KR101147962B1 - LED light - Google Patents

Abstract

The present invention improves the uniformity of light by installing the LED module substrate on each side of the rectangular column-shaped heat dissipation frame formed with a hole therein, and is formed to protrude outward from the junction at the junction of the substrate contact surfaces, but is connected to the aperture from the front side. Ventilation grooves are formed to facilitate air circulation, and a plurality of heat dissipation blades protruding from the inner surface to the inner surface of the through hole are formed to increase the heat dissipation area, so that heat dissipation is efficiently performed, and is installed on the top of the heat dissipation frame. The coupling is to be spaced apart from the surface in contact with the heat dissipation frame, and the air circulation is more active to the LED luminaire to increase the cooling efficiency.

Description

LED luminaires {LED light}

The present invention relates to an LED luminaire that not only improves the light uniformity but also efficiently dissipates heat.

Lighting is a device that emits light by converting light energy into electrical energy in general, and as the lighting infrastructure develops, 20% of the total electricity consumption is used for lighting. Research is being done in many ways.

LED lighting is a light emitting diode that emits light by converting electrical energy into light energy. It is an eco-friendly material that saves energy resources due to low power consumption, and emits less waste such as mercury and greenhouse gases (CO ₂ ). It has been spotlighted as the next-generation eco-friendly lighting due to its advantages such as being able to produce lighting and having a long service life, thereby reducing operating costs.

However, since LED lamps emit high-brightness light from small devices, local heat is generated in the devices. Especially, as the products are miniaturized and integrated, the circuit does not operate normally due to the heat generated when the LED chips are densely installed. Otherwise, the life of the LED is shortened, there is a problem that the illuminance is reduced.

In other words, the heat sink design has emerged as an important problem of LED research because the LED lamp has a significant impact on the life and performance of the LED lamp when the heat generated during the LED light emission is not properly radiated.

1 is an assembled perspective view showing a conventional LED lighting fixture.

1 is a conventional LED luminaire 100, the conventional LED luminaire 100 is a housing cover 101 and the heat dissipation frame 103, LED module 105, power module unit (not shown), reflecting member 107 and frame cover 109.

The housing cover 101 is composed of a housing having a plurality of housing holes and a socket fixed to an upper side of the housing and connected to an external power source. The housing hole is cooled by exhausting heat generated from the LED module 105 by air. It is a moving passage of air if possible.

The heat dissipation frame 103 is empty inside, and preferably has a frame body 131 having a radial shape, and at least three side reflecting portions 133 and side reflecting portions 133 formed outside the frame body 131. Ventilation 135 is formed at the point where the end is connected, the through-hole is formed in the inside of the frame body 131 is a moving passage of air to cool the heat generated from the LED module 105 do.

In addition, the side reflector 133 is where the reflective member 107 is installed, the end of the side reflector 133 is bent to support the reflective member 107.

In addition, the ventilation unit 135 allows the heat generated by the LED module 105 to be quickly discharged to the outside, and the ventilation unit 135 is formed with at least one ventilation hole 137.

The LED module substrate 105 is installed outside the heat dissipation frame 103 and emits an LED light source, and the LED light emitting surface of the LED element is supported by the periphery of the drilling hole 171 of the reflective member 107 to support the LED light emitting surface. The heat accumulated in the heat absorber is absorbed by the reflecting member 107.

The reflective member 107 is fixed to both ends of the side reflector 103 of the heat dissipation frame 103, the base plate 173 having at least one or more drilling holes 171 formed at a position corresponding to the LED element, and the base It is composed of a diffusion lens 175 is installed to be in line with the LED element on the plate 173.

In addition, the periphery of the perforation hole 171 of the base plate 173 is to be supported on the LED emitting surface to absorb heat accumulated in the LED emitting surface as described above.

As described above, the conventional LED lighting device 100 has the advantage that the LED is emitted in various directions by being installed on each side of the heat dissipation frame 103 forming the LED module substrate 105 in various planes. Problems occurred in heat dissipation.

In the conventional LED luminaire 100 of FIG. 1, the heat radiating frame 103 absorbs heat generated by the LED module, and the heat radiating frame 103 that absorbs heat is introduced with cold air through a through hole formed therein. Heat exchange is performed, and the heat exchanged hot air is configured to radiate heat in such a way that the outside flows out, but the conventional LED lighting device 100 is formed in a narrow area of the heat exchange through the heat exchange is formed in the heat radiating area exposed to the air In contrast, since the volume of the heat dissipation frame 103 is relatively large, a problem arises in that heat exchange is not performed smoothly unless an expensive thermal conductive material is used.

In addition, in order for the air to circulate smoothly, the flow of hot air is exchanged with the inflow of cold air, that is, the outflow of hot air, that is, the air circulation must be made smoothly. The conventional LED lamp 100 has a housing cover through which hot air flows out. As the housing holes of the 101 are formed with a small radius, air circulation is not smoothly performed. Accordingly, heat exchange is smoothly performed at the lower portion of the through-hole, which is an air movement passage, but heat exchange is not smoothly performed at the upper portion. The temperature difference between the upper part and the lower part inside the heat dissipation frame 103 is generated.

In addition, in the conventional LED lighting device 100, the outer surface of the heat dissipation frame in which the LED module substrate 105 is installed is formed as a flat surface so that the heat dissipation frame 103 does not efficiently absorb heat generated from the LED module substrate 105. There is a problem that the frequent failure of the LED luminaire 100 occurs.

In addition, the conventional LED luminaire 100 is configured such that the LED module substrate 105 is coupled to the heat dissipation frame 103 in an interference fit type so that when an external shock occurs, the LED module substrate 105 is dissipated from the heat dissipation frame 103. Departure is easy.

In addition, since the passage 135 connected to the through hole of the heat dissipation frame 103 is an air moving passage, the amount of air flowing in and out is small so that heat dissipation is not efficiently performed.

In addition, the conventional LED luminaire 100 is a reflection member 107 is coupled to the adhesive rather than a detachable coupling device that the heat dissipation frame 103 is detachable to remove the LED module when replacing or checking the LED module. It must be forcibly separated, and after replacement and inspection, work for coupling the reflective member 107 must be performed, which causes a problem in that the work process becomes cumbersome.

The present invention is to solve such a problem, the problem of the present invention is to provide an LED luminaire that improves the heat dissipation effect while simplifying the production of the heat dissipation frame while improving the uniformity of light.

Solving means for solving the above problems are the substrate contact surface formed on each side of the polygonal column formed through the vertical longitudinal hole therein, and the ventilation groove is formed in the junction of the substrate contact surface and connected to the through hole in the front A heat radiation frame including at least one ventilation portion formed; An LED module substrate on which at least one LED module is mounted and installed on outer surfaces of the substrate contacts; And a base portion detachably coupled to an upper portion of the heat dissipation frame, wherein the ventilation portions extend outwardly by protruding surfaces that protrude outwardly from one end of an adjacent substrate contact surface, and connect the protruding surfaces. At least one ventilation groove is formed on the front surface.

In the present invention, the outer surface of the substrate contact surface is formed with at least one small hole connected to the through hole from the outer surface, the small hole is preferably formed to be integrally connected to the LED module of the LED module substrate when assembled. Do.

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In addition, in the present invention, the vents are formed of projecting surfaces protruding outwardly from one end of an adjacent substrate contact surface, and a front surface connecting the projecting surfaces, and the ventilation grooves are formed from the front surface and the front surface. It is preferably formed to be bent inward toward the protruding surfaces, the ventilation groove is formed on the protruding surface to be closer to one end of the substrate contact surface toward the middle point of the ventilation groove from the top and bottom.

In addition, in the present invention, the protruding surfaces are preferably formed to be inclined.

In the present invention, it is preferable that at least one heat dissipation blade protruding inwardly from the inner surface of the through hole protrudes continuously in the longitudinal direction.

Also, in the present invention, slot grooves are formed at both sides of the substrate contact surfaces in the longitudinal direction, and both sides of the LED module substrate are inserted into the slot grooves.

In the present invention, the diffusion cover is further provided on the outside of the LED module substrate, it is preferable that both sides of the diffusion cover is inserted into the slot grooves of the substrate contact surfaces.

In addition, in the present invention, the coupling portion is further installed between the heat dissipation frame and the base portion, the coupling portion is formed in a plate shape, both sides of the disk portion is formed at least one or more air movement grooves penetrating the two sides; An upper sidewall portion extending vertically in a direction toward the base portion when assembled from an outer circumference of the disc portion; When assembling from the outer periphery of the disc portion is composed of a lower side wall portion extending vertically in the direction toward the heat dissipation frame, the bottom surface of the disc portion in contact with the top surface of the heat dissipation frame except for a part in contact with the top surface of the heat dissipation frame The air outlet passage is preferably formed to be spaced apart from the air outlet passage is connected to the through hole.

In the present invention, the lower sidewall portion is formed with bent grooves penetrating the outer surface and the inner surface, the bent grooves are preferably connected to the air outlet passage.

In the present invention, the bent grooves are preferably integrally connected to the ventilation grooves of the heat dissipation frame when assembled.

In addition, in the present invention, the coupling portion is preferably made of an insulating material.

According to the present invention having the above problems and solutions, the LED module is installed on the substrate contact surface formed on each surface having various angles, thereby improving the uniformity of light, and forming a through hole through which air is circulated inside the heat dissipation frame. The ventilation part is formed in the part to increase the heat dissipation area exposed to the air to facilitate heat exchange, thereby extending the life of the LED module and reducing the failure rate.

1 is an assembled perspective view showing a conventional LED luminaire.
2 is a perspective view showing an LED luminaire that is an embodiment of the present invention.
3 is a perspective view illustrating the heat dissipation frame of FIG. 2.
4 is a cross-sectional view of FIG. 3.
5 is a perspective view illustrating an LED module substrate installed in the heat dissipation frame of FIG. 3.
6 is a perspective view illustrating the coupling part of FIG. 2.
7 is a perspective view of FIG. 6 viewed from another angle.
8 is a perspective view illustrating the base of FIG. 2.
9 is a side view of FIG. 8.
FIG. 10 is a perspective view illustrating the lid of FIG. 2. FIG.
11 is a plan view of Fig.
12 is a perspective view illustrating the diffusion cover of FIG. 2.
FIG. 13 is a perspective view illustrating a second embodiment of a heat radiation frame applied to the LED luminaire of FIG. 2. FIG.
14 is a side view of FIG. 13.
15 is a cross-sectional view taken along the line CC ′ in FIG. 14.
FIG. 16 is a cross-sectional view illustrating the diffusion cover of FIG. 12 coupled to the heat dissipation frame of FIG. 13.

Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings.

2 is a perspective view showing an LED luminaire that is an embodiment of the present invention.

2 is an LED luminaire (1), the LED luminaire (1) is coupled to the LED module substrate 43, the upper and lower openings are mounted to mount the LED module 41, heat exchange therein The heat dissipation frame 3 is configured to dissipate heat generated by the light emission of the LED module 41 and the light emitted from the LED module 41 by being installed outside the LED module 41 of the heat dissipation frame 3. A diffusion cover 4 for increasing the diffusion angle, a base part 5 installed on the heat dissipation frame 3 and electrically coupled to the socket, and installed between the base part 5 and the heat dissipation frame 3; And a coupling part 7 for coupling them, and a cover part 9 installed in a lower part of the heat dissipation frame 3 so as to allow external cold air to flow therein.

In addition, although not shown in FIG. 2, the coupling part 7 and the base part 5 may further include a control part for controlling the illumination intensity of the LED module 41, which is commonly used in an LED lighting device. Detailed description thereof will be omitted.

3 is a perspective view illustrating the heat dissipation frame of FIG. 2, and FIG. 4 is a cross-sectional view of FIG. 3.

The heat dissipation frame 3 shown in FIG. 3 is formed in a quadrangular column shape having a vertical longitudinal direction, and the substrate contact surfaces 37, 37 ', 37', and 37 'formed on each side of the square column. '') And vents 45, 45 ', 45' formed at the junction of the substrate contact surfaces 37, 37 ', 37' ', 37' ''. ), (45 '' '), and in the present invention, the heat dissipation frame (3) is formed in the shape of a square column to form a substrate contact surface (37), (37'), (37 '' ), But the number of (37 '' ') has been described as an example, but the heat dissipation frame is not limited thereto and may be formed in a polygonal columnar shape with a substrate contact surface.

In addition, the heat dissipation frame 3 forms a through hole 33, which is a passage through which air passes, and the through hole 33 is opened at an upper portion and a lower portion thereof, and external cool air is introduced from the lower portion, and heat is exchanged inside. Air flows upwards.

In addition, the heat dissipation blades 34 protruding inward from the inner surface are continuously formed in the vertical direction on the inner surface of the heat dissipation frame 3 formed of the through holes 33, and the heat dissipation blade 34 is generated by the LED module 41. The heat dissipation area in which the heat is brought into contact with the cold air introduced from the outside is increased, so that heat dissipation is efficiently performed in the same space.

In addition, the inner surface of the heat dissipation frame 3 is formed with the "C" shaped bolt holes 36 and 36 'continuously bent outward from the inner surface in the vertical direction, and the bolt holes 36 and 36' ) Allows the bolt (not shown) to pass through.

In addition, substrate contact surfaces 37, 37 ′, 37 ″, and 37 ′ ″ are formed on each surface of the heat radiation frame 3 that is formed in a quadrangular column shape. The LED module substrate 43 in which the plurality of LED modules 41 of FIG. 5 to be described below are mounted in close contact with each other enables illumination from various angles from the LED module 41, so that the LED luminaire has strong straightness but weak diffusivity. The problem is complemented.

In addition, the substrate contact surface 37 is formed in the hole hole 38 is connected to the inner through hole 33 from the outer surface at regular intervals in the vertical direction, at this time, the small hole holes 38 are the LED module 41 is welded at the time of assembly By being formed integrally with the LED element 42 of the heat transfer to the heat generated due to the light emission of the LED module 41 is easily introduced into the through-hole 33 to the heat exchange with the cold air.

In addition, in FIG. 3, the small holes 38 are formed on the left and right sides of the substrate contact surface 37, for example, but the small holes 38 are the LED elements 42 mounted on the LED module substrate 43. It may be formed in various shapes depending on the alignment of these.

Also adjacent substrate contact surfaces (37) and (37 '), (37') and (37``), (37 '') and (37 '' '), (37' '') and (37) Ventilation portion 45 protruding in a rectangular pillar shape to the outside is connected to the connection portion is formed continuously in the longitudinal direction, the ventilation portion 45 is formed so that the through hole 33 of the heat dissipation frame 3 is connected to the inside do.

In addition, the outer surface of the ventilating portion 45 facing outward from the heat dissipation frame 3 is formed as a flat surface, the outer surface of the plurality of ventilation holes 47, 47 'which penetrate the outer surface and are connected to the through-hole 33. ), (47 '') are formed at regular intervals to provide a passage through which the air is moved to facilitate the air circulation to increase the heat radiation efficiency of the LED lighting (1).

In addition, the substrate contact surface 37 has slot grooves B formed continuously in the vertical direction at both sides connected to the ventilation parts 45 and 45 ', and the LED module substrate 43 as the slot grooves B. And both sides of the diffusion cover 4 of FIG. 12, which will be described later, are inserted in a slide manner, so that the LED module 41 or the LED module substrate 43 is not only firmly coupled to the heat dissipation frame 3, but also assembled at the time of failure and inspection. And easy disassembly.

As described above, the heat radiation frame 3 of the LED luminaire 1 according to the embodiment of the present invention has a through hole 33 having an upper and a lower opening therein, so that the hot air formed by heat exchange between the cold air and the inside is formed. Circulation is made smoothly through the through hole 33, the heat dissipation head 34 is formed in a radial shape on the inner surface of the through hole 33 to increase the heat dissipation area where heat exchange is performed, and the substrate contact surfaces 37 By forming the ventilation part 45 in which the plurality of ventilation holes 47, which are air passages, are formed in the junction, air circulation is actively performed, so that the heat generated by the LED module 41 can be efficiently radiated. Will be.

In addition, the heat dissipation frame 3 of FIG. 3 is manufactured by drawing molding, and is easy to manufacture.

Also, in the present invention, the vents 45, 45 ', 45', and 45 'of the heat dissipation frame 3 may have substrate contact surfaces 37, 37', 37 '. And, it is formed to protrude in a rectangular pillar shape at the junction of the (37 '' '), a plurality of ventilation grooves 47, 47', (47 '') is described as an example, but the ventilation portion 45 ) Is not limited to this shape, the ventilator 45 has at least one vent groove 47 connected to the through hole 33 on the front surface of the substrate contact surface (37), (37 '), (37' ') , 37 '' 'may be applied to protrude in various shapes.

5 is a perspective view illustrating an LED module substrate installed in the heat dissipation frame of FIG. 3.

The LED module substrate 43 of FIG. 5 is a PCB substrate on which a circuit is printed such that the LED module 41 is turned on and blinks, and is formed in a plate shape having a predetermined area, and both sides of the substrate contact surface 37 are formed on both sides. The fitting portion C is formed to be inserted into the slot groove B formed in the LED module substrate 43, and the LED module substrate 43 is inserted into and coupled to the substrate contact surface 37 by a slide method so that the LED module 41 and the LED module substrate 43 are connected to each other. It is easy to assemble and dismantle during breakdown and inspection.

In addition, the LED module substrate 43 is provided with a plurality of LED modules 41 in which the LED elements 42 are mounted at predetermined intervals.

6 is a perspective view illustrating the coupling part of FIG. 2, and FIG. 7 is a perspective view of FIG. 6 viewed from another angle.

6 and 7, the coupling portion 7 is installed on the upper portion of the heat dissipation frame 3 is bonded to the base portion 5 is made of an insulating material, preferably curable synthetic resin, the disc is formed in a circular shape In the direction toward the heat dissipation frame (3) and the upper sidewall portion (73) extending vertically from the outer periphery of the disc portion (71) in the direction toward the base (5) during assembly, The lower side wall portion 75 extends vertically from the outer circumference of the disc portion 71.

A plurality of bolt holes 81 are formed to protrude downward toward the upper surface of the heat dissipation frame 3 on the lower surface of the disc portion 71 (one surface in the direction toward the heat dissipation frame 3 during assembly, hereinafter referred to as the lower surface). , 81 'are formed, and bolt holes (not shown) corresponding to the bolt holes 81 and 81' bored downwardly are formed on the upper surface of the heat dissipation frame 3, so that Since the coupling part 7 and the heat dissipation frame 3 are coupled to each other, the air outlet passage 84 is formed to be spaced apart from the contact surface between the upper surface of the heat dissipation frame 3 and the disc part 71. Cooling efficiency will be higher.

In addition, the disc portion 71 has air movement grooves 82 and 82 ′ which penetrate the upper and lower surfaces at regular intervals, so that the through hole 33 inside the heat dissipation frame 3 is formed due to the light emission of the LED module 41. The formed hot air is to be moved to the inside of the base portion 5 is installed on the top.

In addition, the lower surface of the disc portion 71 is formed with insertion grooves 83, 83 ', 83', 83 '' 'bent inward from the lower surface, and insertion grooves 83, 83 '), (83' '), (83' '') are the insertion projections 48, 48 'of the diffusion cover 4 of FIG. By being inserted, the LED module substrate 43 and the diffusion cover 4 are firmly coupled without being separated even when an external impact occurs.

In addition, the lower side wall portion 75 into which the upper portion of the heat dissipation flame 3 is inserted is bent inward from the lower contact surface 79 at the lower portion which penetrates the outer surface and the inner surface and is welded to the heat dissipation frame 3, thereby providing an air outlet passage ( Bending grooves 80, 80 ', 80 ", and 80' ", which are connected to 84, are formed at regular intervals, and bending grooves 80, 80 ', 80 " ) And 80 '' 'are formed to correspond to the positions of the vents 45, 45', 45 ', 45' '' of the heat dissipation frame 3 of FIG. Bending grooves 80, 80 ', 80' and 80 '' 'are assembled with vents 45, 45', 45 'and 45' By being assembled to be integrally connected to the LED module 41 to allow the heat exchanged hot air due to light emission of the LED module 41 to the outside.

The upper side wall portion 73 is formed as a side wall extending vertically from the outer periphery of the disc portion 71, the inner surface of the coupling grooves 76, 76 'bent outward from the inner surface is formed symmetrically with each other The coupling grooves 76 and 76 'are fitted with the coupling protrusions 53 and 54 of the base portion 5 of FIG. 8 to be described later, so that the base portion 5 is firmly attached to the coupling portion 7. To be combined.

In addition, an upper portion of the upper sidewall portion 73 protrudes upward from the upper sidewall portion 73, but an insertion portion 77 having a predetermined area that is formed to have a length larger than one fourth and less than one third of the entire outer circumference. Is formed, the insertion portion 77 is inserted into the interior of the base portion 5 during assembly, the outer surface of the insertion portion 77 is formed with a coupling protrusion 78 protruding outward from the outer surface, the coupling protrusion 78 ) Is fitted into the engaging grooves 76, 76 ′ of the base portion 5.

In addition, the upper sidewall portion 73 is formed with an insertion portion 77 'having the same size and shape as the insertion portion 77 in a symmetrical center of the disc portion 71 so that the LED luminaire 1 is firmly coupled. do.

8 is a perspective view illustrating the base of FIG. 2, and FIG. 9 is a side view of FIG. 8.

The base part 5 of FIG. 8 is installed on the upper part of the coupling part 7, is electrically coupled to a socket (not shown) to apply power to the LED module 41, and has a cylindrical side in which a space is formed. (51), the inclined portion 55 is connected from the top of the side 51 and is formed to decrease the radius from the bottom toward the upper portion, and the socket insertion portion (57) electrically coupled to the socket (not shown) Is done.

In addition, the inclined portion 55 is formed through the wall surface of the inclined portion 55 along the circumference, the outlet grooves 58, 58 ', 58' 'having a predetermined length is formed, the outlet groove 58, 58 ', 58' are formed at regular intervals in a direction from the side 51 toward the socket insert 57, and the inclined portion 55 has outlet grooves 58, 58 ', ( Outflow grooves 59 and 60 having the same size and shape as 58 '' are formed at regular intervals so that hot air heat-exchanged inside the heat dissipation frame 3 is introduced into the air inlet 82 of the coupling part 7. ) Through the outlet grooves 58, 59, and 60 through the 82 and 82 '.

In addition, the socket insertion portion 57 is formed to extend on the upper end of the inclined portion 55 in a cylindrical shape, a thread 61 is formed on the outer surface to be coupled to the socket (not shown), (+) terminal (not shown) And (-) terminals (not shown) are formed on the bottom and the outer wall to be electrically coupled to the socket (not shown).

In addition, coupling grooves 63 and 63 'bent from the inner surface to the lower portion of the inner surface of the side 51 are formed, and the coupling grooves 63 and 63' are formed in the coupling portion 7 of FIG. The coupling protrusions 78 and 78 'are formed to match the positions of the coupling protrusions 78 and 78' so that the coupling protrusions 78 and 78 'are fitted into the coupling grooves 63 and 63'.

In addition, the lower end of the side 51, the engaging projections 64, 64 'are formed in the lower side in the direction toward the coupling portion 7 when assembled from the side 51, the engaging projections 64, 64' They are inserted into the engaging grooves 76, 76 ′ of the base portion 5 during assembly.

In addition, in the present invention, for example, the socket insertion portion 57 is formed in a circular shape on a plane, for example, but the socket insertion portion 57 can be electrically coupled to the socket (not shown), but various shapes according to the shape of the socket. It can be formed as.

10 is a perspective view illustrating the lid of FIG. 2, and FIG. 11 is a plan view of FIG. 10.

The cover part 9 shown in FIGS. 10 and 11 is installed as if it is sealed in the opened lower part of the heat dissipation frame 3 of the heat dissipation frame 3, and the plate part 92 is formed in a plate shape having a predetermined thickness. On the outer circumference of the plate portion 92, a side surface 91 connected vertically from the outer circumference is formed. At this time, the side surface 91 is formed so as to correspond to the lower outer shape of the heat dissipation frame 3 so that the lower portion of the heat dissipation frame 3 is inserted into it.

In addition, when assembling, the lower surface of the plate portion 92 facing outwards is formed with a curved portion 93 protruding outward from the lower surface and formed as a convex surface, and the curved portion 93 penetrates the inner and outer surfaces of the curved portion 93. An air inlet groove 94 is formed.

) 형상으로 형성되며, 곡면부(93)에는 유입 홈(94)과 동일한 면적과 형상의 복수개의 유입 홈(94')들이 곡면부(93)의 중앙을 대칭으로 복수개가 형성됨으로써 방열 프레임(3) 내부의 더운 공기가 외부로 유출되면 유입 홈(94), (94')들을 통해 외부의 차가운 공기가 방열 프레임(3) 내부로 유입될 수 있으며, 이에 따라 공기의 순환이 활발해져 방열이 원활하게 이루어지게 된다.Inlet groove 94 is also a boomerang (

The plurality of inflow grooves 94 'having the same area and shape as the inflow grooves 94 are formed in the curved portion 93 symmetrically in the center of the curved portion 93, so that the heat dissipation frame 3 ) If the hot air flows out to the outside, the cool air from the outside may flow into the heat dissipation frame 3 through the inflow grooves 94 and 94 '. Will be done.

In addition, the plate portion 92 between the inflow grooves 94, 94 ′ and the side surfaces 91 of the curved portion 93 has air moving grooves 96 and 96 penetrating the outer and inner surfaces of the plate portion 92. '), (96' '), (96' '') are formed, and the air moving grooves (96), (96 '), (96' '), (96' '') have a rectangular shape with a certain length. After assembly, it is cooled to an empty space between the LED module substrate 43 and the diffusion cover 4 through the air moving grooves 96, 96 ', 96' ', and 96' '' after assembly. Air enters.

In addition, although not shown in the upper surface of the plate 92, grooves into which the insertion protrusions 49 and 49 'of the diffusion cover 4 are inserted are formed so that the diffusion cover 4 is firmly coupled so as not to be separated from external impact. Be sure to

In addition, although not shown in the present invention, the watertight packing is preferably coupled between the cover 9 and the heat dissipation frame 3.

) 형상으로 형성되어 곡면부의 중앙을 중심으로 대칭되게 형성되는 것으로 예를 들어 설명하였으나 유입 홈(94)은 외부의 공기를 내부로 유입되도록 하는 다양한 형상으로 형성되어도 무방하다.10 and 11, the inflow groove 94 is a boomerang (

For example, the inlet groove 94 may be formed in various shapes such that external air is introduced into the inside.

In addition, the lower part of the cover portion 9 is formed with a curved portion 93 protruding to a convex curved surface so that the aesthetics are beautiful, so that the LED luminaire 1 according to the embodiment of the present invention can be used not only for lighting but also for decoration. do.

12 is a perspective view illustrating the diffusion cover of FIG. 2.

The diffusion cover 4 of FIG. 12 is disposed on the LED module substrate 43 at regular intervals so as to face the substrate contact surfaces 37, 37 ', 37' ', and 37' ''. It has a vertical direction in which a space is formed therein, and a cross section is formed in a semicircular shape to increase the diffusing power of the LED light of the LED modules 41.

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In addition, at both sides of the diffusion cover 4 in the vertical direction, the fitting portion A is formed to be fitted into the slot grooves B formed at both sides of the substrate contact surface 37, so that the diffusion cover 4 is formed on the substrate contact surface 37. By fitting in a sliding manner in), not only the assembling of the diffusion cover 4 is easy, but also the diffusion cover 4 is firmly coupled to the substrate contact surface 37.

In addition, the upper and lower portions of the diffusion cover 4 in the upper and lower longitudinal directions are inserted into the grooves (not shown) of the coupling portion (7) when the insertion projections 48, (48 '), (49), (49') Is formed to protrude.

As described above, in the LED lighting device 1 according to the embodiment of the present invention, the slot grooves B are formed on the substrate contact surface 37 of the heat dissipation frame 3, so that the LED module substrate 43 can be easily assembled and disassembled. A through hole 33 is formed in the heat dissipation frame 3, and a plurality of heat dissipation blades 34 and 34 ′ are formed in the through hole 33 so that heat generated from the LED element 42 contacts cold air. The heat dissipation area becomes wider, which increases the heat dissipation efficiency.

In addition, the heat dissipation efficiency is further increased by forming a plurality of ventilation holes 47 through which hot air flows out at a point where the substrate contact surfaces 37 and 37 ′ of the heat dissipation frame 3 are connected.

In addition, small holes 38 are formed in the outer surface of the substrate contact surface 37 on which the LED module substrate 43 is installed, and are connected to the inner through holes 33 from the outer surface, and the small holes 38 are formed in the LED module substrate 43. Since it is formed to be integrally connected to the mounted LED element 42, the heat generated by the light emission of the LED element 42 can be easily introduced into the through hole 33 can be heat exchanged in the cold air.

In addition, in the present invention, the coupling part 7 is installed between the heat dissipation frame 3 and the base part 5, and the coupling part 7 has bolt holes 81 and 81 'and the coupling protrusion 78. , 78 ′, coupling grooves 76 are formed to facilitate assembly and disassembly of the LED luminaire 1.

In addition, the lower side wall portion 75 of the coupling portion 7 is formed with a bent groove 80 is connected to the inner through-hole of the vent portion 45, the bent groove 80 is integrally connected to the vent portion 45 during assembly By being assembled so as to be connected to the hot air formed in the through-hole of the ventilation portion 45 is discharged to the outside through the bent groove (80).

In addition, the disc portion 71 of the coupling portion 7 is formed with air inlets 82 and 82 'through which bottom and top surfaces are formed so that hot air formed inside the heat dissipation frame 3 is formed in the base portion 5. Will move inside.

In addition, the inclined portion 55 of the base portion 5 is formed with a plurality of outflow grooves 58, 58 ', and 58' 'having a predetermined length so that hot air can easily flow out to the LED luminaire. The heat radiation effect of (1) is raised.

In addition, a plurality of air inlet grooves 94 through which external cool air flows are formed in the cover part 9 installed at the lower portion of the heat dissipation frame 3, and the air moving grooves 96, 96 ', (96 ''), (96 '' ') are formed so that the cool air flows into the through hole 33 of the heat dissipation frame 3, the heat generated by the light emission of the LED element 42 is heat exchanged to the cold air .

FIG. 13 is a perspective view illustrating a second embodiment of a heat dissipation frame applied to the LED luminaire of FIG. 2, FIG. 14 is a side view of FIG. 13, and FIG. 15 is a cross-sectional view taken along the line CC ′ of FIG. 14.

13 to 15 is a second embodiment of the heat dissipation frame applied to the LED luminaire 1 of Fig. 2 which is an embodiment of the present invention, is formed in a rectangular column shape having a vertical direction, Through holes 17 formed vertically in the vertical direction, substrate contact surfaces 11, 11 ', 11' ', and 11' '' formed on each side of the square pillar, and substrate contact surface 11 ), Vents 13, 13 ', 13' and 13 '' 'formed at the junction of (11'), (11 '') and (11 '' '). Is done.

In addition, the heat dissipation frame 10 is the same as the heat dissipation frame 3 of FIG. 3, the coupling part 7 and the base part 5 are installed in the upper part, the cover part 9 is installed in the lower part, and the coupling part 7 is provided. ), The base portion 5 and the cover portion 9 are formed in the same configuration and appearance as described above.

Substrate contact surfaces 11, 11 ', 11 ", and 11' " are formed on each surface of the heat radiation frame 10 formed in a rectangular columnar shape, and the substrate contact surfaces 11, 11 ' , (11 ''), (11 '' ') are formed into a flat surface formed with slot grooves (S) on both sides so that both sides of the LED module substrate 43 of FIG. Light is emitted from various angles to improve light uniformity.

In addition, the diffusion cover 12 of FIG. 12 is provided outside the LED module substrate 43, and the diffusion cover 12 has slot grooves formed at both sides of the substrate contact surface 11 in the same manner as the LED module substrate 43. By being coupled to (S) it is easy to assemble and disassemble when checking and failure of the LED module 41.

In addition, the inside of the heat dissipation frame 17 is formed through the upper and lower openings 17 in the vertical direction, the cold air flows in from the lower portion of the through hole 17, so that the hot air heat exchanged to the top flows out The air circulation is actively made, so that the heat dissipation is made efficiently.

In addition, a plurality of heat dissipation vanes 18 protruding inward from the inner surface are continuously formed on the inner surface of the through hole 17, and the heat dissipation vanes 18 are absorbed by cold air in the heat dissipation frame 10. The heat dissipation area in contact is increased to facilitate heat exchange.

In addition, the inner surface of the through hole 17, the "C" shaped bolt holes 19 are bent outward from the inner surface is formed continuously in the longitudinal direction to be bolted to the coupling portion 7 of FIG.

Also adjacent substrate contact surfaces (11) and (11 '), (11') and (11 ''), (11 '') and (11 '' '), (11' '') and (11) They are connected to the connection portion is formed with a ventilation portion 13 protruding in a rectangular pillar shape to the outside continuously in the longitudinal direction.

In addition, the ventilation part 13 is a flat surface connecting the protruding surfaces 15 and 15 'extending from one side of the substrate contact surfaces 11 and 11', and the protruding surfaces 15 and 15 '. The front surface 14 is formed of a surface, but the front surface 14 and the protruding surface 15, 15 'is formed with a ventilation groove 16 connected to the through hole 17 of the heat dissipation frame 10.

In addition, the ventilation groove 16 is formed at a predetermined distance from the top and bottom of the front surface 14, the ventilation groove 16 toward the protruding surface (15, 15 ') from the top and bottom to the middle point in the longitudinal direction It is formed to be bent inward. At this time, the ventilation groove 16 is formed as a curved surface closer to the substrate contact surfaces 11, 11 'from the top and bottom toward the intermediate point, the ventilation groove 16 is a projection surface (15, 15') It is formed to be connected to one side of the substrate contact surface (11), (11 ') at the intermediate point of the outside to allow the cool air to flow smoothly into the through hole 17, the hot air formed in the through hole 17 by heat exchange To flow smoothly to the outside.

In addition, the heat dissipation frame 10 of FIG. 13 is formed in a large area at a predetermined distance from the upper end and the lower end of the ventilation groove 16 and the front surface 14 and the protruding surfaces 15 and 15 'of the ventilation unit 13. By doing so, the air circulation becomes more active.

In addition, in FIGS. 13 to 15, for convenience of description, the heat dissipation frame 3 is formed in a quadrangular column shape to form the substrate contact surfaces 11, 11 ′, 11 ″, and 11 that form respective sides of the quadrangular pillar. For example, the number of '' ') is described as an example, but the heat dissipation frame 10 is not limited thereto, and the heat dissipation frame 10 may be formed in a polygonal columnar shape having a substrate contact surface.

In addition, like the heat dissipation frame 3 of FIG. 3, the substrate contact surfaces 11, 11 ′, 11 ″, and 11 ′ ″ have slot grooves B formed at both sides thereof to form an LED module substrate ( 43 and the diffusion cover 4 are inserted in a slide manner.

FIG. 16 is a cross-sectional view illustrating the diffusion cover of FIG. 12 coupled to the heat dissipation frame of FIG. 13.

As shown in FIG. 16, the diffusion cover 4 is fitted to the heat dissipation frame 10 of FIG. 13 in a slide manner, so that the assembly and disassembly can be easily performed during a failure and inspection.

In addition, since the heat dissipation frame 10 is formed to be bent inward as the ventilation groove 16 faces the center in the longitudinal direction, when equipment failure occurs during lighting, the worker absorbs heat when disassembling to check and replace the equipment. Since the equipment can be disassembled by picking up the diffusion cover 4 protruding to the outside of the heat dissipation frame 10, the heat dissipation frame 103 must be dissipated when the disassembly is performed in the conventional LED lighting device 100. Complementary work time can be saved.

1: LED luminaire 3: Heat dissipation frame 4: Diffusion cover
5: base part 7: coupling part 9: cover part
10: Heat dissipation frame 2nd Example 11: Substrate contact surface
13: Heat dissipation groove 15: Extruded surface 17: Through hole
33: through hole 34: heat dissipation wing 37: substrate contact surface
38: hole hole 40: convex part 45: ventilation part
47: Vent groove 48: Insertion protrusion 49: Insertion protrusion
71: disc portion 73: upper side wall portion 75: lower side wall portion
77: inserting portion 100: conventional LED luminaire

Claims (12)

Substrate contact surfaces are formed on each side of the polygonal pillar formed through the vertical longitudinal hole therein, and the ventilation portion is formed at the junction of the substrate contact surfaces and at least one ventilation groove is formed in the front surface connected to the through hole Heat dissipation frame;
An LED module substrate on which at least one LED module is mounted and installed on outer surfaces of the substrate contacts;
It includes a base portion that is detachably coupled to the upper portion of the heat dissipation frame,
The vents may extend outwardly by protrusions protruding outwardly from one end of an adjacent substrate contact surface, and at least one vent groove may be formed on a front surface connecting the protrusions. Luminaire. The method of claim 1, wherein the outer surface of the substrate contact surface is formed with at least one small hole connected to the through hole from the outer surface, the small hole is formed to be integrally connected to the LED module of the LED module substrate during assembly LED luminaires. delete The method of claim 1, wherein the ventilation groove is formed to be bent inward toward the protruding surfaces from the front surface and the front surface, the ventilation groove is at one end of the substrate contact surface toward the middle point of the ventilation groove from the top and bottom LED lighting, characterized in that formed on the protruding surface to be close. The LED lamp of claim 1, wherein the protruding surfaces are formed to be inclined. The LED lamp of claim 1, wherein at least one heat dissipation blade protruding inwardly from the inner surface of the through hole is continuously formed in the longitudinal direction. The LED lamp of claim 1, wherein slot grooves are formed at both sides of the substrate contact surfaces in the longitudinal direction, and both sides of the LED module substrate are inserted into the slot grooves. The LED lamp of claim 7, wherein a diffusion cover having a semicircular cross section is further provided on an outer side of the LED module substrate, and the diffusion cover is inserted at both sides of the slot grooves of the substrate contact surfaces. The method of claim 1, wherein the coupling portion is further provided between the heat dissipation frame and the base portion, the coupling portion
A disc portion formed in a plate shape and having at least one air moving groove passing through the both sides on both sides;
An upper sidewall portion extending vertically in a direction toward the base portion when assembled from an outer circumference of the disc portion;
A lower sidewall portion extending vertically in a direction toward the heat dissipation frame when assembled from an outer circumference of the disc portion,
An LED luminaire, characterized in that the air outlet passage is formed between the lower surface of the disc portion in contact with the upper surface of the heat dissipation frame and the upper surface of the heat dissipation frame. The LED lamp of claim 9, wherein the lower sidewall portion has bent grooves penetrating through an outer surface and an inner surface thereof, and the bent grooves are connected to the air outlet passage. The LED lamp of claim 10, wherein the bending grooves are integrally connected to the ventilation grooves of the heat dissipation frame when assembled. The LED lamp of claim 11, wherein the coupling part is made of an insulating material.

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