KR101179357B1 - Antenna pattern frame, electronic device case provided with antenna pattern frame and electronic device including electronic device case - Google Patents

Abstract

An antenna pattern frame according to an embodiment of the present invention includes a film radiator including a protective film for supporting one or both sides of the radiator, the antenna pattern portion is formed; And an emitter to which the film radiator is attached and fixed, and the radiator frame allowing the antenna pattern part to be embedded in a case of the electronic device.

Description

An antenna pattern frame, an electronic device case having an antenna pattern frame, and an electronic device including an electronic device case.

An electronic device including an antenna pattern frame and an antenna pattern frame, and an electronic device including the electronic device case.

Electronic devices such as mobile communication terminals such as mobile phones, PDAs, navigation devices, and notebook computers that support wireless communication are indispensable in modern society. The mobile communication terminal is developing with the trend of adding functions such as CDMA, WLAN, GSM, DMB, etc., and one of the most important components for enabling these functions relates to an antenna.

The antenna used in such a mobile communication terminal is developed from an external type such as a rod antenna or a helical antenna to an internal type disposed inside the terminal.

The external type has a problem that is vulnerable to external shocks, the internal type has a problem that the volume of the terminal itself increases.

In order to solve this problem, researches for integrating antennas with mobile communication terminals, which are electronic devices, have been actively conducted.

An object of the present invention is to provide an antenna pattern frame formed by fixing a radiator on which an antenna pattern is formed to a protective film to form a film radiator, and fixing the film radiator to an radiator frame which is an injection molded product.

Another object of the present invention is to provide an electronic device case in which an antenna pattern is embedded using an antenna pattern frame to which the film radiator is fixed.

Still another object of the present invention is to provide an electronic device manufactured by using an antenna pattern frame to which a film radiator is fixed.

An antenna pattern frame according to an embodiment of the present invention includes a film radiator including a protective film for supporting one or both sides of the radiator, the antenna pattern portion is formed; And an emitter to which the film radiator is attached and fixed, and the radiator frame allowing the antenna pattern part to be embedded in a case of the electronic device.

In addition, the radiator of the antenna pattern frame according to an embodiment of the present invention to form a connection terminal portion for transmitting or receiving a signal of the antenna pattern portion to the circuit board of the electronic device and the antenna pattern portion and the connection terminal portion different planes. The antenna pattern part may be formed on one surface of the radiator frame, and the connection terminal part may be formed on an opposite surface of the radiator frame.

In addition, the connection portion of the antenna pattern frame according to an embodiment of the present invention may be fixed along the outer surface of the radiator frame.

In addition, the connection portion of the antenna pattern frame according to an embodiment of the present invention may be fixed along the through hole formed in the radiator frame.

In addition, the radiator of the antenna pattern frame according to an embodiment of the present invention includes a plurality, it may be fixed to the protective film.

In addition, the plurality of radiators of the antenna pattern frame according to an embodiment of the present invention further comprises a connection terminal unit for transmitting or receiving a signal of the antenna pattern unit to the circuit board of the electronic device, wherein the antenna pattern unit It is formed on one surface of the radiator frame, the connection terminal portion may be formed on the opposite surface of the radiator frame.

In addition, the radiator frame of the antenna pattern frame according to an embodiment of the present invention may include a receiving groove for receiving the film radiator.

In addition, the thickness of the film radiator of the antenna pattern frame according to an embodiment of the present invention may be the same depth of the receiving groove.

In addition, the film radiator of the antenna pattern frame according to an embodiment of the present invention is a guide pin hole of the manufacturing mold of the electronic device is located to prevent the movement of the radiator frame in the manufacturing mold of the electronic device. It may include.

In addition, the film radiator of the antenna pattern frame according to an embodiment of the present invention may be disposed on the cover portion of the radiator frame.

In another aspect, an electronic device case according to an embodiment of the present invention is an antenna pattern including a radiator frame which is an injection body to which a film radiator having a protective film for supporting one or both sides of the radiator on which the antenna pattern is formed is attached and fixed frame; And a case frame covering the one surface of the radiator frame on which the antenna pattern part is formed so that the antenna pattern part is buried between the radiator frame.

In addition, the case frame of the electronic device case according to an embodiment of the present invention is an injection molded body, the receiving groove corresponding to one surface of the radiator frame may be formed.

In addition, the case frame of the electronic device case according to an embodiment of the present invention may be manufactured by injection molding the radiator frame.

In addition, the radiator of the electronic device case according to an embodiment of the present invention to form a connection terminal portion for transmitting or receiving a signal of the antenna pattern portion to the circuit board of the electronic device and the antenna pattern portion and the connection terminal portion different planes. The antenna pattern part may be formed on one surface of the radiator frame, and the connection terminal part may be formed on an opposite surface of the radiator frame.

In addition, the electronic device case according to an embodiment of the present invention The connection part may be fixed along an outer surface of the radiator frame.

In addition, the connection portion of the electronic device case according to an embodiment of the present invention may be fixed along the through hole formed in the radiator frame.

In addition, the radiator of the electronic device case according to an embodiment of the present invention includes a plurality, it may be fixed to the protective film.

In addition, each of the plurality of radiators of the electronic device case according to an embodiment of the present invention further comprises a connection terminal unit for transmitting or receiving a signal of the antenna pattern portion to the circuit board of the electronic device, the antenna pattern portion the radiator It is formed on one surface of the frame, the connection terminal portion may be formed on the opposite surface of the radiator frame.

In addition, the radiator frame of the electronic device case according to an embodiment of the present invention may include a receiving groove for receiving the film radiator.

In addition, the thickness of the film radiator of the electronic device case according to an embodiment of the present invention and the depth of the receiving groove may be the same.

In addition, the film radiator of the electronic device case according to an embodiment of the present invention is a guide pin hole of the manufacturing mold of the electronic device is located to guide the hole to prevent the movement of the radiator frame in the manufacturing mold of the electronic device. It may include.

In addition, the film radiator of the electronic device case according to an embodiment of the present invention may be disposed on the cover portion of the radiator frame.

In another aspect, an electronic device according to an embodiment of the present invention includes an electronic device case; And a circuit board configured to transmit or receive a signal of the film radiator.

According to the antenna pattern frame, the electronic device case and the electronic device of the present invention, there is an effect that only the radiator, which is a metal plate, is disposed in the manufacturing mold of the antenna pattern frame, thereby eliminating the process of injecting at high temperature and high pressure.

In addition, since the plurality of antenna pattern parts may be fixed by one film radiator, the manufacturing mold design of the antenna pattern frame may not be complicated, and a plurality of various antenna patterns may be implemented in one antenna pattern frame.

In addition, since the manufacturing mold for mold injection molding is not required when manufacturing the antenna pattern frame, the antenna performance may be improved by not forming a pin hole for fixing with the manufacturing mold in the radiator itself.

In addition, compared to the case of two-time injection molding of the antenna pattern frame and the electronic device case, the manufacturing is simple, and the manufacturing cost can be reduced.

1 is a schematic perspective view showing a partially cut case of a mobile communication terminal which is an electronic device according to an embodiment of the present invention;
2 is a schematic exploded perspective view of a first embodiment of an antenna pattern frame according to the present invention;
3 is a rear perspective view of the antenna pattern frame of FIG. 2;
Figures 4a and 4b is a schematic plan view of the film emitter and the radiator according to the invention and the radiator is fixed to the protective film is formed.
5 is a cross-sectional view taken along the line AA of FIGS. 2 and 3.
6 is a schematic sectional view of a second embodiment of an antenna pattern frame according to the present invention;
7 is a schematic sectional view of a third embodiment of an antenna pattern frame according to the present invention;
8 is an exploded perspective view of a case of an human communication terminal which is an electronic device with an antenna pattern part embedded according to an embodiment of the present invention;
9 is a schematic diagram illustrating a first embodiment of a method of manufacturing a case of an electronic device having an antenna pattern portion embedded therein according to an embodiment of the present disclosure.
10 is a schematic diagram of a mold for manufacturing an electronic device case used in a second embodiment of a method for manufacturing a case of an electronic device having an antenna pattern portion embedded therein according to an embodiment of the present invention.
FIG. 11 is a schematic view showing a state in which a resin material is filled in the manufacturing mold of FIG. 10. FIG.
12 is a schematic partial cutaway perspective view of a notebook that is an electronic device according to another embodiment of the present invention.

Hereinafter, with reference to the drawings will be described in detail a specific embodiment of the present invention. It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the inventive concept. Other embodiments falling within the scope of the inventive concept may readily be suggested, but are also considered to be within the scope of the present invention.

The same or similar components appearing in the drawings of the respective embodiments within the same or similar concept will be described using the same or similar reference numerals.

1 is a schematic perspective view showing a partially cut case of a mobile communication terminal which is an electronic device according to an embodiment of the present invention, and FIG. 2 is a schematic exploded perspective view of a first embodiment of an antenna pattern frame according to the present invention. 3 is a rear perspective view of the antenna pattern frame of FIG. 2, FIGS. 4A and 4B are schematic plan views of a radiator according to the present invention and a film radiator fixed to a protective film, and FIG. 5 is FIGS. 2 and 3. A cross section of the AA line.

1 to 5, the film radiator 200 including the antenna pattern part 222 is embedded in the case 120 of the mobile communication terminal 100 which is an electronic device according to an embodiment of the present invention. It can be seen that. The film radiator 200 including the protective film 230 for supporting one or both sides of the radiator 220 in which the antenna pattern part 222 is formed so that the antenna pattern part 222 is embedded in the case 120. The antenna pattern frame 300 formed on the radiator frame 210 is required.

Electronics

The mobile communication terminal 100, which is an embodiment of the electronic device, may include an antenna pattern frame 300, a case frame 130, and a circuit board 140.

As shown in FIG. 1, the antenna pattern frame 300 may be fixed inside the case frame 130 of the mobile communication terminal 100. In addition, as will be described in detail below, the antenna pattern frame 300 may be molded into an electronic device manufacturing mold 500 for manufacturing the electronic device case 120 to be integrated into the case frame 130.

The circuit board 140 is mounted with an antenna pattern portion 222 of the film radiator 200 and circuit elements for transmitting or receiving signals, and are connected to the connection terminal portion 224 of the antenna pattern frame 300. The wiring 144 may be formed.

Antenna pattern frame

The radiator 220 may be made of a conductive material such as aluminum or copper to receive an external signal and transmit the external signal to a signal processing device of an electronic device such as the mobile communication terminal 100. In addition, the radiator 220 has an antenna pattern part 222 forming a meander line to receive external signals of various bands.

The film radiator 200 may include a protective film 230 that supports one or both surfaces of the radiator 220 on which the antenna pattern part 222 is formed.

The protective film 230 may be a polymer plastic material and may be a film of a flexible print circuit board (FPCB) material. The radiator 220 may be fixed to one or both surfaces of the radiator 220.

In this case, a plurality of radiators 220 may be fixedly adhered to the protective film 230. In the present embodiment, an embodiment consisting of two radiators 220 will be described in detail.

The two radiators 220 may include connection terminal parts 224a and 224b that transmit or receive the signals of the antenna pattern parts 222a and 222b to the circuit board 140 of the electronic device 100, respectively. have.

One or both surfaces of the two radiators 220 may be supported by the protective film 230. The antenna pattern parts 222a and 222b are formed on one surface 210a of the radiator frame 210, and the connection terminal parts 224a and 224b are formed on the opposite surface 210b of the radiator frame 210. Can be. That is, the antenna pattern parts 222a and 222b and the connection terminal parts 224a and 224b may form a plane different from the one surface 210a of the radiator frame 210 and the other surface 210b. Here, each of the radiators 220 may include connection parts 226a and 226b connecting the antenna pattern parts 222a and 222b and the connection terminal parts 224a and 224b.

The radiator frame 210 may include a flat portion 260 and a curved curve portion 240 having a flat top surface based on the shape of the top surface, and the curved portion by the elasticity of the film radiator 200. It can also be fixed to 240.

2 and 5, the first embodiment of the antenna pattern frame 300 may be described in detail. The radiator frame 210 of the first embodiment of the antenna pattern frame 300 may include a receiving groove 212 in which the film radiator 200 is accommodated.

Here, the thickness of the film radiator 200 and the depth of the receiving groove 212 may be the same. As described above, when the thickness of the film radiator 200 and the depth of the receiving groove 212 are the same, when injection molding a mold for manufacturing the electronic device case 120 (FIGS. 10 and 11), the flow of resin, which is an injection liquid, is used. You can improve your sex.

Meanwhile, referring to FIG. 4B, the film radiator 200 includes a guide pin 525 of the manufacturing mold 500 of FIGS. 10 and 11 of the electronic device case, so that the film radiator 200 is located within the manufacturing mold 500 of the electronic device case. At may include a guide pin hole 232 to prevent the movement of the radiator frame 210.

6 is a schematic cross-sectional view of a second embodiment of an antenna pattern frame according to the present invention, and FIG. 7 is a schematic cross-sectional view of a third embodiment of an antenna pattern frame according to the present invention.

Unlike the first embodiment, the second embodiment of the antenna pattern frame 300 of FIG. 6 has no receiving groove 212 for receiving the film radiator 200 on the radiator frame 210. The film radiator 200 is fixed to the outer surface of the radiator frame 210 by contact.

Here, the connection part 226 of the radiator 220 may be fixed along the outer surface of the radiator frame 210. In FIG. 6, the connection part 226 may be fixed to the side of the radiator frame 210. In this case, the protective film 230 may also include a connection part 236 covering the connection part 226.

The connection terminal part 224b may be exposed to the outside of the protective film 230 for connection with the connection pad 144 of the circuit board 140.

Unlike the first and second embodiments, the third embodiment of the antenna pattern frame 300 of FIG. 7 has a through hole 215 in which the connection part 226b of the radiator 220 is formed in the radiator frame 210. Can be fixed along).

The film radiator 200 may be fixed to the radiator frame 210 because of the elasticity of the protective film 230.

Electronic case and manufacturing method

8 is an exploded perspective view of a case of an human communication terminal which is an electronic device with an antenna pattern part embedded therein according to an embodiment of the present invention.

9 is a schematic diagram illustrating a first embodiment of a method of manufacturing a case of an electronic device having an antenna pattern portion embedded therein, and FIG. 10 is a view illustrating an antenna pattern portion embedded in an embodiment of the present invention. FIG. 11 is a schematic view showing a manufacturing mold of an electronic device case used in the second embodiment of the manufacturing method of the electronic device case, and FIG. 11 is a schematic view showing a resin material filled in the manufacturing mold of FIG.

Referring to FIG. 8, the electronic device case 120 has a state when the antenna pattern frame 300 including the film radiator 200 is integrated with the case frame 130.

That is, the electronic device case 120 may include an antenna pattern frame 300 and a case frame 130.

The antenna pattern frame 300 may include all of the above technical features and may be implemented in various embodiments.

The case frame 130 may be a pre-fabricated injection molding as shown in FIG. 9, and in this case, an accommodating part 132 may be formed in the case frame 130 to accommodate the antenna pattern frame 300. have.

In this case, an adhesive 410 may be applied to the upper surface of the antenna pattern frame 300 or the accommodating part 132 so that the antenna pattern frame 300 is adhered to the accommodating part 132.

Meanwhile, as shown in FIGS. 10 and 11, the case frame 130 may be injection molded to the radiator frame 210.

That is, the antenna pattern frame 300 and the case frame 130 may be integrated by inserting the antenna pattern frame 300 into the manufacturing mold 500 of the electronic device case 120 and insert injection.

Here, the case manufacturing mold 500 of the electronic device may include an upper mold 520, a lower mold 540, and an injection liquid injection hole 570. When the upper mold 520 and the lower mold 540 are combined, an inner space 550 is formed in the shape of the case frame 130.

The guide pin 525 formed in the upper mold 520 is inserted into the guide pin hole 232 formed in the film radiator 200 of the antenna pattern frame 300, so that the antenna pattern frame ( Flow in the interior space 550 of 300 may be prevented.

Since the guide pin hole 232 is formed, a hole may not be directly formed in the radiator 220 itself, and thus antenna performance may be improved.

Here, the guide pin 525 may be formed in the lower mold 540 or the upper and lower molds 520 and 540.

Electronic Application example

12 is a schematic partial cutaway perspective view of a notebook that is an electronic device according to another embodiment of the present invention.

Referring to FIG. 12, a notebook 800 which is an electronic device according to another embodiment of the present disclosure is disclosed.

Recently, the notebook 800 has a function of receiving a video signal of a low frequency band such as DMB. The case 800 of the notebook 800 in which the radiator 620 is embedded may be manufactured by applying the antenna pattern frame 600 to the notebook 800 as described above.

The radiator 620 may include antenna pattern portions 622a and 622b having different lengths, respectively, and the antenna pattern portions 622a and 622b are fixed with the protective film 630 and then the radiator frame 610 is disposed on the radiator frame 610. Can be fixed at

According to the antenna pattern frame, the electronic device case and the electronic device of the present invention, there is an effect that only the radiator, which is a metal plate, is disposed in the manufacturing mold of the antenna pattern frame, thereby eliminating the process of injecting at high temperature and high pressure.

In addition, since the plurality of antenna pattern parts may be fixed by one film radiator, the manufacturing mold design of the antenna pattern frame may not be complicated, and a plurality of various antenna patterns may be implemented in one antenna pattern frame.

In addition, since the manufacturing mold for mold injection molding is not required when manufacturing the antenna pattern frame, the antenna performance may be improved by not forming a pin hole for fixing with the manufacturing mold in the radiator itself.

In addition, compared to the case of two-time injection molding of the antenna pattern frame and the electronic device case, the manufacturing is simple, and the manufacturing cost can be reduced.

100: mobile communication terminal 120: case of electronic device
200: film emitter 210: radiator frame
300: antenna pattern frame

Claims (16)

A film radiator including a protective film supporting one or both surfaces of the radiator on which the antenna pattern part is formed; And
And a radiator frame to which the film radiator is attached and fixed, the radiator frame allowing the antenna pattern part to be embedded in a case of an electronic device.
The radiator includes a plurality, is fixed to the protective film,
Each of the plurality of radiators includes a connection terminal portion for transmitting or receiving a signal of the antenna pattern portion to a circuit board of the electronic device, and a connection portion for forming a different plane with the antenna pattern portion and the connection terminal portion.
The antenna pattern portion is formed on one surface of the radiator frame, the connecting terminal portion is formed on the opposite surface of the radiator frame. The method of claim 1,
And the connection part is fixed along an outer surface of the radiator frame. The method of claim 1,
And the connection part is fixed along a through hole formed in the radiator frame. The method of claim 1,
The radiator frame is an antenna pattern frame, characterized in that it comprises a receiving groove for receiving the film radiator. The method of claim 4, wherein
And the thickness of the film radiator and the depth of the receiving groove are the same. The method of claim 1,
The film radiator includes a guide pin hole for preventing the movement of the radiator frame in the manufacturing mold of the electronic device is located in the manufacturing mold of the electronic device. The method of claim 1,
The film radiator is an antenna pattern frame, characterized in that disposed on the cover of the radiator frame. An antenna pattern frame including a radiator frame which is an injection body to which a film radiator is attached and fixed, the protective film supporting one or both sides of a radiator on which an antenna pattern part is formed; And
And a case frame covering the one surface of the radiator frame in which the antenna pattern part is formed so that the antenna pattern part is buried between the radiator frame.
The radiator includes a plurality, is fixed to the protective film,
Each of the plurality of radiators includes a connection terminal part for transmitting or receiving a signal of the antenna pattern part to a circuit board of an electronic device, and a connection part for forming another plane on the antenna pattern part and the connection terminal part,
And the antenna pattern part is formed on one surface of the radiator frame, and the connection terminal part is formed on an opposite surface of the radiator frame. 9. The method of claim 8,
The case frame is an injection molded body, characterized in that the receiving groove corresponding to one surface of the radiator frame is formed. 9. The method of claim 8,
The case frame is an electronic device case, characterized in that the injection molded in the mold frame. 9. The method of claim 8,
And the connection part is fixed along an outer surface of the radiator frame. 9. The method of claim 8,
And the connection part is fixed along a through hole formed in the radiator frame. 9. The method of claim 8,
And the radiator frame includes a receiving groove in which the film radiator is accommodated. The method of claim 13,
And the thickness of the film radiator and the depth of the receiving groove are the same. 9. The method of claim 8,
The film radiator is an electronic device case, characterized in that disposed on the cover of the radiator frame. An electronic device case according to any one of claims 8 to 15; And
And a circuit board configured to transmit or receive a signal of the film radiator.

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