KR101195746B1 - Radiation fin of heatsink for LED illuminator - Google Patents

Radiation fin of heatsink for LED illuminator Download PDF

Info

Publication number
KR101195746B1
KR101195746B1 KR1020120040274A KR20120040274A KR101195746B1 KR 101195746 B1 KR101195746 B1 KR 101195746B1 KR 1020120040274 A KR1020120040274 A KR 1020120040274A KR 20120040274 A KR20120040274 A KR 20120040274A KR 101195746 B1 KR101195746 B1 KR 101195746B1
Authority
KR
South Korea
Prior art keywords
heat
convection
air
guide piece
fin
Prior art date
Application number
KR1020120040274A
Other languages
Korean (ko)
Inventor
홍성천
Original Assignee
주식회사 파인테크닉스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 파인테크닉스 filed Critical 주식회사 파인테크닉스
Priority to KR1020120040274A priority Critical patent/KR101195746B1/en
Application granted granted Critical
Publication of KR101195746B1 publication Critical patent/KR101195746B1/en

Links

Images

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/75Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/60Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00Point-like light sources

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

PURPOSE: A heat radiation fin for a heat sink of an LED lighting device is provided to have more excellent heat radiation effects by allowing air to convect to the inside of the heat radiation fin. CONSTITUTION: A plurality of convection holes(11) passes through both sides contacted to external air. A guide piece(12) is formed on the convection hole. The guide piece forms a cutting line on one side or both sides of a heat radiation fin(10). A convection enhancement part(20) is alternately protruded from both sides of the guide piece. A warm current generating part(30) generates warm current.

Description

엘이디 조명장치의 히트씽크용 방열핀{Radiation fin of heatsink for LED illuminator}Radiation fin of heatsink for LED illuminator

본 발명은 LED 조명장치의 히트씽크용 방열핀에 관한 것이다.The present invention relates to a heat sink fin for the heat sink of the LED lighting device.

상세하게 본 발명은, LED 조명장치의 LED에서 발생된 열을 히트씽크에서 전달되어 외부로 방출시킬 때, 히트씽크를 구성하는 방열핀의 사이로 외부의 공기가 방열핀의 내측으로 대류될 수 있도록 하여 보다 우수한 방열효율을 얻을 수 있도록 한 LED 조명장치의 히트씽크용 방열핀에 관한 것이다.
In detail, the present invention, when the heat generated from the LED of the LED lighting device is transferred from the heat sink to the outside, the outside air between the heat sink fin constituting the heat sink can be convection to the inside of the heat sink fin more excellent The present invention relates to a heat sink fin for a heat sink of an LED lighting device to obtain a heat radiation efficiency.

LED 조명장치는 형광등이나 할로겐램프 등을 채용한 조명장치가 갖는 많은 전려소모, 낮은 전기적 응답특성, 친환경적이지 못한 여러 문제점을 해결하고자 출시되는 것으로, PCB에 실장되는 LED의 배치 및 하우징과 투과커버 등의 형태에 따라 형광등형, 평판형, 램프형 등의 구성이 다양하게 제안되고 있다.The LED lighting device is released to solve many problems of lighting devices employing fluorescent lamps or halogen lamps, low electrical response characteristics, and various problems that are not environmentally friendly. Various configurations of fluorescent lamps, flat panels, lamps, and the like have been proposed in accordance with the shape of.

특히, 상기와 같은 LED 조명장치는 LED의 소자 특성상 빛을 방출함과 동시에 LED에서 상당한 열이 발생되어 LED 구동회로에 악영향을 끼치게 된다. 이에따라, 상기 LED 조명장치는 주로 LED가 실장된 기판에 히트씽크를 장착하여 LED에서 발생된 열을 외부로 방열시키게 된다.
In particular, the LED lighting device as described above emits light due to the device characteristics of the LED, and at the same time generates considerable heat from the LED, which adversely affects the LED driving circuit. Accordingly, the LED lighting device mainly heats a heat sink on a substrate on which the LED is mounted to radiate heat generated from the LED to the outside.

대한민국 특허출원 제2011-48010호(명칭: 매입 등기구용 방열장치, 이하 선행발명)에는 LED 조명장치에 적용되어 방열효율을 극대화시킴과 아울러 유지보수가 용이한 매입 등기구용 방열장치(히트씽크)의 구성이 제시된다.Republic of Korea Patent Application No. 2011-48010 (name: heat sink for embedded luminaires, hereinafter referred to as the invention) is applied to the LED lighting device to maximize the heat dissipation efficiency and easy maintenance of the heat sink (heat sink) The configuration is presented.

상기 선행발명의 히트씽크는 「매입형 등기구에 설치되어 LED램프에서 발생되는 열기를 방열시키는 방열방치로서, 중앙에 고정부가 마련되게 방사상으로 다수의 슬릿부가 형성된 방열패널; 상기 방열패널의 슬릿부에 끼움되어 LED램프에서 발생되는 열기를 방열시키는 방열핀; 및 상기 방열핀들의 상부를 감싸도록 설치되며 다수의 통기공을 갖는 덮개부로 이루어지되, 상기 방열핀은 상기 고정부 걸림되도록 턱부가 형성되고, 하부에는 상기 슬릿부에 끼움된 후 절첩되어 상기 방열패널의 저면과 면 접촉되도록 지지날개가 형성」되어 구성된다.The heat sink of the present invention is a heat dissipation device for dissipating heat generated from an LED lamp by being installed in a buried luminaire, the heat dissipation panel having a plurality of slit portions radially formed to have a fixed portion in the center; A heat dissipation fin inserted into the slit portion of the heat dissipation panel to dissipate heat generated from the LED lamp; And a cover part installed to cover the upper part of the heat dissipation fins and having a plurality of vent holes, wherein the heat dissipation fins are formed at the jaws so that the fixing part is caught, and the lower part of the heat dissipation panel is folded after being fitted to the slit part. And a support wing is formed so as to be in contact with the surface ”.

보다 구체적으로, 상기 히트씽크는 방열핀이 금속판으로 적용되고, 이와 같은 방열핀이 방열패널에 방사상 다수개 원형 배열되어 구성된 것으로, LED에서 발생된 열이 전도되면 외부 공기와 열교환을 수행하여 방열을 수행하게 된다.
More specifically, the heat sink is a heat dissipation fin is applied to the metal plate, the heat dissipation fin is composed of a plurality of radially arranged on the heat dissipation panel, when the heat generated from the LED conducts heat dissipation by conducting heat exchange with the outside air do.

상기와 같은 선행발명의 방열핀은 단순한 금속 플레이트의 형태로 형성되기 때문에 LED에서 발생된 열은 방열핀의 전체면적을 거쳐 외측 끝단부에서 열교환이 수행된다. 이는 상기 LED에서 발생된 열이 방열핀의 전체면적을 거쳐 외측 끝단부로 전달되는 상당한 시간에 의해 단위시간 당 열이 방출되는 량이 제한적이며, 이로인해 LED를 장시간 구동시킬 경우 방열효율이 상당히 낮은 문제점이 노출된다.
Since the heat dissipation fin of the prior invention as described above is formed in the form of a simple metal plate, heat generated in the LED is heat exchanged at the outer end portion through the entire area of the heat dissipation fin. This is because the amount of heat emitted per unit time is limited by the considerable time that the heat generated from the LED is transferred to the outer end portion through the entire area of the heat sink fins, and thus the heat dissipation efficiency is considerably low when the LED is driven for a long time. do.

본 발명은 상기 문제점을 해결하기 위해 발명한 것이다.The present invention has been invented to solve the above problems.

이에 본 발명은, LED 조명장치의 LED에서 발생된 열을 히트씽크에서 전달되어 외부로 방출시킬 때, 히트씽크를 구성하는 방열핀의 사이로 외부의 공기가 방열핀의 내측으로 대류될 수 있도록 하여 보다 우수한 방열효율을 얻을 수 있도록 한 히트씽크용 방열핀을 제공함에 그 목적이 있다.
Accordingly, the present invention, when the heat generated from the LED of the LED lighting device is transferred from the heat sink to the outside, the outside air can be convexed to the inside of the heat sink fin between the heat sink fins constituting the heat sink. The purpose is to provide a heat sink fin for heat sinking to achieve thermal efficiency.

상기 목적을 달성하기 위해 본 발명은 아래의 구성을 갖는다.In order to achieve the above object, the present invention has the following configuration.

본 발명은, LED 조명장치에 설치되어 LED에서 발생된 열을 전달받아 외부의 공기와 열교환함에 의해 상기 열을 방열시키는 히트씽크용 방열핀에 있어서, 외부의 공기와 접촉되는 양면을 관통하여 다수의 대류공이 형성되고, 상기 공기가 통과되는 각도를 안내하며 공기가 최대한 많은 면적구간을 접촉하며 통과되도록 하기 위해 대류공의 일측에는 가이드편이 형성된다.The present invention, in the heat sink fins for heat dissipation is installed in the LED lighting device to receive heat generated by the LED to heat the heat by heat exchange with the outside air, a plurality of convection through both sides in contact with the outside air A ball is formed, and a guide piece is formed at one side of the convective hole to guide the angle through which the air passes and to allow the air to pass through the area section as much as possible.

여기서, 상기 대류공은 통과되는 공기의 유속이 빨라지도록 하기 위해 길이방향을 갖는 슬릿형태로 형성된다.Here, the convection hole is formed in a slit shape having a longitudinal direction in order to increase the flow rate of the air passing through.

또한, 상기 가이드편은 방열핀의 일면 또는 양면에 절개선을 형성하고, 절개선의 일측을 프레싱하여 방열핀의 면에서 돌출형성되도록 구성된다.In addition, the guide piece is formed to form an incision line on one side or both sides of the heat radiation fin, and pressing one side of the incision line is configured to protrude from the surface of the heat radiation fin.

이때, 상기 가이드편은 어느 일측 또는 양측으로 교번되어 돌출되도록 형성된다. 이와 다르게, 상기 가이드편은 다수개 중 일부가 어느 일측으로 돌출형성되고, 나머지 일부가 양측으로 교번되어 돌출형성될 수 있다.
At this time, the guide piece is formed to alternately protrude to one side or both sides. Alternatively, some of the plurality of guide pieces may protrude to one side, and some of the guide pieces may alternately protrude to both sides.

이상에서와 같이 본 발명은, 방열핀에 공기가 통과되며 대류될 수 있도록 한 다수의 대류공을 형성함에 의해 방열핀의 내측으로 외부의 공기가 통과되며 단위시간당 방열량을 증가시켜 보다 우수한 방열효율을 얻을 수 있는 효과가 있다.As described above, the present invention, by forming a plurality of convection holes to allow air to pass through the heat dissipation fins, the outside air is passed to the inside of the heat dissipation fins to increase the heat dissipation per unit time to obtain more excellent heat dissipation efficiency It has an effect.

특히, 본 발명은 공기가 통과되기 위한 대류공의 다양한 형태를 제시하여 방열핀을 통과하는 공기의 유속이 빠르게 진행될 수 있도록 하므로써 더욱 우수한 방열효율을 얻을 수 있는 효과가 있다.
In particular, the present invention has the effect of obtaining a more excellent heat dissipation efficiency by presenting various forms of convection holes for the air to pass through so that the flow rate of air passing through the heat dissipation fin can proceed quickly.

도 1은 본 발명에 의한 방열핀 사시도.
도 2는 본 발명에 의한 방열핀 정면도.
도 3은 도 2의 A-A선 단면도.
도 4는 도 2의 B-B선 단면도.
1 is a perspective view of the heat radiation fin according to the present invention.
Figure 2 is a front view of the heat radiation fins according to the present invention.
3 is a sectional view taken along the line AA in Fig.
4 is a sectional view taken along line BB of Fig.

상기와 같은 본 발명의 실시예를 첨부된 도면을 참조하여 상세히 설명한다.Embodiments of the present invention as described above will be described in detail with reference to the accompanying drawings.

도 1은 본 발명에 의한 방열핀 사시도, 도 2는 본 발명에 의한 방열핀 정면도, 도 3은 도 2의 A-A선 단면도, 도 4는 도 2의 B-B선 단면도이다.1 is a perspective view of the heat radiation fin according to the present invention, Figure 2 is a front view of the heat radiation fin according to the present invention, Figure 3 is a cross-sectional view taken along the line A-A of Figure 2, Figure 4 is a cross-sectional view taken along the line B-B of FIG.

도면을 참조하면, 본 발명에 의한 방열핀(10)이 적용되는 히트씽크는 주로 LED 조명장치에 적용되며, 보다 구체적으로 상기 LED 조명장치의 LED가 실장된 PCB와 결합되어 LED에서 발생된 열을 전달받아 외부의 공기와 열교환함에 의해 방열기능을 수행하게 된다.
Referring to the drawings, the heat sink to which the heat dissipation fin 10 according to the present invention is applied is mainly applied to an LED lighting device, and more specifically, is coupled to a PCB mounted with the LED of the LED lighting device to transfer heat generated from the LED. The heat dissipation function is performed by heat exchange with the outside air.

상기 방열핀(10)은 외부의 공기와 접촉되는 양면을 관통하여 다수의 대류공(11)이 형성된다. 이때, 상기 방열핀(10)의 대류공(11)은 방열핀(10) 주변의 가열된 공기가 외부의 차가운 공기와 열교환을 위해 대류될 때, 열교환 공기가 통과되기 위한 공간이 얇고 길게 형성된 슬릿형태로 형성되어 대류공(11)을 통과하는 공기의 유속이 빨라지도록 구성된다.The heat dissipation fins 10 are formed through a plurality of convection holes 11 penetrating both sides in contact with the outside air. At this time, the convection hole 11 of the heat dissipation fin 10 has a slit shape formed with a thin and long space for passing heat exchange air when the heated air around the heat dissipation fin 10 is convexed for heat exchange with cold air outside. It is formed so that the flow rate of air passing through the convection hole 11 is faster.

또한, 상기 방열핀(10)의 대류공(11) 일측에는 공기가 통과되는 각도를 안내하며 공기가 최대한 많은 면적구간을 접촉하며 통과되도록 하기 위해 가이드편(12)이 형성된다. 이때, 상기 가이드편(12)은 방열핀(10)의 일면 또는 양면에 절개선(13)을 형성하고, 절개선(13)의 일측을 프레싱하여 방열핀(10)의 면에서 돌출형성되도록 구성된다. 즉, 상기 방열핀(10)과 가이드편(12)은 일체의 구성임을 의미한다.
In addition, a guide piece 12 is formed at one side of the convection hole 11 of the heat dissipation fin 10 to guide an angle through which air passes and to allow air to pass through as many area sections as possible. At this time, the guide piece 12 is formed to form an incision line 13 on one surface or both sides of the heat radiation fin 10, by pressing one side of the incision line 13 is configured to protrude from the surface of the heat radiation fin (10). That is, the heat dissipation fin 10 and the guide piece 12 means an integral structure.

특히, 상기 가이드편(12)은 방열핀(10) 상에서 어느 일측 또는 양측으로 교번되어 돌출되도록 형성되거나, 다수개의 가이드편(12) 중 일부가 어느 일측으로 돌출형성되고, 나머지 일부가 양측으로 교번되어 돌출형성되도록 구성될 수 있다.In particular, the guide piece 12 is formed to protrude alternately to any one side or both sides on the heat dissipation fin 10, or some of the plurality of guide pieces 12 protrude to any one side, and the remaining part is alternately both sides It may be configured to protrude.

이와 관련하여, 도 3에서 예시된 가이드편(12)은 방열핀(10) 상에서 일측으로 돌출된 형태를 나타내는 것으로, 원내 도면의 화살표와 같이 대류공(11)을 통과한 열교환공기는 가이드편(12)에 안내되어 각 방열핀(10)의 사이(전술된 바와 같이 방사상 배치된 방열핀의 사이)에서 난류를 형성함으로 인해 외부 공기와의 대류가 보다 신속하게 수행된다.In this regard, the guide piece 12 illustrated in FIG. 3 shows a shape protruding to one side on the heat dissipation fin 10, and the heat exchange air passing through the convection hole 11 as shown by the arrow in the drawing is the guide piece 12. ) And convection with the outside air is performed more quickly by forming turbulence between each of the heat sink fins 10 (between the heat sink fins disposed radially as described above).

또한, 도 4에서 예시된 가이드편(12)은 방열핀(10)의 양측면으로 교번되어 돌출된 형태를 나타내는 것으로, 원내 도면의 화살표와 같이 대류공(11)을 통과한 열교환공기가 각 방열핀(10)의 사이에서 적재되지 않고 대류공(11)을 통해 연속적으로 대류된다.
In addition, the guide pieces 12 illustrated in FIG. 4 are alternately protruded on both sides of the heat dissipation fins 10, and protrude, and the heat exchange air passing through the convection holes 11 as shown by the arrow in the drawing of each heat dissipation fin 10. Convection is continuously carried out through the convection hole 11 without being loaded between the holes.

상기와 같이 구성된 히트씽크용 방열핀은 바람직한 실시상태로 도면에서와 같이 열이 전도되는 PCB와 근접된 구간에는 열교환공기가 보다 활발하게 대류되도록 하기 위한 구성으로 가이드편(12)이 양측으로 교번되어 돌출되도록 한 구성을 형성하여 대류촉진부(20)로 구성한다.The heat sink fins configured as described above are configured to allow the heat exchange air to be more convectively in the section adjacent to the PCB to which heat is conducted, as shown in the drawing. The convection accelerator 20 is formed by forming a constitution.

그리고, 상기 대류촉진부(20)에 의해 활발하게 대류되는 열교환공기를 외부의 공기와 신속하게 교환시키기 위해 대류촉진부(20)에서 외측으로 형성된 구간에는 방열핀(10)의 일측으로 가이드편(12)이 돌출되도록 하여 난류를 발생시키는 난류발생부(30)로 구성하게 된다.
In addition, the guide piece 12 is formed at one side of the heat dissipation fin 10 in a section formed outwardly from the convection accelerator 20 in order to quickly exchange heat exchange air actively convection by the convection accelerator 20 with outside air. ) Is configured to be a turbulence generating unit 30 to generate a turbulent flow.

10: 방열핀 11: 대류공
12: 가이드편 20: 대류촉진부
30: 난류발생부
10: heat sink fin 11: convection hole
12: Guide Pr. 20: Convection Accelerator
30: turbulence generating unit

Claims (5)

LED 조명장치에 설치되어 LED에서 발생된 열을 전달받아 외부의 공기와 열교환하기 위해 외부의 공기와 접촉되는 양면을 관통하여 다수의 대류공(11)이 형성되고, 상기 공기가 통과되는 각도를 안내하며 공기가 최대한 많은 면적구간을 접촉하며 통과되도록 하기 위해 대류공(11)의 일측에는 가이드편(12)이 형성되고, 상기 가이드편(12)은 방열핀(10)의 일면 또는 양면에 절개선(13)을 형성하고, 절개선(13)의 일측을 프레싱하여 방열핀(10)의 면에서 돌출형성되도록 구성되는 히트씽크용 방열핀에 있어서,
상기 대류공(11)은 공기의 유속이 빨라지도록 하기 위하여 길이 방향을 갖는 슬릿 형태로 형성되어, 열이 전도되는 PCB와 근접된 구간에는 열교환공기가 보다 활발하게 대류하도록 하기 위하여 가이드편(12)이 양측으로 교번되어 돌출되도록 형성된 대류촉진부(20)와;
상기 대류촉진부에 의해 활발하게 대류되는 열교환공기를 외부의 공기와 신속하게 교환시키기 위해 상기 대류촉진부에서 외측으로 형성된 구간에는 방열핀의 일측으로 가이드편(12)이 돌출되도록 하여 난류를 발생시키는 난류발생부(30)가; 형성된 것을 특징으로 하는 LED 조명장치의 히트씽크용 방열핀.
Installed in the LED lighting device receives a plurality of convection holes 11 through both sides in contact with the outside air to receive heat generated from the LED to exchange heat with the outside air is formed, and guides the angle through which the air passes And guide piece 12 is formed on one side of the convection hole (11) in order to allow the air to pass through the area section as much as possible, the guide piece 12 is a cut line on one side or both sides of the heat radiation fin (10) In the heat sink fins for heat sinks 13, which is formed to protrude from the surface of the heat radiation fins 10 by pressing one side of the incision line 13,
The convection hole 11 is formed in the form of a slit having a longitudinal direction in order to increase the flow rate of the air, the guide piece 12 in order to more convection heat exchange air more actively in the section adjacent to the heat conducting PCB A convection accelerator 20 formed to alternately protrude to both sides;
In order to quickly exchange heat exchanged air actively convection by the convection accelerator, the convex portion is formed outward from the convection accelerator so that the guide piece 12 protrudes to one side of the heat dissipation fin to generate turbulence. A generator 30; Heat sink fin for heat sink of the LED lighting device, characterized in that formed.
삭제delete 삭제delete 삭제delete 삭제delete
KR1020120040274A 2012-04-18 2012-04-18 Radiation fin of heatsink for LED illuminator KR101195746B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020120040274A KR101195746B1 (en) 2012-04-18 2012-04-18 Radiation fin of heatsink for LED illuminator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020120040274A KR101195746B1 (en) 2012-04-18 2012-04-18 Radiation fin of heatsink for LED illuminator

Publications (1)

Publication Number Publication Date
KR101195746B1 true KR101195746B1 (en) 2012-11-01

Family

ID=47563682

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120040274A KR101195746B1 (en) 2012-04-18 2012-04-18 Radiation fin of heatsink for LED illuminator

Country Status (1)

Country Link
KR (1) KR101195746B1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101418073B1 (en) * 2012-12-14 2014-08-05 주식회사 포스코티엠씨 Radiation fin having O-ring groove and hole and, LED illumination lamp having the same
KR102377666B1 (en) * 2021-11-12 2022-03-25 주식회사 한승 Down light type illumination system

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007027056A (en) 2005-07-21 2007-02-01 Sony Corp Backlight unit and liquid crystal display device
JP2009042362A (en) 2007-08-07 2009-02-26 Hitachi Displays Ltd Liquid crystal display

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007027056A (en) 2005-07-21 2007-02-01 Sony Corp Backlight unit and liquid crystal display device
JP2009042362A (en) 2007-08-07 2009-02-26 Hitachi Displays Ltd Liquid crystal display

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101418073B1 (en) * 2012-12-14 2014-08-05 주식회사 포스코티엠씨 Radiation fin having O-ring groove and hole and, LED illumination lamp having the same
KR102377666B1 (en) * 2021-11-12 2022-03-25 주식회사 한승 Down light type illumination system

Similar Documents

Publication Publication Date Title
JP5304198B2 (en) lighting equipment
JP2009238734A (en) Illumination lamp
JP5567730B2 (en) Optical semiconductor lighting device
KR20090000151U (en) Radiator for led lighting equipment
RU2511564C1 (en) Led lamp (versions)
KR101652161B1 (en) Lighting apparatus
KR101796209B1 (en) The radiant heat structure for a LED lamp
JP2012064562A5 (en)
KR101195746B1 (en) Radiation fin of heatsink for LED illuminator
JP3171218U (en) Heat dissipation structure for LED lighting fixtures
KR200456082Y1 (en) LED lamp apparatus
KR101641539B1 (en) Air cooling lamp
JP2010129530A (en) Lighting system
KR101792545B1 (en) Heat sink device of light emitting diode lamp
KR200475330Y1 (en) Heat sink for LED fluorescent apparatus
KR101392962B1 (en) Led lighting module pcb with cooling fin type heat pumping panel
JP2016225064A (en) Radiator and luminaire
JP2018113229A (en) Luminaire
KR20100099520A (en) Illuminator
KR101714440B1 (en) Lighting apparatus
CN105605445B (en) LEDbulb lamp
KR20130006717U (en) radiating device of LED light
KR101435857B1 (en) Lighting apparatus
KR20140067392A (en) Led illumination device
JP6026297B2 (en) lighting equipment

Legal Events

Date Code Title Description
A201 Request for examination
A302 Request for accelerated examination
E902 Notification of reason for refusal
AMND Amendment
E601 Decision to refuse application
AMND Amendment
AMND Amendment
X701 Decision to grant (after re-examination)
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20151002

Year of fee payment: 4

FPAY Annual fee payment

Payment date: 20161013

Year of fee payment: 5

FPAY Annual fee payment

Payment date: 20171018

Year of fee payment: 6

FPAY Annual fee payment

Payment date: 20181002

Year of fee payment: 7

FPAY Annual fee payment

Payment date: 20191008

Year of fee payment: 8