator, as disclosed in Japanese Patent Application Laid-Open No. 2000-3973 (Patent Document 1), a case is formed in which a recess for accommodating the electronic component is opened at an upper surface thereof. And a lid body soldered to the outer periphery of the opening of the case so as to cover the opening of the case to seal the recess.

The said case is formed using ceramics, such as aluminum oxide and aluminum nitride, as a main material. On the other hand, the cover body is a base layer formed of a low thermal expansion metal such as Fe-29% Ni-17% Co alloy (trade name: KOVAR), and the base layer A brazing material layer formed of a metal brazing material, laminated on one surface of the substrate, is provided. As the metal solder, silver lead alloy mainly containing silver is used.

As means for welding the lid to the opening of the case, as disclosed in Patent Literature 1, seam welding may be applied. Seam welding does not need to be performed in a vacuum, and can be soldered efficiently by a relatively simple installation. As another means for solder welding, an electron beam welding for irradiating an electron beam to the outer peripheral portion of the cover body encased in a case by melting the brazing filler metal layer and applying it can also be applied.

In recent years, in addition to the reduction and miniaturization of electronic components, further reduction and miniaturization of such packages are desired. For this reason, the thickness of the lid is thin, and the case itself is also downsized, and the peripheral wall portion of the recess for accommodating the electronic parts of the case formed with ceramic is also thinned.

In such a situation, when the lid is soldered to the case, the melting point of the silver lead alloy is relatively high at about 780 ° C. Therefore, in the package for electronic components described in Patent Document 1, the ceramic layer forming the case and the base layer of the lid are formed. Due to the difference in thermal expansion rate with the low thermal expansion metal, there is a problem that a large thermal stress is generated in the wall part of the case during the cooling of the brazing material, cracks are generated by this stress, and the airtightness is lowered. This problem is not limited to the case of seam welding, but the same applies to welding by localized heating such as electron beam welding.

Thus, as described in Japanese Patent Laid-Open No. 2003-209197 (Patent Document 2), a base material layer formed of a low thermal expansion metal, and a base material, which is a cover material of the package for an electronic component or a material thereof, An intermediate metal layer laminated on one surface of the layer and formed of pure Cu having a proof strength of 110 N / mm ² or less, and a brazing filler metal layer formed of a silver lead alloy containing silver as a main component, What was equipped is proposed.

Patent Document 1: Japanese Patent Application Laid-Open No. 2000-3973

Patent Document 2: Japanese Patent Publication No. 2003-209197

In recent years, the precision improvement of electronic parts is requested | required further, According to the knowledge of this inventor, the degassing process which heats a cover body at the temperature of about 150-300 degreeC for 3 to 60 minutes before soldering a cover body to a case. I found it effective to do. The reason why such degassing is effective is as follows. When the lid is soldered, a gas component (mainly moisture) adhering to the lid from the heated lid turns into a gas such as water vapor and dissipates, and this gas is enclosed together with the electronic component in the case. The problem is that the life of the component is shortened or the oscillation frequency is varied. This problem can be prevented by performing the degassing treatment before the lid is soldered to the case.

By the way, when using the cover body provided with the intermediate metal layer formed from pure Cu described in the said patent document 2, there exist the following problems. In other words, by heating during the degassing treatment, thermal expansion of the intermediate metal layer formed of pure Cu having a large thermal expansion coefficient with respect to the base layer is constrained to the base layer, and the resulting stress causes plastic deformation of the intermediate metal layer. Then, when the lid is cooled, the intermediate metal layer is in a state of being shorter than the original length due to plastic deformation, so that it is pulled by the heat-shrinkable base layer, and the lid is deformed into an arch shape in which the intermediate metal layer side is concave. If the cover body in which such a deformation | transformation generate | occur | produced is soldered to a case, soldering work will become difficult and it will become easy to produce a soldering defect and an airtight defect.

The present invention has been made in view of such a problem, and it is difficult to cause deformation even if degassing treatment for heating and removing water is mainly performed. Furthermore, when soldering to a ceramic case, the thermal stress generated in the wall part of the case is reduced to prevent cracking. It is an object of the present invention to provide a cover body of a package for an electronic component that can be prevented, a cover member of the material, and a method of manufacturing the cover member, and to provide a package for an electronic component having excellent airtightness sealed by the cover member. It is done.

The lid member according to the present invention is a lid member for a lid member of an electronic component package which is welded to an outer peripheral portion of a case formed so that a storage space for storing an electronic component is opened from the surface, and is a low thermal expansion metal. And an intermediate metal layer formed of a Cu-Ni alloy containing 0.5 to 6.Omass% of Ni or a Cu-Ag alloy containing 0.05 to 10 mass% of Ag, stacked on one surface of the base material layer. And a solder material layer laminated on the intermediate metal layer and formed of a silver lead alloy containing silver as a main component. Hereinafter, the unit of a component is simply represented by "%."

According to this cover member, the intermediate metal layer is formed of a Cu-Ni alloy containing 0.5 to 6.0% Ni or a Cu-Ag alloy containing 0.05 to 10% Ag. Even if the degassing treatment is performed before soldering to the outer peripheral part of the opening, the intermediate metal layer is hardly plastically deformed by this treatment, and the cover body is hardly warped after the degassing treatment. In addition, since the alloy is excellent in thermal conductivity, Joule heat generated in the substrate layer is also caused by extremely short local heating (heating to the periphery of the lid), such as lead welding of the lid, seam welding, or electron beam welding. The heat or heat applied to the base material layer can be quickly transferred to the brazing filler metal layer through the intermediate metal layer, so that the cover body is not easily warped, and the cover body can be easily and reliably welded to the outer periphery of the opening of the case. Furthermore, the Cu-Ni alloy and the Cu-Ag alloy have a strength of 100 N / mm ² or less, which is attributable to the difference in thermal expansion coefficient between the case and the base layer when the lid is soldered to the outer periphery of the case. Therefore, even if a large thermal stress occurs in the wall portion of the case, the intermediate metal layer is easily plastically deformed, so that the thermal stress can be reduced, and furthermore, damage to the wall portion of the case can be prevented.

In the above cover member, the intermediate metal layer preferably has a thickness of 10 to 200 µm (10 µm or more and 200 µm or less), more preferably 10 µm or more and less than 100 µm. If it is less than 10 µm, the amount of plastic deformation cannot be obtained sufficiently, so that the effect of reducing the thermal stress generated in the case becomes less. On the other hand, when it exceeds 200 micrometers, the thermal deformation of the intermediate metal layer itself cannot be ignored, and thermal stress generated in the case cannot be reduced.

In the above cover material, a nickel base metal layer formed on the other surface of the base material layer with a nickel alloy containing pure nickel or nickel as the main component (all of these alloys may be referred to as "nickel basic alloys"). ) Can be joined. Thereby, the corrosion resistance of the outer surface of a base material layer can be improved, Furthermore, the contamination of the cover material, the cover body processed from the cover material, and also the electronic component package sealed by this can be prevented. In addition, the nickel base metal layer also has an effect of reducing warpage caused by a difference in thermal expansion coefficient between the base layer and the intermediate metal layer.

The manufacturing method of the lid | cover material by this invention is a manufacturing method of the lid | cover material for lid | cover body welded to the outer periphery of the opening part of the case in which the accommodating space for accommodating an electronic component was opened on the surface, One side of the base material layer formed by the low thermal expansion metal. A preparation step of preparing an intermediate metal layer laminate in which an intermediate metal layer formed of a Cu—Ni alloy containing 0.5 to 6.0% Ni or a Cu—Ag alloy containing 0.05 to 10% Ag is laminated on the surface; and the intermediate metal layer laminated A welding process of pressing a brazing material layer formed of a silver lead alloy containing silver as a main component of the sieve to obtain a brazing material layer press-fitting body; It has a diffusion annealing process for producing a cover material.

By this manufacturing method, the cover material in which the intermediate metal layer and the brazing filler metal layer are laminated on the base material layer can be easily manufactured, and the thickness of the intermediate metal layer can be easily controlled only by adjusting the reduction ratio during press welding. .

In the pressure welding step of this manufacturing method, the average thickness of the intermediate metal layer of the brazing filler metal layer is preferably 10 to 200 µm, more preferably 10 µm or more and less than 100 µm. In the preparation step, it is preferable that a nickel base metal layer formed of pure nickel or a nickel alloy containing nickel as a main component is laminated on the other surface of the base layer of the intermediate metal layer laminate.

An electronic component package according to the present invention includes a case formed so that a storage space for storing electronic components is opened on the surface thereof, and a cover body welded to the outer periphery of the opening so as to cover the opening of the case. The lid is processed from the lid, for example by stamping.

According to this electronic component package, even if the degassing treatment is performed before soldering to the case of the lid, the lid is less likely to warp, and at the time of soldering, the heat generated in the substrate layer or the heat applied to the substrate layer is thermoelectrically transferred. The cover body and the case can be welded by suppressing thermal stress applied to the case while quickly transferring the brazing material to the brazing filler metal layer via the intermediate metal layer having excellent conductivity, and rapidly melting the brazing filler metal. For this reason, it is excellent in the solderability of a cover body, the damage of a case and a joining failure can be prevented, and the outstanding airtightness can be obtained.

As described above, according to the lid member of the present invention, since the intermediate metal layer is formed of a predetermined Cu-Ni alloy and Cu-Ag alloy, the degassing treatment is performed before the lid member made of the lid member is soldered to the outer peripheral part of the case. Even if it carries out, curvature hardly arises in a cover body. In addition, since the alloy has excellent thermal conductivity, it is possible to quickly transfer heat generated or applied to the base material layer to the brazing filler metal layer through the intermediate metal layer at the time of soldering the lid, and thus it is difficult to cause warping of the lid. In addition, the lid can be easily and reliably soldered to the outer periphery of the opening of the case. In addition, since the alloy has a proof strength of 100 N / mm ² or less, even when the lid is thermally expanded with respect to the case during soldering of the lid, the intermediate metal layer is plastically deformed to alleviate the thermal stress generated in the wall of the casing. And furthermore, damage to the wall portion can be prevented. For this reason, the package for electronic components excellent in airtightness can be obtained. Moreover, according to the manufacturing method of the cover material of this invention, the said cover material can be manufactured easily.

1 is a partial cross-sectional schematic diagram showing a basic structure of a lid member according to an embodiment of the present invention.

2 is a schematic cross-sectional view showing the basic structure of an electronic component package according to an embodiment of the present invention.

<Code description>

1: cover material 2: base material layer

3: intermediate metal layer 4: brazing material layer

5: nickel base metal layer 21: cover body

31: case 32: case body

First, the basic structure of the lid | cover material concerning embodiment of this invention is demonstrated with reference to FIG. The lid 1 has a nickel base metal layer 5 on one surface (upper surface in the illustrated example) of the base material layer 2 and an intermediate metal layer 3 on the other surface (lower surface in the illustrated example). Each is press-bonded and diffusion-bonded, and the solder material layer 4 is press-bonded and diffusion-bonded to the surface of the intermediate metal layer 3.

The base material layer 2 is formed of a low thermal expansion metal having a yield strength of pure iron (pure Fe) or higher (200 N / mm ² ) or higher and smaller than iron. It is preferable that the low thermal expansion metal has a thermal expansion coefficient in 4.0-5.5x10 <^-6> / degreeC in 30-300 ^degreeC . As such a low thermal expansion metal, Fe-Ni alloy containing 36-50% of nickel (Ni), such as Fe-42% Ni alloy, 20-30% of Ni, such as Kovar (brand name), Fe-Ni-Co alloys containing 1 to 20% cobalt (Co) are suitable.

The nickel base metal layer 5 improves the corrosion resistance of the outer surface of the lid 1, and is formed of a nickel alloy containing Ni as a main component such as pure nickel or a Cu-Ni alloy containing 50 wt% or more of Ni. do. The nickel base metal is also good in pressure bonding with the base layer 2 and diffusion bonding. However, this nickel base metal layer 5 may be formed as needed, and it is not necessarily required.

The intermediate metal layer 3 is formed of a Cu—Ag alloy containing 0.5 to 6.0% of Ni, Cu—Ni alloy composed of residual Cu and impurities, or 0.05 to 10% Ag, and containing residual Cu and impurities. It is. If the amount of Ni is less than 0.5% and the amount of Ag is less than 0.05%, the amounts of Ni and Ag are too small, and the material is excessively softened by heating during the degassing treatment. For this reason, thermal expansion of the intermediate metal layer 3 is restrained by the base material layer 2, and plastic deformation of compression arises, and the curvature after cooling cannot fully be suppressed. On the other hand, when the amount of Ni exceeds 6.0%, the strength of the alloy improves and is preferable for warping prevention, but the thermal conductivity deteriorates, making it difficult to melt the brazing filler metal layer by local heating to the base layer, resulting in poor bonding. It may occur. For this reason, when using Cu-Ni alloy, the minimum of Ni amount is made into 0.5%, Preferably it is 1.5%, and the upper limit is made into 6.0%, Preferably it is 5.5%. Moreover, when Ag amount exceeds 10%, since Ag is an expensive material, material cost becomes high too much and it impairs economics. For this reason, when using Cu-Ag alloy, the minimum of Ag amount is 0.05%, Preferably it is 0.15%, The upper limit is 10%, Preferably it is 5.0%, More preferably, it is 2.0%. In the Cu-Ni alloy and the Cu-Ag alloy, the balance is typically formed of Cu and impurities, but a small addition of an element such as Zr or Sn is allowed as long as it does not impair the characteristics of the alloy. In addition, the thermal stress reduction effect of the case wall portion during soldering of the intermediate metal layer 3 depends on the strength (0.2% yield strength) of the metal material (annealed material) forming the same layer, and is preferably 110 N / mm ² or less. Advantageously, but known not more than 100N / mm ^2, wherein both the Cu-Ni alloy and Cu-Ag alloy, the strength of the small dunjae is 45N / mm ² as above, 100N / mm ² or less, as well as the resistance to bending Excellent thermal stress relief.

The brazing filler metal layer 4 is formed of a silver lead alloy containing silver (Ag) as a main component. It is preferable to make content of Ag which is a main component into 70 to 90%. It is preferable that melting | fusing point of the said silver lead alloy is about 700-900 degreeC. As a specific silver lead alloy, Ag-Cu alloys, such as 85% Ag-Cu alloy (melting point 780 degreeC), Ag-Cu-Zn alloy and Ag-Cu-Ni alloy whose melting | fusing point exists in the said melting | fusing point range are mentioned. Since the package for an electronic component is soldered to a substrate at a temperature of about 400 ° C. or lower, it is necessary that the brazing filler metal layer, once welded, does not soften or deteriorate at that temperature. It is preferable because it satisfies the same temperature conditions and also has good strength and corrosion resistance.

On the other hand, silver lead alloys tend to easily form voids at their interfaces during diffusion bonding between the intermediate metal layer and the brazing filler metal layer, as will be described later. In addition, when the melting point is high, and the lid body processed from the lid member 1 is welded to the outer periphery of the case, it is necessary to heat the solder joint of the lid body to a high temperature, and the thermal deformation of the substrate layer 2 is performed. There is a problem that thermal stress is generated in the case, but this problem is solved by interposing the intermediate metal layer 3 between the base material layer 2 and the brazing filler metal layer 4.

Although the average thickness of each said layer depends also on the magnitude | size of the opening part of a case, the base material layer 2 will be about 30-200 micrometers, Preferably it becomes about 50-100 micrometers. The intermediate metal layer 3 is about 10 to 200 µm, preferably about 10 µm or more, less than about 100 µm, and more preferably about 15 to 60 µm. When the intermediate metal layer is less than about 10 μm, the effect of reducing thermal stress is insufficient. On the other hand, when the intermediate metal layer is more than about 200 μm, the layer thickness is too thick, so that the thermal deformation of the intermediate metal layer itself cannot be ignored. Done. And, during soldering, the intermediate metal layer with respect to the thickness (tb) of the base layer 2 (b) so that the amount of plastic deformation of the intermediate metal layer 3 can be sufficiently secured against the thermal stress generated by the expansion of the base layer 2 ( It is preferable to make ratio tm / tb of thickness (tm) of 3) into about 0.25-0.6. The brazing filler metal layer 4 may have a thickness of about 5 to 50 µm, and the nickel base metal layer 5 may have a thickness of about 3 to 50 µm. From the standpoint of low magnification of the package for an electronic component, the total thickness of the lid member is about 50 to 150 m, and in this case, the total thickness of the base layer and the intermediate metal layer is preferably about 35 to 135 m.

Next, the manufacturing method of the said cover material is demonstrated.

The cover material 1 is manufactured by the following process. The nickel base metal sheet which is a raw material of the nickel base metal layer 5 is superposed on one surface of the base sheet which is a raw material of the base material layer 2, and the copper alloy sheet which is a raw material of the intermediate metal layer 3 is superimposed on the other surface. This superimposed polymer is passed through a pair of rolls to reduce the reduction ratio to about 70 to 80%, thereby pressing each sheet simultaneously and pressing the intermediate metal layer in which the nickel base metal layer and the intermediate metal layer are pressed on both sides of the base layer. Obtain a laminate. The intermediate metal layer laminate can be subjected to intermediate annealing at a temperature of about 950 to 1050 ° C, if necessary. By this intermediate annealing, the adjacent layers can be diffusion bonded to each other to improve the bonding strength and to soften each layer. When the nickel base metal layer 5 is not formed in the cover material 1, the nickel base metal sheet is of course unnecessary. The process of preparing the said intermediate metal layer laminated body as mentioned above is called a preparation process.

Next, the brazing filler metal sheet, which is a raw material of the brazing filler metal layer 4, is superposed on the surface of the intermediate metal layer of the intermediate metal layer laminate. The superimposed polymer is passed through a pair of rolls to be pressed down to obtain a brazing filler metal layer in which a brazing filler metal layer is pressed onto the surface of the intermediate metal layer. This process is called a pressure welding process.

The brazing filler metal bonding body is subjected to diffusion annealing to obtain a cover material 1 of which both layers are diffusion bonded without interposing an empty space between the intermediate metal layer and the brazing filler metal layer. This process is called a diffusion bonding process. The lid member 1 may be further subjected to finish rolling as needed, and the plate thickness thereof may be adjusted. The layer thickness of each layer after finishing rolling reduces thickness to (1-R) times the original layer thickness, when the rolling reduction rate is set to R.

In order to join both layers so that an empty space does not arise between the said intermediate metal layer and a brazing filler metal layer, in the said press welding process, the reduction ratio for obtaining the brazing filler metal layer contact body is about 50 to 80%, and In the diffusion annealing step, the diffusion annealing temperature may be about 380 to 590 ° C. The diffusion annealing time is preferably 2 minutes or more, more preferably 3 minutes or more. Although the upper limit of annealing time is not specifically determined, considering productivity, it is good to set it as 10 minutes or less, Preferably it is 5 minutes or less.

Next, an embodiment of an electronic component package will be described with reference to FIG. 2. The lid 21 used for sealing the case 31 of this package is stamped into a predetermined dimension using the lid 1 as a press. In FIG. 1, the parts constituting the lid 21 are the same as those of the lid member 1, and therefore, the same reference numerals are given, and description thereof is omitted.

The package includes a case 31 in which a storage space (concave portion) 33 for storing the electronic component P is opened from the upper surface, and a lid body welded by soldering to the outer peripheral portion of the opening of the case 31. (21) is hitting. The case 31 is provided with an insulating case body 32 having the insulating space 33 opened from an upper surface thereof and formed of ceramic such as aluminum oxide or silicon nitride, and the outer periphery of the case body 32. The adhesion promotion layer 37 which promotes welding with a brazing filler metal is integrally formed in the. The adhesion promotion layer 37 has a metallization layer 34 made of a high melting point metal such as tungsten (W) or molybdenum (Mo) that is fired integrally with the case body 32. The nickel layer 35 and the gold layer 36 are further formed as needed on it.

In order to weld the lid 21 to the outer periphery of the case 31, the brazing filler metal layer 4 contacts the outer periphery of the case 31 on the case 31 so as to close the opening of the case 31. The lid 21 is placed so that the brazing filler metal layer 4 is melted in a vacuum or an inert gas, and the lid 21 is welded to the outer periphery of the opening of the case 31. The melting of the brazing filler metal layer 4 is preferably performed by local heating using seam welding, electron beam welding, or the like. The seam welding is energized while driving a pair of electrode rollers along the ends of two opposite sides of the lid 21, and is mainly localized near the contact portion of the roller of the base material layer 2. Joule heat is generated, and this is conducted to the brazing filler metal layer 4 through the intermediate metal layer 3, the brazing filler metal layer 4 is melted, and the lid 21 is made of the case body 31 by the molten brazing filler metal. ) Is a method of soldering. And since the melting point of the silver lead alloy which forms the said brazing filler metal layer 4 is comparatively high temperature, the whole case 31 and the cover body 21 which accommodated the electronic component P are heated in a furnace, and a brazing filler metal layer Melting (4) may deteriorate the characteristics of the electronic component P housed in the case 31. For this reason, such a heating method should be avoided.

EMBODIMENT OF THE INVENTION Hereinafter, although this invention is demonstrated further more concretely based on an Example, this invention is not interpreted limitedly by the said embodiment or the following example.

Example

The sample of the cover material of the four-layered structure shown in FIG. 1 was produced with the following method. A base sheet composed of Fe-29% Ni-17% Co alloy (trade name: Kovar) having a width of 20 mm and a thickness of 2.5 mm as the material of the base material layer 2, and a width of 20 mm as the material of the nickel base metal layer 5, The nickel sheet made of pure Ni having a thickness of 0.23 mm was used as the raw material of the intermediate metal layer 3, and the pure copper (oxygen-free copper) or copper alloy (hereinafter, both of which was shown in Table 1 having a width of 20 mm and a thickness of 1.36 mm was simply referred to as “ Copper sheet), a nickel sheet is superposed on one surface of the base sheet, and a copper sheet is superimposed on the other surface, and cold-rolled to 60% reduction rate. As a result, a three-layer pressure welding body having a thickness of 1 mm in which adjacent materials were pressed together was obtained. And about this press contact body, the diffusion annealing which hold | maintains for about 1 to 3 minutes at 800-1000 degreeC was performed, and the three-layer laminated body was obtained.

A brazing filler metal sheet made of 85% Ag-15% Cu (melting point 780 ° C) having a width of 20 mm and a thickness of 0.13 mm is superimposed on the copper cladding layer of the three-layer laminate, and has a reduction ratio of 60% or more. Cold rolling was carried out to obtain a four-layer press body in which a brazing filler metal layer was press-contacted to the copper cladding layer of the three-layer laminate. The 4-layer press body was subjected to diffusion annealing held at 500 to 600 ° C. for about 3 minutes. After finishing rolling, a lid member composed of a four-layer laminate having a thickness of 85 µm was obtained.

From each cover member thus produced, a specimen having a width of 10 mm and a length of 50 mm was taken, flattened on a surface plate, and heated at a maximum heating temperature (300 ° C.) for 30 minutes under degassing conditions. After the cooling, the test piece bent in an arch was placed again on the surface plate, and the maximum height (amount of warpage) of the warpage from the surface surface was measured by a non-contact laser displacement gauge. The results are shown in Table 1.

Further, a copper sheet of the same component as that of the copper sheet forming the intermediate metal layer of each intervening plate was prepared, and a copper sheet was pressed and annealed under the same manufacturing conditions as the cover material, and a test piece specified in JISZ2201 was taken therefrom. The tensile test was conducted by the method specified in the above, and the yield strength (stress when causing 0.2% permanent extension) of the intermediate metal layer of the cover member was measured. The results are shown together in Table 1.

Then, a copper sheet having a thickness of 1 mm, which is the same component as the copper material forming the intermediate metal layer of each cover material, was prepared, a test piece having a diameter of 10 mm was taken out, and thermal conductivity was measured by a laser flash method. The measuring instrument used is TC-7000 which is a product of Alvac Corporation (ULVAC-RIKO, Inc.). The results are shown together in Table 1. In addition, if the brazing filler material is to be uniformly wetted and spread over the intermediate metal layer, a thermal conductivity of 100 W / m · K or more is practically required.

[Table 1]

From Table 1, in the case of the cover material in which the intermediate metal layer was formed of pure copper, the warpage amount was very large (12 mm), but in the case of copper alloy, the warpage amount was considerably reduced in the sample having Ni content of 0.5% or more and Ag content of 0.05% or more. As the amount of alloying elements increased, the amount of warpage decreased. However, when Ni amount is 12%, the yield strength exceeds 110 N / mm ² , which is unsuitable for the relaxation of thermal stress. However, when Ni exceeds 6.0%, thermal conductivity will be less than 100 W / m * K, and solderability will deteriorate. Sample No. of the Invention Example In 2-4, 7, and 8, the amount of warpage is greatly reduced, the strength of the intermediate metal layer is also less than 100 N / mm ² , and the thermal conductivity is also practical, and has suitable properties as a cover material.

Claims (12)

delete A lid member for a cover body of an electronic component package, which is welded to an outer peripheral portion of a case formed so that a storage space for storing an electronic component is opened on a surface thereof. A base layer formed of a low thermal expansion metal, an intermediate metal layer laminated on one surface of the base layer and formed of a Cu-Ag alloy containing 0.05 to 10 mass% of Ag, and a silver lead alloy laminated on the intermediate metal layer Cover material having a brazing filler metal layer. 3. The method of claim 2, A cover material having an average thickness of the intermediate metal layer of 10 μm or more and 200 μm or less. The method according to claim 2 or 3, A lid member in which a nickel-based metal layer formed of pure nickel or a nickel alloy is bonded to the other surface of the base layer. delete A method of manufacturing a lid member for a cover body of an electronic component package welded to an outer periphery of a case formed so that a storage space for storing an electronic component is opened on the surface thereof. A preparation step of preparing an intermediate metal layer laminate in which an intermediate metal layer formed of a Cu-Ag alloy containing 0.05 to 10 mass% of Ag is laminated on one surface of a base layer formed of a low thermal expansion metal; A pressure welding step of pressing the brazing filler metal layer formed by the silver lead alloy to the intermediate metal layer of the intermediate metal layer laminate to obtain a brazing filler metal bonding body; And a diffusion annealing step of diffusing annealing to the brazing filler metal layer to produce a cover member in which the intermediate metal layer and the brazing filler material layer are diffusion bonded to each other. The manufacturing method of Claim 6 WHEREIN: The manufacturing method which makes the average thickness of the intermediate metal layer of the said brazing filler metal layer welding body 10 micrometers or more and 200 micrometers or less. The manufacturing method of Claim 6 or 7 WHEREIN: The manufacturing method of laminating | stacking the nickel base metal layer formed of the nickel base metal which consists of pure nickel or nickel alloy on the other surface of the base material layer of an intermediate metal layer laminated body. A lid for an electronic component package, which is welded to an outer peripheral portion of a case formed so that a storage space for storing electronic components is opened on a surface thereof. The cover body of the package for electronic components processed from the cover material of Claim 2 or 3 to the size which covers the opening part of the said case. And a cover body formed so as to open at the surface of the storage space for storing electronic components, and a cover body welded to the outer periphery of the opening so as to cover the opening of the case. The cover body described in claim 2 or 3. Package for electronic parts processed from cover material. A lid for an electronic component package, which is welded to an outer peripheral portion of a case formed so that a storage space for storing electronic components is opened on a surface thereof. The cover body of the package for electronic components processed from the cover material of Claim 4 to the size which covers the opening part of the said case. A case formed with a storage space for storing electronic components on the surface thereof, and a cover body welded to the outer periphery of the opening so as to cover the opening of the case, wherein the cover body is processed from the cover material according to claim 4. For electronic components.

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