KR101177619B1 - Pad dressing apparatus - Google Patents

Abstract

A pad dressing device is disclosed. The pad dressing device comprises a plate; And a plurality of cutting portions surrounding the center of the plate and disposed on the plate, wherein the cutting portions include a cutting area that becomes larger in width as it moves away from the center of the plate.

Description

Pad dressing device {PAD DRESSING APPARATUS}

An embodiment relates to a pad dressing device.

In order to polish the wafer, a pad is used. Of particular importance for the quality of polishing is the distribution of abrasive particles throughout the pad. The top of the pad supports the particles by fibrous or small pores, which provide sufficient friction to inhibit the dropping of the particles due to the centrifugal force generated by the rotational movement of the pad. Therefore, it is important to keep the top of the pads as flexible as possible, to keep the fibers upright as much as possible, and to ensure that there are abundant open voids to accommodate the newly treated abrasive particles.

At this time, the pad dresser holding the pad surface can be used to regenerate the pad surface by "combing" or "cut". This process is known as "dressing" and "conditioning" of the pad. Many types of apparatus and processes have been used for this purpose. One such device is a dresser having a plurality of ultrahard crystalline particles, such as diamond particles attached to a metal-matrix surface.

Embodiments provide a pad dressing device for uniformly dressing a pad.

Pad dressing apparatus according to an embodiment includes a plate; And a plurality of cutting portions surrounding the center of the plate and disposed on the plate, wherein the cutting portions include a cutting area that becomes larger in width as it moves away from the center of the plate.

The pad dressing apparatus according to the embodiment includes a cutting area that becomes larger in width as it moves away from the center of the plate. For example, the cutting region may have a triangular or scalloped shape with the vertices facing the center of the plate.

Accordingly, the pad dressing apparatus according to the embodiment has a higher cutting force toward the outer portion and can uniformly dress the pads of the wafer double-side polishing apparatus.

Accordingly, the wafer double-side polishing apparatus including the pad dressed by the pad dressing apparatus according to the embodiment can produce a wafer having improved flatness.

1 is an exploded perspective view illustrating a pad dresser according to an embodiment.
2 is a plan view illustrating a pad dresser according to an embodiment.
3 is a view showing a part of the pad dresser according to the embodiment.
4 is a cross-sectional view illustrating a cross section taken along AA ′ in FIG. 3.
5 is a plan view illustrating a state in which a pad dresser according to an embodiment is mounted on a wafer double-side polishing apparatus.
6 is a plan view illustrating a pad dresser # 1 according to the experimental example.
7 is a plan view illustrating a pad dresser # 2 according to a comparative example.
8 is a view showing the pad dressing degree of the experimental and comparative examples.

In the description of the embodiment, in the case where each pad, plate, wafer, or region is described as being formed "on" or "under" of each pad, plate, wafer, or region, "On" and "under" include both being formed "directly" or "indirectly" through other components. In addition, the upper or lower reference of each component is described with reference to the drawings. The size of each component in the drawings may be exaggerated for the sake of explanation and does not mean the size actually applied.

1 is an exploded perspective view illustrating a pad dresser according to an embodiment. 2 is a plan view illustrating a pad dresser according to an embodiment. 3 is a view showing a part of the pad dresser according to the embodiment. FIG. 4 is a cross-sectional view illustrating a cross section taken along line AA ′ in FIG. 3. 5 is a plan view illustrating a state in which a pad dresser according to an embodiment is mounted on a wafer double-side polishing apparatus.

1 to 4, the pad dresser 10 according to the embodiment includes a plate 100 and a plurality of cutting parts 200.

The plate 100 is a hollow disc. That is, the plate 100 is a circular plate 100 having a hollow 101 is formed by opening the central portion. That is, when viewed in plan, the plate 100 may have a closed loop shape, that is, a donut shape.

The plate 100 may have a thickness of about 2 mm to about 20 mm. Examples of the material used for the plate 100 may include an alloy such as stainless steel, a metal, a ceramic, and the like.

A fastening hole for fastening the cutting parts 200 is formed on an upper surface of the plate 100. That is, the plate 100 fastens the cutting parts 200.

The plate 100 includes a plurality of gears 102 formed on the outside. That is, the plate 100 may be driven by the gears 102 formed on the outside.

The size of the plate 100 may vary. For example, the plate 100 may have various diameters according to the size of the pad to be cut. In addition, the diameter of the hollow 101 may also be variously adjusted.

The cutting parts 200 are disposed on the plate 100. The cutting parts 200 surround the center of the plate 100. That is, the cutting parts 200 surround the circumference of the hollow 101. The cutting parts 200 are arranged in rows along the periphery of the hollow 101. In this case, the cutting parts 200 are spaced apart from each other at regular intervals.

In addition, the cutting parts 200 are fixed to the plate 100. That is, the cutting parts 200 are fastened to the plate 100. As shown in FIGS. 3 and 4, the cutting parts 200 include a body 210, a plurality of cutting particles 220, and a coating layer 230.

The body portion 210 is disposed on the plate 100. The body portion 210 is fixed to the plate 100. Although not shown in the figure, the body portion 210 may be fastened to the upper surface of the plate 100 by a bolt or the like. That is, the body portion 210 may include a fastening groove into which the bolt and the like may be inserted.

The body portion 210 has a plate 100 shape. Examples of the material used as the body portion 210 may be a metal, an alloy or a ceramic.

In addition, the body portion 210 includes a plurality of receiving grooves for accommodating the cutting particles 220. For example, one cutting particle may be accommodated in one receiving groove. Alternatively, two or more cutting particles 220 may be accommodated in one receiving groove.

The cutting particles 220 are disposed in the body portion 210. In more detail, the cutting particles 220 may be disposed in the receiving grooves, respectively. In this case, the cutting particles 220 are partially inserted into the receiving grooves. That is, a part of the cutting particles 220 is inserted into the body portion 210, and another part of the cutting particles 220 is exposed from the body portion 210.

The cutting particles 220 have a high hardness. Examples of the material used as the cutting particles 220 may include diamond, polycrystaline diamond (PCD), cubic boron nitride, polycrystaline boron nitride (PCBN), and the like.

As shown in FIG. 3, the cutting particles 220 are disposed in a specific area of the body portion 210. For example, the cutting particles 220 define a cutting area 201 and are disposed in the body portion 210. That is, the cutting part includes the cutting area 201 defined by the cutting particles 220. That is, the region where the cutting particles 220 are disposed is the cutting region 201.

The cutting area 201 has a shape in which the width is wider as it gets further from the center of the plate 100. In other words, the width W1 of the cutting region 201 becomes larger as it moves away from the center of the hollow 101.

The cutting area 201 may have a triangular or fan shape when viewed in a plan view. In this case, the vertex 203 of the cutting area 201 may face the center of the plate 100. That is, the cutting region 201 may have a triangular or fan shape in which one vertex 203 faces the center of the hollow 101.

The diameter and eccentricity of the cutting particles 220 may be variously adjusted according to the type of pad to be cut. In addition, the density of the cutting particles 220 disposed in the cutting area 201 may also be variously adjusted according to the type of pad to be cut.

The cutting particles 220 in FIGS. 3 and 4 are shown to be exaggerated for explanation, and the size of the cutting particles 220 in the drawing does not mean an actual size.

The region where the cutting particles 220 are not disposed is defined as the non-cutting region 202. That is, the non-cutting area 202 is adjacent to the cutting area 201 and is an area in which the cutting particles 220 are not disposed in the body portion 210. That is, the cutting particles 220 are not disposed on the upper surface of the cutting part 200.

The non-cutting area 202 includes a first non-cutting area 202a and a second non-cutting area 202b. The first non-cutting area 202a and the second non-cutting area 202b face each other with the cutting area 201 interposed therebetween. The first non-cutting area 202a and the second non-cutting area 202b may have symmetrical structures.

The width W2 of the first non-cutting area 202a is smaller as it moves away from the center of the plate 100. Similarly, the width W3 of the second non-cutting area 202b becomes smaller as it moves away from the center of the plate 100.

That is, as the distance from the center of the plate 100, the width W2 of the first non-cutting area 202a and the width W3 of the second non-cutting area 202b become smaller, The width W1 of the cutting area 201 becomes larger and larger.

The width of each of the regions 201 and 202 means a width measured in a direction perpendicular to a straight line passing through the center of the plate 101, that is, a straight line in the radial direction.

The cutting zone 201 has a high cutting force. That is, the cutting area 201 is an area for cutting the pad by the cutting particles 220. In contrast, the non-cutting area 202 has a very low cutting force. In more detail, the non-cutting area 202 has little cutting force. For example, the cutting unit may dress the pad only into the cutting area 201.

The coating layer 230 is disposed on the upper surface of the body portion 210. That is, the coating layer 230 is coated on the upper surface of the body portion 210. The coating layer 230 may be a metal layer electroplated on the body portion 210. For example, the coating layer 230 may be formed by electroplating a metal such as nickel on the body portion 210.

The cutting particles 220 may be inserted into the body portion 210 by the pressure. That is, the coating layer 230 is formed by electroplating of the body portion 210, and then the cutting particles 220 are disposed on the upper surface of the body portion 210. In this case, the cutting particles 220 are disposed only in the cutting area 201.

Thereafter, pressure is applied to the cutting particles 220 by an alloy sheet having a flat lower surface. Accordingly, the cutting particles 220 may be inserted into the body portion 210, and at the same time, the receiving grooves may be formed in the body portion 210.

Since the cutting area 201 has a larger width toward the outside, the pad dresser 10 according to the embodiment has a higher cutting force toward the outside. In particular, the cutting area 201 has a triangular or scalloped shape, and the vertex 203 faces the center of the plate 100. Accordingly, in the pad dresser 10 according to the embodiment, the cutting force may increase rapidly toward the outer region.

That is, the pad dresser 10 according to the embodiment has a high rate of increase in cutting force when going to the outer region, so that the polishing pad can be cut more uniformly.

Referring to FIG. 5, a pad dresser 10 according to an embodiment dresses polishing pads of a double side polishing (DSP) device.

The double-sided polishing apparatus includes a lower platen, an upper platen, a sun gear 40 and an outer gear 50. In addition, although not shown in the drawing, the double-side polishing apparatus may further include a carrier for receiving the wafer.

The lower plate has a circular plate shape. The lower surface plate includes a first body and a first polishing pad 22.

The first body supports the first polishing pad 22. The first body has a circular plate shape. The first body may be rotated by a driving means such as a motor. As the first body rotates, the first polishing pad 22 also rotates together.

The first polishing pad 22 is disposed on the first body. The first polishing pad 22 may be combined with the first body. The first polishing pad 22 may be integrally formed with the first body. The first polishing pad 22 may directly contact the lower surface of the wafer to polish the lower surface of the wafer.

The upper surface plate is disposed on the lower surface plate. The upper plate is spaced apart from the lower plate and faces the lower plate. That is, the upper plate and the lower plate face each other.

The upper plate has a circular plate shape. The upper surface plate includes a second body and a second polishing pad.

The second body supports the second polishing pad. The second body has a circular plate shape. The second body may be rotated by a driving means such as a motor. At this time, as the second body rotates, the second polishing pad also rotates together.

The second polishing pad is disposed below the second body. The second polishing pad may be combined with the second body. The second polishing pad may be integrally formed with the second body. The second polishing pad may be in direct contact with the top surface of the wafer to polish the top surface of the wafer.

The sun gear 40 is gear-coupled with the carrier or pad dresser 10. That is, the carrier or pad dresser 10 is driven by the rotation of the sun gear 40.

The outer gear 50 is disposed between the upper and lower plates. The outer gear 50 surrounds the sun gear 40. The wrap gear is gear-coupled with the carrier or pad dresser 10 to transmit power to the carrier or pad dresser 10.

As shown in FIG. 5, one or more pad dressers 10 are disposed inside the outer gear 50 and outside the sun gear 40. At this time, some of the pad dressers may be inverted to dress the first polishing pad 22. That is, the cutting area of some of the pad dressers may be in contact with the first polishing pad 22. In addition, the cutting area of some other pad dressers is in contact with the second polishing pad.

Thereafter, the pad dressers 10 are driven by driving the sun gear 40 and / or the outer gear 50, and the first polishing pad 22 and the second polishing pad are dressed. . Alternatively, the first polishing pad 22 and the second polishing pad may be dressed by rotating the first polishing pad 22 and the second polishing pad.

In addition, the features, structures, effects and the like described in the embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, and the like illustrated in the embodiments may be combined or modified with respect to other embodiments by those skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It will be understood that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Experimental Example

As shown in FIG. 7, a stainless steel plate having a hollow and having a diameter of about 595 mm was provided. At this time, the diameter of the hollow was about 442 mm. In addition, a plurality of cutting parts 200 including a cutting area 201 having a fan shape is fastened to the plate. Diamonds of 170 mesh size were inserted into the cutting zone 201 at a density of about 420 / cm 2. Thus, pad dresser # 1 was manufactured. Thereafter, the sun gear was not rotated, only the outer gear was rotated, and the polishing pad was cut while the pad dresser # 1 was processed once.

Comparative example

As shown in FIG. 8, a plate of the same type as the experimental example was provided. Also, diamonds were inserted under the same conditions as in the experimental example, and the cutting parts 200b having the entire upper surface of the cutting area 203 were fastened to the plate to manufacture a pad dresser # 2. Thereafter, the pad dresser # 2 was used under the same conditions as in the experimental example, and the polishing pad was cut.

Referring to Figure 9, it can be seen that the polishing pad dressed by the pad dresser # 1 of the experimental example has a higher flatness.

Pad Dresser: 10
Plate: 100
Cuttings: 200
Body: 210
Cutting Particles: 220
Coating Layer: 230
Cutting area: 201
Non-cutting area: 202
Sun gear: 40
Outer gear: 50
1st polishing pad: 22

Claims (9)

plate; And
Surrounding a center of the plate and including a plurality of cuttings disposed on the plate,
The cutting portions include a cutting area that becomes wider as the distance from the center of the plate increases,
The cutting area includes a vertex toward the center of the plate,
And the cutting parts are fastened to the plate. The pad dressing apparatus of claim 1, wherein the cutting area has a triangular or scalloped shape. The pad dressing apparatus of claim 1, further comprising a plurality of gears disposed outside the plate. The pad dressing apparatus of claim 1, wherein the cutting part comprises a plurality of cutting particles disposed in the cutting area. 5. The pad dressing apparatus of claim 4, wherein the cutting particles are diamond particles. The method of claim 5, wherein the cutting portion comprises a body portion is formed a plurality of holes,
And the cutting particles are disposed inside the holes. delete The pad dressing apparatus of claim 1, wherein the cutting portions include a non-cutting region adjacent to the cutting region, the width of which decreases as the distance from the center of the plate becomes smaller. plate; And
Surrounding a center of the plate and including a plurality of cuttings disposed on the plate,
The cutting portions include a cutting area that becomes wider as the distance from the center of the plate increases,
The cutting area includes a vertex toward the center of the plate,
The cutting portions are adjacent to the cutting region and include a non-cutting region that becomes smaller in width as it moves away from the center of the plate,
The non-cutting area includes a first non-cutting area and a second non-cutting area,
And the cutting area is disposed between the first non-cutting area and the second non-cutting area.

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