KR101167077B1 - Thin layers deposition system for manufacturing oled - Google Patents

Abstract

A vertical deposition system is disclosed. The vertical deposition system of the present invention includes a process chamber for performing a deposition process on a substrate standing in a direction crossing with respect to the ground; A turn chamber selectively docked on either side of the process chamber to redirect the substrate; And connected to the turn chamber, characterized in that it comprises a dual loader (dual roader) for supplying the substrate to the turn chamber by standing one by one. According to the present invention, not only can the process defects caused by the sag of the substrate be reduced by standing the substrate upright and the substrate is deposited upright, but also the foot print due to the enlargement of the system can be reduced, and the tact time ( tact time) can be reduced.

Description

Vertical Deposition System {THIN LAYERS DEPOSITION SYSTEM FOR MANUFACTURING OLED}

The present invention relates to a vertical deposition system, and more particularly, to reduce process defects caused by sagging of the substrate by transferring the substrate upright and depositing the substrate upright. It is directed to a vertical deposition system that can reduce print, and can also reduce tact time.

Generally, a substrate is a flat panel display (FPD) such as a plasma display panel (PDP), a liquid crystal display (LCD), and an organic light emitting diode (OLED), The wafer for semiconductors, the glass for photomasks, etc. are pointed out.

Although a substrate as a flat panel display device (FPD) and a substrate as a semiconductor wafer are different from each other in terms of materials and uses thereof, a series of processing processes for the substrates, for example, exposure, development, etching, stripping, rinsing, Processes, such as cleaning, are substantially very similar, and these processes proceed sequentially to produce a substrate.

Among the flat panel display devices (FPD), OLEDs, which are in the spotlight these days, are ultra-thin display devices that realize color images by self-emission of organic materials, and are attracting attention as next-generation display devices because of their simple structure and high light efficiency. . Such an OLED includes an anode and a cathode and organic layers interposed between the anode and the cathode. The organic layers may include at least a light emitting layer, and may further include a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer in addition to the light emitting layer.

OLEDs may be classified into high molecular organic light emitting diodes and low molecular organic light emitting diodes, depending on the organic layer, in particular, the light emitting layer. In order to realize full color, the light emitting layer needs to be patterned. In order to manufacture a large OLED, a direct patterning method using a fine metal mask (FMM) and a laser induced thermal imaging (LITI) method are used. There is a method applied, a method using a color filter.

On the other hand, when manufacturing a large size OLED by applying a mask method, a so-called horizontal upward deposition method in which a substrate and a patterned mask are horizontally disposed in a chamber and then deposited is applied. The horizontal upward deposition method is a method of aligning a substrate and a mask disposed horizontally with respect to a bottom surface of a chamber or the like, bonding them together, and depositing organic material on a large substrate in a horizontal state.

However, as OLEDs become larger in size, masks are becoming larger and larger in weight, and in this case, deflection of the mask occurs in the direction of gravity, making it difficult to closely adhere the mask to the substrate, thereby eventually securing the precision required for mass production. There is a difficult problem.

In consideration of this problem, a method of aligning the substrate and the mask disposed in the horizontal direction with respect to the bottom surface of the chamber and bonding them together, and then rotating the bonded substrate and the mask, setting them in the vertical direction, and depositing organic materials may be considered. However, even in this case, there is a problem in that the space of the chamber is increased, that is, the foot print is increased because the substrate and the mask bonded in the horizontal direction in the chamber must be rotated to stand in the vertical direction.

As a result, when applying a large-area substrate including OLED, it is difficult to use a horizontal deposition system to reduce the foot print caused by the enlargement of the system, and above all, it is difficult to deflect the substrate. It is expected that the above problems can be solved only by applying a vertical deposition system that deposits. For this reason, it is necessary to develop an efficient vertical deposition system.

Further, in developing such a vertical deposition system, a new gate valve arrangement or a new turn unit structure is required.

The object of the present invention is not only to reduce process defects caused by sagging of the substrate by standing up and transferring the substrate upright and to deposit the substrate upright, but also to reduce the foot print according to the enlargement of the system, and also the tact time. It is to provide a vertical deposition system that can reduce the (tact time).

The object is, according to the present invention, a process chamber for performing a deposition process for a substrate erected in a direction crossing with respect to the ground; A turn chamber selectively docked on one side of the process chamber to redirect the substrate; And a dual roader connected to the turn chamber and feeding the substrates one by one to the turn chamber.

Here, the process chambers may be docked in pairs symmetrically on both sides with respect to the turn chamber.

Further comprising a pair of first and second gate valves disposed in pairs adjacent to each other in the intersection area where the process chamber and the turn chamber are docked, the projections projecting toward the other side alternately alternately arranged. Can be.

Each of the first and second gate valves may include: a valve frame having an opening and an opening through which the substrate enters and exits; A gate disposed at an entrance opening in the valve frame to open and close the entrance opening; At least one actuator disposed to protrude in one direction from an outer surface of the valve frame and connected to the gate to move the gate; And at least one guide disposed adjacent to the actuator on an outer surface of the valve frame and protruding in the same direction as the actuator to guide movement of the gate, wherein the protrusion may include the actuator and the guide. Can be.

When the process chamber and the turn chamber are docked so that the first and second gate valves are disposed next to each other, the actuator of the first gate valve is disposed in an area between the actuator and the guide of the second gate valve, The guide of the first gate valve may be disposed in the region between the actuator and the guide of the second gate valve or in the region between the guides of the second gate valve.

The turn chamber may include: a chamber body having a substrate entrance through which at least one substrate enters and exits on each outer wall surface; And a turn unit rotatably provided in the chamber body to change a direction of the substrate.

The turn unit may include: a plurality of substrate trays forming an outer wall surface and provided at positions corresponding to the substrate entrances to support the substrates; And a tray rotator for selectively rotating the plurality of substrate trays.

The plurality of substrate trays may be four substrate trays arranged on four sides at equal angle intervals in a circumferential region of the tray rotating part so that a pair of faces arranged in parallel to face each other cross each other.

The turn unit may further include a gripping unit provided on the substrate tray to grip the substrate on the substrate tray.

The gripping unit includes: a support member having a shaft portion provided in the vertical substrate tray along a direction crossing the direction in which the substrate is raised, and a head portion formed at an end of the shaft portion larger than the diameter of the shaft portion; A first pressing portion for pressing the support member in a direction away from the surface of the vertical substrate tray by the head portion; A first spring coupled to the shaft portion of the support member and elastically biased in a direction of pulling the head toward the surface of the vertical substrate tray; And a first gripper disposed between the shaft and the head to grip the substrate.

The turn chamber may further include a substrate transfer unit configured to transfer the substrate from the substrate entrance to the substrate tray or from the substrate tray to the substrate entrance.

The substrate transfer unit may include: a plurality of transfer rails disposed in different directions in a lower region of the turn unit; And a rail driver coupled to the plurality of transfer rails to independently drive the plurality of transfer rails, respectively.

A pair of the substrate entrances may be formed on each of the outer wall surfaces of the chamber body so as to be spaced apart from each other, and the substrate tray may be arranged on four surfaces along the circumferential direction with respect to the tray rotating part.

When the substrate entrance is used, any one of the first and second gate valves may be disposed at the substrate entrance, and the shielding plate may be coupled when the substrate entrance is not used.

According to the present invention, not only can the process defect due to the sagging of the substrate be reduced by standing up and transferring the substrate upright and the substrate is deposited upright, but also the foot print according to the enlargement of the system can be reduced, and the tact time ( tact time) can be reduced.

1 is a structural diagram of a vertical deposition system according to a first embodiment of the present invention.
2 is a schematic internal structural diagram of a process chamber.
3 is a perspective view of a turn chamber.
4 is a perspective view of the turn unit.
5 is a perspective view of a docked state of a process chamber and a turn chamber.
6 is a perspective view of a state where the first and second gate valves are arranged to cross each other.
7A-13 are various modifications to the gripping unit, respectively.

In order to fully understand the present invention, operational advantages of the present invention, and objects achieved by the practice of the present invention, reference should be made to the accompanying drawings and the accompanying drawings which illustrate preferred embodiments of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Like reference symbols in the drawings denote like elements.

Prior to the description of the drawings, the substrate described below is not limited to the organic light emitting display (OLED) or the scope of the present invention.

1 is a structural diagram of a vertical deposition system according to a first embodiment of the present invention, FIG. 2 is a schematic internal structural diagram of a process chamber, FIG. 3 is a perspective view of a turn chamber, FIG. 4 is a perspective view of a turn unit, 5 is a perspective view of a docking state of a process chamber and a turn chamber, FIG. 6 is a perspective view of a state where the first and second gate valves are alternately arranged, and FIGS. 7A to 13 are various modifications of the gripping unit, respectively. .

The vertical deposition system of this embodiment may be manufactured in the form as shown in FIG. That is, in the vertical deposition system of the present embodiment, as illustrated in FIG. 1, a process chamber 100 for performing a deposition process on a substrate standing in a direction crossing with respect to the ground, and a process chamber 100 of the process chamber 100. A turn chamber 110 selectively docked on one surface to change the direction of the substrate, and dual loaders 1a and 1b connected to the turn chamber 110 and vertically supplied to the turn chamber 110 to supply the substrate to the turn chamber 110. dual roader).

In addition, in the vertical deposition system of the present embodiment, a direction change chamber 2 disposed at the rear of the turn chamber 110 along the process line, the transfer chamber 3, and a rod provided at one side of the outer circumferential surface of the transfer chamber 3 is provided. The lock / unload lock chamber 4 and the fusion machine 5 are included.

The dual loaders 1a and 1b are parts for supplying a substrate, which is erected in a direction crossing the ground, to the process. Instead of the dual loaders 1a and 1b, one loader may be provided to supply a single board to the process. However, when the dual loaders 1a and 1b are used as in this embodiment, the tact time may be reduced. There is an advantage.

The turn chamber 110 is a place to redirect the substrate provided from the dual loaders 1a and 1b, and the process chamber 100 is a place where a substantial deposition process on the substrate is performed. In the present embodiment, the pair of process chambers 100 are docked symmetrically on both sides of the turn chamber 110. Therefore, in addition to the application of the dual loader (1a, 1b) there is an advantage that can further reduce the tact time. Detailed structures of the process chamber 100 and the turn chamber 110 will be described later.

The direction change chamber 2 is a part which lays down the standing board | substrate which the vapor deposition process completed, and converts it to the board | substrate of a horizontal direction, and supplies it to the transfer chamber 3 here. A robot or the like can be mounted in the divert chamber 2.

The transfer chamber 3 sends the substrate in the horizontal state to the splicer 5 by the operation of the robot 3a therein so that the deposition substrate and the separate encapsulation substrate provided in the load lock / unload lock chamber 4 are mutually connected. It handles to adhere and serves to send the finished substrate to the load lock / unload lock chamber 4 when the work is completed.

Meanwhile, between the dual loaders 1a and 1b and the turn chamber 110, the turn chamber 110 and the turn chamber 110, the turn chamber 110 and the direction change chamber 2 along the X-axis direction of FIG. 1. The first gate valve 141 is provided with a plurality of first gate valves 141, which maintain a vacuum between the modules and form an access passage of the substrate. The substrate transfer chamber 150 is provided between the pair of first gate valves 141. A second gate valve 142 is provided between the process chamber 100 and the turn chamber 110 in the Y-axis direction of FIG. 1. As will be described later, the first and second gate valves 141 and 142 have only the structure or arrangement of the protruding portions, but their functions and roles are the same.

In fact, strictly speaking, in FIG. 1, the regions of the dual loaders 1a, 1b, the turn chamber 110, and the process chamber 100 are vertical deposition systems, and the remainder may be the cementation system, but the cementer 5 may also be Considering that the bonding process is performed using the deposition substrate provided in the deposition system, the entire embodiment of FIG. 1 will be considered as a deposition system.

In the following, the vertical deposition system of the present embodiment has a process chamber 100 and a turn chamber 110, and first and second gate valves 141 and 142 provided therebetween, with reference to FIGS. 1 to 6 as a whole. Let's take a closer look.

The process chamber 100 is a place where a deposition process is performed on a substrate standing in a direction crossing with respect to the ground. As mentioned above, in the present embodiment, since the pair of process chambers 100 are docked symmetrically on both sides of the turn chamber 110, the tact time is applied together with the application of the dual loaders 1a and 1b. There is an advantage that can be further reduced.

As shown in FIG. 2, both sides of the process chamber 100 may be used as deposition surfaces. In this case, deposition on two substrates may be performed at a time. Of course, this is merely an example, and may be implemented such that one substrate is deposited in the process chamber 100.

Referring briefly to the process chamber 100 with reference to FIG. 2, the process chamber 100 includes a process chamber body 101, a mask 102, and a substrate with respect to the mask 102 in a state of holding a substrate. A substrate holding alignment unit 103 for aligning the substrate, and a source 104 disposed on one side of the mask 102 to provide a predetermined deposition material to the substrate through the mask 102.

The process chamber body 101 forms the place where the deposition process for the substrate proceeds. The interior of the process chamber body 101 forms a vacuum atmosphere so that the deposition process on the substrate can be reliably performed.

The mask 102 is supported on the surface of the substrate in order to proceed with deposition in a predetermined pattern on the surface of the substrate. Although not shown in detail, the mask 102 is provided with a number of through holes (not shown) through which the deposition material from the source 104 passes.

The substrate holding alignment unit 103 is disposed to face the source 104 with respect to the mask 102, and freezes the substrate with respect to the mask 102 in a state where the substrate is held in parallel with the mask 102. It serves to cut.

The substrate holding alignment unit 103 may include a unit main body 103a, a substrate supporting plate 103b coupled to the unit main body 103a so as to be relatively movable, and having a substrate supported on one side toward the mask 102. And a substrate holding portion 103c for holding a substrate in contact with the substrate supporting plate 103b at a corresponding position and a substrate holding portion connected to the unit main body 103a to align the substrate with respect to the mask 102. Liner 103d.

The unit body 103a is where parts are installed to move the substrate support plate 103b toward the mask 102 or to return to the opposite home position, with one area inside the process chamber body 101 and the remaining area. May be disposed outside the process chamber body 101.

The substrate supporting plate 103b is a place where the substrate is supported on the surface. The substrate supporting plate 103b may be applied as a cooling plate, and in this case, the deposition efficiency may be improved by lowering the temperature of the substrate before the actual deposition process is performed on the surface of the substrate. A magnet generating magnetic force that pulls the mask 102 toward the unit main body 103a with the substrate interposed therebetween so that the metal mask 102 can be in surface contact with the substrate while being in close contact with the substrate. The array 103e is further provided. When the magnet array 103e is in contact with the mask 102 and the substrate, a magnetic field is formed to make the mask 102, which is a metal material, adhere more firmly to the substrate, resulting in poor deposition due to the lifting phenomenon between the mask 102 and the substrate. This can be prevented from occurring.

The board | substrate holding part 103c is a means for holding the board | substrate arrange | positioned at the surface of the board | substrate supporting plate 103b in the said position. In particular, in the case of this embodiment, since the substrate is supplied vertically and the substrate is a large substrate, the substrate should be held without shaking. In this embodiment, the structure capable of elastically supporting the substrate is schematically illustrated, but the scope of the present invention is not necessarily limited thereto. That is, the shape of the substrate holding part 103c may be replaced by an electrostatic chuck or an adsorption chuck.

The substrate aligner 103d is connected to the unit main body 103a to perform alignment of the substrate with respect to the mask 102. In the drawing, there is shown a schematic box structure. The substrate aligner 103d is connected to the unit main body 103a or the unit main body 103a so that the substrate supporting plate substantially supports the substrate ( It may include a UVW driving force providing unit (not shown) for providing a driving force to move 103b) in at least one direction selected from the X-axis, Y-axis, θ axis. The substrate aligner 103d may further include a vision unit (not shown) for photographing an align mark formed on the mask 102.

The source 104 is disposed on one side of the mask 102 to serve to provide the desired deposition material through the mask 102 to the substrate.

Next, the turn chamber 110 is docked on one surface of the process chamber 100 to change the direction of the substrate. As shown in FIG. 1, the process chamber 100 may be docked in pairs on both sides with respect to the turn chamber 110, but the scope of the present invention is not limited to the structure thereof. However, as shown in FIG. 1, there is an advantage of reducing the tact time.

The turn chamber 110 includes a chamber body 101 in which a substrate entrance 101a through which a substrate enters and exits is formed on each outer wall, and a turn rotatably provided inside the chamber body 101 to change the direction of the substrate. A unit 106 includes a turn unit and a substrate transfer part 115 for transferring a substrate from the substrate entrance 101a to the substrate tray 120 or from the substrate tray 120 to the substrate entrance 101a.

Referring to FIG. 3, a pair of substrate entrances 101a are formed on each of the outer wall surfaces of the chamber body 101 having a substantially rectangular block structure to be spaced apart from each other. A total of four outer wall surfaces of the chamber body 101 and a pair of substrate entrances 101a are formed on each of the outer wall surfaces, so that in this embodiment, eight substrate entrances 101a are formed. Of course, the numerical scope of the present invention does not need to be limited.

If all of the substrate entrances 101a are used in the process, the first gate valve 141 or the second gate valve 142 is disposed at the substrate entrance 101a, but none of the substrate entrances 101a is used. If not, the substrate entrance 101a may be shielded by a shield plate 101b (see FIG. 5).

A plurality of lattice ribs 101c and caps 101d are provided on the chamber body 101. In addition, a frame structure 101e is provided below the chamber body 101 to support the chamber body 101 with respect to the ground.

The turn unit 106 is rotatably provided in the chamber body 101 to change the direction of the substrate. That is, referring to FIG. 1, the turn unit 106 changes the direction of the substrate provided from the dual loaders 1a and 1b to send or receive the process chamber 100 docked at both sides.

The turn unit 106 may be configured to rotate the plurality of substrate trays 120 and the plurality of substrate trays 120 and the substrate trays 120 that form an outer wall surface and are provided at positions corresponding to the substrate entrances 101a to support the substrates. The tray rotating unit 110 and a gripping unit 130 provided on the substrate tray 120 to grip the substrate on the substrate tray 120.

The substrate tray 120 is a portion in which the substrate is standing and supported in a vertical direction or a vertical tilting direction (hereinafter, referred to as a vertical direction as a whole) of about 80 to 90 degrees. Since the substrate tray 120 must support the substrate, the substrate tray 120 is made larger than the size of the substrate.

Since a plurality of gripping units 130 must be coupled to the substrate tray 120 and a large area substrate must be supported, the substrate tray 120 is preferably made to be rigid, but to have as little weight as possible. The load of the tray rotating part 110 can be reduced.

In the present exemplary embodiment, the substrate tray 120 is disposed on four sides at equal angle intervals in the circumferential region of the tray rotating part 110 so that a pair of faces facing each other and arranged side by side cross each other. As such, when four substrate trays 120 are provided, when two substrate trays 120 facing each other are used for handling the substrates, the remaining two substrates 120 may serve as a buffer. Therefore, the effect of tact time reduction can be provided by that amount.

The tray rotating part 110 is a part for rotating the substrate tray 120 disposed on four sides along the circumferential direction to a desired position and a desired position. Since the tray rotating unit 110 may be variously implemented by a combination of a cylinder, a motor, and a gear, a detailed description thereof will be omitted.

A plurality of gripping units 130 are provided on the substrate tray 120 to grip the substrate on the substrate tray 120. The plurality of gripping units 130 operate at positions spaced apart from each other along the circumferential direction of the substrate tray 120 to grip the substrate together with the substrate tray 120. In this case, a plurality of gripping units 130 may be provided in the substrate tray 120 to grip the long side or short side region of the substrate or the four corner regions of the substrate.

Although only the gripping unit 130 is schematically shown in FIG. 4, the gripping unit 130 may have various structures as shown in FIGS. 7A to 13. Various modifications to the gripping unit 130 will be described later with reference to FIGS. 7A to 13.

As shown in FIG. 4, the substrate transfer unit 115 transfers the substrate from the substrate entrance 101a to the substrate tray 120 or from the substrate tray 120 to the substrate entrance 101a.

The substrate transfer part 115 is coupled to a plurality of transfer rails 115a and a plurality of transfer rails 115a which are disposed in different directions in the lower region of the turn unit 106 to connect the plurality of transfer rails 115a. The rail drive part 115b which drives each independently is provided. Accordingly, when the turn unit 106 is rotated by the tray rotating unit 110 so that the substrate tray 120 of the turn unit 106 is disposed in a desired direction and the gripping unit 130 is released, the rail driving unit 115b operates. The vertical substrate is able to be transported in a desired direction along the transfer rail 115a.

Next, the first and second gate valves 141 and 142 are arranged in pairs adjacent to each other in an intersection area (area A in FIGS. 1 and 5) where the process chamber 100 and the turn chamber 110 are docked. An entry and exit passage is formed. At this time, the protrusions (not shown) of the first and second gate valves 141 and 142 are alternately arranged alternately so as not to interfere.

1, 5, and 6, the process chamber 100 and the turn chamber (in the A region of FIGS. 1 and 5) in which one process chamber 100 and the turn chamber 110 are docked. The first and second gate valves 141 and 142 are formed to maintain the vacuum of the region 110 and form the access passage of the substrate.

As described above with reference to FIG. 1, the dual loaders 1a and 1b, the turn chamber 110, the turn chamber 110, the turn chamber 110, and the turn chamber 110 are arranged along the X-axis direction of FIG. 1. A plurality of first gate valves 141 are formed between the direction change chambers 2 to form an access passage of the substrate while maintaining a vacuum between the modules. A second gate valve 142 is provided between the process chamber 100 and the turn chamber 110 in the Y-axis direction of FIG. 1.

As shown in FIG. 6, both the first and second gate valves 141 and 142 are provided with valve frames 141a and 142a in which entrance and exit openings and exits of the substrate are formed, and entrances and exits in the valve frames 141a and 142a. Gates 141b and 142b disposed in the opening to open and close the entrance and exit, and protrude in one direction from the outer surfaces of the valve frames 141a and 142a and are connected to the gates 141b and 142b to connect the gates 141b and 142b. The plurality of actuators 141c and 142c to be moved and the actuators 141c and 142c are disposed adjacent to the actuators 141c and 142c on the outer surfaces of the valve frames 141a and 142a and protrude in the same direction as the actuators 141c and 142c. A plurality of guides 141d and 142d for guiding the movement of the < RTI ID = 0.0 > Thus, when the actuators 141c and 142c are operated by separate control signals, the gates 141b and 142b are guided by the guides 141d and 142d to open and close the entrance and exit openings of the valve frames 141a and 142a.

In this case, unlike the valve frames 141a and 142a and the gates 141b and 142b, the actuators 141c and 142c and the guides 141d and 142d protrude to one side from the outer surfaces of the valve frames 141a and 142a. 1 and 5, the first and second gate valves 141 and 142 are formed at an intersection area (area A in FIGS. 1 and 5) where the process chamber 100 and the turn chamber 110 are docked as shown in FIGS. 1 and 5. ), It is difficult to dock the process chamber 100 and the turn chamber 110 because the actuators (141c, 142c) and the guides (141d, 142d) as protrusions may interfere with each other.

In this embodiment, this problem is solved by a simple and simple structure. That is, in the present exemplary embodiment, protrusions (not shown) protruding toward each other from the first and second gate valves 141 and 142 disposed in pairs adjacent to each other alternately alternate with each other.

That is, between the actuators 141c as the protrusions provided in the first gate valve 141 and the guides 141d between the actuators 142c as the protrusions provided in the second gate valve 142 and the guides 142d. By disposing the process chamber 100 and the turn chamber 110, the first and second gate valves 141 and 142 are prevented from interfering with each other.

In other words, in the present embodiment, the actuators 142c of the first gate valve 141 are disposed in an area between the actuator 142c and the guide 142d of the second gate valve 142, and the first gate valve 141. Guides 141d of the second gate valve 142 are disposed in the region between the actuator 142c and the guide 142d of the second gate valve 142 or in the region between the guides 142d of the second gate valve 142. Even though the protrusions of the two gate valves 141 and 142 protrude toward each other, the two gate valves 141 and 142 do not interfere with each other. In fact, although this structure is simple, it is expected that the efficiency of the process may be increased by easily implementing the process without a separate manufacturing process.

According to the vertical deposition system of this embodiment having the structure and operation as described above, by processing the substrate upright and depositing the substrate upright, not only can the process defects caused by the sag of the substrate be reduced, but also the footprint according to the enlargement of the system (foot) print, and also reduce the tact time.

Hereinafter, various modifications to the gripping unit omitted in the above description will be described one by one with reference to FIGS. 7A to 13.

As illustrated in FIGS. 7A and 7B, the gripping unit 130 according to the first modification includes an axis portion 131a provided in the substrate tray 120 along a direction crossing the direction in which the substrate is standing, and Support member 131 having a head portion 131b formed larger than the diameter of the shaft portion 131a at the end of the shaft portion 131a, and the head portion 131b is supported in a direction away from the surface of the substrate tray 120. It is coupled to the first pressing portion 132 for pressing the member 131, the shaft portion 131a of the support member 131 and elastically biased in the direction of pulling the head portion 131b toward the surface of the substrate tray 120 And a first gripper 134 disposed between the first spring 133 and the shaft portion 131a and the head portion 131b of the support member 131 to grip the substrate.

The supporting member 131 is a portion supporting the first gripper 134, and the first spring 133 moves the head 131b to the substrate tray (FIG. 7A) when the pressing force of the first pressing part 132 is released. Pull toward the surface of 120 to cause the first gripper 134 to grip the substrate.

As a result, as shown in FIG. 7B, when the first pressing unit 132 is operated to press the shaft portion 131a of the supporting member 131, the supporting member 131 is moved by the pressing force of the supporting member 131. The first gripper 134 may also be spaced apart from the surface of the substrate tray 120, and the substrate may be released from the recess groove 121 of the substrate tray 120. On the contrary, as shown in FIG. 7A, when the pressing force of the first pressing unit 132 is released while the substrate is disposed in the seat groove 121 of the substrate tray 120, the first spring 133 moves the head 131b to the substrate tray ( Pulling towards the surface of 120 causes the first gripper 134 to grip the substrate.

As illustrated in FIG. 8, the gripping unit 230 according to the second modified example includes a rack gear 231 and a rack gear 231 provided in the substrate tray 220 along a direction in which the substrate is placed. It is connected to the gear drive unit 232 for driving, the pinion gear 233 gear meshed with the rack gear 231, the pinion gear 233 and is operated based on the operation according to the forward and reverse rotation of the pinion gear 233 And a second gripper 234 for gripping the substrate. In this case, the second gripper 234 may also be meshed with the pinion gear 233.

Thus, as the rack gear 231 is operated by the gear driving unit 232, the pinion gear 233 is rotated to operate the second gripper 234, thereby allowing the substrate to be gripped or released.

As shown in FIG. 9, the gripping unit 330 according to the third modified example includes a moving block 331 provided on the substrate tray 320 so as to be movable and a substrate on which the substrate is placed on the moving block 331. A second spring 333 is elastically biased so that one end is connected to the second pressing portion 332 for pressing along the direction and the plate 336 connected to the moving block 331 and the moving block 331 is returned to its original position. And a third gripper 334 connected to the moving block 331 to grip the substrate based on the action of the second pressing unit 332, and connecting the moving block 331 to the third gripper 334. The first connection block 335 is provided.

Accordingly, when the second pressing unit 332 is operated to press or release the moving block 331, the substrate is gripped or released by inducing the operation of the first connection block 335 and the third gripper 334. You can do that.

As illustrated in FIG. 10, the gripping unit 430 according to the fourth modification includes a leaf spring 431 provided in the substrate tray 420 and a second portion connected to one end of the leaf spring 431. A fourth gripper 433 connected to the connection block 432, the second connection block 432 to grip the substrate, and the other end region of the leaf spring 431 in the other end region of the leaf spring 431. It is provided with a third pressing portion 434 for selectively pressing.

Accordingly, the third pressing unit 434 is operated to press or release the other end region of the leaf spring 431 so that the second connection block 432 operates the fourth gripper 433 to grip the substrate. Alternatively, the gripping can be performed.

As illustrated in FIGS. 11 and 12, the gripping units 530 and 630 according to the fifth and sixth modifications are provided by a correction chuck 530 and a chuck that adsorb or desorb the substrate by electrostatic force. This is an example applied to the adhesion chuck (630, chuck) for adsorbing or desorbing the substrate.

As illustrated in FIG. 13, the gripping unit 730 according to the modified example of FIG. 13 may be formed in a Korean letter 'c' shape to be movable on the substrate tray 720 to partially wrap the substrate. A fifth gripper 731 and a third spring 732 connected to the fifth gripper 731 for returning the fifth gripper 731 to the home position are provided.

Even if such a configuration is applied, the substrate may be gripped or released from the substrate tray 720 as the fifth gripper 731 is operated based on the elastic force of the third spring 732.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Accordingly, such modifications or variations are intended to fall within the scope of the appended claims.

100: process chamber 110: turn chamber
101: chamber body 106: turn unit
110: tray rotating section 115: substrate transfer section
120: substrate tray 130: gripping unit
141,142: Gate Valve

Claims (14)

A process chamber for performing a deposition process on a substrate standing in a direction crossing the ground;
A chamber body having a substrate entrance through which the substrate enters and exits on each of the outer wall surfaces, and a turn unit rotatably provided in the chamber body to change a direction of the substrate, A turn chamber selectively docked on one surface to change the direction of the substrate; And
And a dual roader connected to the turn chamber and supplying the substrate to the turn chamber one by one. The method of claim 1,
And said process chambers are docked in pairs symmetrically to both sides relative to said turn chamber. The method of claim 1,
And a first and second gate valves disposed in pairs adjacent to each other in an intersection area where the process chamber and the turn chamber are docked, and protrusions protruding toward each other are alternately alternately disposed. Vertical deposition system, characterized in that. The method of claim 3,
Each of the first and second gate valves,
A valve frame having an entrance opening and an opening through which the substrate is entered;
A gate disposed at an entrance opening in the valve frame to open and close the entrance opening;
At least one actuator disposed to protrude in one direction from an outer surface of the valve frame and connected to the gate to move the gate; And
At least one guide disposed adjacent to the actuator on the outer surface of the valve frame and protrudes in the same direction as the actuator to guide the movement of the gate,
And the protrusion includes the actuator and the guide. The method of claim 4, wherein
When the process chamber and the turn chamber are docked so that the first and second gate valves are disposed next to each other, the actuator of the first gate valve is disposed in an area between the actuator and the guide of the second gate valve, The guide of the first gate valve is disposed in the region between the actuator and the guide of the second gate valve or the region between the guides of the second gate valve. delete The method of claim 1,
The turn unit,
A plurality of substrate trays forming an outer wall surface and provided at positions corresponding to the substrate entrances to support the substrates; And
And a tray rotator for selectively rotating the plurality of substrate trays. The method of claim 7, wherein
And the plurality of substrate trays are four substrate trays arranged on four sides at equal angle intervals in a circumferential region of the tray rotation part such that a pair of faces arranged in parallel to face each other cross each other. The method of claim 7, wherein
And the turn unit further comprises a gripping unit provided on the substrate tray to grip the substrate on the substrate tray. 10. The method of claim 9,
The gripping unit,
A support member having a shaft portion provided in the vertical substrate tray in a direction crossing the direction in which the substrate is placed, and a head portion formed larger than a diameter of the shaft portion at an end of the shaft portion;
A first pressing portion for pressing the support member in a direction away from the surface of the vertical substrate tray by the head portion;
A first spring coupled to the shaft portion of the support member and elastically biased in a direction of pulling the head toward the surface of the vertical substrate tray; And
And a first gripper disposed between the shaft and the head to grip the substrate. The method of claim 7, wherein
The turn chamber further comprises a substrate transfer unit for transferring the substrate from the substrate entrance to the substrate tray or from the substrate tray to the substrate entrance. The method of claim 11,
The substrate transfer unit,
A plurality of transfer rails disposed in different directions in a lower region of the turn unit; And
And a rail driver coupled to the plurality of transfer rails to independently drive the plurality of transfer rails, respectively. The method of claim 7, wherein
A pair of the substrate entrances is formed on each of the outer wall surfaces of the chamber body so as to be spaced apart from each other.
The substrate tray is a vertical deposition system, characterized in that arranged on four sides in the circumferential direction with respect to the tray rotating unit. The method of claim 3,
And one of the first and second gate valves is disposed at the substrate entrance when the substrate entrance is used, and a shielding plate is coupled when the substrate entrance is not used.

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