KR101138611B1 - Apparatus for treating Substrate including Injectior - Google Patents

Abstract

The present invention relates to a substrate processing apparatus including an injector capable of injecting gas into a parabola on a substrate at an end of a rotatable injector, comprising: a chamber providing a reaction space; A substrate holder for placing a substrate in the chamber; A rotatable injector including a plurality of first injection holes for supplying gas onto the substrate; And a side portion provided at both ends of the rotatable injector and including a plurality of second injection holes for supplying a gas in a parabolic form on the substrate.

Rotary injector, injection hole, substrate processing device, side part

Description

Apparatus for treating Substrate including Injectior}

The present invention relates to a substrate processing apparatus including an injector, and more particularly, an injector capable of forming a rotary injector shorter than a diameter or a diagonal length of a substrate and injecting a gas into a parabola on a substrate at an end of the rotary injector. It relates to a substrate processing apparatus including a.

In general, a flat panel display device including an organic light emitting device is a thin film deposition process for depositing a thin film of a specific material on the substrate, a photo process using a photosensitive material to expose or conceal a selected region of the thin film, and to remove the thin film of the selected region The patterning process is performed through an etching process such as patterning, and is performed in a substrate processing apparatus designed for an optimal environment. In the substrate processing apparatus used for the thin film deposition process, a gas supply device for supplying the reaction gas, the source gas and the purge gas is provided on the substrate, and must be uniformly sprayed on the substrate.

1 is a cross-sectional view of a conventional substrate processing apparatus, FIG. 2 is a schematic view of a conventional rotary injector, FIG. 3 is a rear view of a conventional rotary injector, and FIG. 4 is a conventional rotary injector and It is a relationship diagram of a board | substrate.

As shown in FIG. 1, the substrate processing apparatus 10 includes a chamber 12 defining a reaction region sealed to the outside, a rotary injector 14 installed above the chamber 12, and a rotary injector 14. It is composed of a substrate support 18 located in the lower portion and the substrate 16 is placed, and a gas supply pipe 20 for supplying gas to the rotary injector 14. As shown in FIG. 2, a gas supply pipe 20 is connected to a central portion of the rotary injector 14, and the gas supplied through the gas supply pipe 20 rotates uniformly on the substrate 16 while the rotary injector 14 rotates. Spray it.

On the rear surface of the rotary injector 14, a plurality of injection holes 34 for supplying gas onto the substrate 16 are distributed at regular intervals. As shown in FIG. 1, through a plurality of injection holes 34 of the rotary injector 14, gas is vertically supplied onto the substrate 16 to deposit a thin film (not shown).

In order to distribute the gas uniformly on the substrate 16, as shown in FIG. 4, the length of the rotary injector 14 is equal to or larger than the diameter of the substrate 16 when the substrate 16 is circular. In the case where the rectangle 16 is rectangular, it is equal to or larger than the diagonal of the substrate 16. If the diameter of the substrate 16 is smaller than the diameter or the diagonal length, the end region of the substrate 16 does not have a thin film deposited thereon. In the related art, since the length of the rotatable injector 14 is formed to correspond to the diameter or diagonal length of the substrate 16, the size of the chamber 12 is proportional to the length of the rotatable injector 14.

Therefore, since the chamber 12 is manufactured on the basis of the diagonal length of the substrate 16, the chamber 12 includes unnecessary volume, and when the rotary injector 14 has a rectangular shape of the substrate 16, the shortening of the substrate 16 is reduced. When rotating, the gas consumption does not increase due to the gas not contributing to the deposition of the thin film, and the capacity of the pump for evacuating the chamber 12 must also increase. When using a rotary injector as in the prior art, there is a problem that the operating cost and equipment manufacturing cost of the substrate processing apparatus increases.

In order to solve the above problems of the prior art, the present invention provides a substrate including a rotary injector for reducing the volume and gas consumption of the chamber by installing a rotary injector of a length shorter than the diameter of the substrate or the length of the diagonal. It relates to a processing apparatus.

The present invention relates to a substrate processing apparatus including a rotatable injector capable of reducing the length of the rotatable injector by installing a plurality of injection holes capable of injecting gas by drawing a parabola on the side of the rotatable injector. .

Substrate processing apparatus including an injector according to the present invention for achieving the above object, the chamber for providing a reaction space; A substrate holder for placing a substrate in the chamber; A rotatable injector including a plurality of first injection holes for supplying gas onto the substrate; And a side portion provided at both ends of the rotatable injector and including a plurality of second injection holes for supplying a gas in a parabolic form on the substrate.

In the substrate processing apparatus including the injector as described above, the side surface portion is characterized in that it comprises a projection projecting in the vertical direction with the rotatable injector.

In the substrate treating apparatus including the injector as described above, the side surface portion is sealed except for a portion connected to the rotatable injector.

In the substrate processing apparatus including the injector as described above, the side portion is a cylindrical tube having a diameter equal to the height of the rotatable injector is vertically connected to the end of the rotatable injector, the plurality of second injection holes It is characterized in that formed in the lower diameter of the side portion parallel to the substrate.

In the substrate processing apparatus including the injector as described above, wherein the plurality of first injection holes are installed perpendicular to the substrate, the plurality of second injection holes are 0 to 90 degrees with respect to the reference line perpendicular to the substrate. It features.

In the substrate processing apparatus including the injector as described above, the rotary injector may include first, second, and third sub-injectors for supplying a reaction gas, a purge gas, and a source gas, respectively.

In the substrate processing apparatus including the injector as described above, the rotary injector is characterized in that it has a length equal to or less than the length of the diameter or the diagonal of the substrate.

Substrate processing apparatus including an injector according to an embodiment of the present invention has the following effects.

In the substrate processing apparatus, since the length of the rotary injector is set to be shorter than the diameter of the substrate or the length of the diagonal, the volume of the chamber can be reduced as compared with the prior art of manufacturing the rotary injector with a length corresponding to the diagonal length of the substrate. Can reduce the gas consumption and equipment operating costs. In addition, the travel distance with respect to the input and output of the substrate in the chamber is reduced, thereby improving productivity.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

5 is a diagram illustrating a relationship between a rotary injector and a substrate in which the rotary injector is positioned in the long axis direction of the substrate according to the present invention, and FIG. Fig. 7 is a cross-sectional view of the substrate treating apparatus according to the present invention cut by A-A 'of Fig. 6, Fig. 8 is a perspective view of a rotary injector according to the present invention, and Fig. 9 is a sectional view of the present invention. Side detail view of a typical injector, and FIG. 10 is a relational view of a side portion and a substrate according to the present invention.

As shown in FIG. 7, the substrate processing apparatus 110 includes a chamber 112 defining a reaction area sealed to the outside, a rotatable injector 114 installed above the chamber 112, and a rotatable injector 114. It is composed of a substrate support 118 positioned below the substrate 116 and the gas supply pipe 120 for supplying gas to the rotary injector 114. The rotatable injector 114 is fabricated to a length equal to or less than the diameter or diagonal of the substrate 116. As shown in FIG. 8, the gas supply pipe 120 is connected to the center of the rotatable injector 114, and the substrate 116 is rotated while the rotatable injector 114 rotates the gas supplied by a constant pressure through the gas supply pipe 120. Spray uniformly on

The gas supply pipe 120 includes a first gas pipe 122 for supplying a reaction gas, a second gas pipe 124 for supplying a purge gas, and a third gas pipe 126 for supplying a source gas. The first gas pipe 122 is connected to the first sub injector 128, the second gas pipe 124 is connected to the second sub injector 130, and the third gas pipe 126 is connected to the third sub injector 132. Connected with. The first, second, and third sub injectors 128, 130, and 132 have a plurality of first injection holes 134 for supplying a gas onto the substrate 116 at a rear surface of the first, second, and third sub injectors. At both ends of each of the first, second and third sub injectors 128, 130 and 132, side portions 140 perpendicular to the longitudinal direction of the rotatable injector 114 are provided.

The side portion 140 is sealed except for portions connected to each of the first, second and third sub injectors 128, 130, and 132, and a plurality of second injection holes 146 are formed in the outward direction. . The side part 140 may include protrusions 142 protruding in the vertical direction of the first, second and third sub injectors 128, 130, and 132. The injection distance of the gas injected from the side part 140 may be controlled by adjusting the volume of the protrusion 142. Side portion 140 is a cylindrical tube having the same diameter as each of the first, second and third sub-injector (128, 130, 132) is vertically connected to the end thereof, the plurality of second injection holes (146) It is formed below the diameter of the side portion 140 parallel to the substrate 116.

9 and 10, the angle between the side portion 140 on which the plurality of second injection holes 146 are installed and the reference line 144 perpendicular to the substrate 116 is 0 to 90 °. When the second injection hole 146 is formed on the diameter of the side portion 140 parallel to the substrate 116, the side portion 140 where the reference line 144 and the second injection hole 146 are located becomes 0 °. When the second injection hole 146 is formed on the diameter of the side portion 140 parallel to the reference line 144 perpendicular to the substrate 116, the side portion at which the reference line 144 and the second injection hole 146 are located is located. The angle of 140 is 90 degrees. The density, spacing, and angle between the second injection hole 146 and the reference line 144 perpendicular to the substrate 116 are designed according to the pressure of the thin film and the gas formed on the substrate 116.

As shown in FIG. 7, the reaction is performed through the plurality of first injection holes 134 and the plurality of second injection holes 146 by the rotation of the first, second and third sub injectors 128, 130, and 132. The gas is supplied onto the substrate 116 in the order of the order of purge, source, and source gas to deposit a thin film (not shown). In order to distribute the gas evenly on the substrate 116, as shown in FIGS. 5 and 6, the length of the rotatable injector 114 is formed equal to or smaller than the diameter of the substrate 116 or the length of the diagonal.

In FIG. 5, the first region 150 in which the rotatable injector 114 rotates is supplied with gas perpendicularly to the substrate 116 through the plurality of first injection holes 134, and the rotatable injector 114 is rotated. Is concentric with the rotating first region 150, the second region 152 on the outside of the first region 150 is a plurality of second injection is installed on the side portion 140 of the rotatable injector 114 It is supplied in the form of a parabola through the hole 146. The distance between the first region 150 and the second region 152 is a distance of gas supplied through the plurality of second injection holes 146. The flying distance depends on the angle formed by the plurality of second injection holes 146 installed in the side part 140 and the reference line 144 perpendicular to the substrate 116. When designing the rotary injector 114, the distance of the gas injected from the side portion 140 is taken into account.

Since the length of the rotatable injector 114 is formed to be shorter than the diameter of the substrate 116 or the length of the diagonal, the volume of the chamber 112 can be reduced unlike the prior art. Therefore, since the volume of the chamber 112 is reduced, the operating cost and equipment manufacturing cost of the substrate processing apparatus can be reduced by reducing the gas consumption and the capacity of the pump for evacuating the chamber 112. In addition, the movement distance with respect to the input / output of the substrate 116 in the chamber 112 is reduced, thereby improving productivity.

1 is a cross-sectional view of a substrate processing apparatus of the prior art.

2 is a schematic diagram of a prior art rotary injector

3 is a rear view of a rotary injector of the prior art;

4 is a relational view of a conventional rotary injector and a substrate

5 is a diagram illustrating a relationship between a rotary injector and a substrate in which a rotary injector is positioned in a long axis direction of the substrate according to the present invention;

6 is a relational view of a rotary injector and a substrate in which the rotary injector is positioned in a diagonal direction of the substrate according to the present invention;

FIG. 7 is a cross-sectional view of the substrate treating apparatus according to the present invention taken along the line AA ′ of FIG. 6.

8 is a perspective view of a rotary injector according to the present invention;

9 is a side detail view of the rotatable injector according to the present invention;

10 is a relationship between the side portion and the substrate according to the present invention

Claims (7)

A chamber providing a reaction space; A substrate holder for placing a substrate in the chamber; A rotatable injector including a plurality of first injection holes for supplying gas onto the substrate; Side portions provided at both ends of the rotatable injector and including a plurality of second injection holes for supplying gas onto the substrate; And A protruding portion protruding from the side surface portion in a vertical direction with the rotatable injector and controlling an injection distance of the gas injected from the plurality of second injection holes; Substrate processing apparatus comprising an injector comprising a. delete The method of claim 1, And the side portion is sealed except for a portion connected to the rotatable injector. The method of claim 1, The side portion is a cylindrical tube having the same diameter as the rotary injector is vertically connected to the end of the rotary injector, the plurality of second injection holes are formed in the lower diameter of the side portion parallel to the substrate Substrate processing apparatus including an injector. The method of claim 1, The plurality of first injection holes are installed perpendicular to the substrate, the plurality of second injection holes are substrate processing apparatus including an injector, characterized in that 0 to 90 ° with respect to the reference line perpendicular to the substrate. The method according to any one of claims 1 and 3 to 5, The rotatable injector includes a first, second and third sub injectors for supplying a reaction gas, a purge gas, and a source gas, respectively. The method according to any one of claims 1 and 3 to 5, The rotatable injector is substrate processing apparatus comprising an injector, characterized in that having a length equal to or less than the length of the diameter or diagonal of the substrate.

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