KR101178935B1 - Method for producing a product having a structured surface - Google Patents

Abstract

The object of the present invention is based on processing microstructures in glass or glass-like layers.
For this purpose, auxiliary substrates 10, 20 with structured surfaces 20a are used, which define a negative mold for the product to be produced. Thereafter, a layer of glass 30 or a glass-like material is applied to the structured surface 20a of the auxiliary substrate by evaporation coating. The auxiliary substrate is then removed in such a way that the relief structure is not covered, for example by wet chemical means.
The present invention makes it possible to produce excellent microchannels and optical microstructures such as microlenses.

Description

METHOD FOR PRODUCING A PRODUCT HAVING A STRUCTURED SURFACE}

The present invention relates to a method for producing a product having a structured surface, and generally to products of this type, and more particularly to a method for generating microstructures in glass.

Glass is valuable and used in a wide range of applications because of its excellent optical and chemical properties. For example, glass is very durable in water and water vapor, and especially in highly reactive components such as acids and bases. In addition, by the use of other compositions or additives, the glass is very variable and therefore suitable for a very wide range of applications.

One major application area for glass is optics and optoelectronics. For example, it is now unthinkable not to use optical components in the field of data transmission.

Especially in these applications, the components are getting very small, and as a result the demand for accuracy of the components continues to increase. There is a strong demand for extremely high optical quality light effects, for example refractive or diffractive elements. In this respect, optical microlenses may be mentioned by way of example only.

Because of the excellent optical properties of the glass. Glass is very suitable for this purpose. On the other hand, however, glass presents certain difficulties in use. For example, accurate machining of glass, in particular precision structuring, is a problem.

It is well known to etch glass by wet or dry chemical means, in particular only in the case of glass, with low etch rates, and as a result this process is slow, thereby making mass production very expensive. .

For example, it is also known to use photostructureable glasses such as FOTURAN ^™ . However, these types of glass are very expensive.

Using a laser, accurate structures can also be formed on the glass, which technique is also very slow and similarly mass production becomes very expensive.

In addition, there are many known mechanical machining processes, such as grinding and polishing, but these processes generally do not achieve the accuracy or precision that can be achieved by other processes.

It is therefore an object of the present invention to provide a method for producing a product having a structured surface in a simple and low cost.

Another object of the present invention is to provide a method for producing a product having a structured surface that is accurately and precisely positioned and / or allows for a variety of structuring.

It is a further object of the present invention to provide a method for producing a product having a structured, particularly microstructured surface suitable for, or not limited to, a material suitable for glass or having a glass structure.

It is a further object of the present invention to provide a method of producing a product having a structured surface that is suitable for mass production and which eliminates or at least reduces the disadvantages of the prior art.

The object of the invention is achieved very simply by the content of the independent claims. Advantageous refinements of the invention are defined in the dependent claims.

The present invention provides a process for producing a product with a structured surface in some way, in particular for producing microstructures, for example microlenses and / or microchannels in or from glass. The process includes providing an auxiliary substrate, structuring at least one surface of the auxiliary substrate, and applying a first layer of a first material to the structured surface of the auxiliary substrate.

In this specification, the structured surface of the auxiliary substrate need not be understood to mean the actual structured surface of the auxiliary substrate, but rather it is to be understood to include the structured surface of the layer applied to the auxiliary substrate. However, the auxiliary substrate may also be structured directly (see FIGS. 4A, 4B and 4C).

The use of an auxiliary substrate as an element defining the structure has been found to be very advantageous in the present invention, when suitable for the added layers, since the material of such an auxiliary substrate can be selected or adjusted based on the configurable properties. . In particular, the auxiliary substrate does not necessarily need to be transparent because it is removed again and not part of the final product. The removable auxiliary substrate is reusable if appropriate, thus also contributing to cost reduction.

Thus, the auxiliary substrate may preferably be separated or removed again after application of the first layer, if appropriate after further processing steps, in particular from the first layer or from the product. In other words, the first layer can be separated or removed from the auxiliary substrate while maintaining the structured surface.

Therefore, especially. In the method according to the invention, a negative mask or mold having a structured surface in a predetermined form is provided, and a positive impression of the structured surface of the negative mask in the first layer. In order to produce the first layer, the first layer is deposited on the intaglio mask.

It is preferred that a third material, in particular glass, a material with a glass structure or another, in particular a self-supporting carrier or product substrate material made of a transparent material is applied to the first layer.

The process according to the invention for producing a structured layer on a substrate, in particular a product substrate, does not allow the layer to be grown separately from the product substrate as in existing processes, but rather in terms of the product to be produced. It will be clear that this is a very surprising approach since it grows toward the surface, since the engraved technique used means that the structured layer is grown on the auxiliary substrate.

The method according to the invention is particularly advantageous in that it is simple, fast and low cost to produce microstructures in glass. It is also possible to produce very small, in particular diffractive or refractive structures, for example microlenses or microchannels, on the surface of the layer with the surface of the auxiliary substrate defining the corresponding negative molds.

In addition, the surface structure can be accurately predetermined and controlled by the engraving technology used, so that it is possible to achieve uniform product quality and high surface quality.

The first material is preferably glass or a glass-like material, and therefore it is possible to produce a structured glass layer in any form having the advantages outlined above. Microstructures, for example microlenses made of glass, glass-like materials or other transparent materials according to the invention have a wide range of potential applications in the field of glass fiber optics.

Suitable layers similar to glass are in particular SiO ₂ layers deposited by CVD (chemical vapor deposition) and doped with phosphorus and / or boron, for example. Phosphorus and boron are similarly deposited in the vapor phase. This type of layer has the advantage that the reflow temperature is lower than for glass.

Further, unexpected benefits of the present invention have been found that the products structured according to the present invention are well suited for use in microfluidics. It is particularly advantageous here that the glass layer with micro channels is characterized by high chemical stability.

Glass is characterized by a high degree of variability in terms of its thermal, mechanical and optical properties.

It is particularly preferred that the first layer or glass layer is deposited on the auxiliary substrate by evaporation coating. Electron beam evaporation coating processes or sputtering processes are known to be particularly suitable. Herein, evaporation coated glass, for example evaporation coated glass 8329 produced by Schott, is heated until it is evaporated in a vacuum chamber by an electron beam while condensing and vitrifying vapor on the auxiliary substrate. desirable.

In this respect, the present invention relates to the following patent application filed under the same name as the applicant of the present application, which is incorporated herein by reference.

Filed DE 202 05 830.1, April 15, 2002

Filed DE 102 22 964.3, 23 May 2002

Filed DE 102 22 609.1, May 23, 2002

Filed DE 102 22 958.9, 23 May 2002

Filed DE 102 52 787.3, November 13, 2002

Filed DE 103 01 559.0, January 16, 2002

The following parameters are advantageous for applying a continuous layer of glass.

Surface Roughness of Substrate: <50㎛

BIAS temperature during evaporation: ≒ 100 ℃

Barometric pressure during evaporation: 10 ^-4 mbar

The deposition or application of the first layer by evaporation coating is preferably accomplished by plasma ion assisted deposition (PIAD). In this case, an additional ion beam is applied on the substrate. The ion beam may be generated by ionization of a plasma source, for example a suitable gas. The plasma makes the layer even more dense and loosely attached particles are removed from the substrate surface. This results in particularly high density, low defect deposition layers.

According to a preferred embodiment of the invention, the first layer is for example chemically and / or mechanically planarized after the layer has been applied or deposited. Suitable processes for this purpose include wet chemical etching or grinding and / or polishing of the glass layer. In this case, the product substrate is preferably provided after the following planarization has been made.

It is preferred that the product substrate, in particular the product substrate freestanding and providing stability to the article, is applied to the flattened first layer or glass layer. In this case, the product substrate is, for example, anodically bonded to the first layer. Anodic bonding is beneficial in that it enables high chemical loads on the produced product.

Alternatively or additionally, the product substrate is adhesively bonded to the first layer. In particular in this case, it is advantageous that the flattening is omitted since the flatness is compensated for by the adhesive. In this example, the planarization is, as it were, affected by the adhesive. This simple embodiment is particularly suitable for non-optical products, for example those relating to microfluidics. The adhesive used is, for example, epoxy, in particular transparent epoxy resin.

Epoxy is used both during the anodic bonding and during the adhesive bonding, wherein a fixed and durable sandwich composite is implemented by the anodic bonding or the epoxy resin, the composite comprising the product substrate, the first layer or the glass layer, And the bonding layer, wherein the composite is obtained as an intermediate product or an end product after removal of the auxiliary substrate producible or produced by the process according to the invention.

In particular, the product substrate and / or the first layer are transparent, whereby the composite is particularly transparent to light or may be permeable to light, particularly in the visible or infrared region. In other words, according to the invention, a composite device optically for example refractive or diffractive is produced. Thus, for example, the present invention can be used to create an entire micro lens array.

Alternatively or additionally, further layers, such as, for example, antireflective coatings and / or infrared ray absorbing layers, are preferably applied to the planarized first layer, ie between the first layer and the product substrate. However, this type of layer or layers can also be applied to the product substrate on a bonded layer on opposite sides from the first layer. In this way, additional optical components are integrated.

According to a preferred embodiment of the invention, the auxiliary substrate comprises a freestanding carrier made of or composed of a second material. The second material used is preferably not glass, but a metal and / or metal alloy which is silicon and / or ceramic and / or aluminum for example.

According to any embodiment of the present invention, the auxiliary substrate, more precisely the second material, is directly structured and consequently additional layers may be applied prior to the deposition of the glass layer, although not necessarily additional layers need to be applied. Can be. In this embodiment, the auxiliary substrate is planarized by chemical or mechanical manner, for example by plane-lapping, prior to the structuring step or after the structuring step, as appropriate.

In order to expose the glass structure after the deposition of the glass layer, it is preferred that the auxiliary substrate is removed, in particular the second layer being substantially completely or at least partially etched away. For example, in the case of a silicon auxiliary substrate, the silicon auxiliary substrate is chemically dissolved by potassium hydroxide.

Alternatively or additionally to the embodiment described above, according to another embodiment, the auxiliary substrate comprises a self supporting carrier made of a second material and a structured layer applied to the carrier. In this case, it is preferred that the side of the structured layer, rather than the carrier, is structured.

The structured layer comprises in particular or consists of a resistor or photoresist. Gray scale resists are used in particular to produce analog structures, for example lenses. Following deposition of the glass layer, the structured layer is then completely or at least partially etched away, in particular removed by chemical dissolution.

According to a preferred embodiment of the invention, at least one or more intermediate layers are also disposed between the carrier and the structured layer. The intermediate layer or layers preferably comprise resist or consist of resist. In particular, the resist of the intermediate layer and the resist of the structured layer are made of different materials, whereby the resists can be selectively etched away.

 In a preferred embodiment, the auxiliary substrate or structured layer is structured by lithography. Alternatively or additionally, however, it is also possible that the structuring is produced mechanically by a precision master, for example by compression, in particular into a film or foil. Even in this simplification process, it is possible to achieve accuracy in the micrometer range.

For structures that require relatively low accuracy, for example, the structuring can be created by screen printing.

Applying or adhesively bonding a prestructured or microstructured film or foil to the auxiliary substrate is particularly simple and is therefore preferred.

The invention also relates to the inventions presented in German Utility Model Application U-202 05 830.1, filed April 15, 202 and German Patent Application DE-102 22 609.1, filed May 23, 202. Therefore, the contents of these two applications are incorporated herein by reference.

In the following, the invention will be explained in more detail on the basis of exemplary embodiments with reference to the drawings.

A method is provided for producing a product having a structured surface in a simple and low cost.

1A-1I illustrate the production of a product according to the invention, in accordance with a first embodiment of the invention.
2F-2G illustrate the production of a product according to the invention, in accordance with a second embodiment of the invention.
3a to 3f show the production of a product according to the invention, according to a third embodiment of the invention.
4A, 4C, and 4D illustrate the production of a product according to the invention, in accordance with a fourth embodiment of the invention.
5F and 5G illustrate the production of a product according to the invention, in accordance with a fifth embodiment of the invention.
6A, 6D and 6F illustrate the production of a product according to the invention, in accordance with a sixth embodiment of the invention.
7 shows the results of the TOF-SIMS measurement.
8 shows a photograph of a microscope image.
9 shows diagrammatically a wafer with a hole mask for a leaktightness test.

In the following, by way of example, six embodiments of the present invention are described, in which the features of the various embodiments can be combined with each other.

The figures show a schematic cross sectional view of the product at a corresponding production stage.

For the sake of clarity, figures representing the same or similar production stages have been represented by the same characters, with the result that any characters have been omitted in the order of the figures. The same and similar parts in the drawings are represented by the same reference numerals.

Example  One

1A shows an auxiliary substrate 10 made of silicon.

According to the next process step, a photoresist layer, more specifically gray scale resist 20, shown in FIG. 1B is applied to the top surface 10a of the substrate 10. The gray scale resist has the advantage that it is also possible to produce analog structures.

As shown in FIG. 1C, structures 21 to 24 are produced by gray scale lithography in the gray scale resist 20. The structures 21 and 22 represent two rotary symmetrical hollows designed as intaglio molds for two convex lenses. The structure 23 forms an intaglio mold for a triangular structure and the structure 24 represents an intaglio mold for a rectangular binary diffraction structure.

As shown in FIG. 1D, a first layer or glass layer 30 is deposited on top surface 20a of resist 20 by PVD (physical vapor deposition). In this example, deposition coated glass 8329 produced by Schott Glas is used as the material for the glass layer 30. Alternatively, however, it is also possible to actually use any other glass suitable for the evaporation coating. However, it is also possible to deposit other materials than glass, for example Al ₂ O ₃ or SiO ₂ .

In order to flatten the uneven surface 30a of the glass layer 30 as shown in FIG. 1D, the layer is planarized.

In this exemplary embodiment, the planarization is achieved by grinding and polishing the glass layer 30 at its side 30a of the glass layer 30 away from the auxiliary substrate 10. As a result, the glass layer 30 becomes a flat polished surface 30b. The result after the planarization step is shown in FIG. 1E.

As shown in FIG. 1F, a product substrate 50, which is not identical to the auxiliary substrate 10, is anodized to the surface 30b of the glass layer 30, which is referred to by reference numeral 40 in FIG. 1F. Is indicated by).

For example, the product substrate 50 used is a rolled plate, in particular D263 produced by Schott. Depending on any application, alkali free glass such as AF45, AF37 produced by Schott is also beneficial. Alternatively, float glass such as Borofloat 33 produced by Schoot, known under the trade name "Tenaer Glas", is used. The product substrate 50 is self supporting and stabilizes the product to be produced, and consequently in this example, the glass layer 30 may be self supporting, if desired, but not self supporting.

Thereafter, the auxiliary substrate 10 and the gray scale resist 20 are removed by etching the gray scale resist, whereby what remains as shown in FIG. 1G is the product substrate 50, the glass layer. Or glass structure 30 and the anodic bonding 40. The glass layer 30 has relief structures 31 to 34 complementary to the intaglio structures 21 to 24. The relief structures include two rotatable symmetrical convex lenses 31 and 32, a triangular protrusion 33 and a rectangular structure 34 having a diameter of about 1 mm. The structures 33 and 34 extend in a direction perpendicular to the plane of the figure. However, it will be apparent to those skilled in the art that the process according to the invention can be used to actually produce other desirable binary or non-binary structures in the glass layer 30. In particular, it is also possible to produce structures smaller than 500 μm, 200 μm, 100 μm, 50 μm, 20 μm and 10 μm. The product shown in FIG. 1G already represents an optically clear product with a microstructured surface. However, according to this exemplary embodiment, the article is further processed as shown in FIGS. 1H and 1I to obtain a product having double sided structured surfaces.

In FIG. 1H, an antireflective coating 60 is applied to the top surface 50a of the product substrate 50 away from the glass layer 30. Alternatively or additionally, it is also possible to apply, for example, an infrared absorbing layer and / or other optical layers.

As shown in FIG. 1I, a second structured glass layer is applied to the antireflective coating 60 by an anodic bonding 70. The second structured glass layer 80 is produced using the same process as the first structured glass layer 30. In this specification, the second structured glass layer 80 is applied to the antireflective coating 70 together with an associated photoresist and an auxiliary substrate (not shown), ie in a step corresponding to FIG. It would then be advantageous if the photoresist and auxiliary substrate (not shown) associated with the second glass layer 80 were only etched away.

Alternatively, the second structured glass layer before the auxiliary substrate 10 and the photoresist 20 are etched away from the first structured glass layer 30, ie in the step shown in FIG. 1F. 80 will also be applied to the product substrate 50 with the antireflective coating 60 and / or other layers, if appropriate. This process is advantageous in that the photoresists and auxiliary substrates associated with the first and second structured glass layers 30, 80 can be simultaneously etched away.

Example  2

2F shows the article adhesively bonded by an epoxy layer 41 rather than an anodic junction. The difference is that the product is produced in the same manner as the steps shown in Figs. 1A to 1D until the step shown in Fig. 2F.

Therefore, the starting point used to adhesively bond the product substrate or carrier 50 is the product prior to the step of planarizing the glass layer 30. The product substrate 50 is adhesively bonded to the non-flat glass layer 30 by epoxy. As shown in FIG. 2F, the epoxy 41 compensates for the flatness of the glass layer 30.

In FIG. 2G, the auxiliary substrate 10 and the photoresist 20 are etched away in the manner of the first embodiment.

The product 1 shown in FIG. 2G differs from the product shown in FIG. 1D in that it further has a triangular binary structure 35 instead of the binary structure 34. Microchannels 36 having a volume in the range of 0.1 to 2 μl are formed between the two triangular structures 33, 35 extending perpendicular to the plane of the figure. Therefore, the article 10 is particularly well suited for microfluidics, for example known as DNA processors, due to the biological neutrality of the glass.

As shown in FIG. 2G, in the article 1 according to the second embodiment of the present invention, since the bonded or attached layer 41 is not planar on both sides, the structured glass layer 30 And an epoxy having a refractive index similar to that of the product substrate 50 has been found to be a benefit.

Optical epoxy adhesives based on one component, such as "Delo Katiobond 4653" produced by Delo, have been found to be particularly suitable for use as epoxy 41, having a refractive index of n = 1.5 and a solvent-free UV adhesive.

In this case, the refractive index is selected as follows.

Product Board (50) Glass AF45 n = 1.52

Epoxy Layer (41) Delo Katiobond 4653 n = 1.50

Glass Layer 30 Evaporation Coated Glass 8329 n = 1.47

When Borofloat 33 (n = 1.47) or D263 (n = 1.52) is used as the material for the product substrate 50, the refractive index difference is small, and thus works well with the same epoxy. When other glasses are used in the glass layer 30 or the product substrate 50, an epoxy having a corresponding refractive index is selected. Epoxy with a refractive index of 1.3 to 1.7 is effective for this purpose.

Example  3

3A-3F illustrate the production of a product according to a third embodiment of the invention with unique binary structures.

First, in Fig. 3A, a self supporting auxiliary substrate 10 made of silicon is supplied. Thereafter, a first intermediate layer 15 is applied to the auxiliary substrate 10. The intermediate layer 15 may be a photoresist or a simple intermediate layer which is optically non-responsive, for example made of plastics material.

A photoresist layer 20 is applied to the intermediate layer 15 and structured in binary form, for example by photolithography. The result is shown in FIG. 3C.

Thereafter, in FIG. 3D, the glass layer 30 is applied by evaporation coating. As shown in FIG. 3E, the glass layer 30 is flattened and the product substrate 50 is anodized to the flattened glass layer 30.

Thereafter, the auxiliary substrate, the intermediate layer 15 and the photoresist layer 20 are etched away, thereby exposing the structured surface 30c of the glass layer 30 and consequently the figure. As shown in 3f, the optical product 1 is produced.

In this case, the intermediate layer 15 prevents the evaporation coated glass 30 from being adhesively bonded to the auxiliary substrate 10. As a result, the above-mentioned embodiment is particularly advantageous for the production of binary structures in which gray scale resists are not used.

Example  4

In FIG. 4A, an auxiliary substrate 10 is supplied for product production in accordance with a fourth embodiment of the present invention. The auxiliary substrate 10 is composed of a polished silicon wafer.

In FIG. 4C, a binary engraved structure 10a is produced directly on the auxiliary substrate 10, ie by wet chemical etching on the silicon.

Thereafter, the glass layer 30 is applied by evaporation coating and the product is further processed according to the remaining embodiments.

In this exemplary embodiment, the auxiliary substrate 10, more specifically the silicon, is dissolved by a KOH solution to expose the structured surface 30c.

Example  5

FIG. 5F shows a product according to the fifth embodiment, in a step corresponding to FIG. 3F, showing a slightly differently structured surface 30c. The surface 30c of the glass layer 30 has a recess 35 in the center and raised projections 36 on the outer edge.

In FIG. 5G, the bottom face of the protrusions 36 of the glass layer 30 on the article 1 is joined to the second protruding substrate 81 by a second anodic bonding 70. This creates a central cavity 35 around the MEMS (micro-electromechanical system) structure 82, which is sealed by this process.

Example  6

6A shows a pre-structured plastic film 25 that is commercially available from an embossed, for example 3M roll form.

The prestructured film 25 is applied to the auxiliary substrate 10 by, for example, adhesive bonding. Thereafter, the glass layer 30 is applied to the structured surface of the plastic film 25.

In FIG. 6F, the glass layer 30 descends and is anodized to the product substrate 50. Thereafter, the auxiliary substrate 10 and the plastic film 25 are removed, for example, by etching or by another separation method. The glass carrier 50 then produces a completely transparent article 1 with a structured surface on one side in the form of the structured glass layer 30.

In the following, the results of a number of tests performed on glass layers formed from Glas 8329 deposited by vapor coating are shown.

Figure 7 shows the result of the TOF-SIMS measurement, in which the count rate is shown as a function of sputtering time. The measurement specifies the profile of the element concentration in the glass layer. It was determined with respect to the glass layer that the constant of the layer thickness was less than 1%.

8 shows glass structures produced according to the invention from Glas 8329.

In addition, leakage testing of the copy protection layer formed from Glas 8329 is performed as follows.

The silicon wafer has an etch stop mask. As shown in FIG. 9, the wafer 97 is separated into nine hole regions 98 (1 cm x 1 cm). The individual holes spaced in this area vary with heat as follows.

First row: 1 mm hole spacing

Second row: 0.5 mm hole spacing

Third row: 0.2 mm hole spacing

All square holes 99 have an edge length of 15 μm.

After the unstructured back of the wafer is coated with 8 μm (Sample A) or 18 μm (Sample B) of Glas 8329, the wafer is dry etched from the hole surface to the glass. It is possible to observe the success of the etching under a transmitted light microscope.

For all 18 measured areas, the helium leak test showed a leak rate less than 10 ⁻⁸ mbar 1 / sec.

In each measurement area, the high strength of the areas of the glass layer is very surprising despite the significant bending of the wafer during the observation. There is no change in the glass structure even after heating at 200 ° C.

In addition, durability measurements were made on the glass layer in accordance with DIN / ISO. The results are shown in Table 1.

Sample designation: 8329 Hydrolysis resistance rating according to ISO 719 HCL consumption (ml / g) Na2O [μg / g] equivalent Commentary HGB 1 0.011 3 none Oxidation Resistance Rating to DIN 12 116 Substance removal [mg / dm ² ] Total Surface Area [cm ² ] Commentary / visible change 1 W 0.4 2 × 40 No change Alkali resistance rating according to ISO 695 Substance removal [mg / dm ² ] Total Surface Area [cm ² ] Commentary / visible change A2 122 2 × 14 No change

It will be apparent to those skilled in the art that the above-described embodiments will be understood by way of example only, and that the invention is not limited to these embodiments, but rather can be modified in various ways without departing from the spirit of the invention.

10: auxiliary substrate 10a: top surface
20: resist 20a: top surface
30: glass layer 30a, 30b, 30c: surface
31, 32, 33, 34: embossed structures 40: joint
41: epoxy layer 50: product substrate
50a: top surface 60: antireflective coating
70: anodic bonding 80: glass layer

Claims (12)

A method of making a product having a structured surface 30c comprising diffractive or refractive glass components, the method comprising:
a) providing an auxiliary substrate 10;
b) applying a photoresist or gray scale resist 20 on the auxiliary substrate to produce similar structures;
c) fabricating a secondary structured surface (20a) in the photoresist or gray scale resist (20);
d) depositing a glass layer (30) on the secondary structured surface (20a) to form a structured surface (30c) along the secondary structured surface (20a);
e) treating said glass layer (30) in preparation for bonding to a transparent product substrate (50);
f) bonding the glass layer (30) to the transparent product substrate (50); And
g) removing the auxiliary substrate 10 and the photoresist or gray scale resist 20 from the glass layer 30 to expose the structured surface 30c of the glass layer 30. And a product having a structured surface (30c). The method of claim 1,
The processing step e) comprises planarizing the side of the glass layer 30 away from the secondary structured surface 20a. How to make. The method of claim 2,
The bonding step f) comprises anodic bonding 40 the transparent product substrate 50 to the flattened side of the glass layer. How to make. The method of claim 1,
The treatment step e) has a step of applying an epoxy 41 to the side of the glass layer 30 away from the auxiliary structured surface 20a. How to manufacture the product. The method of claim 4, wherein
The bonding step f) comprises the step of adhesively bonding the transparent product substrate 50 to the glass layer 30 by means of the epoxy 41 to obtain a product having a structured surface 30c. How to make. The method of claim 1,
The removing step g) has a structured surface 30c, characterized in that it comprises at least partially etching the auxiliary substrate 10 to expose the structured surface 30c of the article. How to manufacture the product. The method of claim 1,
A first structured surface 30c is fabricated on the first side of the transparent product substrate 50 and a second structured surface 80 is fabricated on the second side of the transparent product substrate 50. To a product having a structured surface (30c). The method of claim 1,
The exposed structured surface (30c) coupled to the transparent product substrate (50) is anodically bonded to a second product substrate (81). The method of claim 1,
Said auxiliary structured surface is formed of a pre-structured film or foil (25). An optically clear article having a micro structured surface comprising diffractive or refractive glass lenses,
A transparent product substrate 50; And
A glass layer 30 bonded to the transparent product substrate,
The glass layer 30 is formed according to steps a) to d) of claim 1 and has a microstructured surface, characterized in that it has a structured surface 30c comprising the diffractive or refractive glass lenses. Optically transparent products. 11. The method of claim 10,
The transparent product substrate 50 has a side 50a coated 60 with an antireflective or infrared absorbing layer, the side 50a being remote from the glass layer 30 having the structured surface 30c. An optically clear article with a micro structured surface, characterized in that it is a side on the side. 11. The method of claim 10,
The transparent product substrate 50 has a first side provided with the first glass layer 30 and a second side provided with the second glass layer 80, the first glass layer 30 and And wherein said second glass layer has structured surfaces formed according to steps a) to d) of claim 1.

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