KR101136581B1 - Lighting apparatus - Google Patents

Abstract

PURPOSE: A light emitting apparatus is provided to improve the radiation efficiency of the light emitting apparatus by radiating the heat generated from the LED chip to the heat sink and the case. CONSTITUTION: A light emitting unit comprises a printed circuit board and an LED chip which generates the light. A reflector(200) is arranged to surround the printed circuit board along the edge of the printed circuit board. A heat sink(300) is arranged on the lower part of the printed circuit board. The heat sink comprises a body(310) and a plurality of heat radiation fins(320).

Description

Lighting device {LIGHTING APPARATUS}

The present invention relates to a lighting device, and more particularly to a lighting device that can be used for general lighting.

In general, light emitting devices such as light emitting diodes (LEDs) have many advantages such as high luminous efficiency, low power consumption, and environmental friendliness, and thus, the technical field using the light emitting devices is increasing. .

In general, an illumination device using the light emitting element as a light source, such as a lamp, is composed of an optical module and an electronic module. The optical module includes a light emitting unit for generating light and a reflection shade disposed to surround the light emitting unit, and the electronic module is coupled to an external power supply socket to receive driving power and transmit the driving power to the optical module.

Light generated by the light emitting unit is reflected by the reflection shade and irradiated to the upper side of the lighting device. In this case, a problem arises in that a lens having one surface formed convexly on the reflection shade in order to have a constant orientation angle occurs. In addition, when an AC is input to the driving power source for driving the light emitting device, a non-light emitting time during which no light is generated in the light emitting device is longer, thereby confirming a moment when no light is generated in the light emitting device. Problems may occur.

Accordingly, the present invention has been made in view of the above problems, and the present invention relates to a lighting apparatus that can easily control a directing angle.

Illumination apparatus according to an aspect of the present invention includes a light emitting unit and a reflection shade. The light emitting unit includes a printed circuit board and at least one LED package mounted on one surface of the printed circuit board to generate light. The reflection shade is disposed to surround the printed circuit board along the edge of the printed circuit board, and reflects the light generated from the LED package and irradiates upward to have a predetermined directivity angle. In this case, the distance from the LED package to the center of the direction angle from the upper end of the reflection shade is formed 1.5 times longer than the distance from the LED package to the lower end of the reflection shade.

The lighting apparatus may further include a heat sink disposed under the printed circuit board and having a mounting surface on which the printed circuit board is mounted. The lighting apparatus may further include a power connection unit coupled to the bottom surface of the heat sink facing the mounting surface to be detachably attached thereto, and receiving a driving power to drive the LED package from the outside.

In addition, the lighting device is formed of an aluminum material formed on the outer surface of the reflector, further comprises a case coupled to the heat sink, supported by the other end of the reflector, the characteristics of the light generated in the LED package The lens may further include a lens.

The printed circuit board may be a metal printed circuit board (MPCB) including a base layer formed of a metal material and an insulating layer disposed on one surface of the base layer and formed of a ceramic filler.

In addition, the LED package may include a plurality of AC driving LED packages driven by an AC voltage, and the printed circuit board may include an LED driving circuit which may increase a light emission time of the AC driving LED packages. .

According to such a lighting apparatus, the distance from the LED package to the center of the orientation angle from the LED package to the upper end of the reflector is formed 1.5 times longer than the distance from the LED package to the bottom of the reflector, thereby adjusting the inclination of the reflector to facilitate the orientation. Can be controlled.

In addition, it is possible to reduce the phenomenon that the LED package flickers by increasing the light emission time of the LED package driven by AC power.

As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to a specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention.

The terms first, second, etc. may be used to describe various elements, but the elements should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "having" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described in the specification, and that one or more other features It should be understood that it does not exclude in advance the possibility of the presence or addition of numbers, steps, actions, components, parts or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art.

Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the meaning in the context of the relevant art and are to be interpreted as ideal or overly formal in meaning unless explicitly defined in the present application Do not.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings.

1 is a perspective view showing a lighting apparatus according to an embodiment of the present invention, Figure 2 is a cross-sectional view showing a cross section taken along the line II 'of FIG. 1 and 2, the lighting apparatus according to the present exemplary embodiment includes a light emitting unit 100, a reflection shade 200, a heat sink 300, a power connection unit 400, 500, and a lens 600.

The light emitting unit 100 includes a printed circuit board 110 and at least one LED package 120 mounted on an upper surface of the printed circuit board 110 to generate light.

The printed circuit board 110 may have a plurality of wires (not shown). The wires may be formed on the top, bottom, or top and bottom surfaces of the printed circuit board 110. The LED package 120 is mounted on an upper surface of the printed circuit board 110, and the heat sink 300 is disposed on a lower surface of the printed circuit board 110 opposite to the upper surface of the printed circuit board 110. The lower surface of the printed circuit board 110 may be in contact with the heat sink 300. When the wiring is formed on the bottom surface of the printed circuit board 110, an insulating material may be formed between the printed circuit board 110 and the heat sink 300 because the wiring may contact the heat sink 300. .

In the present embodiment, the printed circuit board 110 is preferably a metal printed circuit board (MPCB), wherein the MPCB is formed on a base layer, an insulating layer formed on the base layer, and an upper portion of the insulating layer. And a mounting layer on which the LED package 120 is mounted. The base layer may be formed of a material having excellent thermal conductivity, for example, aluminum, in order to quickly release heat generated from the LED package 120. In addition, the insulating layer may be formed of a material having excellent thermal conductivity, for example, ceramic filler (Aluminum Nitride powder), in order to electrically dissipate heat generated from the LED package 120. The mounting layer may be formed of copper (Cu) or a copper alloy to transfer driving power to the LED package 120 through the wires.

The LED package 120 may be mounted on an upper surface of the printed circuit board 110 to be electrically connected to the wirings. In addition, the LED package 120 may receive light from the driving power from the wires. The LED package 120 may include, for example, a white light emitting diode, or may include a red light emitting diode, a green light emitting diode, and a blue light emitting diode.

The reflection shade 200 is connected to the printed circuit board 110 along an edge of the printed circuit board 110, that is, the side surface of the printed circuit board 110 connecting the top and bottom surfaces of the printed circuit board 110. It is arranged to surround. In addition, the reflector 200 reflects the light generated from the LED package 120 and irradiates toward the upper direction of the LED package 120 to have a predetermined directivity angle. In addition, the reflector 200 is formed to accommodate the light emitting unit 100 therein, and may be inclined at a predetermined angle with respect to the printed circuit board 110 to increase the orientation angle of the LED package 120. have. The lower end of the reflection shade 200 is in contact with the top surface of the heat sink 300, and the stepped portion is formed at the upper end of the reflection shade 200 facing the lower portion of the reflection shade 200. Can be.

The inner surface of the reflector 200 is coated with a material having an excellent reflectance so that the light emitted from the LED package 120 can be emitted toward the inner surface of the reflector 200 to the outside of the lighting device. Can be. For example, the reflector 200 may be formed of a material including chromium (Cr) and aluminum in polycarbonate.

The distance from the LED package 120 to the upper end of the reflector 200, that is, the distance H1 toward the center of the direction angle of the reflector 200 is from the LED package 120 to the reflector 200. Is formed to be about 1.5 times longer than the distance to the bottom, that is, the distance H2 to the lower end of the reflection shade 200. The distance H1 from the LED package 120 to the upper end of the reflector 200 is formed to be about 1.5 times longer than the distance H2 from the LED package 120 to the lower end of the reflector 200. The inclination angle may be easily controlled by adjusting the inclination of the reflection shade 200 with respect to the upper surface of the printed circuit board 110. In this case, the orientation angle preferably has an angle of about 10 to 60.

The heat sink 300 may be disposed under the printed circuit board 110 and may have a mounting surface on which the printed circuit board 110 is mounted. The heat sink 300 emits heat generated from the light emitting unit 100 to the outside of the lighting device to prevent the function of the light emitting unit 100 from being degraded due to heat generated from the light emitting unit 100. can do. The heat sink 300 may be formed of a metal material having excellent thermal conductivity. For example, it may be made of copper, aluminum, stainless steel, aluminum alloy, or the like, and preferably made of aluminum alloy die castings (ALDC).

The heat sink 300 may include a body 310 and a plurality of heat dissipation fins 320. The upper surface of the body 310, that is, the mounting surface may be in contact with the lower surface of the printed circuit board 110, and the lower surface of the body 310, that is, the bottom surface, may be in contact with the power connection parts 400 and 500 to be described later. . And, the side of the body 310 may connect the upper surface and the lower surface of the body 310. For example, the body 310 may have a rectangular parallelepiped shape.

The heat dissipation fins 320 may be formed in parallel on the outer surface of the body 310 at regular intervals, and each may have a plate shape having the same size and thickness. In this case, the heat dissipation fins 320 may have a thickness and a spacing between the heat dissipation fins 320 at a ratio of about 1: 2.5 to 3.5. Therefore, heat generated in the light emitting unit 100 may be conducted to the heat sink 300 to prevent damage to the light emitting unit 100 and a decrease in reliability.

The power connection parts 400 and 500 may be coupled to a lower surface of the body 310 to be detachable, and may receive the driving power to drive the LED package 120 from the outside. The lower surface of the power connection unit 400,500 is coupled to an external power supply socket (not shown) to receive the driving power, and the upper surface of the power connection unit 400,500 opposite to the lower surface of the power connection unit 400,500 is the body. The driving power is coupled to the bottom surface of the 310 and detachably coupled to the LED package 120.

The first and second housings 410 and 510 coupled to the bottom surface of the body 310 to be detachably attached to the power supply units 400 and 500, and the first and second housings 410 and 510 facing the top surfaces of the first and second housings 410 and 510. The first and second bases 420 and 520 may be disposed on the bottom surfaces of the second housings 410 and 510 to be coupled to the power supply socket. A plurality of circuit components (not shown) may be disposed in the first and second housings 410 and 510. For example, the circuit components may have a capacitor, a resistor, an AC / DC converter, a driver IC, a transistor, and the like.

The first and second bases 420 and 520 may be determined according to the type of the power supply socket coupled to the power connection units 400 and 500. In the present embodiment, the first base 420 may have an Edison-type base, and the second base 520 may have a GU-type base.

The first base 420 may have a circular shape and may have a plurality of protrusions on an outer surface thereof. The lighting device may be coupled to or separated from the power supply socket by rotating the first base 420 in a predetermined direction. The second base 520 may be formed of a pillar having a polygonal shape such as a square pillar. In addition, the second base 520 may have two protrusions formed on one surface thereof and may be coupled to or separated from the power supply socket. Alternatively, the second base 520 may be formed of a circular pillar. In addition, since the first and second bases 420 and 520 may come into contact with the user's hand when the power supply socket is detached from the power supply socket, the first and second bases 420 and 520 may be formed of an insulating material or may be coated with an insulating material.

The lens 600 may be supported by the upper end of the reflector 200 and may improve characteristics of light generated by the LED package 120. The lens 600 may be combined with the step formed on the upper end of the reflector 200 and may be formed of a transparent material so that light generated from the LED package 120 is transmitted. For example, the lens 600 may be formed of a transparent material such as epoxy resin, silicone resin, or glass.

In addition, the distance H1 from the LED package 120 to the upper end of the reflector 200 is formed to be about 1.5 times longer than the distance H2 from the LED package 120 to the lower end of the reflector 200. As a result, since the directivity angle of the light generated by the LED package 120 may be adjusted, the lens 600 may be formed flat to be parallel to the printed circuit board 110.

As such, the distance H1 from the LED package 120 to the upper end of the reflector 200 is about 1.5 times longer than the distance H2 from the LED package 120 to the lower end of the reflector 200. By being formed, it is possible to easily control the orientation angle by adjusting the inclination of the reflection shade 200.

In addition, by disposing the heat sink 300 on the lower surface of the printed circuit board 110, the heat generated from the LED package 120 is discharged to the outside of the lighting device generated in the LED package 120 Heat may prevent the function of the LED package 120 from being degraded.

In addition, the power connection parts 400 and 500 are coupled to the lower surface of the body 310 so that the power connection parts 400 and 500 may be detachably attached to each other so that the power connection parts 400 and 500 may have different types of the first and second bases. 420, 520).

3 is a circuit diagram illustrating an electrical configuration of a lighting apparatus according to an embodiment of the present invention, Figure 4 is a graph showing the brightness of the LED package according to the supply voltage applied to the circuit of FIG.

3 and 4, the LED package 120 generates light when AC is supplied to the driving power, and in this case, flicker may occur in the LED package 120. . The flicker phenomenon is that the alternating voltage is applied to the LED package 120, the brightness of the LED package 120 is increased and decreased repeatedly, so that the LED package 120 appears to flicker for the human eye to confirm. Say. In order to prevent the flicker, the circuit shown in FIG. 3 may be formed on the printed circuit board 110.

In FIG. 3, R ₁ and R ₂ are resistors, C ₁ is a capacitor, D ₁ , D ₂ , D ₃ and D ₄ are diodes, and V _ac is a supply voltage. In this case, the diodes D ₃ and D ₄ are defined as first diode parts, and the diodes D ₁ and D ₂ are defined as second diode parts. Unlike the drawing, each of the first and second diode units may include two or more diodes. In addition, when the supply voltage V _ac is applied, a minimum voltage value at which light is generated in the first diode unit is defined as a first emission threshold, and light is generated in the first and second diode units. The minimum voltage value to be defined is defined as a second emission threshold.

In the circuit, when the supply voltage V _ac is a positive voltage and a voltage value greater than the first emission threshold value and less than the second emission threshold value is applied (S1), the current flowing through the circuit is the resistance. Light is generated in the LED package 120 after passing through R ₁ , the capacitor C ₁ , and the diode D ₄ of the first diode unit. In the circuit, when the supply voltage V _ac is a positive voltage and a voltage value greater than the second light emission threshold is applied (S2), the current flowing through the circuit includes the resistor R ₂ and the Light is generated in the LED package 120 through the diode D ₂ of the second diode part and the diode D ₄ of the first diode part.

In the circuit, when the supply voltage V _ac is a negative voltage and a voltage value greater than the first emission threshold value and less than the second emission threshold value is applied, the current flowing in the circuit is generated in the first voltage. The diode C ₃ moves in the direction of the capacitor C ₁ and the resistor R ₁ through the diode D ₃ , and light is generated in the LED package 120. In the circuit, when the supply voltage V _ac is a negative voltage and a voltage value greater than the second emission threshold is applied, the current flowing in the circuit is the diode D ₃ of the first diode unit. And the diode D ₁ is moved in the direction of the resistor R ₂ past the diode D ₁ and light is generated in the LED package 120.

When the brightness of the LED package 120 according to the supply voltage (V _ac ) applied to the circuit is measured, a graph is formed by drawing the first curve (V1) and the second curve (V2) as shown in FIG. The first curve V1 is formed when a voltage value greater than the first emission threshold value is applied (S1), and the second curve V2 is applied when a voltage value greater than the second emission threshold value is applied. In the case (S2) is formed. Therefore, the light emission time during which the light is generated in the LED package 120 is increased, thereby increasing the probability that the person does not recognize the flicker phenomenon.

In order to apply the circuit to the printed circuit board 110, the wiring is formed on the printed circuit board 110, the LED package 120, the capacitor C ₁ , and the resistors R ₁ and R _2. Electronic components such as) may be mounted on the printed circuit board 110. In this case, in order to reduce the mounting area of the electronic components mounted on the printed circuit board 110, the size of the capacitor C ₁ is preferably small. In addition, the capacitor ₍₁ C) is preferably the ability to pass the current through the capacitor (C ₁₎ and not a function to charge the current through the capacitor (C _1).

On the other hand, although not shown, the circuit may further include a piezoelectric element. When a high temperature is generated in the diodes D ₁ , D ₂ , D ₃ , and D ₄ due to the characteristics of the piezoelectric elements, the resistivity of the piezoelectric elements is increased so that the diodes D ₁ , D ₂ , D ₃ , D _The amount of current applied to ₄ ) can be reduced. Therefore, a failure occurs in the LED package 120 to prevent the reliability of the LED package 120 is lowered.

As such, when the circuit is formed on the printed circuit board 110, a light emission time during which light is generated in the LED package 120 may be increased, thereby increasing the probability that the person does not recognize the flicker phenomenon.

In addition, the mounting area of the electronic components mounted on the printed circuit board 110 may be reduced by mounting the small capacitor C ₁ on the printed circuit board 110. In addition, when a high temperature is generated due to the piezoelectric element, the resistance of the piezoelectric element is increased to reduce the amount of current applied to the diodes D ₁ , D ₂ , D ₃ , and D ₄ , thereby increasing the reliability of the LED package 120. This can be increased.

5 is a perspective view showing a lighting apparatus according to another embodiment of the present invention. Since the lighting apparatus according to the present exemplary embodiment is substantially the same as the lighting apparatus illustrated in FIG. 1 except for the case, the same reference numerals are used for the same components, and detailed description thereof will be omitted.

Referring to FIG. 5, a lighting apparatus according to another embodiment of the present invention is formed on an outer surface of the reflector 200 to protect the reflector 200 and is coupled to a part of the body 310. ) May be further included. The case 700 may be formed of a material having excellent thermal conductivity, for example, aluminum.

In addition, the case 700 is coupled to the body 310 using a bolt, or forms a thermal conductive adhesive between one end of the case 700 and the upper surface of the body 310 and the body 310 and Can be combined. Although not shown, the case 700 may be integrally formed with the heat sink 300 so that one end of the case 700 and an upper surface of the body 310 may be connected.

As such, since the case 700 is formed of a material having excellent thermal conductivity and is in contact with the top surface of the body 310, the heat generated from the LED package 120 is transferred to the heat sink 300 and the case ( By conducting the discharge to the 700, the heat dissipation area of the lighting apparatus is increased, and as a result, the heat radiation efficiency of the lighting apparatus can be improved.

While the present invention has been described in connection with what is presently considered to be practical and exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention. Therefore, the above description and the drawings below should be construed as illustrating the present invention, not limiting the technical spirit of the present invention.

1 is a perspective view showing a lighting apparatus according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view illustrating a cross section taken along line II ′ of FIG. 1.

3 is a circuit diagram showing an electrical configuration of a lighting apparatus according to an embodiment of the present invention.

4 is a graph illustrating luminance of an LED package according to a supply voltage applied to the circuit of FIG. 3.

5 is a perspective view showing a lighting apparatus according to another embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

100: light emitting unit 110: printed circuit board

120: LED package 200: reflector

300: heat sink 400, 500: power connection

600: lens 700: case

Claims (8)

A light emitting unit having a printed circuit board and at least one LED package mounted on one surface of the printed circuit board to generate light; And It is disposed so as to surround the printed circuit board along the edge of the printed circuit board, and reflects the light generated from the LED package to include a reflector for irradiating upward to have a predetermined directivity angle, The distance from the LED package to the center of the direction angle from the upper end of the reflector is formed 1.5 times longer than the distance from the LED package to the lower end of the reflector, A heat sink disposed under the printed circuit board and having a mounting surface on which the printed circuit board is mounted; The heat sink includes a heat sink body on which the mounting surface is formed, and a plurality of heat dissipation fins formed on the heat sink body. The heat dissipation fins are characterized in that it comprises a shape protruding outward from the top to the bottom of the heat sink body corresponding to the mounting surface. delete The method of claim 1, And a power connection unit coupled to the bottom surface of the heat sink body opposite to the mounting surface, the power connection unit receiving a driving power to drive the LED package from the outside. The method of claim 1, Is formed of an aluminum material is formed on the outer surface of the reflecting shade, the lighting device further comprises a case coupled to the heat sink. The method of claim 1, And a lens supported by the other end of the reflecting shade and improving a characteristic of light generated from the LED package. The method of claim 1, wherein the printed circuit board And a metal printed circuit board (MPCB) including a base layer formed of a metal material and an insulating layer disposed on one surface of the base layer and formed of a ceramic filler. The LED package of claim 1, wherein the LED package includes a plurality of AC driving LED packages driven by an AC voltage. The printed circuit board is an illumination device, characterized in that it comprises an LED drive circuit that can increase the light emitting time for the AC drive LED package to emit light. A light emitting unit having a printed circuit board and at least one LED package mounted on one surface of the printed circuit board to generate light; And It is disposed so as to surround the printed circuit board along the edge of the printed circuit board, and reflects the light generated from the LED package to include a reflector for irradiating upward to have a predetermined directivity angle, The distance from the LED package to the center of the direction angle from the upper end of the reflector is formed 1.5 times longer than the distance from the LED package to the lower end of the reflector, The LED package includes first and second light emitting diode units connected in series with each other. The light emitting unit may further include an LED driving circuit including a capacitor connected in parallel to the first light emitting diode unit such that the second light emitting diode unit emits light before the first light emitting diode unit emits light when AC power is applied. Lighting equipment.

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