KR101177292B1 - A bonding method and apparatus for electroinc elements using laser beam - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for bonding various types of electronic components to a surface of a glass substrate or film in a manufacturing process such as a flat panel display using a laser.
According to the present invention, in the bonding method of an electronic component to press the base member and the member to be joined to each other while irradiating a laser beam to the bonding region to perform a fusion bonding, the bonding between the lower support member and the upper pressing member is bonded to the bonding region. A first step of loading the base member, the bonding material and the member to be bonded to the upper position of the lower support member in a stacked state, and a laser beam including a coating portion for controlling the transmission amount of the laser beam together with the upper pressing member A second step of positioning the transmission member on the upper portion of the bonding region, and transmitting and projecting a predetermined laser beam to the bonding region while transmitting a predetermined laser beam to the bonding region while controlling the transmission amount by transmitting the laser beam transmission member having a coating portion thereon; Press to press the bonding area to melt-bond the base member and the member to be joined to produce a joined product. Bonding method of the electronic component using a laser comprising a third step and a fourth step of positioning the upper pressing member in the rising position and the unloading of the bonded article melt-bonded in the third step to the outside and specifically A bonding device is provided.

Description

A bonding method and apparatus for electroinc elements using laser beam}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for bonding various types of electronic components to a surface of a glass substrate or film in a manufacturing process such as a flat panel display by using a laser. The present invention relates to a method and apparatus for bonding an electronic component using a laser to adjust a transmission amount and to maintain a uniform temperature distribution of a bonding area to improve product quality and to flexibly cope with problems occurring in a process.

In general, anisotropic conductive film (ACF) is bonded to a surface of a base substrate such as a glass substrate or film in a manufacturing process such as a flat panel display. Started.

As described above, the conventional bonding technology for plastics using laser is one of two materials to be bonded, one of which is excellent in permeability to the laser beam, and the other of which is a material of high absorption. The principle is that the laser beam passes through the material with excellent permeability and reaches the material with high absorption, and is absorbed by the material with high absorption, so that the temperature rises instantaneously on the surface and melts the surface. This is how it is done.

Of course, when the two materials to be bonded are materials having excellent permeability, when an absorbent material having strong absorption is interposed between the two materials, the laser beam is absorbed by the absorber material and the temperature rises due to the increased heat. As the plastic surface of the two materials melts, they are joined together.

By applying this principle, it is used for bonding method using anisotropic conductive film in display module manufacturing process such as LCD, PDP, LED, etc.For bonding method using such anisotropic conductive film, FOG (Film on Glass) bonding, Chip on Film ), And COG (Chip on Glass) bonding.

Among them, FOG bonding is a method of bonding TCP (Tape Carrier Package) with IC embedded on a film to a glass substrate. It is characterized by the simple module process, excluding IC mounting process, and applied to general 4-gray graphic LCD. The previous module of the color module is one of the competitive methods in terms of production cost.

In addition, COF bonding is a process of bonding LCD drive ICs to microcircuit boards having a film thickness of 40 μm. In recent years, since the mounting method and the board are thin films that can cope with miniaturization and light weight of communication portable terminals, the film pattern and drive The disadvantage is that the pattern of the IC is not easy to align.

In addition, COG bonding is applied to various display devices by simplifying the mechanism by bonding the LCD drive IC directly on the LCD panel, but recently, it is mainly used in the small size, simple display and AMOLED display.

Bonding of the anisotropic conductive film in such a display module is conventionally performed using a hot plate, but bonding of the anisotropic conductive film by the hot plate may cause an imbalance in pressure due to thermal expansion of the plate to transmit pressure. It can take a long time to reach the thermal curing temperature of the anisotropic conductive film of the hot plate has a problem that the process time is increased, to improve this, recently to adopt the bonding method of anisotropic conductive film using a laser This results in an excellent advantage such as shortening the process time.

In the case of a bonding method using such a laser, a laser beam passes through a laser beam transmitting member to form a bonding region. The bonding region is absorbed while the laser beam reaches a laser beam absorbing member, which is a member to be joined including a base film. As the heat energy is converted into heat energy and is transferred to the anisotropic conductive film through the copper or gold coated bump terminals, the anisotropic conductive film is melted and press-melted to each other with the base member including the film or glass substrate which is in contact with the anisotropic conductive film. To be formed.

However, in this case, when the pressure fusion bonding is performed by the laser, the surface temperature distribution of the laser beam absorbing member, which is the bonded member, is not uniform and the temperature deviation becomes larger as the bonding operation is performed. It has a bad effect on the quality of the product is made difficult quality control is occurring, it is difficult to solve this problem.

The present invention has been made in order to solve such a conventional problem has the following object.

An object of the present invention is to install a laser beam transmitting member having a coating portion for adjusting the light transmittance in advance in the middle of the path through which the laser beam passes, so that the temperature distribution of the bonding region can be maintained uniformly to improve the quality of the product. In order to improve and flexibly cope with the problems occurring in the process.

In order to achieve the above object, the present invention configures a bonding area by placing a bonding material between a base member, a member to be joined including an electronic component, and the base member and the member to be joined, and an upper pressurizing member and a lower part. Position the bonding region at a position between the supporting members and pressurize while irradiating a laser beam to the bonding region to press-melt-bond the base member and the joined member to each other, and the position between the lower supporting member and the upper pressing member. The base member, the bonding material, and the joined member to be bonded to each other are placed in a stacked state, and a laser beam transmitting member through which the laser beam is transmitted is installed together with the upper pressurizing member. Provides a bonding device for electronic components using a laser formed by forming a coating to control the do.

In addition, in the bonding method of an electronic component to press the base member and the member to be joined to each other while irradiating a laser beam to the bonding region to perform a fusion bonding, a base to be bonded to the bonding region between the lower supporting member and the upper pressing member. A first step of loading the member, the bonding material and the member to be bonded to the upper position of the lower support member in a laminated state, and the laser beam transmitting member formed with the upper pressing member to form a coating for controlling the transmission amount of the laser beam; A second step of positioning the upper portion of the bonding region, and pressing the upper pressing member while transmitting a predetermined laser beam through the laser beam transmitting member having a coating portion and transmitting the projection beam to the bonding region in a controlled state. A third step of pressing the bonding area to melt-bond the base member and the joined member to each other to produce a joined product; And it provides a bonding method for an electronic component using a laser comprising a fourth step of positioning the upper pressing member in the rising position and unloading the bonded product melt-bonded in the third step to the outside.

In addition, the second step is the bonding method of the electronic component using the laser comprising the step of positioning the laser beam transmission member formed with a coating for controlling the transmission amount of the laser beam with the lower support member in the lower portion of the bonding region. To provide.

In addition, the coating part of the laser beam transmitting member obtains the temperature distribution formed in the bonding region as the predetermined pattern data through the first step and the third step in the state where the coating part is not adopted, and based on the pattern data. The present invention provides a bonding method for an electronic component using a laser formed by forming a coating to control light transmittance on the laser beam transmitting member.

Thus, according to the present invention, the laser beam transmitting member having a coating portion for adjusting the light transmittance is formed in the middle of the path through which the laser beam passes, so that the light transmittance is controlled while the laser beam passes through the coating portion of the laser beam transmitting member. In addition, the temperature distribution of the bonding region can be maintained uniformly to improve the quality of the product and to flexibly cope with problems occurring in the process.

1 is a schematic schematic diagram showing a preferred example of the present invention;
2 is a plan view showing an example of a coating formed on the surface of the laser beam transmitting member used in the present invention;
3 is a schematic schematic diagram showing another preferred example of the present invention;
4 is a schematic schematic diagram showing another preferred example of the present invention;
5 is a schematic diagram corresponding to FIG. 1 as another preferred embodiment of the present invention;
6 is a schematic diagram corresponding to FIG. 3 as another preferred embodiment of the present invention;
7 and 8 are each a schematic diagram illustrating a state in which no coating is formed on the surface of the laser beam transmitting member.

Hereinafter, with reference to the accompanying drawings will be described in more detail and in detail a preferred example of the present invention.

Looking at a preferred example of the bonding device of the present invention, the base member (1), the member to be joined (2) including the electronic component, and the bonding material (2) between the base member (1) and the member to be joined (2) 3) to position the bonding area 4, the bonding area 4 is positioned between the upper pressing member 5 and the lower support member 6, and the laser beam 7 in the bonding area 4 Pressing while irradiating the base member (1) and the member to be joined (2) is a pressure-melted joint is made to each other.

At this time, in the case of the present invention, as shown in Figure 1, the base member 1, which is to be bonded to the bonding region 4 as a position between the lower support member 6 and the upper pressing member 5, bonding Positioning the material (3) and the member to be joined (2) in a stacked state, the laser beam transmitting member 8 through which the laser beam 7 is transmitted together with the upper pressurizing member (5) is installed, but the laser beam transmitting member The surface of (8) is made by forming a coating portion 80 for adjusting the transmission amount of the laser beam (7). That is, an example in which the laser beam 7 penetrates from the upper portion to the lower portion of the laser beam transmitting member 8 positioned together with the upper pressing member 5 is performed by the laser bonding in the bonding region 4.

At this time, the base member (1) is made of a glass substrate or film in the case of a display, the bonded member (2) is the base member (1), such as an electronic component such as a chip or a film containing these electronic components To the object to be bonded to, and the bonding material (3) is an anisotropic conductive film as shown, for example, as a medium interposed therebetween to attach the member to be joined (2) to the base member (1). 30 and the conductive film pattern 34 positioned on the opposite side of the bump 32 as the other side of the bump 32 located on one side thereof.

In addition, as illustrated in FIG. 3 as another example of the present invention, the base member 1, the joining material 3, and the base member 1 to be joined to a position between the lower support member 6 and the upper pressurizing member 5; Position the joined member 2 in a stacked state, and install a laser beam transmitting member 8 through which the laser beam 7 is transmitted together with the lower supporting member 6, but the surface of the laser beam transmitting member 8 is installed. The coating unit 80 may be formed to adjust the amount of transmission of the laser beam 7 so that the configuration may be achieved. That is, an example is shown in which the laser beam 7 is transmitted upward from the lower portion of the laser beam transmitting member 8, which is positioned together with the lower support member 6, so that the bonding operation by the laser is performed in the bonding region 4.

In this case, it is preferable to use the glass substrate having excellent transmittance of the laser beam 7 as the base member 1, because the laser beam 7 is directed upward from the bottom of the laser beam transmitting member ( 8) and through the base member (1), and then to reach the laser beam absorber of the member 2 or the bonding material (3) to be absorbed to obtain a sufficient effect of heat melting.

In this case, the lower support member 6 may be formed of the same member as the laser beam transmitting member 8 as shown in FIG. 3, and separated from the laser beam transmitting member 8 as illustrated in FIG. 4. The laser beam transmitting member 8 may be made of quartz having excellent transmittance of the laser beam 5 and excellent strength.

Of course, the coating portion 80 may be formed on the inner surface portion as viewed from the bonding region 4 as the surface of the transmissive member 8 as described above, as illustrated in FIGS. 5 and 6. As the surface of the permeable member 8, it may be formed on the outer side when the bonding region 4 is viewed from the center.

At this time, the coating portion 80 described above, for example, as shown in Figures 7 and 8, the lower support member 6 and the upper pressing member 5 in the state that the coating portion 80 is not adopted. The base member 1, the bonding material 3, and the joined member 2, which are to be bonded to the bonding region 4 therebetween, are placed in a stacked state, and the laser beam transmitting member together with the upper pressing member 5 is disposed. The upper pressurizing member is placed at the upper portion of the bonding region 4 and the predetermined laser beam 7 is transmitted through the laser beam transmitting member 8 to the bonding region 4 for projection to the bonding region 4. (5) pressurizing the bonding region 4 to melt-bond the base member 1 and the joined member 2 to each other based on the temperature distribution formed in the bonding region 4 in the laser beam transmitting member In (8), a coating may be formed to control light transmittance.

At this time, the method for obtaining the temperature distribution pattern data formed in the bonding region 4 is obtained by measuring the temperature for each part using a thermocouple to obtain the temperature distribution pattern data or by transmitting the laser beam by an infrared thermal camera. The coating unit 80 is coated so that the light transmittance can be adjusted to the laser beam transmitting member 8 based on the data obtained by photographing the area where the member 8 is located and obtaining a predetermined temperature distribution pattern data. Can be formed.

Of course, as illustrated in FIG. 2, the coating portion 80 is not formed at a portion corresponding to an average below the lowest temperature at the temperature distribution, and on the contrary, at a portion where the temperature distribution reaches from the average to the highest temperature. By varying the small density of the coating, that is, the higher the temperature, the more dense and thicker the coating is formed in the form of a coating portion 80 is formed so that the transmission amount of the laser beam 7 can be controlled less Will be done.

The present invention bonding device to be made as described above is made as follows, will be summarized based on the present invention bonding method will be described.

That is, the base supporting member 1, the joining material 3, and the member to be joined 2, which are to be bonded to the bonding region 4 between the lower supporting member 6 and the upper pressing member 5, are stacked on the lower supporting member. A laser beam transmitting member (8) having a first step of loading the upper portion of (6) and a coating portion (80) for adjusting the transmission amount of the laser beam (7) together with the upper pressing member (5). The second step of positioning the upper portion of the bonding region 4, the predetermined laser beam 7 is transmitted through the laser beam transmitting member 8, the coating portion 80 is formed to adjust the amount of transmission Pressing the upper pressurizing member 5 while projecting the projection to the bonding region 4 to pressurize the bonding region 4 to melt-bond the base member 1 and the joined member 2 to each other to produce a joined product. The third step, and the upper pressing member (5) to the original position of the rising and the third step to the outside the joined bonded product melted And a fourth step of loading becomes the operation is done in sequence.

Next, a detailed description will be made of a bonding process sequentially performed, including the first to fourth steps.

Phase 1 (loading phase)

In the first step, the base member 1, the bonding material 3, and the joined member 2, which are to be bonded to the bonding region 4 between the lower support member 6 and the upper pressing member 5, are stacked in a lower state. Loading in the upper position of the support member 6, in this case, the base member (1), which is to be subjected to laser bonding to the bonding area (4) as the upper position of the lower support member (6), The bonding material 3 is placed on the upper portion of the base member 1 and the bonded member 2 is placed on the upper portion of the bonding material 3 so as to be positioned at the correct positions with each other.

Second step (laser beam Penetrating member Position  step)

Next, in the second step, the laser beam transmitting member 8 having the coating unit 80 formed thereon is formed in the upper portion of the bonding region 4 together with the upper pressing member 5 to adjust the amount of transmission of the laser beam 7. In the first step, the base member 1, the bonding material 3, and the joined member 2 are stacked and aligned on the upper portion of the lower support member 6 as the loading region 4 in the first step. In this state, the coating unit 80 for adjusting the transmission amount of the laser beam 7 is positioned on the upper portion thereof.

At this time, the coating portion 80 is bonded to the bonding region 4 between the lower support member 6 and the upper pressing member 5 in a state where the coating portion 80 is not adopted, as illustrated in FIG. The base member 1, the joining material 3, and the member 2 to be bonded are placed in the stacked state, and the laser beam transmitting member 8 together with the upper pressurizing member 5 is bonded to the bonding region 4. ) And the bonding area 4 to the upper pressing member 5 while projecting a predetermined laser beam 7 through the laser beam transmitting member 8 to be transmitted to the bonding area 4. In the process of fusion bonding the base member 1 and the joined member 2 to each other by pressing), a temperature distribution diagram formed in the bonding region 4 can be obtained. And based on the temperature distribution pattern data obtained in this way to form a coating to control the light transmittance on the laser beam transmitting member 8, the coating of the coating from the above temperature distribution to the site where the temperature reaches the highest temperature It is formed by varying the density. That is, the higher the temperature portion, the more dense and thicker the coating is formed in the form of a coating portion 80, the amount of transmission of the laser beam 7 is controlled less and the bonding area during the projection of the laser beam 7 for the bonding operation (4) ) Even temperature distribution is maintained throughout.

Therefore, when the object to be bonded is changed, such as the type or shape of the base member 1, the bonding material 3, and the member to be joined 2, which are located in the bonding region 4, the bonding region is changed depending on the object to be bonded. According to the temperature distribution of (4) to produce a laser beam projection member 8 configured by varying the coating portion 80 in a suitable form to utilize.

Third step (melt press bonding step)

Next, in the third step, the predetermined laser beam 7 is transmitted through the laser beam transmitting member 8 having the coating portion 80 formed thereon, and then transmitted to the bonding region 4 while being projected to the bonding region 4. Pressing the pressing member (5) to press the bonding region (4) to melt and press the base member 1 and the joined member (2) to each other to produce a joined product, wherein the pressing member (5) When the laser beam 7 is projected onto the bonding region 4 while pressing the light, the bonding material 3 or the member 2 to be absorbed in the form of an absorber of the laser beam 7 absorbs the laser beam 7 to absorb heat. Although the coating unit 80 is made of a different density in a pre-configured state, the permeation supply is made in a state in which the permeation amount is controlled via the remaining transmission unit except the coating unit 80 or the coating unit 80. As a result, the bonding area 4 maintains an even temperature distribution and thus is uniformly pressure-bonded. This is achieved, and eventually produce a bonded product having an even quality.

Step 4 ( Unloading  step)

In the fourth step, the upper pressurizing member 5 is lifted up and unloaded to the outside from the joined product melted in the third step. The pressurized state of the upper pressurizing member 5 is released and raised to bond. In the state where the region 4 is opened, the joining product, which is press-bonded, is made to have a uniform quality in the third step.

Further, in addition to the example of implementing the bonding method of the present invention by the above-described first to fourth steps, the first step is performed in the same manner as the above-described method, and in the second step, the lower support member 6 and Together, the laser beam transmitting member 8 having the coating portion 80 for controlling the amount of transmission of the laser beam 7 is positioned in the lower portion of the bonding region 4 and the laser beam 7 is upwardly moved from the bottom. The laser beam transmitting member 8 may be projected to perform a melt bonding step, and a bonding method of an electronic component using a laser that is performed through the third and fourth steps described above may be provided. have.

In this case, as illustrated in FIG. 8, the coating part 80 is disposed between the lower support member 6 and the upper pressing member 5 in the bonding region 4 in a state where the coating part 80 is not adopted. The base member 1, the bonding material 3, and the joined member 2 to be bonded are placed in the stacked state, and the laser beam transmitting member 8 together with the lower support member 6 is bonded to the bonding area ( 4, the bonding area (3) to the upper pressing member (5) while being positioned in the lower portion, while the predetermined laser beam 7 is transmitted through the laser beam transmitting member (8) to the bonding region (4). In the process of melt-bonding the base member 1 and the joined member 2 with each other by pressing 4), a temperature distribution diagram formed in the bonding region 4 is obtained. The coating unit 80 is formed by coating the laser beam transmitting member 8 so as to adjust the light transmission amount to the laser beam transmitting member 8 based on the temperature distribution pattern data obtained as described above. Is different from the average to the site where the highest temperature is reached, that is, the higher the temperature, the denser the coating is formed in the form of a coating part 80 that becomes denser and thicker at the site and transmits the laser beam 7 This is controlled so that the temperature distribution is kept low over the entire bonding area 4 during the projection of the laser beam 7 for the bonding operation.

Thus, according to the present invention, the laser beam transmission member 8 is formed by installing the coating portion 80 that can adjust the light transmission amount in the middle of the path through which the laser beam 7 passes. The light transmittance is controlled while penetrating the coating portion 80 of the laser beam transmitting member 8, so that the temperature distribution of the bonding region 4 can be maintained uniformly, improving the quality of the product and occurring in the production process of the product. It is possible to flexibly cope with the problem.

1: base member, 2: member to be joined,
3: bonding material, 4: bonding area,
5: upper pressing member, 6: lower supporting member,
7: laser beam, 8: laser beam transmitting member,
80: coating part

Claims (10)

Bonding region 4 by placing a bonding material 3 between the base member 1, the joined member 2 including the electronic component, and the base member 1 and the joined member 2; The bonding member 4 is positioned at a position between the upper pressing member 5 and the lower supporting member 6 and pressed while irradiating a laser beam 7 to the bonding region 4 to press the foundation member 1. ) And the to-be-joined member 2 are press-melted to each other,
The base member 1, the joining material 3, and the joined member 2 to be bonded to the bonding region 4 as a position between the lower support member 6 and the upper pressurizing member 5 are stacked. Position it,
A laser beam transmitting member (8) through which the laser beam (7) is transmitted together with the upper pressing member (5) is installed, and a coating for controlling the transmission amount of the laser beam (7) on the surface of the laser beam transmitting member (8). Bonding operation by laser is performed in the bonding region 4 by forming the portion 80 so that the laser beam 7 is transmitted from the upper portion to the lower portion of the laser beam transmitting member 8 where the laser beam 7 is positioned together with the upper pressing member 5. Bonding apparatus for an electronic component using a laser, characterized in that made. The method of claim 1,
Place the base member (1), the bonding material (3) and the member to be joined (2) to be laminated in a position between the lower supporting member (6) and the upper pressing member (5),
The laser beam transmitting member 8 through which the laser beam 7 is transmitted is installed together with the lower support member 6, and a coating for controlling the transmission amount of the laser beam 7 on the surface of the laser beam transmitting member 8. Bonding operation by laser in the bonding region 4 by forming the portion 80 so that the laser beam 7 is transmitted upward from the lower portion of the laser beam transmitting member 8 in which the laser beam 7 is positioned together with the lower support member 6. Bonding apparatus for an electronic component using a laser, characterized in that made. The method of claim 2,
The lower support member (6) is formed of the same member as the laser beam transmitting member (8) bonding device of the electronic component using a laser, characterized in that the configuration is made. The method of claim 2,
The lower support member (6) is a bonding device for an electronic component using a laser, characterized in that the configuration is made separately from the laser beam transmitting member (8). The method according to claim 1 or 2,
The coating unit 80 is formed by varying the density of the coating based on the temperature distribution pattern data formed in the bonding region 4 so that the transmission amount of the laser beam 7 can be controlled. Bonding device for electronic components using a laser. The base supporting member 1, the joining material 3, and the joined member 2 which are to be bonded to the bonding region 4 between the lower supporting member 6 and the upper pressing member 5 are laminated in the lower supporting member 6 in a laminated state. The first step of loading the upper position of the),
A second position in which the laser beam transmitting member 8 having the coating portion 80 formed thereon to adjust the amount of transmission of the laser beam 7 together with the upper pressing member 5 is positioned in an upper portion of the bonding region 4; Steps,
The upper pressurizing member 5 is transferred to the bonding region 4 while projecting a predetermined laser beam 7 to the bonding region 4 while transmitting the laser beam transmissive member 8 having the coating portion 80 formed therethrough. A third step of pressurizing the bonding region 4 to melt-bond the base member 1 and the joined member 2 to each other to produce a joined product, and
And a fourth step of placing the upper pressing member (5) in the rising position and unloading the bonded product melt-bonded in the third step to the outside. The method of claim 6,
The base member 1, the bonding material 3, and the to-be-joined to be bonded to the bonding region 4 between the lower support member 6 and the upper pressurizing member 5 without the coating portion 80 being adopted. Position the member 2 in a laminated state, position the laser beam transmitting member 8 together with the upper pressurizing member 5 on the bonding region 4, and place a predetermined laser beam 7. The base member 1 and the member to be joined 2 are pressed by pressing the bonding region 4 with the upper pressing member 5 while transmitting and projecting the laser beam transmitting member 8 to the bonding region 4. Coating the coating part 80 so as to adjust the light transmittance to the laser beam transmitting member 8 based on the temperature distribution chart by obtaining a temperature distribution chart formed in the bonding region 4 in the process of melting and bonding each other. However, using a laser, characterized in that formed by varying the small density of the coating Now part of the bonding method. The method of claim 7, wherein
A method of bonding electronic components using a laser, characterized in that the temperature distribution diagram formed in the bonding area (4) is obtained in a predetermined temperature distribution pattern data form by a thermocouple or an infrared thermal imaging camera. The method of claim 6,
In the second step, the laser beam transmitting member 8 having the coating part 80 for controlling the transmission amount of the laser beam 7 together with the lower support member 6 is disposed below the bonding region 4. And positioning the laser beam transmitting member (8) upward from the bottom to perform a fusion bonding step. 10. The method of claim 9,
The base member 1, the bonding material 3, and the to-be-joined to be bonded to the bonding region 4 between the lower support member 6 and the upper pressurizing member 5 without the coating portion 80 being adopted. Position the member 2 in a laminated state, position the laser beam transmitting member 8 together with the lower support member 6 to the lower portion of the bonding region 4, and place a predetermined laser beam 7. The base member 1 and the member to be joined 2 are pressed by pressing the bonding region 4 with the upper pressing member 5 while transmitting and projecting the laser beam transmitting member 8 to the bonding region 4. Obtain a temperature distribution diagram formed in the bonding region 4 in the process of melt-bonding each other, and adjust the light transmittance to the laser beam transmission member 8 based on the temperature distribution diagram thus obtained. ) To form a coating 80 by forming a coating, but by varying the density of the coating Bonding method of an electronic component using a laser, characterized by the above-mentioned.

Images