KR101181340B1 - LED light - Google Patents

LED light Download PDF

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Publication number
KR101181340B1
KR101181340B1 KR1020100085238A KR20100085238A KR101181340B1 KR 101181340 B1 KR101181340 B1 KR 101181340B1 KR 1020100085238 A KR1020100085238 A KR 1020100085238A KR 20100085238 A KR20100085238 A KR 20100085238A KR 101181340 B1 KR101181340 B1 KR 101181340B1
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South Korea
Prior art keywords
led
circuit
case
case body
heat dissipation
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KR1020100085238A
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Korean (ko)
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KR20120022107A (en
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안정수
조하연
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안정수
(주)중앙 엔룩스
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Priority to KR1020100085238A priority Critical patent/KR101181340B1/en
Priority to PCT/KR2010/008780 priority patent/WO2012030023A1/en
Publication of KR20120022107A publication Critical patent/KR20120022107A/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/237—Details of housings or cases, i.e. the parts between the light-generating element and the bases; Arrangement of components within housings or cases
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/18—Latch-type fastening, e.g. with rotary action
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/007—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array enclosed in a casing
    • F21V23/008—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array enclosed in a casing the casing being outside the housing of the lighting device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/007—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array enclosed in a casing
    • F21V23/009—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array enclosed in a casing the casing being inside the housing of the lighting device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

본 발명은 LED보다 수명이 짧은 전기 전자회로를 회로 케이스 내부에 설치하고, 회로 케이스를 케이스 몸체에 착탈하도록 함으로써 부품 교체 및 수리가 용이하도록 한 LED등기구이다.The present invention is an LED luminaire that installs an electrical and electronic circuit shorter than the LED inside the circuit case, and to replace the circuit case to the case body to facilitate component replacement and repair.

Description

ＬＥＤ 등{LED light}LED light {LED light}

본 발명은 LED 등에 관한 것으로, 보다 상세하게는 중앙에 착탈 가능한 회로모듈이 설치되어 편리하게 회로모듈을 수리 교체할 수 있도록 한 LED 등에 관한 것이다. The present invention relates to an LED and the like, and more particularly, to a LED or the like that is installed in the center detachable circuit module to be able to repair and replace the circuit module conveniently.

LED는 전력소비가 낮은 등기구로 백열등, 형광등의 수요를 대체하고 있다. 또한 LED 등기구는 LED를 점등시키기 위해서 가정에 인입되는 AC 220V를 DC 12V 또는 DC 24V로 변환하여 LED 소자에 공급하여야 하기 때문에 컨버터 및 여러 가지의 회로소자를 필요로 한다. 이때, LED의 수명은 반영구적이라 할 수 있으며, IC 집적소자를 중심으로 이루어진 컨버터 등의 전자소자들은 LED 보다 수명이 매우 짧다. 이와 같은 수명차이를 갖는 LED 등기구를 사용하는 경우에 LED에 비하여 LED에 전원을 공급하기 위한 전원공급회로의 잦은 교체가 발생하게 된다.LED is a low-power luminaire, replacing the demand for incandescent and fluorescent lamps. In addition, the LED luminaire requires a converter and various circuit elements because the AC 220V to be converted into DC 12V or DC 24V to supply to the LED device to turn on the LED. At this time, the life of the LED can be said to be semi-permanent, and electronic devices such as converters mainly composed of IC integrated devices have a very short lifespan than LEDs. In the case of using an LED luminaire having such a life difference, frequent replacement of the power supply circuit for supplying power to the LED occurs compared to the LED.

도 1은 공개특허2010-82411호(발명의 명칭: 엘이디 다운라이트 조명등 기구의 체결구조)의 전체구성을 설명하는 단면도이다.BRIEF DESCRIPTION OF THE DRAWINGS It is sectional drawing explaining the whole structure of Unexamined-Japanese-Patent No. 2010-82411 (the name of the invention: the fastening structure of LED downlight luminaire).

도 1에 도시된 바와 같이 종래의 엘이디 등기구(100)는 열냉각 고정부(Heat Sink & Fixture Part)(10)와; 상기 열냉각 고정부(10)에 삽입되어, LED 조명장치의 가동전원을 공급하는 파워서플라이 유닛(Power Supply Unit; PSU)(30)과; 상기 열냉각 고정부(10)의 내측에 밀착 설치되고, LED 조명장치의 전원 및 점멸 작동을 제어하는 회로를 내장한 LED PCP어셈블리(LED Printed Circuit Package Assembly)(20)와; 상기 LED PCP 어셈블리(20)로 부터 방사되는 LED 광원을 반사하기 위한 리플렉터(Reflector)(60)와; 상기 리플렉터(60)를 통과한 광원을 확산하여 주사 방향으로 확산하기 위한 확산판(Diffuser)(50)으로 이루어져 있다.As shown in FIG. 1, a conventional LED lamp 100 includes a heat sink & fixture part 10; A power supply unit (PSU) 30 inserted into the heat-cooling fixing part 10 and supplying operating power of the LED lighting device; An LED PCP assembly (LED Printed Circuit Package Assembly) 20 installed in close contact with the heat cooling fixing part 10 and including a circuit for controlling power and blinking operation of the LED lighting device; A reflector (60) for reflecting the LED light source radiated from the LED PCP assembly (20); It is made of a diffuser 50 for diffusing the light source passing through the reflector 60 in the scanning direction.

이와 같이 구성된 종래의 발명은 LED PCP 어셈블리의 하부면에 LED가 설치되어 LED 광원을 출사시키며, 열냉각고정부(10)의 상부 내측에 밀착 설치되어 LED 전원을 공급하는 파워서플라이 유닛(30)이 설치되어 파워서플라이 유닛(30)이 고장 나는 경우에 엘이디 등기구(30) 전체를 설치벽으로부터 분리한 후 교체작업이 이루어져야 한다. 파워서플라이 유닛(30)의 수리 및 교체 회수가 반영구적인 LED 보다 많기 때문에 수리 및 교체작업은 엘이디 등기구(30) 사용기간 중에 상당회수 발생되기 때문에 사용자에게 많은 번거로움을 주게 된다. In the conventional invention configured as described above, the LED is installed on the lower surface of the LED PCP assembly to emit the LED light source, and the power supply unit 30 is installed in close contact with the upper inside of the heat cooling fixing unit 10 to supply the LED power. If the power supply unit 30 is installed to be broken, the replacement work should be made after separating the entire LED luminaire 30 from the installation wall. Since the number of repair and replacement of the power supply unit 30 is greater than that of semi-permanent LEDs, the repair and replacement work may cause a lot of inconvenience to the user because a considerable number of times are generated during the use of the LED luminaire 30.

본 발명은 이러한 문제점을 개선하기 위한 것으로, LED가 설치된 기판 중심을 통과하여 방열부에 착탈가능하게 결합되는 회로수납 케이스를 설치하고, 회로수납 케이스에 전기, 전자회로를 설치하도록 하여 LED 등기구를 해체하지 않고도 회로수납 케이스를 LED 등기구로부터 분리시킴으로써 전기, 전자회로를 교체 및 수리할 수 있도록 하기 위한 것이다. The present invention is to improve the above problems, through the center of the LED board is installed, the circuit storage case is installed detachably coupled to the heat dissipation unit, and to disassemble the LED luminaire by installing electrical and electronic circuits in the circuit storage case It is intended to replace and repair electrical and electronic circuits by separating the circuit storage case from the LED luminaire without having to do so.

상기 과제를 해결하기 위한 본 발명의 해결수단은 케이스 몸체; 상기 케이스 몸체 내부에 설치되어 상기 케이스 몸체의 전면에 불빛을 투사하는 LED들이 설치되는 LED 기판; 상기 LED 기판에 수직으로 전면을 향하도록 설치되며 내부에 상기 LED들에 전원을 공급하기 위한 전원회로가 설치되는 회로 케이스를 포함하며, 상기 회로케이스는 상기 케이스 몸체에 착탈가능하게 결합되는 것이다.The solution means of the present invention for solving the above problems is the case body; An LED substrate installed in the case body and configured to project LEDs on a front surface of the case body; It is installed so as to face the front vertically to the LED substrate and includes a circuit case therein is installed a power circuit for supplying power to the LEDs, the circuit case is detachably coupled to the case body.

또한 본 발명에서 상기 케이스 몸체는 상기 LED 기판의 후면에 설치되는 는 방열부를 구비하며, 상기 회로 케이스의 전원회로에는 상기 방열부의 중앙에 형성된 부싱을 통하여 전선이 인입되어 연결되고, 상기 회로케이스는 상기 LED 기판의 중앙에 형성된 관통공을 통하여 삽입되어 상기 방열부에 착탈가능하게 결합되는 것이 바람직하다.In addition, in the present invention, the case body is provided with a heat dissipation unit which is installed on the back of the LED substrate, the power supply circuit of the circuit case is connected to the wire through the bushing formed in the center of the heat dissipation unit, the circuit case is It is preferable to be inserted through a through hole formed in the center of the LED substrate and detachably coupled to the heat dissipation unit.

또한 본 발명에서 상기 방열부는 상기 부싱을 중심으로 원호상의 두 개의 절개부들이 형성되되 상기 절개부들은 광폭절개부와 상기 광폭절개부에 연장되는 소폭절개부로 이루어지는 것이 바람직하다.In addition, in the present invention, the heat dissipation portion is formed with two arc-shaped cutouts centered on the bushing, the cutouts are preferably made of a wide cutout and a narrow cutout extending to the wide cutout.

또한 본 발명에서 상기 회로 케이스는 원통형상으로 이루어지되 단부에는 외측으로 절곡되는 걸림부가 상기 회로 케이스의 중심에 대칭으로 두개 형성되며, 상기 회로 케이스를 상기 방열부에 결합시 상기 걸림부를 상기 광폭절개부를 통과시켜 소폭절개부로 회전시키는 것이 바람직하다.In addition, in the present invention, the circuit case is formed in a cylindrical shape, but two end portions are bent outwardly and symmetrically formed at the center of the circuit case, and when the circuit case is coupled to the heat dissipating portion, the widening portion is formed in the wide cutting portion. It is preferable to make it pass and rotate to a narrow incision.

또한 본 발명의 다른 해결수단은 케이스 몸체; 상기 케이스 몸체 내부에 설치되어 상기 케이스 몸체의 전면에 불빛을 투사하는 LED들이 설치되는 LED 기판; 상기 케이스 몸체 또는 상기 LED 기판 중 어느 하나에 착탈가능하게 결합되며, 상기 LED 기판에 수직으로 전면을 향하도록 설치되며 내부에 상기 LED들에 전원을 공급하기 위한 전원회로가 설치되는 회로 케이스를 포함하는 것이다.In addition, another solution of the present invention is the case body; An LED substrate installed in the case body and configured to project LEDs on a front surface of the case body; Removably coupled to any one of the case body or the LED substrate, it is installed so as to face the front vertically to the LED substrate and includes a circuit case is installed therein a power circuit for supplying power to the LEDs therein; will be.

상기 해결과제와 해결수단을 갖는 본 발명에 따르면, LED보다 수명이 짧은 전기전자부품으로 이루어진 전원회로가 내부에 설치된 회로 케이스를 LED 등기구 케이스 몸체로부터 착탈할 수 있도록 함으로써 부품교체 및 수리가 용이하도록 한다. According to the present invention having the above-mentioned problems and solutions, it is easy to replace and repair parts by allowing the power supply circuit made of electrical and electronic components shorter lifespan than the LED to be detached from the LED luminaire case body. .

도 1은 공개특허2010-82411호(발명의 명칭: 엘이디 다운라이트 조명등 기구의 체결구조)의 전체구성을 설명하는 단면도이다.
도 2는 본 발명의 일실시예의 전체 사시도이다.
도 3은 본 발명의 일실시예의 분해 사시도이다.
도 4는 본 발명의 일실시예에서 회로 케이스의 구성을 나타내는 사시도이다.
도 5는 본 발명의 회로 케이스와 결합되는 방열부의 구성을 설명하는 평면도이다.BRIEF DESCRIPTION OF THE DRAWINGS It is sectional drawing explaining the whole structure of Unexamined-Japanese-Patent No. 2010-82411 (the name of the invention: the fastening structure of LED downlight luminaire).
2 is an overall perspective view of one embodiment of the present invention.
3 is an exploded perspective view of one embodiment of the present invention.
Figure 4 is a perspective view showing the configuration of a circuit case in an embodiment of the present invention.
5 is a plan view illustrating a configuration of a heat dissipation unit coupled to a circuit case of the present invention.

이하, 첨부된 도면에 따라서 본 발명의 일실시예를 상세히 설명하기로 한다.Hereinafter, an embodiment of the present invention according to the accompanying drawings will be described in detail.

도 2에 도시된 실시예는 케이스 몸체(390)의 후면에 방열부(400)가 설치되고, 케이스 몸체(390)의 내부에 중앙에 관통공이 설치된 LED 기판(351)이 설치되며, LED 기판(351)의 전면에 LED(350)들이 설치되며, LED 기판(351)의 중앙에 형성된 관통공을 통하여 회로 케이스(210)가 삽입된 후 방영부(400)에 착탈된다.2, the heat dissipation unit 400 is installed at the rear of the case body 390, and an LED substrate 351 having a through hole installed at the center of the case body 390 is installed. The LEDs 350 are installed on the front surface of the 351, and the circuit case 210 is inserted through the through-hole formed in the center of the LED substrate 351 and then detached from the air conditioner 400.

케이스 몸체(390)는 전면링(395)과 후면링(397), 이들을 연결하는 연결판(391), (393)으로 이루어지며, 후면링(397)에는 중앙에 관통공이 형성된 원판 형상의 고정판(430)이 설치되며, 고정판(430)의 후면에는 방열부(400)가 설치되고, 전면에는 LED 기판(351)이 설치된다.The case body 390 is composed of a front ring (395) and a rear ring (397), connecting plates (391), (393) for connecting them, the rear ring (397) has a plate-shaped fixing plate formed with a through hole in the center ( 430 is installed, the heat dissipation unit 400 is installed on the rear surface of the fixing plate 430, and the LED substrate 351 is installed on the front surface.

또한 케이스 몸체(390)의 전면링(395)에는 확산판 설치구(270)가 설치된다. 확산판 설치구(270)는 원통형상으로 이루어지되 전단부가 외측으로 확장된 확장부(271)를 갖으며, 확장부(271)의 후면에는 스프링(290), (291)이 삽입될 수 있는 삽입홈이 돌출형성되며, 원통형상의 내부에는 원형턱을 갖으며, 원형턱에 중앙에 관통공이 형성된 확산판(310)이 안착된다.In addition, the front plate 395 of the case body 390 is provided with a diffusion plate mounting hole 270. Diffusion plate mounting portion 270 is made of a cylindrical shape, but the front end has an extension portion 271 extending outward, the back of the expansion portion 271 can be inserted into the spring 290, 291 can be inserted The groove is formed to protrude, and has a circular jaw in the cylindrical shape, the diffuser plate 310 is formed in the through-hole in the center of the circular jaw is seated.

또한 케이스 몸체(390)의 연결판(391), (393)의 내측에는 LED(350)의 빛을 반사할 수 있도록 원통형상의 반사판(330)이 설치된다.In addition, a cylindrical reflector 330 is installed inside the connection plates 391 and 393 of the case body 390 to reflect light of the LED 350.

또한 스프링(290), (291)은 U자형상으로 이루어져 내측으로 삽입되는 반사판(330)의 외주면을 탄성 지지할 수 있도록 설치된다.In addition, the springs 290 and 291 are formed in a U-shape so as to elastically support the outer circumferential surface of the reflecting plate 330 inserted inwardly.

반사판(310), LED 기판(351), 고정판(430)에는 중앙 관통공들이 형성되어 있으며, 중앙 관통공들에는 원통형상으로 이루어진 회로 케이스(210)가 삽입되어 방열부(400)에 착탈가능하게 결합되게 되며, 회로 케이스(210)의 내부에는 회로기판(230), (250)이 설치되고, 회로기판(230), (250)에는 전자회로가 실장되게 된다.Center through holes are formed in the reflector plate 310, the LED substrate 351, and the fixing plate 430, and a circuit case 210 having a cylindrical shape is inserted into the center through holes to be detachably attached to the heat dissipation part 400. The circuit boards 230 and 250 are installed in the circuit case 210, and the electronic circuits are mounted in the circuit boards 230 and 250.

또한 방열부(400)에는 자바라(430)를 통하여 유입되는 전선이 고정되는 단자대(410)가 설치되며, 단자대(410)로부터 인출되는 전선은 방열부(400)의 중앙에 형성된 관통공에 설치된 부싱(413)을 통하여 회로 케이스(210)의 내부에 설치된 기판 단자대(251)에 연결되고, 회로 기판(230), (250)에 설치된 회로를 동작시킨다. 또한, 회로기판(230), (250)에 설치된 회로들은 인입되는 AC 전원을 LED 기판(351)에 설치된 LED들이 동작될 수 있도록 적정전압의 DC로 가변시켜 미도시된 전선에 의하여 LED 기판(351)에 공급한다. In addition, the heat dissipation unit 400 is provided with a terminal block 410 is fixed to the wire flowing through the bellows 430, the wire drawn out from the terminal block 410 is a bushing installed in the through hole formed in the center of the heat dissipation unit 400 It is connected to the board terminal block 251 provided in the circuit case 210 through 413 to operate the circuits provided on the circuit boards 230 and 250. In addition, the circuits installed on the circuit boards 230 and 250 vary the incoming AC power source to a DC of appropriate voltage so that the LEDs installed on the LED board 351 can be operated. Supplies).

도 4는 본 발명의 일실시예에서 회로 케이스의 구성을 나타내는 사시도이고, 도 5는 본 발명의 회로 케이스와 결합되는 방열부의 구성을 설명하는 평면도이다.Figure 4 is a perspective view showing the configuration of a circuit case in an embodiment of the present invention, Figure 5 is a plan view illustrating the configuration of the heat dissipation unit coupled to the circuit case of the present invention.

회로 케이스(210)는 전면이 막힌 원통형상으로 이루어지며, 전면에 인접된 부위의 외주면에는 확산판(310)에 걸릴 수 있도록 돌출턱(211)이 형성되며, 후면단부에는 방열부(400)의 원호상의 광폭 절개부(421), (425)들에 삽입되고, 소폭 절개부(423), (427)를 따라 회전시킬 때 소폭 절개부(427)에 걸쳐지는 걸침부(213), (215)가 외측으로 절곡 형성된다.The circuit case 210 has a cylindrical shape in which the front surface is blocked, and a protruding jaw 211 is formed on an outer circumferential surface of a portion adjacent to the front surface so as to be caught by the diffusion plate 310, and at the rear end of the heat dissipation unit 400. Interstitial portions 213 and 215 that are inserted into the arc-shaped wide cuts 421 and 425 and span the narrow cuts 427 when rotating along the narrow cuts 423 and 427. Is bent outwardly.

방열부(400)는 중앙의 부싱(413)을 중심으로 대칭형상으로 원호상의 두 개의 절개부가 형성되되 각각의 절개부는 광폭 절개부(421), (425)가 형성되고, 광폭 절개부(421), (425)에 연장되는 소폭 절개부(423), (427)가 형성된다.The heat dissipation unit 400 has two circumferential cutouts formed in a symmetrical shape around the center bushing 413, and each cutout is formed with wide cutouts 421 and 425, and a wide cutout 421. Narrow cuts 423, 427 extending at 425 are formed.

회로 케이스(210)를 방열부(400)에 결착시에는 회로 케이스(210)의 걸침부(213), (215)를 광폭 절개부(421), (425)에 삽입시킨 후 소폭 절개부(423), (427)를 따라서 회전시키면 걸침부(213), (215)가 소폭 절개부(423), (427)로부터 이탈되지 않도록 한다. 탈착시에는 반대로 회전시켜 걸침부(213), (215)가 광폭 절개부(421), (425)로 빠져 나가도록 함으로써 착탈가능하게 결합되도록 한다.When the circuit case 210 is attached to the heat dissipation part 400, the hook parts 213 and 215 of the circuit case 210 are inserted into the wide cutouts 421 and 425 and then the narrow cutouts 423. Rotation along the (427), so that the hook portion (213), (215) is not separated from the narrow incision (423), (427). In the case of detachment, the rotating parts 213 and 215 are rotated in the opposite direction to be detachably coupled to the wide cutouts 421 and 425.

또한 방열부(400)에는 두 개의 설치 클립(370), (371)이 스프링에 의하여 탄발되도록 설치되어 있어 벽체에 고정시킬 수 있도록 구성된다.In addition, the heat dissipation unit 400 is installed so that the two mounting clips 370, 371 is elasticated by the spring is configured to be fixed to the wall.

이와 같이 구성된 LED 등기구(200)는 케이스 몸체(390)의 후면에 방열판(400)이 설치되고, 방열판(400)의 전면에 LED 기판(350)이 설치되고, LED 기판(350)의 중앙을 회로 케이스가 관통하도록 하여 방열부(400)에 착탈가능하게 결합 되도록 하여 수명이 LED 기판(350)의 전면에 설치된 LED 보다 짧은 회로부품들을 교체하거나 수리할 수 있도록 함으로써 케이스 몸체(390)등에 부착된 LED 기판(350), 방열부(400) 등을 위치 변동 없이 수리할 수 있도록 한다. 이때 방열부(400)를 통하여 회로 케이스(210)의 회로기판에 인입되는 전선은 회로 케이스(210)를 분리하여 이격될 수 있도록 충분히 길게 연결하는 것이 바람직하다.The LED luminaire 200 configured as described above is provided with a heat sink 400 on the back of the case body 390, the LED substrate 350 is installed on the front of the heat sink 400, the center of the LED substrate 350 to the circuit LEDs attached to the case body 390 by allowing the case to penetrate and detachably coupled to the heat dissipation unit 400 so that the circuit parts having a lifespan shorter than the LEDs installed on the front of the LED substrate 350 can be replaced or repaired. The substrate 350, the heat dissipation unit 400 and the like can be repaired without a change in position. In this case, it is preferable that the wires introduced into the circuit board of the circuit case 210 through the heat dissipation unit 400 be connected long enough to separate and separate the circuit case 210.

본 발명의 일실시예는 회로 케이스(210)가 LED 기판(351)을 관통하여 방열부(400)에 착탈가능하게 결합되는 구조를 예시하고 있으나, 당업자는 LED 기판(351)에 착탈가능하게 결합되는 구성으로 제작될 수 있듯이 다양한 변형이 존재할 수 있으며, 본원 발명의 권리범위는 후술되는 청구범위에 의하여 정하여 져야 한다.One embodiment of the present invention illustrates a structure in which the circuit case 210 is detachably coupled to the heat dissipation unit 400 through the LED substrate 351, but those skilled in the art can detachably couple to the LED substrate 351. Various modifications may be present as may be made to the configuration, and the scope of the present invention should be defined by the claims that follow.

210: 회로케이스, 230, 250: 회로기판, 310: 확산판, 350:LED
351: LED 기판, 390: 케이스 몸체, 400: 방열부 413: 부싱
421, 425: 광폭 절개부 423, 427: 소폭 절개부 210: circuit case, 230, 250: circuit board, 310: diffuser plate, 350: LED
351: LED substrate, 390: case body, 400: heat sink 413: bushing
421, 425: wide incision 423, 427: narrow incision

Claims (5)

케이스 몸체;
상기 케이스 몸체 내부에 설치되어 상기 케이스 몸체의 전면에 불빛을 투사하는 LED들이 설치되는 LED 기판;
상기 LED 기판에 수직으로 전면을 향하도록 설치되며 내부에 상기 LED들에 전원을 공급하기 위한 전원회로가 설치되는 회로 케이스를 포함하며,
상기 회로케이스는 상기 케이스 몸체에 착탈가능하게 결합되는 것을 특징으로 하는 LED 등기구.Case body;
An LED substrate installed in the case body and configured to project LEDs on a front surface of the case body;
It is installed so as to face the front vertically to the LED substrate and includes a circuit case there is installed a power circuit for supplying power to the LEDs therein,
The circuit case is LED lamp, characterized in that detachably coupled to the case body. 청구항 1에서, 상기 케이스 몸체는 상기 LED 기판의 후면에 설치되는 방열부를 구비하며, 상기 회로 케이스의 전원회로에는 상기 방열부의 중앙에 형성된 부싱을 통하여 전선이 인입되어 연결되고, 상기 회로케이스는 상기 LED 기판의 중앙에 형성된 관통공을 통하여 삽입되어 상기 방열부에 착탈가능하게 결합되는 것을 특징으로 하는 LED 등기구. The method of claim 1, wherein the case body has a heat dissipation unit is installed on the back of the LED substrate, the power supply circuit of the circuit case is connected to the wire through the bushing formed in the center of the heat dissipation unit, the circuit case is the LED The LED luminaire, characterized in that is inserted through the through hole formed in the center of the substrate detachably coupled to the heat dissipation unit. 청구항 2에서, 상기 방열부는 상기 부싱을 중심으로 원호상의 두 개의 절개부들이 형성되되 상기 절개부들은 광폭절개부와 상기 광폭절개부에 연장되는 소폭절개부로 이루어지는 것을 특징으로 하는 LED 등기구.The LED lamp of claim 2, wherein the heat dissipation portion includes two arc-shaped cutouts formed around the bushing, wherein the cutouts include a wide cutout and a narrow cutout extending to the wide cutout. 청구항 3에서, 상기 회로 케이스는 원통형상으로 이루어지되 단부에는 외측으로 절곡되는 걸림부가 상기 회로 케이스의 중심에 대칭으로 두개 형성되며, 상기 회로 케이스를 상기 방열부에 결합시 상기 걸림부를 상기 광폭절개부를 통과시켜 소폭절개부로 회전시키는 것을 특징으로 하는 LED 등기구. The circuit case of claim 3, wherein the circuit case is formed in a cylindrical shape, and two end portions bent outwardly are symmetrically formed at the center of the circuit case. An LED luminaire characterized in that it is passed through and rotated by a narrow incision. 케이스 몸체;
상기 케이스 몸체 내부에 설치되어 상기 케이스 몸체의 전면에 불빛을 투사하는 LED들이 설치되는 LED 기판;
상기 케이스 몸체 또는 상기 LED 기판 중 어느 하나에 착탈가능하게 결합되며, 상기 LED 기판에 수직으로 전면을 향하도록 설치되며 내부에 상기 LED들에 전원을 공급하기 위한 전원회로가 설치되는 회로 케이스를 포함하는 것을 특징으로 하는 LED 등기구.Case body;
An LED substrate installed in the case body and configured to project LEDs on a front surface of the case body;
Removably coupled to any one of the case body or the LED substrate, it is installed so as to face the front vertically to the LED substrate and includes a circuit case is installed therein a power circuit for supplying power to the LEDs therein; LED luminaires characterized in that.
KR1020100085238A 2010-09-01 2010-09-01 LED light KR101181340B1 (en)

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11339543A (en) 1998-05-29 1999-12-10 Toshiba Tec Corp Flush mount ceiling luminaire

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11339543A (en) 1998-05-29 1999-12-10 Toshiba Tec Corp Flush mount ceiling luminaire

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