KR101208611B1 - Adhesive composition containing epoxy terminated poly(alkylphenylene oxide)s and adhesion lead lock tape for semiconductor package using the same - Google Patents

Abstract

PURPOSE: An adhesive composition is provided to improve compatibility with an epoxy resin, to increase the glass transition temperature(Tg) of the composition after hardening, and to able to decrease a dielectric constant and dielectric loss by introducing a polyphenylene oxide resin with low dielectric constant and dielectric loss. CONSTITUTION: An adhesive composition comprises 100.0 parts by weight of a polyalkylphenylene oxide resin which has an epoxy-terminated group indicated in chemical formula 1, 50-150 parts by weight of an epoxy resin, 20-250 parts by weight of a hardener, 20-300 parts by weight of a modifier which consists of a thermoplastic resin, and 0.1-10 parts by weight of a hardening accelerator. In chemical formula 1, R1 and R2 is hydrogen or a C1-C3 alkyl group and can be the same or different to each other, m is 4-80, and n is 4-80.

Description

Adhesive composition containing a polyalkylphenylene oxide resin having an epoxy end group, a lead lock tape for a semiconductor package using the same, and a method for manufacturing the same THE SAME}

The present invention relates to an adhesive composition containing a polyalkylphenylene oxide resin having an epoxy end group, a lead lock tape for a semiconductor package using the same, and a manufacturing method thereof, and more particularly, to an adhesive composition containing an epoxy resin as a main component. In order to effectively introduce a polyphenylene oxide resin having low dielectric constant and low dielectric loss ratio property into the compound, by containing it in the form of a bifunctional polyalkylphenylene oxide epoxy resin having epoxy groups at both ends of the polyalkylphenylene oxide main chain, The present invention relates to a lead lock tape for a semiconductor package using the same and a method for manufacturing the same.

Epoxy resin is the most commonly used thermosetting resin because of its efficiency, low cost, and ease of use. Especially, it is widely applied as an insulating adhesive material in the form of composition because it is excellent in heat resistance, mechanical rigidity and insulation, and can be cured even when mixed with various compounds. have.

Thus, epoxy resins have been used as adhesives, coatings, underfills and encapsulating agents for decades, and in particular in the electronics industry, epoxy resins have been used as key materials in the field of micro packages.

Due to its properties, such an epoxy resin easily penetrates and fills an empty space such as a complicated pattern of a micropackage structure before curing, and after being completely cured, a high thermal, Mechanical reliability is provided to the package structure.

Recently, according to the trend of the semiconductor package field, the circuit density is increased due to the high performance and light and small size of electronic products, and the signal transmission speed and the device operating temperature are increasing.

In order to meet such a change, the semiconductor package field requires a higher insulation reliability than the past with respect to the conventional adhesive.

However, in general, adhesives based on epoxy resins contain a large amount of thermoplastic resins with low glass transition temperature, and thus, the glass transition temperature of the adhesive is low, and further, the cured adhesive layer has a high dielectric constant, so that sufficient thermal and electrical reliability requirements are required. There is a problem in that an electrical short is generated because the circuit is not satisfied.

, Vp: 신호 전달 속도, C: 광속, Dk: 유전상수) 신호 전달 손실은 유전상수의 제곱근과 유전손실률에 비례한다(식2:

, L: 신호전달 손실, f: 주파수, Df: 유전손실률). 따라서 전자 회로의 신호 전달 손실을 줄이면서 신호 전달 속도를 높이기 위해서는 저유전상수, 저유전손실률의 물질이 유리하다. 이러한 저유전상수 및 저유전손실률 특성을 충족하는 수지로서, 폴리페닐렌옥사이드(Poly(phenylene oxide), PPO)가 공지되어 있는데, 상기 폴리페닐렌옥사이드 수지는 저유전상수 및 저유전손실률 뿐만 아니라, 기계적 물성, 내습성 및 내열성이 뛰어난 것으로 알려져 있다. In general, the signal propagation rate is inversely proportional to the square root of the dielectric constant (Eq. 1:

, Vp: signal propagation rate, C: luminous flux, Dk: dielectric constant) The signal transmission loss is proportional to the square root of the dielectric constant and the dielectric loss rate (Equation 2:

, L: signal loss, f: frequency, Df: dielectric loss rate). Therefore, in order to reduce the signal transmission loss of the electronic circuit and to increase the signal transmission speed, materials having low dielectric constant and low dielectric loss rate are advantageous. As a resin that satisfies such low dielectric constant and low dielectric loss characteristics, polyphenylene oxide (Poly) is known, and the polyphenylene oxide resin has a low dielectric constant and a low dielectric loss as well as mechanical properties. It is known to be excellent in moisture resistance and heat resistance.

Accordingly, in order to solve the problem of the adhesive based on the conventional epoxy resin, the polyphenylene oxide resin having the low dielectric constant and low dielectric loss ratio is mixed with the conventional adhesive composition to be provided as it is, thereby providing a polyphenylene oxide structure in the epoxy network. It has been proposed to introduce.

However, when the polyphenylene oxide resin is mixed with the epoxy adhesive composition, the dielectric constant of the cured adhesive composition is lowered and the glass transition temperature is increased, but the compatibility between the polyphenylene oxide resin and the epoxy resin can be seen. This shortage causes a problem that the domains rich in polyphenylene oxide resin and the domains rich in cured epoxy resin are clearly separated even by the naked eye after curing.

Furthermore, since the polyphenylene oxide resin is a thermoplastic resin that does not participate in the epoxy curing reaction, when mixed in an appropriate amount or more, the crosslinking density of the entire adhesive composition is lowered after thermal curing, thereby lowering heat resistance and severely decreasing mechanical strength. . Therefore, when the polyphenylene oxide resin itself is mixed with the epoxy adhesive composition, the amount of the polyphenylene oxide resin itself is limited as a modifier level to provide tacky property at room temperature and serve as a coating binder.

Accordingly, the present inventors have endeavored to obtain an adhesive composition having excellent insulation reliability. As a result, in the adhesive composition containing a common epoxy resin as a main component, poly (phenylene oxide) having low dielectric constant and low dielectric loss rate characteristics, PPO) resin is effectively introduced to improve the compatibility with the epoxy resin as the main component in the adhesive composition, increase the polyphenylene oxide content, increase the glass transition temperature and lower the dielectric constant of the adhesive composition after curing, so that it is stable at high temperatures. The present invention was completed by providing an adhesive tape for a semiconductor package exhibiting adhesive strength.

An object of the present invention is to provide an adhesive composition containing a polyalkylphenylene oxide resin having an epoxy end group in an adhesive composition containing an epoxy resin as a main component.

Another object of the present invention is to provide a lead lock tape for a semiconductor package using the adhesive composition.

Another object of the present invention is to provide a method for producing a lead lock tape for a semiconductor package.

In order to achieve the above object, the present invention (a) with respect to 100 parts by weight of a polyalkylphenylene oxide resin having an epoxy end group represented by the formula (1),

(b) 50 to 150 parts by weight of an epoxy resin,

(c) 20 to 250 parts by weight of a curing agent,

(d) 20 to 300 parts by weight of a modifier made of thermoplastic resin, and

(e) An adhesive composition containing 0.1 to 10 parts by weight of a curing accelerator is provided.

(In the above, R ₁ and R ₂ are hydrogen or a C ₁ to C ₃ alkyl group, may or may not be the same, m is 4 to 80, n is 4 to 80.)

In the adhesive composition of the present invention, the equivalent ratio of the curing agent to the total epoxy resin component is preferably 0.7 to 1.3.

More specifically, as the polyalkylphenylene oxide resin having an epoxy end group represented by the formula (1), a compound represented by the following formula (2) is preferable.

(In the above, m is 4 to 80 and n is 4 to 80.)

In the adhesive composition of the present invention, the epoxy resin of component (b) is an aromatic epoxy resin, and the curing accelerator of component (e) preferably uses hexamethylmethoxymelamine.

Moreover, this invention provides the lead lock tape for semiconductor packages which consists of an adhesive bond layer formed from the said adhesive composition on a polyimide film.

Furthermore, the present invention is applied to the polyimide film in the form of varnish of the adhesive composition prepared by dissolving the adhesive composition in an organic solvent, and heated and aged to remove volatiles in the varnish of the adhesive composition to form an adhesive layer Provided is a method of manufacturing a lead lock tape for a semiconductor package.

At this time, the organic solvent is a ketone; Acetic acid esters; And aromatic hydrocarbons; used alone or in combination of two or more thereof.

In the above production method, in order to more effectively remove the volatile components, it is preferable to heat at 200 ℃ or less for 1 to 5 minutes.

In addition, after the heating step, in order to remove the residual solvent and obtain the desired physical properties, a process of low temperature aging for 7 days or less at a temperature of 70 ℃ or less is carried out.

The present invention efficiently introduces a polyphenylene oxide resin having a low dielectric constant and a low dielectric loss ratio property into an adhesive composition containing an epoxy resin as a main component to improve compatibility with the epoxy resin, It is possible to provide an adhesive composition that can increase the glass transition temperature (Tg) and lower the dielectric constant and dielectric loss rate.

At this time, by introducing into the adhesive composition containing the epoxy resin as a main component in the form of a bifunctional polyalkylphenylene oxide resin having epoxy groups at both ends of the polyalkylphenylene oxide main chain, rather than being introduced as the polyphenylene oxide resin itself. The compatibility with the epoxy resin is improved to improve the crosslinking density of the adhesive layer after curing. In addition, since the polyphenylene oxide content in the adhesive composition can be increased, the low dielectric constant and low dielectric loss rate characteristics provided from the polyphenylene oxide are provided in the adhesive composition.

Thus, the present invention can provide an adhesive tape for a semiconductor package by applying the adhesive composition, since the adhesive layer having a low dielectric constant, low dielectric loss rate and high glass transition temperature before and after curing is formed, electrical reliability between circuits And heat resistance reliability will rise dramatically.

The present invention (a) with respect to 100 parts by weight of a polyalkylphenylene oxide resin having an epoxy end group represented by the formula (1),

(b) 50 to 150 parts by weight of an epoxy resin,

(c) 20 to 250 parts by weight of a curing agent,

(d) 20 to 300 parts by weight of a modifier made of thermoplastic resin, and

(e) An adhesive composition containing 0.1 to 10 parts by weight of a curing accelerator is provided.

Formula 1

(In the above, R ₁ and R ₂ are hydrogen or a C ₁ to C ₃ alkyl group, may or may not be the same, m is 4 to 80, n is 4 to 80.)

Hereinafter, the components of the adhesive composition of the present invention will be described in detail.

The adhesive composition of the present invention, as component (a), comprises bifunctional polyalkylphenylene oxide resins (EPPO) having epoxy functional groups at both ends of the polyalkylphenylene oxide main chain. It is characterized by containing.

Component (a) in the adhesive composition of the present invention is represented by the following general formula (1), and is a bifunctional polyalkylphenylene oxide resin provided with epoxy functional groups at both ends of the polyalkylphenylene oxide main chain.

Formula 1

(In the above, R ₁ and R ₂ are hydrogen or a C ₁ to C ₃ alkyl group, may or may not be the same, m is 4 to 80, n is 4 to 80.)

More preferably, it is bifunctional polyalkylphenylene oxide resin by which the alkyl group is substituted by the hydrogen position of the phenyl group of a principal chain, as represented by following General formula (2). In this case, when an alkyl group is substituted for hydrogen in the phenyl group of the main chain, it is advantageous to increase the glass transition temperature and improve the mechanical strength.

(2)

(In the above, m, n are as defined in formula (1).)

Component (a) in the adhesive composition can be obtained by reacting a diol of polyalkylphenylene oxide with Epichlorohydrin under a polar solvent, as shown in Scheme 1.

Scheme 1

(In the above, m, n are as defined in formula (1).)

Accordingly, the bifunctional polyalkylphenylene oxide resin in which epoxy functional groups are imparted to both ends of the polyalkylphenylene oxide main chain of component (a) in the adhesive composition of the present invention acts as a thermoplastic modifier before curing, thereby tacky to the adhesive. property) and adhesiveness, and when heat is applied, it also participates in hardening reaction with an epoxy resin, and improves the crosslinking density of an adhesive bond layer after hardening.

Therefore, the adhesive composition containing the epoxy resin as a main component is introduced in the form of a bifunctional polyalkylphenylene oxide resin having an epoxy group at both ends of the polyalkylphenylene oxide main chain, rather than the introduction of the polyphenylene oxide resin itself. This improves the compatibility with the epoxy resin and improves the crosslinking density of the adhesive layer after curing, so that the content of polyphenylene oxide can be increased without concern for crosslinking density.

That is, since the polyalkylphenylene oxide content in the adhesive composition of the present invention can be increased, the low dielectric constant and low dielectric loss rate characteristics provided from the polyalkylphenylene oxide are provided in the adhesive composition.

In addition, it is possible to reduce the amount of the modifier made of a thermoplastic resin having a low glass transition temperature, such as a rubber (rubber) conventionally mixed in the adhesive composition, it is possible to increase the glass transition temperature of the entire adhesive composition.

In the adhesive composition of the present invention, the epoxy resin used as component (b) is not particularly limited, but is preferably a molecule having an aliphatic, alicyclic, or aromatic cyclic or linear main chain having a molecular weight of 200 or more, and in two molecules in one molecule. A divalent or higher epoxy resin having at least two glycidyl groups is used.

Examples of preferred epoxy resins include bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol AD type epoxy resins, bisphenol S type epoxys, alicyclic epoxy resins, alicyclic chain epoxy resins, and phenol novolac epoxy resins having a molecular weight of 300 or more. Epoxy resin having a glycidyl group in a single main chain such as cresol novolac epoxy resin, naphthalene epoxy resin, florene epoxy resin, imide epoxy resin, epihalohydrin modified epoxy resin, acrylic modified epoxy resin, vinyl It can select from the epoxy resin obtained by making resin of a different physical property or rubber react with the main chain, such as a modified epoxy resin, an elastomer modified epoxy resin, an amine modified epoxy resin, etc.

In order to ensure the glass transition temperature and mechanical strength after hardening of the epoxy resin of this invention, it is preferable that equivalent is 470 or less, It is more preferable that it is 300 or less.

Accordingly, as the epoxy resin used in the present invention, an aromatic epoxy resin having an aromatic ring skeleton in the molecule is preferable in view of physical properties after curing. Therefore, the epoxy resin of component (b) has 2 or more epoxy groups in 1 molecule, and the aromatic epoxy resin whose equivalent is 470 or less is preferable.

In the present invention, the adhesive composition contains, as component (c), a curing agent, more preferably an epoxy curing agent that can be used if curing reaction between the epoxy functional groups of component (a) and component (b) is possible.

As the epoxy curing agent of the present invention, anhydride and amine curing agents may be used. Of these, the unhydride-based curing agent is preferably capable of increasing the curing reaction rate by the action of the curing accelerator as component (e) of the adhesive composition of the present invention. Because the speed is slow, it is necessary to adjust the curing temperature and speed by adding a curing accelerator.

An unhydride curing agent is preferably a long pot life, and a preferred example is methylhexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, benzenetetra It can be selected from carboxylic anhydride (1,2,4,5-Benzenetetracarboxylic anhydride), benzophenone tetracarboxylic dianhydride, phthalic anhydride and the like.

In addition, the amine-based curing agent is meta phenylene diamine, dimethyl aniline (4,4'-dimethyl aniline) diamino diphenyl sulfone (diamino diphenyl sulfone), diamino diphenyl methane (4,4'- diaminodiphenyl methan) and the like can be used.

In the adhesive composition of this invention, content of the hardening | curing agent of component (c) is 20-250 weight part with respect to 100 weight part of components (a).

In addition, it is preferable that the equivalence ratio of the hardening | curing agent with respect to the total epoxy resin component is 0.7-1.3.

At this time, when the content of the curing agent of the component (c) is out of the above range, the unreacted product of the epoxy resin or the curing agent is left in the entire adhesive composition, so that the crosslinking density is low, or other side reactions other than the intended curing reaction and decomposition reaction in the adhesive composition. This is likely to happen.

Component (d) of the adhesive composition according to the invention is a modifier made of a thermoplastic resin.

The component (d) improves the brittle properties of the epoxy curing system to increase fracture toughness and to mitigate internal stress.

Thermoplastic resins used as modifiers capable of performing these functions include polyester polyols, acrylic rubber epoxy resin diluted acrylic rubbers, core shell rubbers, carboxy-terminated butadiene nitrile rubbers (carboxy). terminated butadiene nitrile (CTBN), acrylonitrile-butadiene-styrene, polymethyl siloxane, phenoxy resin, etc. Can be.

More preferably, when used as an adhesive tape for a semiconductor package, since its attachment site requires flexibility, it is to use a thermoplastic resin that provides flexibility such as polyester polyol, carboxy-terminated butadiene nitrile rubber, and the like.

In addition, when a strong heat resistance property is required before decomposition, a resin having a relatively high glass transition temperature and good compatibility with epoxy, such as a phenoxy resin, may be used.

The core shell rubber particles are rubber particles in which the particles have a core layer and a shell layer. For example, the outer shell layer is a glassy polymer, and the inner core layer is a rubbery polymer. The two-layer structure or outer shell layer constituted is a glass-like polymer, the intermediate layer is a rubber-like polymer, and the core layer is a three-layer structure composed of a glass-like polymer.

At this time, the glassy polymer is a polymer of methyl methacrylate (methyl methacrylate), and the rubbery polymer is composed of a butyl acrylate polymer.

The thermoplastic resin serving as a modifier of component (d) in the adhesive composition of the present invention contains 20 to 300 parts by weight based on 100 parts by weight of component (a). At this time, if the content of the modifier is less than 20 parts by weight, it is difficult to achieve the purpose of increasing the fracture toughness and relieve internal stress, and if the content of the modifier exceeds 300 parts by weight, the content of the curable component in the adhesive composition is excessively reduced so that the mechanical reliability and electrical properties after curing There is a high possibility of deterioration in reliability.

Component (e) in the adhesive composition of the present invention contains a curing accelerator for enhancing the reactivity of the curing agent component and the epoxy resin.

The adhesive composition of the present invention is used for the purpose of shortening the time required for the curing process when the adhesive tape for a semiconductor package is attached to a printed circuit board or an electronic component assembly.

The curing accelerator which can be used in the present invention is to inhibit the curing promoting action at a temperature of 100 ℃ or less, to accelerate the curing reaction at a temperature of 100 ℃ or more to improve the crosslinking density without adversely affecting the pot life of the adhesive.

Accordingly, preferred curing accelerators include organic phosphine compounds such as triphenylphosphine, imidazole compounds such as 2-ethyl-4-methylimidazole, and tertiary amines. (tertiary amine) may be used. More preferably, hexamethylmethoxymelamine is used.

The hardening accelerator of component (e) of this invention contains 0.1-10 weight part with respect to 100 weight part of component (a). At this time, if the content of the curing accelerator is less than 0.1 parts by weight, it is difficult to expect the effect of promoting the curing reaction, if it exceeds 10 parts by weight, the curing reaction occurs at a rapid rate during the manufacturing process to produce an adhesive layer harder than necessary In addition, it is difficult to obtain the tackyness necessary for the temporary welding and adversely affects the stability over time.

In addition to the above components, the adhesive composition of the present invention may add a diluent, a surfactant, an adhesion imparting agent, an inorganic filler, a flame retardant, an ion trapping agent, or the like as an additive. At this time, with respect to 100 parts by weight of component (a) in the present adhesive composition, the additive is contained within 0.001 to 1 part by weight.

In addition, surfactants can be used to impart proper coating performance to the base film, and with respect to component (a), the surfactant is added within the range of 0.001 to 1 part by weight. At this time, a preferred example of the surfactant is an organic acrylic polymer (polymeric acryl polymer), a high molecular siloxane such as polyol (polyol), or a fluorine-based compound such as FC-430 of 3M.

The present invention can produce a variety of types of adhesive tape for a semiconductor package using the adhesive composition.

Accordingly, the present invention provides a lead lock tape for fixing a lead frame during wire bonding, among adhesive tapes for a semiconductor package that can be manufactured with the adhesive composition.

More specifically, the present invention provides a lead lock tape for a semiconductor package composed of an adhesive layer formed from the adhesive composition on a base film.

As the base film used for the lead lock tape of the present invention, it is preferable to use a polyimide film in consideration of electrical insulation and physical rigidity, and in this case, the thickness of the polyimide film is preferably 10 to 150 μm. .

The adhesive composition of the present invention is composed of the composition as described above, may have a high glass transition temperature [ Table 1 ] and low dielectric constant [ Table 2 ] after curing the adhesive composition. In addition, due to the characteristics of the composition component, compatibility with the epoxy resin as a main component is improved, and heat resistance due to improvement in crosslinking density after curing is provided.

Thus, the lead lock tape of the present invention, as a result of measuring the adhesion between the copper foil-lead lock tape, as well as room temperature, it shows a stable adhesion at a high temperature of 230 ℃ [ Table 3 ].

Furthermore, the lead lock tape of the present invention may further laminate a protective film on the back surface on which the adhesive layer is formed.

At this time, the protective film is a polyolefin such as polyethylene, polyvinyl chloride, polypropylene; Polyethylene terephthalate, or other polyester or release paper.

The thickness of the protective film is preferably 10 to 150㎛, the protective film can be satisfactorily treated by the peeling process in addition to the mud process and the embossing process.

In the present invention, the varnish of the adhesive composition of the present invention is applied onto a base film to form an adhesive layer, and when dried, a lead lock tape on a B-stage can be produced.

That is, the present invention is applied to a polyimide film in the form of a varnish of the adhesive composition prepared by dissolving the adhesive composition in an organic solvent, and heated and aged to remove volatiles in the varnish of the adhesive composition to form an adhesive layer Provided is a method of manufacturing a lead lock tape for a semiconductor package.

At this time, in the process of obtaining the varnish of the adhesive composition, an organic solvent may be used so that a blend of various components is easily obtained. Preferably, ketones such as acetone, methyl ethyl ketone, and cyclohexanone, ethyl acetate, butyl acetate, and cellosolve One or two or more of conventional solvents containing acetic acid esters such as acetate, propylene glycol mono methyl ether acetate and aromatic hydrocarbons such as toluene and xylene can be used in combination.

The content of solids in the varnish of the adhesive composition is preferably contained in 20 to 40% by weight.

In addition, after applying the varnish of the adhesive composition on the polyamide film, by heating and aging drying, it is possible to remove the volatile components such as water generated by the organic solvent and moisture absorption, etc. to form an adhesive layer.

At this time, in the above production method, in order to more effectively remove the volatile components, it is preferable to heat for 1 to 5 minutes at 200 ℃ or less.

In addition, the aging in the above is a low-temperature aging drying for a period of 7 days or less at 70 ° C or less, more preferably 60 ° C or less, it is possible to obtain the residual solvent removal and the desired physical properties through the low temperature aging.

Hereinafter, the present invention will be described in more detail with reference to Examples. This is for further illustrating the present invention, and the scope of the present invention is not limited to these examples.

Example 1 Preparation of Adhesive Composition

Component (a) 100 parts by weight of a dicyclopentadiene epoxy (XD-1000, Nippon kayaku) as a component (b) epoxy resin with respect to 100 parts by weight of a polyalkylphenylene oxide resin represented by the following formula (2), component ( c) 40 parts by weight of diaminodiphenyl methan as a curing agent, 100 parts by weight of nitrile butadiene rubber as a modifier consisting of component (d) thermoplastic resin, component (e An adhesive composition consisting of 6 parts by weight of hexamethylmethoxymelamine as a curing accelerator and 0.1 parts by weight of surfactant (FC4430, 3M) as an additive additive was prepared.

(2)

At this time, the weight average molecular weight of the resin was 5,400, the glass transition temperature (Tg) was 172 ℃.

Example 2 Manufacture of Lead Lock Tape for Semiconductor Package

Using the solvent methyl ethyl ketone was prepared a varnish of the adhesive composition prepared in Example 1, wherein the solid content was adjusted to 28% by weight. The varnish of the adhesive composition was applied on a 50 μm thick polyimide base film and left for 10 minutes at a temperature of 50 ° C. After drying for 3 minutes at a temperature of 170 ° C, a lead lock tape for a semiconductor package was finally formed in which an adhesive layer having a thickness of 20 μm was formed on a base film of polyimide.

Comparative Example 1 Preparation of Adhesive Composition

An adhesive composition having the same composition as in Example 1 was prepared except that component (a) of Example 1 was omitted.

Specifically, 150 parts by weight of dicyclopentadiene epoxy (XD-1000, Nippon kayaku) as the component (b) epoxy resin, and diaminodiphenyl methan (4,4-diaminodiphenyl methan) as the component (c) curing agent 70 parts by weight of component (d) a thermoplastic resin, a modifier of nitrile butadiene rubber 200 parts by weight, component (e) a curing accelerator, 6 parts by weight of hexamethylmethoxymelamine and component (f) As an additional additive, an adhesive composition consisting of 0.1 parts by weight of surfactant (FC4430, 3M) was prepared.

Comparative Example 2 Fabrication of Lead Lock Tape for Semiconductor Package

Except for using the adhesive composition prepared in Comparative Example 1, the lead-lock tape for a semiconductor package was formed in the same manner as in Example 2 to form an adhesive layer of 20㎛ thickness on a polyimide base film of 50㎛ thickness Prepared.

Experimental Example 1 Measurement of Glass Transition Temperature of Adhesive Composition

With respect to the adhesive composition prepared in Example 1 and Comparative Example 1, the glass transition temperature was measured using a differential scanning calorimeter. At this time, the temperature increase rate was set to 10 ℃ per minute, the results are shown in Table 1 below.

From the results of Table 1, but the same composition, but the adhesive composition of Example 1 further contains a compound represented by the formula (2) in the epoxy resin was confirmed that the glass transition temperature of the adhesive composition after curing increased by more than 60% .

Experimental Example 2 Dielectric Constant Measurement of Adhesive Composition

Dielectric constant of the adhesive composition prepared in Example 1 and Comparative Example 1 was measured at room temperature, 5MHz frequency, the results are shown in Table 2 below.

<Experiment 3> Check the adhesive strength after high temperature treatment

On the copper foil having a thickness of 36 μm, the lead lock tapes for the semiconductor packages prepared in Example 2 and Comparative Example 2 were pasted, and the adhesive layer was disposed on the lead lock tape so as to face the copper foil surface, and then at 130 ° C. Compressed by applying a pressure of 1.5 MPa for 0.3 seconds.

The adhesive force between the lead lock tape and the copper foil attached under the crimping conditions was measured at room temperature (25 ° C.). Subsequently, the copper foil-leadlock tape assembly was heated in a convection oven attached to a peel strength meter at a high temperature (230 ° C.) at a rate of 10 ° C./min, and then adhesive strength was measured. The results are shown in Table 3 below.

From the results of Table 3, the adhesion of the lead lock tape of Example 2 using the adhesive composition of Example 1 having a relatively high glass transition temperature and low dielectric constant, the adhesion between the copper foil and the lead lock tape at room temperature In addition to excellent, especially in the high temperature conditions of 230 ℃, the degree of adhesion improvement is further increased, it was confirmed a stable adhesion between the copper foil-leadlock tape at a high temperature.

As described above,

The present invention provides an adhesive composition containing a bifunctional polyalkylphenylene oxide resin having epoxy groups at both ends of a polyalkylphenylene oxide main chain in an adhesive composition containing an epoxy resin as a main component.

The adhesive composition contains a polyalkylphenylene oxide resin having an epoxy end group, thereby improving the compatibility between the polyphenylene oxide resin and the epoxy resin and participating in the curing reaction, compared to the introduction of the polyphenylene oxide resin itself. After the high crosslinking density is achieved.

Moreover, since this invention can increase and contain content of a polyphenylene oxide without fear of a crosslinking density, the lead lock tape for semiconductor packages using the said adhesive composition was provided.

Since the lead lock tape is formed with an adhesive layer having a low dielectric constant, a low dielectric loss rate, and a high glass transition temperature before and after curing, the electrical reliability and the heat resistance reliability between circuits are greatly increased.

While the invention has been shown and described with reference to certain exemplary embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (9)

(a) 100 parts by weight of a polyalkylphenylene oxide resin having an epoxy end group represented by the following formula (1),
(b) 50 to 150 parts by weight of an epoxy resin,
(c) 20 to 250 parts by weight of a curing agent,
(d) 20 to 300 parts by weight of a modifier made of thermoplastic resin, and
(e) an adhesive composition containing 0.1 to 10 parts by weight of a curing accelerator:
Formula 1

In the above, R ₁ and R ₂ are hydrogen or a C ₁ to C ₃ alkyl group, may or may not be the same, m is 4 to 80, n is 4 to 80. The adhesive composition of claim 1, wherein the polyalkylphenylene oxide resin having an epoxy end group represented by Chemical Formula 1 is a compound represented by the following Chemical Formula 2:
Formula 2

In the above, m is 4 to 80, n is 4 to 80. The said adhesive composition of Claim 1 whose said epoxy resin is an aromatic epoxy resin. The adhesive composition according to claim 1, wherein the curing accelerator is hexamethylmethoxymelamine. On polyimide film,
The lead lock tape for semiconductor packages which consists of an adhesive bond layer formed from the adhesive composition of Claim 1. The adhesive composition of claim 1 is applied onto a polyimide film in the form of a varnish of the adhesive composition prepared by dissolving in an organic solvent,
Method of manufacturing a lead lock tape for a semiconductor package characterized in that the heating and aging to remove the volatile components in the varnish of the adhesive composition to form an adhesive layer. The method of claim 6, wherein the organic solvent is a ketone comprising acetone, methyl ethyl ketone and cyclohexanone; Acetic acid esters including ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol and mono methyl ether acetate; And aromatic hydrocarbons containing toluene and xylene; or a mixture of two or more kinds selected from the group consisting of toluene and xylene. The method of claim 6, wherein the heating is performed at 200 ° C. or lower for 1 to 5 minutes. The method of claim 6, wherein the low temperature aging drying process is performed at a temperature of 70 ° C. or lower after the heating process for a period of 7 days or less.