KR101186651B1 - Cap of Light emitting diode and Light emitting diode - Google Patents

Abstract

A substrate on which at least one light emitting diode chip is mounted; A resin layer covering at least a portion of the light emitting diode chip; A phosphor layer formed on the light emitting diode chip; A cap formed on the resin layer and the light emitting diode chip; And a diffusion layer for diffusing the light emitted from the light emitting diode chip.

Description

Cap and light emitting diode for light emitting diodes

The present invention relates to a cap for a light emitting diode and a light emitting diode, and more particularly, to uniformly distribute a diffusion agent on a plurality of light emitting diode chips to diffuse and mix the light emitted from the light emitting diode to realize a uniform color light The present invention relates to a light emitting diode having excellent color reproducibility.

A light emitting diode (LED) refers to a device that makes a small number of carriers (electrons or holes) injected by using a pn junction structure of a semiconductor and emits a predetermined light by recombination thereof, and red using GaAsP or the like. Green light emitting diodes using light emitting diodes, GaP and the like, and blue light emitting diodes using InGaN / AlGaN double hetero structure.

The light emitting diode has a low power consumption, a long service life, can be installed in a narrow space, and provides a strong vibration resistance characteristic. Such light emitting devices are used as display devices and backlights, and active research is being conducted to apply them to general lighting applications. Recently, white light emitting diodes are being released in addition to single color components such as red, blue, or green light emitting diodes. As white light emitting diodes are applied to automotive and lighting products, the demand is expected to increase rapidly.

White light emitting diode technology can be divided into two ways. First, red, green, and blue light emitting diode chips are installed adjacent to each other, and the light emission of each device is mixed to realize white color.

The second method is to place a phosphor on the LED chip so that a part of the first emission of the LED chip and the secondary emission wavelength-converted by the phosphor are mixed to realize white color. For example, a white phosphor is attached onto a light emitting diode chip that emits blue light, and a part of the light is emitted as yellow green or yellow light as an excitation source to obtain white color by blue light emission of the light emitting diode chip and yellow green or yellow light emission of the phosphor.

1 is a cross-sectional view illustrating a light emitting diode using a red, green, and blue light emitting diode chip for white light emission as described above.

Referring to the drawings, the light emitting diode includes a substrate 4 having electrodes 5 formed thereon, red, green, and blue light emitting diode chips 1, 2, and 3 mounted on the substrate 4, and the light emitting diode chip. The molding part 6 which seals (1, 2, 3) is included. The red, green, and blue LED chips 1, 2, and 3 are mounted on the first electrode 5 and are electrically connected to a second electrode (not shown) through the wire 7. Thus, when current is applied to all of the light emitting diode chips 1, 2, and 3, white due to a combination of red, green, and blue can be realized.

However, in general, such white light emitting diodes are difficult to achieve perfect white light because the optimum conditions for mixing tricolor light are difficult to be achieved depending on the position of the light emitting diode chip in the form of a package. Because of this, it's hard to get clean colors on a small package. In addition, since each LED chip has different thermal or temporal characteristics, there is a disadvantage in that uniform color mixture is not realized, such as color tone change and color staining, depending on the use environment. The color mixture of the light emitted from each light emitting diode chip is not uniform, which causes a problem in reproducibility of color, and there is a problem in that the color of the light emitted is different for each viewing angle of the light emitting diode.

The present invention is to solve the above problems, by uniformly dispersing the diffusion agent on a plurality of light emitting diode chip, the light emitting diode that can implement a uniform color by diffusing and mixing the light emitted from the light emitting diode chip It aims to provide.

Another object of the present invention is to provide a light emitting diode capable of improving color reproducibility.

In order to achieve the above object, the present invention provides a light emitting diode comprising at least one light emitting diode chip and a molding portion encapsulating the light emitting diode chip, the diffusion agent is distributed on the light emitting diode chip. The light emitting diode of the present invention may be characterized in that the mixture of the diffusion agent and the resin is doped to a predetermined thickness so as to surround the top and side surfaces of each light emitting diode chip, or the diffusion agent is uniformly distributed in the molding part. . The diffusion agent may be at least one of barium titanate, titanium oxide, aluminum oxide, or silicon dioxide. The light emitting diode chip may include three light emitting diode chips emitting red, green, and blue light.

The present invention provides a light emitting diode cap, wherein the light emitting diode cap encapsulating the light emitting diode chip comprises a diffusing agent. The diffusion agent may be formed integrally with the cap. It may also include a layer of a diffusion agent on the inner side or outer side of the cap. The cap is a silicone resin, polyester resin, acrylic resin, epoxy resin, urethane resin, nylon resin, polyamide resin, polyimide resin, vinyl chloride resin, polycarbonate resin, polyethylene resin, Teflon resin, polystyrene resin, polypropylene resin It may be formed of at least one resin or glass selected from polyolefin resin, the diffusion agent may be at least one of barium titanate, titanium oxide, aluminum oxide or silicon dioxide.

The present invention provides a light emitting diode comprising at least one light emitting diode chip and the cap for the light emitting diode described above. The light emitting diode chip may include three light emitting diode chips emitting red, green, and blue light.

Hereinafter, with reference to the accompanying drawings will be described an embodiment of the present invention in more detail. It will be apparent to those skilled in the art that the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, It is provided to let you know. Wherein like reference numerals refer to like elements throughout.

The light emitting diode according to the present invention uniformly distributes the diffusion agent on a plurality of light emitting diode chips emitting light of different wavelengths, so as to diffuse the light emitted from each light emitting diode chip and to facilitate mixing. Thus, uniform color emission of the light emitting diode can be obtained, the color of light emitted for each viewing angle can be made constant, and color reproducibility can be improved. The technical gist of the present invention can be applied to various structures as can be seen in various embodiments described below.

In general, the light emitting diode according to the present invention may be formed by including a diffusion agent in a molding part encapsulating the light emitting diode chip to protect the light emitting diode chip. For example, a dopant may be formed by doping the mixture of the diffusion agent and the resin to a predetermined thickness so as to surround the top and side surfaces of each light emitting diode chip, or may be formed by uniformly distributing the diffusion agent inside the molding part. Can be.

The LED according to the present invention uniformly distributes the diffusion agent on the plurality of LED chips, thereby diffusing and mixing the light emitted from the LED chip to realize a uniform color, and has the advantage of excellent color reproducibility. In addition, the color of light emitted for each viewing angle of the light emitting diode can be made constant.

1 is a cross-sectional view showing a conventional light emitting diode.
2 is a sectional view showing a first embodiment of the present invention.
3 is a sectional view showing a second embodiment of the present invention;
4 is a sectional view showing a third embodiment of the present invention;
5 is a sectional view showing a fourth embodiment of the present invention.
6 is a sectional view showing a fifth embodiment of the present invention;
7 is a sectional view showing a sixth embodiment of the present invention;
8 is a sectional view showing a seventh embodiment of the present invention.
9 is a sectional view showing an eighth embodiment of the present invention;
10A or 10B are a sectional view and a plan view showing a light emitting device to which the present invention is applied.

Figure 2 shows a first embodiment of the present invention, which shows a chip-shaped light emitting diode.

Referring to the drawings, the light emitting diode includes three substrates emitting light of different wavelengths, which are mounted on the substrate 20, the electrode 30 formed on the substrate 20, and the first electrode 30. And chips 10, 11, 12. The molding unit 40 may include a molding unit 40 encapsulating the three LED chips 10, 11, and 12, and a diffusion agent 50 may be included in the molding unit 40. As shown in the drawing, the diffusion agent 50 is preferably uniformly distributed in the molding part 40. The present invention is not limited thereto, and a molding part may be formed after doping the mixture of the diffusion agent and the resin to a predetermined thickness so as to surround the top and side surfaces of each LED chip.

The substrate 20 may include a reflector (not shown) formed by forming a predetermined groove in the central region of the substrate 20 through mechanical processing and giving a predetermined slope to the sidewall surface of the groove. By forming such a reflector, the reflection of the light emitted from the light emitting diode chips 10, 11, and 12 may be maximized, and light emission efficiency may be increased.

The electrode 30 of the present embodiment is a first electrode 30 and a second electrode (not shown) for connecting to the positive terminal and the negative terminal of each light emitting diode chip 10, 11, 12 on the substrate 20. Configure. The electrode 30 may be formed through a printing technique or using an adhesive. The electrode 30 is formed of a metal material including copper or aluminum having excellent conductivity, and the first electrode 30 and the second electrode are formed to be electrically disconnected.

The three LED chips 10, 11, and 12 of the present exemplary embodiment are mounted on the first electrode 30 and are electrically connected to the second electrode through the wire 60. In addition, when the three LED chips 10, 11, 12 are mounted on the substrate 20 instead of being mounted on the electrode 30, each of the first electrodes 30 is provided through two wires 60. Or may be connected to the second electrode.

In the present embodiment, three light emitting diode chips 10, 11, and 12 are used, but the type and number of light emitting diode chips are not limited and may be variously formed to realize colors of a desired spectrum. For example, the three LED chips may be configured as LED chips emitting red, green, and blue light to emit white light, and the number of the LED chips may be configured as a plurality of LED chips. In addition, the position at which each LED chip is mounted may be variously configured according to, for example, an optimal position for mixing light emitted from each LED chip or the number of LED chips.

The upper portion of the light emitting diode chip 10, 11, 12 may further include a predetermined phosphor (not shown) for implementing a desired color.

A molding part 40 is formed on the substrate 20 to encapsulate the plurality of light emitting diode chips 10, 11, and 12. In the molding part 40, a diffuser 50 for uniformly emitting light is mixed by diffusing light emitted from the LED chips 10, 11, and 12 by scattering. The molding part 40 uses transparent resins, such as an epoxy resin and a silicone resin, and it is preferable to use barium titanate, titanium oxide, aluminum oxide, silicon oxide, etc. as the diffusing agent 50.

In general, light emitted from a light emitting diode chip has a specific light emission pattern, and thus is not uniformly emitted in all directions. However, the light emitting diode including the diffusing agent scatters the light from the light emitting diode chip by the diffusing agent and emits light, so that light can be emitted uniformly over a wide range without forming unnecessary light emitting patterns. Accordingly, light of different wavelengths of the plurality of light emitting diode chips is emitted in a wide range and uniformly mixed, and the light emitting diode may realize light of a constant color. In addition, a constant color of light can be obtained regardless of the viewing angle of the light emitting diode.

In the present embodiment, such a diffusion agent 50 is mixed with a liquid epoxy resin at a predetermined ratio, and the mixture is applied to the upper portions of the light emitting diode chips 10, 11, and 12 so that the appearance of the applied mixture has a certain shape. Pressing the upper portion of the mixture with a molding machine having a partition wall may be cured for a long time to form the molding portion 40. In addition, the molding part 40 may be formed using a transfer molding method using a tablet made of a mixed powder of an epoxy resin and a diffusion agent 50. That is, when the tablet formed by mixing the powder epoxy resin and the diffusion agent 50 evenly and compressed to a predetermined pressure is put into a transfer molding machine, a predetermined temperature and pressure are applied to the upper portion of the substrate 20 according to the mold shape of the transfer molding machine. The molding part 40 is formed in the.

The manufacturing method of the molding part 40 is not limited to the above, and may be formed by various processes and manufacturing methods.

The shape of the molding part 40 is not limited as shown, and may include a lens function for focusing or diffusing light emitted from the light emitting diode chips 10, 11, 12, for example, in the form of an optical lens, It can be formed in various shapes, such as a flat plate shape and the form which has predetermined unevenness | corrugation in the surface.

In the light emitting diode of the present invention as described above, since a diffusion agent uniformly distributed inside a molding part encapsulating a plurality of light emitting diode chips emitting light of different wavelengths, the light emitted from the plurality of light emitting diode chips is widely spread. Compared to the conventional light emitting diode of FIG. 1, the color is uniformly mixed to emit light of a certain color and improve color reproducibility. In addition, the color of light emitted from each viewing angle of the light emitting diode can be made constant due to the diffusion agent uniformly distributed on the plurality of light emitting diode chips.

Figure 3 shows a second embodiment of the present invention, showing a tower-shaped light emitting diode.

Referring to the drawings, the light emitting diode includes three substrates emitting light of different wavelengths, which are mounted on the substrate 20, the electrode 30 formed on the substrate 20, and the first electrode 30. And chips 10, 11, 12. This is almost the same as the configuration of the first embodiment, and a detailed description thereof will be replaced with the above description with respect to FIG. Only the second embodiment includes a reflector 70 formed to surround three light emitting diode chips 10, 11, 12 on top of the substrate 20, and protects the light emitting diode chips 10, 11, 12. It includes a molding part 40 formed in the central hole of the reflector 70 for. The interior of the molding part 40 includes a diffusing agent 50, and as shown, the diffusing agent 50 is preferably uniformly distributed in the molding part 40. Of course, the present invention is not limited thereto, and a molding part may be formed after doping the mixture of the diffusion agent and the resin to a predetermined thickness so as to surround the top and side surfaces of each light emitting diode chip.

The reflector 70 is formed on the substrate 20 so as to surround the plurality of light emitting diode chips 10, 11, and 12. In this case, the light emitting diode chips 10, 11, The inner wall of the reflector 70 surrounding the 12 may be formed to have a predetermined slope. This is desirable in order to maximize the reflection of the light emitted from the light emitting diode chips 10, 11 and 12 and to increase the luminous efficiency.

After the reflector 70 is formed on the substrate 20, a molding part 40 for encapsulating the light emitting diode chips 10, 11, and 12 is formed in the center hole of the reflector 70. The molding part 40 may be formed by mixing the diffusion agents 50 in a liquid epoxy resin at a predetermined ratio and filling the mixture in the central hole of the reflector 70 by heat curing for a predetermined time. Of course, the manufacturing method of the molding part 40 is not limited and may be formed by various processes and manufacturing methods.

The shape of the molding part 40 is not limited as shown, and may include a lens function for focusing or diffusing light emitted from the light emitting diode chips 10, 11, 12, for example, in the form of an optical lens, It can be formed in various shapes, such as a flat plate shape and the form which has predetermined unevenness | corrugation in the surface.

Similarly, the molding part 40 uses a transparent resin such as an epoxy resin or a silicone resin, and the diffusion agent 50 preferably uses barium titanate, titanium oxide, aluminum oxide, silicon oxide, or the like. The diffusion agent 50 diffuses the light emitted from the light emitting diode chips 10, 11, and 12 by scattering to uniformly distribute light having different wavelengths emitted from the light emitting diode chips 10, 11, and 12. Mixing and improving color reproducibility.

Figure 4 shows a third embodiment of the present invention, showing a light emitting diode in the form of a lamp.

Referring to the drawings, the light emitting diode includes a first lead terminal 90 and a second lead terminal 95 spaced apart from the first lead terminal 90 by a predetermined distance. A plurality of LED chips 10 emitting light having different wavelengths are mounted on the first lead terminal 90, and are electrically connected to the second lead terminal 95 through a wire 60. The front ends of the lead terminals 90 and 95 include a molding part 40, and the diffusion part 50 is uniformly distributed in the molding part 40. Of course, the present invention is not limited thereto, and a molding part may be formed after doping the mixture of the diffusion agent and the resin to a predetermined thickness so as to surround the top and side surfaces of each light emitting diode chip.

As illustrated, the first lead terminal 90 on which the LED chip 10 is mounted may include a reflector 80 having a groove formed in a predetermined region and having a predetermined slope on the sidewall surface of the groove. The light emitting diode chip 10 is mounted on a lower plane of the reflector 80, which is to maximize reflection of light emitted from the light emitting diode chip 10 and to increase luminous efficiency.

In the present embodiment, a plurality of light emitting diode chips are mounted and one light emitting diode chip 10 is shown. However, the type and number of light emitting diode chips are not limited, and various light emitting diode chips may be formed in various ways to implement colors of a desired spectrum. have. In addition, the upper portion of the light emitting diode chip 10 may further include a predetermined phosphor (not shown) to implement a desired color.

The LED chip 10 is formed at an end of the lead terminals 90 and 95 and a molding part 40 is formed to fix the lead terminals 90 and 95, and the light emitting diode chip 10 is formed therein. And a diffuser 50 which emits light uniformly by diffusing the light emitted from the light by scattering. The molding part 40 uses transparent resins, such as an epoxy resin and a silicone resin, and it is preferable to use barium titanate, titanium oxide, aluminum oxide, silicon oxide, etc. as the diffusing agent 50.

The molding part 40 mixes the diffusion agents 50 in a liquid epoxy resin at a predetermined ratio and fills the mixture in a molding mold, and then, in the molding mold containing the mixture of the diffusion agent 50 and the epoxy resin, The lead terminals 90 and 95 on which the light emitting diode chip 10 is mounted may be dipped and heat-cured for a predetermined time. Of course, the manufacturing method of the molding part 40 is not limited and may be formed by various processes and manufacturing methods.

Figure 5 shows a fourth embodiment of the present invention, showing a light emitting diode including a housing.

Referring to the drawings, the light emitting diode includes a housing 110 having electrodes 30 and 35 formed at both sides thereof, including a through hole, a substrate 25 mounted in the through hole of the housing 110, and the substrate ( A plurality of light emitting diode chips 10 mounted on 25) emit light of different wavelengths. The molding unit 40 may include a molding part 40 encapsulating the plurality of light emitting diode chips 10, and the diffusion part 50 may be uniformly distributed in the molding part 40. Of course, the present invention is not limited thereto, and a molding part may be formed after doping the mixture of the diffusion agent and the resin to a predetermined thickness so as to surround the top and side surfaces of each light emitting diode chip.

In this case, the substrate 25 may be formed of a heat sink using a material having excellent thermal conductivity, so that heat emitted from the light emitting diode chip 10 may be more effectively emitted. This may extend the external heat sink to achieve higher heat dissipation.

In addition, a reflector (not shown) may be formed to have a truncated cone-shaped recess region inverted in a predetermined region in the center of the substrate 25, and the LED chip 10 may be mounted on a lower plane thereof. The inverted truncated cone-shaped recess region may be formed to have a predetermined slope to improve the brightness and the light collecting ability of the light.

The electrodes 30 and 35 of this embodiment consist of first and second electrodes 30 and 35 for connecting to the positive terminal and the negative terminal of the light emitting diode chip 10 on the substrate 25. The LED chip 10 is mounted on the substrate 25 and is electrically connected to the first electrode 30 or the second electrode 35 through the wire 60.

A molding part 40 including a diffusion agent 50 is formed on the substrate 25 to diffuse light from the light emitting diode chip 10 to uniformly mix light having different wavelengths. Same as the case.

On the other hand, the light emitting diode according to the present invention may form a cap containing a diffusing agent to encapsulate the light emitting diode chip. Here, the cap uses a material that can pass light, silicone resin, polyester resin, acrylic resin, epoxy resin, urethane resin, nylon resin, polyamide resin, polyimide resin, vinyl chloride resin, polycarbonate resin, It may be formed of at least one resin or glass selected from polyethylene resin, teflon resin, polystyrene resin, polypropylene resin, polyolefin resin.

6 shows a fifth embodiment of the present invention, which shows a chip-shaped light emitting diode.

Referring to the drawings, the light emitting diode includes three substrates emitting light of different wavelengths, which are mounted on the substrate 20, the electrode 30 formed on the substrate 20, and the first electrode 30. And chips 10, 11, 12. This is almost the same as the configuration of the first embodiment, and a detailed description thereof will be replaced with the above description with respect to FIG. Only the fifth embodiment includes a cap 100 encapsulating the light emitting diode chips 10, 11, 12 on top of the substrate 20, wherein the diffuser layer is formed uniformly on the inner side of the cap 100. And 55.

The cap 100 may be made of a material having excellent light transmittance through which light may pass, and a light transmissive resin or glass may be used. Although the cap 100 is formed in the shape of a lens in the drawing, the shape of the cap 100 encapsulating the light emitting diode chips 10, 11, and 12 is not limited thereto. The shape of the cap 100 may be a hexahedron shape or a hexahedron shape having a rectangular cross section. It is possible to configure a variety of shapes, such as further comprising a lens shape on the upper plane of the.

The inner side of the cap 100 is formed with a diffuser layer 55 for diffusing light emitted from the light emitting diode chips 10, 11, 12. This may be applied to the cap 100 by mixing a diffusing agent in water or an organic solvent, and then maintaining only a predetermined temperature to volatilize water or an organic solvent to leave only the diffusing agent. In addition, the diffusion agent may be deposited by sputtering or vapor chemical vapor deposition toward the inside of the cap 100. As described above, the diffusing agent layer 55 may be formed in various ways according to process convenience. Although the diffuser layer 55 is formed only on the inner side surface of the cap 100 on the drawing, the diffusion layer 55 may be formed on the outer side surface of the cap 100.

The diffusing agent serves to diffuse light by causing scattering of light emitted from the plurality of light emitting diode chips 10, 11, and 12, and it is preferable to use barium titanate, titanium oxide, aluminum oxide, silicon oxide, or the like. Do.

The diffusing agent diffuses the light emitted from each of the light emitting diode chips 10, 11, and 12 by scattering, and thus can uniformly emit light in a wide range without a constant light emitting pattern. Accordingly, light of different wavelengths emitted from the plurality of light emitting diode chips 10, 11, and 12 is uniformly mixed to emit light of a constant color.

In the light emitting diode of the present invention as described above, since the diffusion layer is formed on the inner side or the outer side of the cap for encapsulating the plurality of light emitting diode chips emitting light of different wavelengths, the light emitting diodes are different from each other. The light of the wavelength is widely spread and uniformly mixed to achieve a certain color and has the advantage of improving the color reproducibility. In addition, the color of light emitted from each viewing angle of the light emitting diode can be made constant due to the diffusion agent uniformly distributed on the plurality of light emitting diode chips.

7 shows a sixth embodiment of the present invention, which shows a chip-shaped light emitting diode.

Referring to the drawings, the light emitting diode includes light having different wavelengths, which is mounted on the substrate 20 having the reflector 80, the electrode 30 formed on the substrate 20, and the first electrode 30. Three light emitting diode chips 10, 11, and 12 that emit light are included. This is almost the same as the configuration of the first embodiment, and a detailed description thereof will be replaced with the above description with respect to FIG. Only the sixth embodiment includes a cap 105 that encapsulates the light emitting diode chips 10, 11, 12, which is formed integrally with the diffusing agent 50. That is, after forming a separate cap 100 as in the fifth embodiment, the diffusion layer 55 is not formed on the inner side or the outer side of the cap 100, but is diffused during the manufacture of the cap 105. The diffusion agent 50 and the cap 105 may be integrated by uniformly mixing the agent 50.

The reflector 80 is formed by forming a predetermined groove in the center region of the substrate 20 through mechanical processing, and refers to a region formed by giving a predetermined slope to the sidewall surface of the groove. Its lower surface is preferably flat for mounting the LED chips 10, 11, 12. In addition, as illustrated in FIG. 3, a reflector may be formed on the planar substrate 20 to surround the light emitting diode chips 10, 11, and 12. The reflection unit 80 may be formed to maximize reflection of light emitted from the light emitting diode chips 10, 11, and 12, and increase light emission efficiency.

The cap 105 is made of a light-transmitting material that can pass light, it is prepared by uniformly mixing the diffusion agent (50). The diffusion agent 50 serves to diffuse light by causing scattering of light emitted from the light emitting diode chips 10, 11, and 12, and to use barium titanate, titanium oxide, aluminum oxide, silicon oxide, or the like. desirable. The diffusion agent 50 may be mixed with the liquid epoxy resin, and the mixture of the diffusion agent 50 and the epoxy resin may be press-molded into a mold to be heated. This can be formed in various ways according to the process convenience. Although the cap 105 is formed in the shape of a lens in the drawing, the shape of the cap 105 for encapsulating the light emitting diode chips 10, 11, and 12 is not limited thereto. It is possible to configure a variety of shapes, such as further comprising a lens shape on the upper plane of the.

The diffuser 50 uniformly distributed inside the cap 105 diffuses the light emitted from each of the LED chips 10, 11, and 12 by scattering, and thus uniformly emits light in a wide range without a constant light emission pattern. Can emit. Therefore, light of different wavelengths emitted from the plurality of light emitting diode chips 10, 11, and 12 may be uniformly mixed to emit light of a constant color, and improve color reproducibility.

8 shows a seventh embodiment of the present invention, which shows a light emitting diode in the form of a lamp.

Referring to the drawings, the light emitting diode includes a first lead terminal 90 having a reflector 80 formed thereon, and a second lead terminal 95 spaced apart from the first lead terminal 90 by a predetermined distance. A plurality of LED chips 10 emitting light of different wavelengths are mounted on the first lead terminal 90 and electrically connected to the second lead terminal 95 through the wire 60. This is almost the same as the configuration of the third embodiment, and a detailed description thereof will be replaced with the above description with respect to FIG. However, the seventh embodiment includes a cap 100 for protecting the light emitting diode chip 10 at the front ends of the lead terminals 90 and 95, and a diffuser layer uniformly distributed on the inner surface of the cap 100. And 55.

The cap 100 is made of a light-transmitting material that can pass light, it may be used a transparent resin or glass. The shape of the cap 100 encapsulating the light emitting diode chip 10 is not limited to those shown in the drawings, and may be variously configured in a cylindrical shape, a hemispherical shape, a hexahedral shape, and the like.

A diffusion layer 55 is formed on the inner side of the cap 100 to diffuse the light emitted from the LED chip 10. This may be applied to the cap 100 by mixing a diffusing agent in water or an organic solvent, and then maintaining only a predetermined temperature to volatilize water or an organic solvent to leave only the diffusing agent. In addition, the diffusion agent may be deposited by sputtering or vapor chemical vapor deposition toward the inside of the cap 100. As described above, the diffusing agent layer 55 may be formed in various ways according to process convenience. In addition, although the diffusing agent layer 55 is formed only on the inner side of the cap 100 on the drawing, the diffusion agent 55 layer may be formed on the outer side of the cap 100.

The cap 100 including the diffusion layer 55 is coupled to a lead support 99 that penetrates the first lead terminal 90 and the second lead terminal 95 to support the light emitting diode chip 10. Encapsulate. An external current may be applied to the LED chip 10 by electrically connecting the first and second lead terminals 90 and 95 exposed below and the external current input terminal.

In the present exemplary embodiment, since the diffusion layer 55 is formed on the inner surface of the cap 100 and the diffusion layer 55 is uniformly distributed on the plurality of light emitting diode chips 10, the plurality of emission Light of different wavelengths emitted from the diode chip 10 is broadly expanded to be uniformly mixed, and color reproducibility can be improved.

9 shows an eighth embodiment of the present invention, showing a light emitting diode including a housing.

Referring to the drawings, the light emitting diode includes a housing 110 having electrodes 30 and 35 formed at both sides thereof, including a through hole, a substrate 25 mounted in the through hole of the housing 110, and the substrate ( A plurality of light emitting diode chips 10 mounted on 25) emit light of different wavelengths. In this case, the substrate 25 may be formed of a heat sink using a material having excellent thermal conductivity, so that heat emitted from the light emitting diode chip 10 may be more effectively emitted. This may extend the external heat sink to achieve higher heat dissipation. This is almost the same as the configuration of the fourth embodiment, and a detailed description thereof will be replaced with the above description with respect to FIG. Only the eighth embodiment includes a cap 105 encapsulating the light emitting diode chip 10, which is formed integrally with the diffusing agent 50. That is, the cap 105 in which the diffusing agent 50 is uniformly mixed can be manufactured to integrate the diffusing agent 50 and the cap 105.

The cap 105 is made of a light-transmitting material that can pass light, it is prepared by uniformly mixing the diffusion agent (50). The diffusing agent 50 serves to diffuse light by causing scattering of light emitted from the light emitting diode chip 10, and it is preferable to use barium titanate, titanium oxide, aluminum oxide, silicon oxide, or the like. The diffusion agent 50 may be mixed with the liquid epoxy resin, and the mixture of the diffusion agent 50 and the epoxy resin may be press-molded into a mold to be heated. This can be formed in various ways according to the process convenience. Although the cap 105 is formed in the shape of a lens in the drawing, the shape of the cap 105 for encapsulating the light emitting diode chip 10 is not limited thereto. It can be configured in various ways, such as a shape further including a lens form.

Since the diffuser 50 uniformly distributed in the cap 105 diffuses the light emitted from each light emitting diode chip 10 by scattering, light may be uniformly emitted in a wide range without a constant light emission pattern. . Therefore, light of different wavelengths emitted from the plurality of light emitting diode chips 10 is uniformly mixed to emit light of a constant color.

The light emitting diode of the present invention is not limited to the above-described embodiment, but may be manufactured in various structures and methods, and may be applied to products having various configurations.

For example, FIGS. 10A to 10B are for explaining an embodiment in which the present invention is applied to a light bulb. Referring to the drawings, a socket 130 of a metallic material, a housing 140 of a metallic material coupled by the socket 130 and a spiral groove, and a resin part filled in the socket 130 and the housing 140. 170, a substrate 120 mounted on the housing 140, a pin 150 of a metal material penetrating through the resin unit 170 and the substrate 120, and the substrate 120. It includes a plurality of light emitting diode chips 10, 11, 12, 13 which are mounted to emit light of different wavelengths. The substrate 120 is coupled to the housing 140 using pins or screws 160. As shown in FIG. 10B, which shows a plane on the substrate 120, four LED chips 10, 11, 12, and 13 are mounted on the electrode pad 180 of a metal material. In this case, the type, number, and location of the LED chips to be mounted are not limited, and may be variously formed as desired. The plurality of light emitting diode chips 10, 11, 12, and 13 are connected in series, and although not shown in the drawing, may further include a rectifier if necessary when AC power is applied. In addition, as can be seen in Figure 10a, it is coupled to the housing 140 connected from the above-described socket 130 by the spiral groove, and includes a cap 100 formed of transparent resin or glass. On the inner side or the outer side of the cap 100, a diffuser layer 55 is formed to diffuse light emitted from the light emitting diode chips 10, 11, 12, 13. In addition, the diffusion agent may be formed integrally with the cap. Since the diffusing agent is uniformly distributed on the light emitting diode chips 10, 11, 12, and 13, the present embodiment has a uniform color because light of different wavelengths emitted from a plurality of light emitting diode chips is widely diffused and uniformly mixed. It can be implemented, and the color of the light emitted for each viewing angle of the light emitting diode can be made constant.

Of course, the present invention is not limited thereto, and the present invention can be variously applied to other products such as street lamps, flashlights, fluorescent lamps, and the like.

As described above, the light emitting diode of the present invention can uniformly form a diffusing agent on a plurality of light emitting diode chips emitting light of different wavelengths, thereby broadly diffusing and mixing the emitted light, thereby improving color reproducibility. .

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined in the appended claims. It will be understood that the invention may be varied and varied without departing from the scope of the invention.

1, 2, 3: light emitting diode chip 4: substrate
5 electrode 6 molding part
7: wire
10, 11, 12, 13: light emitting diode chip
20, 25: substrate 30, 35: electrode
40 molding part 50 diffusion agent
55 diffuser layer 60 wire
70 reflector 80 reflector
90, 95: lead terminal 99: lead support
100, 105: cap 110: housing
120: substrate 130: socket
140: housing 150: pin
160: screw 170: resin part
180: electrode pad

Claims (19)

A substrate on which at least one light emitting diode chip is mounted;
A resin layer covering at least a portion of the light emitting diode chip;
A phosphor layer formed on the light emitting diode chip;
A cap formed on the resin layer and the light emitting diode chip; And
It includes a diffusion layer for diffusing the light emitted from the light emitting diode chip,
The phosphor layer is positioned between the diffusion layer and the light emitting diode chip. The method according to claim 1,
A first electrode electrically connected to the first terminal of the light emitting diode chip; And
And a second electrode electrically connected to the second terminal of the light emitting diode chip and spaced apart from the first electrode. The method according to claim 2,
Further comprising a housing surrounding at least one side of the substrate,
The first and second electrodes are light emitting diodes, characterized in that formed to extend to the outer surface of the housing. The method according to claim 3,
The lower surface of the substrate, the light emitting diode, characterized in that exposed to the outside. The method according to claim 1,
The diffusion layer is formed to be spaced apart from the light emitting diode chip by a predetermined interval, the light emitting diode, characterized in that formed adjacent to the cap than the light emitting diode chip. The method according to claim 1,
The diffusion layer is formed on any one selected from the inner surface and the outer surface of the cap. The method according to claim 1,
And the diffusion layer is formed integrally with the cap. The method according to claim 1,
The diffusion layer includes at least one of barium titanate, titanium oxide, aluminum oxide, and silicon dioxide. The method according to claim 1,
The cap is silicone resin, polyester resin, acrylic resin, epoxy resin, urethane resin, nylon resin, polyamide resin, polyimide resin, vinyl chloride resin, polycarbonate resin, polyethylene resin, polystyrene resin, polypropylene resin and polyolefin resin. A light emitting diode, characterized in that formed of one of the resin or glass. The method according to claim 1,
The light emitting diode comprises a plurality of light emitting diode chips for emitting light of different wavelengths. housing;
A socket coupled to the housing;
A substrate coupled to the housing and having at least one light emitting diode chip mounted thereon;
A phosphor layer formed on the light emitting diode chip;
A cap coupled to the housing and formed on the substrate; And
It includes a diffusion layer for diffusing the light emitted from the light emitting diode chip,
The phosphor layer is positioned between the diffusion layer and the light emitting diode chip. The method of claim 11,
The diffusion layer is formed spaced apart from the light emitting diode chip a predetermined interval, characterized in that formed in the adjacent to the cap than the light emitting diode chip. The method of claim 11,
The diffusion layer is an illumination device, characterized in that formed on any one selected from the inner surface and the outer surface of the cap. The method of claim 11,
And the diffusion layer is formed integrally with the cap. The method of claim 11,
The diffusion layer includes at least one of barium titanate, titanium oxide, aluminum oxide and silicon dioxide. The method of claim 11,
And a coupling member for coupling the substrate and the housing. The method of claim 11,
And the cap is coupled to the housing through a screw groove formed in a predetermined surface of the housing. The method of claim 11,
And said light emitting diode chip comprises a plurality of light emitting cells connected in series. The method of claim 11,
The cap is silicone resin, polyester resin, acrylic resin, epoxy resin, urethane resin, nylon resin, polyamide resin, polyimide resin, vinyl chloride resin, polycarbonate resin, polyethylene resin, polystyrene resin, polypropylene resin and polyolefin resin. Illuminating apparatus, characterized in that formed of one selected from resin or glass.

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