KR101145823B1 - Resin composition for printing and patterning method using the same - Google Patents

Abstract

The present invention is a resin composition for printing comprising 3 to 30% by weight of an alkali-soluble resin, 59 to 95.9% by weight of an organic solvent, 1 to 10% by weight of a colorant and 0.1 to 1% by weight of a surfactant, and a method of forming a pattern using the same. The present invention provides a method for forming a pattern of a substrate using the same, and an electronic device manufactured by the method.

Using the composition, not only can achieve the effect of simplicity and cost reduction in pattern formation, but also the pattern film formed by the resin composition for printing has excellent resistance to etching of the lower substrate, so that It can significantly reduce the pattern transfer failure, and also has the advantage of excellent transfer characteristics and no deterioration of the composition even in long-term use.

Description

Resin composition for printing and pattern formation method using the same {RESIN COMPOSITION FOR PRINTING AND PATTERNING METHOD USING THE SAME}

1 shows a method for transferring a resin composition for printing according to the present invention onto a substrate.

2 is an optical micrograph after transferring the resin composition for printing according to Example 1 of the present invention on a substrate.

3 is an optical micrograph after transferring the resin composition for printing according to Comparative Example 1 of the present invention on a substrate.

4 is an optical micrograph after transferring the resin composition according to Comparative Example 2 of the present invention on a substrate.

The present invention provides a resin composition for printing, a method of forming a pattern using the same, a method of forming a pattern of a substrate using the same, and an electronic device manufactured by the method. Specifically, the printing resin composition may be used as a pattern forming resin composition or a pattern forming resin composition of an electronic device, which may serve as a mask for forming a pattern of a metal film, a semiconductor film, or an insulating film.

In liquid crystal display devices and semiconductor devices, numerous layers formed on a substrate are patterned. Therefore, processes for forming and patterning the numerous layers on the substrate are performed, and various methods such as chemical vapor deposition and photoresist are generally used. However, since a large number of layers must be formed on the substrate, productivity is lowered when the pattern forming process is complicated, so applying a simple process method is essential for mass production. One relatively simple method is the printing method. The printing method is a method of forming a desired pattern by applying a desired material to a printing roll in a desired pattern, and then rotating the substrate onto a substrate. Such a printing method has limitations in its application due to physical contact between the substrate and the printing roll, but is advantageous for mass production because of its simple method, and has been variously modified and developed.

For example, the pattern formation during the TFT (thin film transistor) circuit manufacturing process of the liquid crystal display device may be performed by conducting metal films such as aluminum, copper, and molybdenum, semiconductor films such as amorphous silicon, silicon oxide films, and silicon nitride films. A photoresist film was formed by uniformly applying and baking a photosensitive resin composition to an insulating film of the photoresist film, and selectively exposing and developing the photoresist film to form a photoresist pattern. The metal film, the semiconductor film, or the insulating film is etched wet or dry to transfer the fine circuit pattern to the lower photoresist layer, and then the unnecessary photoresist pattern is removed with a stripper.

The process takes a considerable part in time and cost in the manufacture of the liquid crystal display because of the complexity of the process and the use of expensive equipment.

Accordingly, an object of the present invention is to provide a resin composition capable of forming a pattern by a printing method using a roll or a flat plate without undergoing an exposure and developing process in consideration of the problems of the process time and cost of the prior art. Moreover, an object of this invention is to provide the method of forming a pattern using the said resin composition, and the electronic device manufactured by this method.

The present invention provides a resin composition for printing comprising 3 to 30% by weight of alkali-soluble resin, 59 to 95.9% by weight of an organic solvent, 1 to 10% by weight of a colorant, and 0.1 to 1% by weight of a surfactant.

In addition,

(a) a resin comprising from 3 to 30% by weight of an alkali-soluble resin, from 59 to 95.9% by weight of an organic solvent, from 1 to 10% by weight of a colorant and from 0.1 to 1% by weight of a surfactant, on a substrate using a roll or flat printing method Patterning and coating the composition; And

(b) drying the coated resin composition

It provides a pattern forming method comprising a.

In addition,

(a) forming a metal film, a semiconductor film or an insulating film on the substrate;

(b) 3 to 30% by weight of alkali-soluble resin, 59 to 95.9% by weight of organic solvent, 1 to 10% by weight of colorant and 0.1 to 1 surfactant on the metal film, semiconductor film or insulating film by using a roll or printing method Patterning, coating, and drying the resin composition comprising weight percent;

(c) etching and patterning the metal film, semiconductor film, or insulating film using a pattern formed from the resin composition as a mask; And

(d) removing the pattern formed from the resin composition

It provides a pattern forming method of the substrate comprising a.

In addition, the present invention provides a pattern made of a resin composition according to the present invention or an electronic device comprising the same.

The electronic device using the pattern forming method of the substrate may be a plasma display panel (PDP), a printed circuit board (PCB), a liquid crystal display device or a semiconductor device.

EMBODIMENT OF THE INVENTION Hereinafter, this invention is demonstrated in detail.

The resin composition for printing of the present invention contains 3 to 30% by weight of alkali-soluble resin. The alkali-soluble resin is not particularly limited as long as it serves as a matrix resin for forming a pattern layer and has a dissolution property in an alkaline developer, but it is preferable to use a novolak resin.

The novolak resin may be synthesized by the condensation reaction of phenols and aldehydes. The phenols include phenol, 4-t-butylphenol, 4-t-octylphenol, 2-ethylphenol, 3-ethylphenol, 4-ethylphenol, o-cresol, m-cresol, p-cresol, 2,5 -Xylenol, 3,4-Xylenol, 3,5-Xylenol, 2,3,5-trimethylphenol, 3-methyl-6-t-butylphenol, 2-naphthol, 1,3-dihydroxynaphthalene Or bisphenol-A. The aldehydes include formaldehyde, paraformaldehyde, acetoaldehyde, benzaldehyde or phenylaldehyde. In the present invention, the phenols or aldehydes may be used alone or as a mixture of two or more thereof. As a catalyst used for the condensation reaction, organic acids such as oxalic acid, p-toluenesulfonic acid and trichloroacetic acid or inorganic acids such as sulfuric acid, hydrochloric acid and phosphoric acid, or metal salts such as zinc chloride, aluminum chloride, magnesium acetate and zinc acetate can be used. The molecular weight of the novolak resin used in the resin composition for printing of the present invention is preferably in the range of 2,500 to 15,000 weight average molecular weight based on polystyrene conversion.

When the content of the alkali-soluble resin is less than 3% by weight, it is difficult to form a pattern due to the content of a small resin when forming a pattern by the resin composition, and there is a problem in that the pattern is not formed on the substrate because there is no etching resistance when the pattern is formed on the substrate. When it exceeds 30% by weight, there is a problem that agglomeration of the resin occurs when transferring the pattern by the resin composition to the substrate.

The printing resin composition contains 59 to 95.9 wt% of an organic solvent. The organic solvent is responsible for dissolving alkali-soluble resins, colorants and surfactants to enable coating on the substrate.

Specific examples of the organic solvent include ketones such as acetone, methyl acetate, ethyl acetate, butyl carbitol acetate, methyl ethyl ketone, methyl isobutyl ketone, cyclopentanone, and cyclohexanone; Ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monopropyl ether Glycol ethers such as diethylene glycol monobutyl ether and dipropylene glycol monomethyl ether; Methyl acetate, ethyl acetate, butyl acetate, methyl propionate, ethyl propionate, 3-methoxymethyl propionate, ethyl lactate, ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol monopropyl Ether acetate, ethylene glycol monobutyl ether acetate, propylene glycol monomethyl ether acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol monopropyl ether acetate, diethylene glycol monobutyl ether acetate, diethylene glycol Acetates such as propylene glycol monomethyl ether acetate. In the present invention, the aforementioned organic solvents may be used alone or in a mixture of two or more thereof.

When the content of the organic solvent is less than 59% by weight, the resin composition of the present invention has a problem that it is difficult to transfer the pattern of the resin composition to the substrate due to rapid drying upon coating on a substrate such as PDMS (Polydimethylsiloxane), and more than 95.9% by weight. When the resin composition of the present invention is too late to dry, a swelling phenomenon occurs on a substrate such as PDMS, and thus a pattern may be broken.

The printing resin composition contains 1 to 10% by weight of a colorant. The colorant improves the bonding force with the resin and serves to make the resin composition hard to break without sagging when forming the pattern in the Clichée, so that the pattern transfer can be made precisely.

As the colorant, one or more pigments, dyes or mixtures thereof may be used, and preferably pigments. Black pigments that can be used include carbon black, graphite or metal oxides. Examples of carbon blacks are (in brand name) cysto 5HIISAF-HS, cysto KH, cysto 3HHAF-HS, cysto NH, cysto 3M, cysto 300HAF-LS, cysto 116HMMAF-HS, cysto 116MAF, cis Sat FMFEF-HS, Sisto SOFEF, Sisto VGPF, Sisto SVHSRF-HS and Sisto SSRF (Donghae Carbon Co., Ltd.); Diagram Black II, Diagram Black N339, Diagram Black SH, Diagram Black H, Diagram LH, Diagram HA, Diagram SF, Diagram N550M, Diagram M, Diagram E, Diagram G, Diagram R, Diagram N760M, Diagram LR, # 2700, # 2600, # 2400, # 2350, # 2300, # 2200, # 1000, # 980, # 900, MCF88, # 52, # 50, # 47, # 45, # 45L, # 25, # CF9, # 95, # 3030, # 3050, MA7, MA77, MA8, MA11, MA100, MA40, OIL7B, OIL9B, OIL11B, OIL30B or OIL31B (Mitsubishi Chemical Corporation); PRINTEX-U, PRINTEX-V, PRINTEX-140U, PRINTEX-140V, PRINTEX-95, PRINTEX-85, PRINTEX-75, PRINTEX-55, PRINTEX-45, PRINTEX-300, PRINTEX-35, PRINTEX-25, PRINTEX- 200, PRINTEX-40, PRINTEX-30, PRINTEX-3, PRINTEX-A, SPECIAL BLACK-550, SPECIAL BLACK-350, SPECIAL BLACK-250, SPECIAL BLACK-100, or LAMP BLACK-101 (Daegu Corporation); RAVEN-1100ULTRA, RAVEN-1080ULTRA, RAVEN-1060ULTRA, RAVEN-1040, RAVEN-1035, RAVEN-1020, RAVEN-1000, RAVEN-890H, RAVEN-890, RAVEN-880ULTRA, RAVEN-860ULTRA, RAVEN-850, RAVEN- 820, RAVEN-790ULTRA, RAVEN-780ULTRA, RAVEN-760ULTRA, RAVEN-520, RAVEN-500, RAVEN-460, RAVEN-450, RAVEN-430ULTRA, RAVEN-420, RAVEN-410, RAVEN-2500ULTRA, RAVEN-2000, RAVEN-1500, RAVEN-1255, RAVEN-1250, RAVEN-1200, RAVEN-1190ULTRA, or RAVEN-1170 (Colombia Carbon).

In addition, color pigments include carmine 6B (CI12490), phthalocyanine green (CI 74260), phthalocyanine blue (CI 74160), perylene black (BASF K0084. K0086), cyanine black, linol yellow (CI21090), linol yellow GRO (CI 21090), benzidine yellow 4T-564D, Victoria pure blue (CI42595), CI Pigment RED 3, 23, 97, 108, 122, 139, 140, 141, 142, 143, 144, 149, 166, 168, 175, 177, 180, 185, 189, 190, 192, 202, 214, 215, 220, 221, 224, 230, 235, 242, 254, 255, 260, 262, 264, 272; C.I. PIGMENT GREEN 7, 36; C.I. PIGMENT BLUE 15: 1, 15: 3, 15: 4, 15: 6, 16, 22, 28, 36, 60, 64; C.I. PIGMENT YELLOW 13, 14, 35, 53, 83, 93, 95, 110, 120, 138, 139, 150, 151, 154, 175, 180, 181, 185, 194, 213; C.I. PIGMENT VIOLET 15, 19, 23, 29, 32, 37, etc. In addition, a single or a mixture of two or more selected from the group consisting of a white pigment and a fluorescent pigment can be used. Other dyes such as Victoria Pure Blue, Crystal Violet or Methyl Violet can also be used.

If the content of the colorant is less than 1% by weight, the patterned portion may not be distinguished when the pattern is formed. If the content is more than 10% by weight, there is a problem of degrading a substrate such as PDMS.

The resin composition for printing of the present invention contains 0.01 to 1% by weight of surfactant. The surfactant serves to improve the coating uniformity of the pattern layer formed by the resin composition of the present invention and to remove stains.

Specific examples of the surfactant may be a silicone-based surfactant or a fluorine-based surfactant. Such a surfactant can satisfy both the hydrophobicity of PDMS that can be used as a blanket during pattern transfer and the hydrophilicity of glass that can be used as a substrate to which the pattern is transferred.

The resin composition for printing of the present invention may further include additives such as a film improving agent, a surfactant, a sensitizer, or a dye as necessary. The film improving agent is added to improve the thermal and mechanical properties of the resin composition pattern layer. For example, a plasticizer, an acrylic resin, a polystyrene derivative or a polyvinyl methyl ether may be used.

In addition, the present invention,

(a) a resin comprising from 3 to 30% by weight of an alkali-soluble resin, from 59 to 95.9% by weight of an organic solvent, from 1 to 10% by weight of a colorant and from 0.1 to 1% by weight of a surfactant, on a substrate using a roll or flat printing method Patterning and coating the composition; And

(b) drying the coated resin composition

It provides a pattern forming method comprising a.

In the step (a), the method of printing a roll or a flat plate refers to a roll or a flat plate type cliché by coating a resin composition in a predetermined pattern on a roll or plate type blanket, and then using the cliché to form a resin composition pattern. To transfer the substrate to the substrate. For example, the resin composition of the present invention is coated on a blanket-like blanket material (PDMS) using a slit nozzle, and then transferred onto a cliché in which grooves and protrusions of a specific shape are formed, and the resin on the cliché is formed. The resin composition remaining on the composition or the blanket may be contacted with the surface of the substrate to form a pattern. However, the scope of the present invention is not limited by such a method. The printing method applicable to the present invention is illustrated in FIG. 1.

In the present invention, it is preferable to use glass as the material of the cliché, and PDMS is preferred as the blanket material, but is not limited thereto.

In addition,

(a) forming a metal film, a semiconductor film or an insulating film on the substrate;

(b) a resin comprising from 3 to 30% by weight of an alkali-soluble resin, from 59 to 95.9% by weight of an organic solvent, from 1 to 10% by weight of a colorant and from 0.1 to 1% by weight of a surfactant, on a substrate using a roll or flat printing method Patterning and coating the composition;

(c) etching and patterning the metal film, semiconductor film, or insulating film using a pattern formed from the resin composition as a mask; And

(d) removing the pattern formed from the resin composition;

It provides a pattern forming method of the substrate comprising a.

In the step (a), the deposition of the metal film, the semiconductor film or the insulating film on the substrate may be performed by a method known in the art, such as spin coating, dip coating or doctor blading. The metal film, semiconductor film, or insulating film may be formed of silicon, aluminum, indium tin oxide (ITO), indium zinc oxide (IZO), molybdenum, nitrogen dioxide, silicon nitride, tantalum, copper, polysilicon, ceramic, aluminum / copper mixture or It can apply without exception to all the board | substrates to which patterns, such as various polymeric resins, are intended.

In the step (b), the roll or flat plate printing method is as described above.

In the step (c), a fine circuit pattern is formed by wet or dry etching the metal film, the semiconductor film or the insulating film using the pattern formed from the resin composition as a mask. According to the film quality of the lower substrate, wet etching using a liquid etching solution or dry etching using a plasma in a gas phase is performed. Metal substrates such as aluminum, molybdenum, copper, ITO, and chromium use liquid etching solutions such as a mixed acid solution of phosphoric acid / nitric acid / acetic acid, an aqueous solution of hydrogen peroxide, an aqueous solution of oxalic acid, and a protective film or semiconductor such as silicon nitride and amorphous silicon. The film is plasma etched.

In the step (d), the composition is removed with a stripping solution. The stripping solution may be a solvent mixture such as monoethanolamine, alkanolamine of 2- (2-aminoethoxy) ethanol, N-methylpyrrolidone, dimethylacetamide or diethylene glycol monoethyl ether, and the like. After spraying the stripper for 2 to 5 minutes at -80 ° C, it is preferable to wash with ultrapure water for 60 to 120 seconds and then dry.

The present invention provides a pattern made of the resin composition according to the present invention, or an electronic device including the same.

The manufacturing method of the electronic device according to the present invention may use techniques in the art, except that the pattern forming method using the above-described resin composition or the pattern forming method of the substrate is used. Further, the electronic device according to the present invention is not particularly limited as long as it includes a pattern formed according to the method of the present invention, but may be a plasma display panel (PDP), a printed circuit board (PCB), a liquid crystal display device, or a semiconductor device.

Specifically, the method of forming the TFT circuit pattern of the liquid crystal display device using the resin composition for roll printing of the present invention is as follows.

The TFT circuit of the liquid crystal display element is composed of a thin film transistor composed of a gate electrode, a gate insulating film, a semiconductor film (amorphous silicon), a source / drain electrode, a protective film, a gate bus line, a data bus line, and a pixel electrode. The TFT array is formed by arranging the unit pixels thus constructed in matrix. Conventional TFT arrays are manufactured by performing a photolithography process to pattern each stacked film into a shape having a predetermined shape, and are usually repeated 4 to 5 times. In the present invention, PDMS using a roll or a flat plate printing process is performed. After coating, the pattern is formed on the cliché and then transferred to the lower substrate, and prebaking, etching and stripping processes may be performed.

First, the printing resin composition of the present invention is coated on a PDMS substrate using a slit nozzle. After the pattern is transferred onto the cliché after coating, the pattern is contacted with the surface of the desired substrate to form a pattern, and the patterned resin composition is prebaked to remove the organic solvent to form a patterned photoresist film. At this time, the film thickness is about 0.5 to 3 µm, and the prebaking is preferably performed at 80 to 200 ° C for 1 to 5 minutes. 2 and 3 show optical micrographs after the resin composition for printing according to the present invention is transferred onto a substrate.

After the patterned photoresist film is formed as described above, the lower substrate is etched using the patterned photoresist film as a mask to form a pattern.

After the etching is completed, the photoresist film is stripped off. The stripper uses a solvent mixture such as monoethanolamine, alkanolamine of 2- (2-aminoethoxy) ethanol, N-methylpyrrolidone, dimethylacetamide or diethylene glycol monoethyl ether, and the like. After spraying the stripper for 2 to 5 minutes at, it is preferable to wash with ultrapure water for 60 to 120 seconds and then dry.

Forming a circuit pattern of an electronic device using the resin composition for printing according to the present invention can significantly reduce the simplicity and time saving of the process, and minimize the photoresist denaturation, thereby drastically reducing residue and foreign material defects in the strip process. Can improve the yield.

< Example  1>

18g of novolak resin having a weight average molecular weight of 6,500 in terms of polystyrene prepared by mixing m-cresol and p-cresol weight ratio 5: 5, and C.I. PIGMENT BLUE 15: 6 and C.I. 0.8 g of PIGMENT VIOLET 23 and 0.3 g of florin-based surfactant were dissolved in 18 g of butyl carbitol acetate and 62.9 g of methyl acetate, and filtered to 0.2 µm to prepare a resin composition for printing.

Comparative Example 1

A resin composition for printing was prepared in the same manner as in Example 1 except that 0.8 g of Victoria Pure Blue was added as dye particles instead of 0.8 g of pigment particles.

Comparative Example 2

Prepared by mixing m-cresol and p-cresol weight ratio 5: 5 A resin composition was prepared by dissolving 18 g of novolak resin and 0.2 g of florin-based surfactant having a polystyrene equivalent weight average molecular weight of 6,500 in propylene glycol monomethyl ether acetate, and then filtration at 0.2 μm.

< Experimental Example >

The prepared resin composition for printing was evaluated for stability over time, substrate adhesion characteristics and drying characteristics in the following manner.

1) Evaluation of stability over time

After spin coating the resin composition for printing on PDMS and transferring it to a substrate, the coating stability over time was performed by the following method. First, after the spin coating of the resin composition for printing on PDMS, the uniformity of the surface was visually evaluated. As a result of the stability over time, after coating the resin composition for printing on PDMS, it was possible to visually confirm the void (void) and coating formation, the results are shown in Table 1.

The stability over time was evaluated based on the following criteria.

○: Excellent stability over time (within 5% change in coating properties)

△: Stability slightly deteriorated with time (coating characteristic change 5% to 10%)

X: Poor stability over time (10% or more of coating characteristic change)

2) Evaluation of Lower Substrate Transfer Characteristics

The resin composition for printing was transferred onto molybdenum 1000Å deposited 4 "glass and copper 1000Å deposited glass, respectively, and the pattern formation state was evaluated by measuring the interval between patterns. The results of the transfer characteristics evaluation are shown in Table 1 below. It was.

○: excellent pattern characteristics (within 1 ~ 2㎛)

(Triangle | delta): Poor pattern characteristic performance (2-10 micrometers)

X: pattern characteristic defect (10 micrometers or more)

3) Drying property evaluation

After the pattern was formed using the resin composition for printing, the state of maintaining the pattern formation without flowing down after the soft bake was evaluated using an optical microscope. Table 1 shows the results of the drying characteristics evaluation.

○: excellent drying characteristics (100% emissivity)

(Triangle | delta): Poor drying characteristic performance (50-90% of transfer rate)

X: Drying property defect (less than 50% of transfer rate)

[Table 1]

division
Composition Components (wt%) Properties a) alkali
Soluble resin b) organic solvents c) pigments / dyes d) surfactants Coating Transcription Dryness Kinds amount Kinds amount Kinds amount Kinds amount
Example 1
Novolac
Suzy

18
MA
18
Pigment
0.8

Florin

0.3

○
○
○
BGA
62.9
Comparative example
One

Novolac
Suzy
18
MA
18
dyes
0.8
Florin

0.3

○
×
○
BGA
62.9
Comparative Example 2
Novolac
Suzy
18
PGMEA
81.7

Florin
0.3
×
×
×

* MA: methyl acetate

* BCA: Butyl Carbitol Acetate

* PGMEA: Propylene glycol monomethyl ether acetate

* Pigments: BLUE 15: 6 and VIOLET 23

Dye: Victoria Pure Blue

Using the resin composition of the present invention can not only achieve the effect of the simplicity and cost reduction of the process when forming the pattern, but also excellent resistance to etching can significantly reduce the pattern transfer defects in the etching process. In addition, the resin composition of the present invention has the advantage of excellent transfer properties and no deterioration of the composition even when used for a long time.

Claims (17)

3 to 30% by weight of alkali-soluble resin, 59 to 95.9% by weight of organic solvent, 0.8 to 10% by weight of pigment, and 0.1 to 1% by weight of surfactant, the pigment being black pigment, colored pigment, white pigment and fluorescence A resin composition for printing, which is a single or a mixture of two or more selected from the group consisting of pigments. The resin composition for printing according to claim 1, wherein the alkali-soluble resin is a novolak resin. The method of claim 2, wherein the novolak resin is synthesized by the condensation reaction of phenols and aldehydes, the phenols are phenol, 4-t-butylphenol, 4-t-octylphenol, 2-ethylphenol, 3-ethyl Phenol, 4-ethylphenol, o-cresol, m-cresol, p-cresol, 2,5-xylenol, 3,4-xylenol, 3,5-xylenol, 2,3,5-trimethylphenol, 3 -Methyl-6-t-butylphenol, 2-naphthol, 1,3-dihydroxynaphthalene and bisphenol-A, and aldehydes in the group consisting of formaldehyde, paraformaldehyde, acetoaldehyde, benzaldehyde and phenylaldehyde Resin composition for printing, characterized in that selected alone or a mixture of two or more. The resin composition of claim 2, wherein the novolak resin has an average molecular weight in the range of 2,500 to 15,000. The method of claim 1, wherein the organic solvent is acetone, methyl acetate, ethyl acetate, butyl carbitol acetate, methyl ethyl ketone, methyl isobutyl ketone, cyclopentanone, cyclohexanone, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether , Ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monopropyl ether, diethylene glycol monobutyl ether, dipropylene glycol Monomethyl ether, methyl acetate, ethyl acetate, butyl acetate, methyl propionate, ethyl propionate, 3-methoxymethyl propionate, ethyl lactate, ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, Ethylene Glycol Monoprop Fill ether acetate, ethylene glycol monobutyl ether acetate, propylene glycol monomethyl ether acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol monopropyl ether acetate, diethylene glycol monobutyl ether acetate and A resin composition for printing, characterized in that it is a single or a mixture of two or more selected from the group consisting of dipropylene glycol monomethyl ether acetate. delete The resin composition for printing according to claim 1, wherein the black pigment is a single or a mixture of two or more selected from the group consisting of carbon black, graphite, and metal oxide pigments. The method of claim 1, wherein the surfactant is a resin composition for printing, characterized in that at least one selected from the group consisting of silicone-based surfactants and fluorine-based surfactants. The resin composition for printing according to claim 1, wherein the resin composition for printing further comprises at least one of a film improving agent, a surfactant, a sensitizer and a dye. (a) 3 to 30 weight percent alkali-soluble resin, 59 to 95.9 weight percent organic solvent, 0.8 to 10 weight percent pigment, and 0.1 to 1 weight percent surfactant, on a substrate using a roll or flat printing method, The pigment may be coated by coating a resin composition which is a single or a mixture of two or more selected from the group consisting of black pigments, color pigments, white pigments and fluorescent pigments; And (b) drying the coated resin composition Pattern forming method comprising a. The method of claim 10, wherein the roll or flat printing method of step (a) is performed after coating the resin composition on the blanket and transferring it to a cliché having grooves and protrusions formed thereon, thereby restoring the resin composition remaining on the blanket. And a method of transferring the pattern in contact with the surface of the substrate. (a) forming a metal film, a semiconductor film or an insulating film on the substrate; (b) 3 to 30% by weight of alkali-soluble resin, 59 to 95.9% by weight of organic solvent, 0.8 to 10% by weight of pigment and 0.1 to 1 surfactant on the metal film, the semiconductor film or the insulating film by using a roll or flat plate printing method Wt%, wherein the pigment is coated and dried by patterning a resin composition which is a single or a mixture of two or more selected from the group consisting of black pigments, color pigments, white pigments and fluorescent pigments; (c) etching and patterning the metal film, semiconductor film, or insulating film using a pattern formed from the resin composition as a mask; And (d) removing the pattern formed from the resin composition Pattern forming method of the substrate comprising a. The method of claim 12, wherein the roll or flat printing method of step (a) is performed after coating the resin composition on the blanket and transferring it to a cliché having grooves and protrusions formed thereon, thereby restoring the resin composition remaining on the blanket. The pattern forming method of the substrate which is performed by the method of transferring the pattern in contact with the surface of the substrate. 3 to 30% by weight of alkali-soluble resin, 59 to 95.9% by weight of organic solvent, 0.8 to 10% by weight of pigment, and 0.1 to 1% by weight of surfactant, the pigment being black pigment, colored pigment, white pigment and fluorescence An electronic device comprising a pattern consisting of a resin composition that is a single or a mixture of two or more selected from the group consisting of pigments. The electronic device of claim 14, wherein the electronic device is a plasma display panel (PDP), a printed circuit board (PCB), a liquid crystal display device, or a semiconductor device. The pigment of claim 1 wherein the pigments with color are Carmine 6B, Phthalocyanine Green, Phthalocyanine Blue, Perylene Black, Cyanine Black, Linol Yellow, Linol Yellow, Benzidine Yellow, Victoria Pure Blue, C.I. Pigment Red, C.I. Pigment Green, C.I. Pigment Blue, C.I. Pigment yellow, and C.I. The resin composition for printing, characterized in that the printing is characterized in that the mixture is selected from the group consisting of pigment violet or two or more. The method according to claim 7, wherein the carbon black is cysto 5HIISAF-HS, cysto KH, cysto 3HHAF-HS, cysto NH, cysto 3M, cysto 300HAF-LS, cysto 116HMMAF-HS, cysto 116MAF, cis Sat FMFEF-HS, Sisto SOFEF, Sisto VGPF, Sisto SVHSRF-HS and Sisto SSRF (Donghae Carbon Co., Ltd.); Diagram Black II, Diagram Black N339, Diagram Black SH, Diagram Black H, Diagram LH, Diagram HA, Diagram SF, Diagram N550M, Diagram M, Diagram E, Diagram G, Diagram R, Diagram N760M, Diagram LR, # 2700, # 2600, # 2400, # 2350, # 2300, # 2200, # 1000, # 980, # 900, MCF88, # 52, # 50, # 47, # 45, # 45L, # 25, # CF9, # 95, # 3030, # 3050, MA7, MA77, MA8, MA11, MA100, MA40, OIL7B, OIL9B, OIL11B, OIL30B or OIL31B (Mitsubishi Chemical Corporation); PRINTEX-U, PRINTEX-V, PRINTEX-140U, PRINTEX-140V, PRINTEX-95, PRINTEX-85, PRINTEX-75, PRINTEX-55, PRINTEX-45, PRINTEX-300, PRINTEX-35, PRINTEX-25, PRINTEX- 200, PRINTEX-40, PRINTEX-30, PRINTEX-3, PRINTEX-A, SPECIAL BLACK-550, SPECIAL BLACK-350, SPECIAL BLACK-250, SPECIAL BLACK-100, or LAMP BLACK-101 (Daegu Corporation); And RAVEN-1100ULTRA, RAVEN-1080ULTRA, RAVEN-1060ULTRA, RAVEN-1040, RAVEN-1035, RAVEN-1020, RAVEN-1000, RAVEN-890H, RAVEN-890, RAVEN-880ULTRA, RAVEN-860ULTRA, RAVEN-850, RAVEN -820, RAVEN-790ULTRA, RAVEN-780ULTRA, RAVEN-760ULTRA, RAVEN-520, RAVEN-500, RAVEN-460, RAVEN-450, RAVEN-430ULTRA, RAVEN-420, RAVEN-410, RAVEN-2500ULTRA, RAVEN-2000 , Phosphorus for printing, characterized in that it is a single or a mixture of two or more selected from the group consisting of RAVEN-1500, RAVEN-1255, RAVEN-1250, RAVEN-1200, RAVEN-1190ULTRA, or RAVEN-1170 (Colombia Carbon Co., Ltd.) Resin composition for printing, characterized in that.

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