KR101133702B1 - Notebook computer - Google Patents

Abstract

The present invention provides a notebook computer. The notebook computer includes: a main body having a main board to receive input signals from a plurality of input keys; An edge frame which is hingedly connected to one end of the main body and has an image window electrically connected to the main substrate to display an image, and surrounds the edge of the image window, and the edge frame to cover a rear surface of the image window. A cover part having a rear frame connected to the cover; A high frequency signal having a plurality of high frequency line patterns inserted into the cover part and electrically connected to the main substrate and made of a flexible material and extending toward a plurality of positions of the edge frame to transmit high frequency signals from the outside; Transfer sheet; And a plurality of antenna pattern parts disposed at a plurality of positions of the edge frame and electrically connected to ends of each of the high frequency line patterns. Accordingly, the present invention can facilitate the securing of space in the notebook computer by using the high frequency signal transmission to the antenna pattern portion by forming the high frequency line patterns on the flexible circuit board of the flexible material rather than the coaxial cable.

Description

Notebook computer {NOTEBOOK COMPUTER}

The present invention relates to a notebook computer. More particularly, the high frequency signal transmission to the antenna pattern parts is formed by using high frequency line patterns on a flexible circuit board made of a flexible material instead of a coaxial cable, thereby making it easy to secure space in the notebook computer. It's about a laptop computer that lets you do that.

In general, a personal computer such as a notebook is composed of a main body portion in which input keys and a circuit board are installed, and a cover portion in which an image window hinged to the main body portion and an image window for visually displaying information transmitted from the circuit board are installed.

Recently, as a wireless communication environment such as the Internet is provided, development of a notebook which can receive information through a certain radio frequency band is actively progressing. Accordingly, such a notebook is provided with an antenna capable of receiving a high frequency of a predetermined frequency band.

Conventionally, the antenna is provided in an edge frame provided at the edge of the image window in the cover portion.

Referring to FIG. 1, generally, a high frequency circuit unit (not shown) is provided in the main body unit 30, and a coaxial cable 60 is used to electrically connect the high frequency circuit unit and the antenna 201.

The coaxial cable 60 extends from both high frequency circuit portions to both sides of the edge frame 42 and is electrically connected to a pair of antennas 70 installed on the edge frame 42 located above the image window 41.

Accordingly, in the related art, the antennas 70 must be installed on the upper side of the image window 41, and when the number of the antennas 70 is increased, the number of the coaxial cables 60 must be increased. Since the increased coaxial cable 60 cannot all be accommodated in the side space of the image window 41, there is a problem in that the number of antennas 70 cannot be increased.

Furthermore, since the number of antennas 70 cannot be increased as described above, there is also a problem that the reception rate is remarkably decreased.

In addition, when the number of the coaxial cables 60 is increased and excessively twisted in the space of the edge frame 41, the problem of disconnection of the cable 60 and the difficulty in assembling when assembling the product are also difficult. have.

Accordingly, the present invention was created to solve the above-described problems, and an object of the present invention is to use high frequency signal transmission to antenna pattern portions by forming high frequency line patterns on a flexible circuit board of a flexible material instead of a coaxial cable, The present invention provides a notebook computer that can easily secure space in a notebook.

In addition, another object of the present invention is to selectively install the installation position of the plurality of antenna pattern parts in a plurality of positions of the frame of the notebook, and the high-frequency line patterns connecting the antenna pattern parts and the high-frequency circuit end inside the edge frame of the notebook In the central area, to provide a notebook computer that can improve the information reception rate.

It is still another object of the present invention to separate a high frequency signal transmission sheet on which high frequency line patterns are formed, from a main sheet portion provided on a main body of a notebook having an image window, and a connection sheet part provided on a main body of a notebook having input keys. By making it possible, it is possible to provide a notebook computer that can reduce cost and improve assembly performance in manufacturing a sheet.

In a preferred aspect, the present invention is directed to providing a notebook computer.

The notebook computer includes: a main body having a main board to receive input signals from a plurality of input keys; An edge frame which is hingedly connected to one end of the main body and has an image window electrically connected to the main substrate to display an image, and surrounds the edge of the image window, and the edge frame to cover a rear surface of the image window. A cover part having a rear frame connected to the cover; A high frequency signal having a plurality of high frequency line patterns inserted into the cover part and electrically connected to the main substrate and made of a flexible material and extending toward a plurality of positions of the edge frame to transmit high frequency signals from the outside; Transfer sheet; And a plurality of antenna pattern parts disposed at a plurality of positions of the edge frame and electrically connected to ends of each of the high frequency line patterns.

[High Frequency Signal Transmission Sheet]

The high frequency signal transmission sheet may include: a connection sheet part having connection holes electrically connected to the main substrate at one end thereof, and a main sheet part connected to the other end of the connection sheet part and forming a predetermined area to be located at the rear of the image window. Equipped.

Here, the high frequency line patterns, one end is connected to the connection holes and the other end is preferably extended to the plurality of positions of the edge of the main sheet portion toward the plurality of positions in the connection sheet portion.

In addition, each of the high frequency line patterns formed on the main sheet portion may include a ground vane having a predetermined width and width electrically connected to the rear frame.

In addition, the high frequency signal transmission sheet is preferably a flexible circuit board.

[Formation of connection protrusion in high frequency signal transmission sheet]

In addition, it is preferable that connection protrusions extending from the other end of the high frequency line patterns are further formed at a plurality of positions of the edges of the main sheet portion.

[Connecting main sheet parts of antenna pattern parts as independent objects]

Meanwhile, the plurality of antenna pattern parts may be formed independently of the main sheet part and installed at a plurality of positions of the edge frame and electrically connected to the other ends of the high frequency line patterns.

[Antenna pattern portions formed integrally with the main sheet portion]

In addition, the plurality of antenna pattern parts may be integrally formed with the main sheet part, may extend from an edge part of the main sheet part, and be disposed at a plurality of positions of the edge frame.

[1 Example of Structure of High Frequency Signal Transmission Sheet]

The high frequency signal transmission sheet may include a first line structure and a cover layer that closely surrounds the first line structure using an adhesive layer.

The first line structure may include a ground conductor layer, an inner dielectric layer disposed on an upper surface of the ground conductor layer, and the high frequency line patterns disposed on an upper surface of the inner dielectric layer,

The cover layer is preferably formed of the adhesive layer and an outer dielectric layer formed on one surface of the adhesive layer.

[Auxiliary Adhesive Coating in One Example of Structure of High Frequency Signal Transmission Sheet]

Here, an auxiliary adhesive layer may be further formed between the ground conductor layer and the inner dielectric layer and between the inner dielectric layer and the high frequency line patterns.

[2 Structures of High Frequency Signal Transmission Sheet]

The high frequency signal transmission sheet may include a second line structure and a cover layer disposed on an upper surface of the second line structure.

The second line structure may include an inner dielectric layer, the high frequency line patterns formed on an upper surface of the inner dielectric layer, and an auxiliary adhesive layer formed between the rear frame and the inner dielectric layer.

The cover layer preferably comprises an adhesive layer formed on top of the inner dielectric layer and surrounding the high frequency line patterns, and an outer dielectric layer formed on top of the adhesive layer.

[Formation of Air Layer in Two Structures of High Frequency Signal Transmission Sheet]

Here, it is preferable that an air layer having a predetermined depth and wider than a width of the high frequency line pattern is formed on the rear frame.

[Method of Forming Two Structures of High Frequency Signal Transmission Sheet]

The high frequency signal transmission sheet may provide the inner dielectric layer, form a signal conductor layer on an upper surface of the inner dielectric layer, and etch the signal conductor layer to form the high frequency line patterns. Forming the cover layer to surround the high frequency line patterns on top of the inner dielectric layer, and forming the auxiliary adhesive layer between the inner dielectric layer and the back frame. It is preferable that the frames are formed by adhering each other.

[Air Layer Forming Method in Two Structures of High Frequency Signal Transmission Sheet]

In addition, the upper surface of the rear frame may be further excavated to have a predetermined width and a certain depth than the width of the high frequency line pattern to further form an air layer between the dielectric layer and the rear frame.

[Integrated connection structure of high frequency signal transmission sheet]

The main sheet portion and the connection sheet portion may be integrally formed with each other.

[Separable connection method of high frequency signal transmission sheet]

In addition, the main sheet part and the connection sheet part may be formed independently of each other, and the first connection part of the main sheet part and the second connection part of the connection sheet part may be connected to each other by a connecting means.

[First Example of Separated Connection Method of High Frequency Signal Transmission Sheet]

The high frequency line pattern may include a first high frequency line pattern formed on the main sheet part and a second high frequency line pattern formed on the connecting sheet part.

The first connector may include a first inner dielectric layer formed on an upper surface of the rear frame, the first high frequency line pattern formed on an upper surface of the first inner dielectric layer, and both sides of the first high frequency line pattern. A pair of first grounding conductor patterns formed on an upper surface of the first inner dielectric layer, a pair of first fastening holes formed at ends of the pair of first grounding conductor patterns, and the pair A first cover layer covering an upper end of the pair of first ground conductor patterns and the first high frequency line pattern such that an end of the first ground conductor pattern of the first pattern and the end of the first high frequency line pattern are exposed to the outside; ,

The second connection portion may include a second inner dielectric layer, a second high frequency line pattern formed on a bottom surface of the second inner dielectric layer and in contact with an upper surface of the first high frequency line pattern, and both sides of the second high frequency line pattern A pair of second ground conductor patterns formed on the second ground conductor patterns contacting the upper surfaces of the pair of first ground conductor patterns and the third high frequency lines formed on the upper surfaces of the second inner dielectric layers and connected to the second high frequency line patterns; A line pattern, a pair of third ground conductor patterns formed on both sides of the third high frequency line pattern, an end of the second inner dielectric layer, an end of the second ground conductor pattern, and the third ground conductor It has a pair of second fastening holes to penetrate the end of the pattern,

The connecting means is a pair of coupling bolts fitted in the pair of first fastening holes and the pair of second fastening holes to bind the first connection part and the second connection part,

The third high frequency line pattern and the pair of third grounding conductor patterns may have a length of connecting the second high frequency line pattern and the pair of second grounding conductor patterns to one end and the other end of the second connection part and have a rectangular shape. Formed,

The length of the pair of second high frequency line patterns is formed to be shorter than the length of the third high frequency line pattern, and the length of the pair of second ground conductor patterns is the pair of third ground conductor patterns. It is preferable that the predetermined length is shorter than the length of.

[Second example of split connection of high frequency signal transmission sheet]

The high frequency line pattern may include a first high frequency line pattern formed on the main sheet part and a second high frequency line pattern formed on the connecting sheet part.

The first connector may include a first inner dielectric layer formed on an upper surface of the rear frame, the first high frequency line pattern formed on an upper surface of the first inner dielectric layer, and both sides of the first high frequency line pattern. A pair of first grounding conductor patterns formed on an upper surface of the first inner dielectric layer, a pair of first fastening holes formed at ends of the pair of first grounding conductor patterns, and the pair A first cover layer covering an upper end of the pair of first ground conductor patterns and the first high frequency line pattern such that an end of the first ground conductor pattern of the first pattern and the end of the first high frequency line pattern are exposed to the outside; ,

The second connection portion may include a second inner dielectric layer, a second high frequency line pattern formed on a bottom surface of the second inner dielectric layer and in contact with an upper surface of the first high frequency line pattern, and both sides of the second high frequency line pattern A pair of second ground conductor patterns formed on and in contact with a top surface of the pair of first ground conductor patterns, a ground conductor layer stacked on a top surface of the second inner dielectric layer, and the pair of first And a pair of second fastening holes penetrating the second inner dielectric layer, the pair of second grounding conductor patterns, and the ground conductor layer so as to coincide with the first fastening hole.

The connecting means is a pair of coupling bolts fitted in the pair of first fastening holes and the pair of second fastening holes to bind the first connection part and the second connection part,

The second high frequency line pattern and the pair of second ground conductor patterns may have a length connecting the one end and the other end of the second connection part and may have a rectangular shape.

[Third example of split type connection of high frequency signal transmission sheet]

The high frequency line pattern may include a first high frequency line pattern formed on the main sheet part and a second high frequency line pattern formed on the connecting sheet part.

The first connector may include a first inner dielectric layer formed on an upper surface of the rear frame, the first high frequency line pattern formed on an upper surface of the first inner dielectric layer, and both sides of the first high frequency line pattern. A pair of first grounding conductor patterns formed on an upper surface of the first inner dielectric layer, a pair of first fastening holes formed at ends of the pair of first grounding conductor patterns, and the pair A first cover layer covering an upper end of the pair of first ground conductor patterns and the first high frequency line pattern such that an end of the first ground conductor pattern of the first pattern and the end of the first high frequency line pattern are exposed to the outside; ,

The second connection portion may include a second inner dielectric layer, a second high frequency line pattern formed on a bottom surface of the second inner dielectric layer and in contact with an upper surface of the first high frequency line pattern, and both sides of the second high frequency line pattern A pair of second ground conductor patterns formed on and in contact with a top surface of the pair of first ground conductor patterns, a ground conductor layer stacked on a top surface of the second inner dielectric layer, and the pair of first And a pair of second fastening holes penetrating the second inner dielectric layer, the pair of second grounding conductor patterns, and the ground conductor layer so as to coincide with the first fastening hole.

The connecting means is a pair of coupling bolts fitted in the pair of first fastening holes and the pair of second fastening holes to bind the first connection part and the second connection part,

The second high frequency line pattern and the pair of second ground conductor patterns may have a length shorter than a length between one end and the other end of the second connection part and may be formed in a square shape.

The present invention is not limited to the number of antennas by constructing a plurality of high-frequency line patterns in a single sheet form, and since a plurality of antennas can be freely connected, a process of joining a conventional antenna and a high-frequency line to each other will be omitted. Because it can improve the assembly and minimize the defect rate that can occur during the bonding process.

In addition, the present invention is to place the sheet formed with ultra-thin high-frequency line patterns between the rear of the image window and the rear frame of the notebook computer, it is possible to eliminate the frame in the notebook computer itself, add the antenna to the notebook computer side wall space It can be used for such purposes as.

In addition, the present invention has an effect that can effectively improve the platform noise of the notebook computer itself by exposing part of the high-frequency line pattern in the form of a sheet to the ground or the frame itself of the notebook computer itself. Therefore, it is easy to apply a material having a low loss than a dielectric of a general printed circuit board which is currently used, and thus it is possible to implement a low loss high frequency transmission line.

1 is a perspective view showing a notebook computer having a conventional antenna and coaxial cable.
2 is a perspective view showing a notebook computer of the present invention.
3 is a perspective view illustrating a notebook computer in which the high frequency line pattern of FIG. 2 is grounded by a ground vane.
4 is a view showing that a high frequency signal transmission sheet according to the present invention is installed in a notebook computer.
5 is a diagram showing that a high frequency signal transmission sheet according to the present invention is installed in a notebook computer.
6 is a perspective view showing a high frequency signal transmission sheet according to the present invention.
7 is a perspective view illustrating a high frequency signal transmission sheet in which an antenna is integrally formed.
8 is a cross-sectional view along the line AA of FIG. 6.
9 is a cross-sectional view showing a first example of the structure of a high frequency signal transmission sheet according to the present invention.
FIG. 10 is a cross-sectional view illustrating that an auxiliary adhesive layer is further formed on the high frequency signal transmission sheet of FIG. 9.
11 is a cross-sectional view showing a second example of the structure of a high frequency signal transmission sheet according to the present invention.
FIG. 12 is a diagram illustrating a process of forming a high frequency line pattern and a dielectric of FIG. 11.
FIG. 13 is a cross-sectional view illustrating that an air layer is further formed on the rear frame of FIG. 11.
14 is a view showing a detachable structure of a high frequency signal transmission sheet according to the present invention.
15 is a perspective view illustrating an example of a second connector according to the present invention.
FIG. 16 is a perspective view illustrating a coupling process between a second connector and a first connector of FIG. 15.
17 is a perspective view showing another example of the second connecting portion according to the present invention.
FIG. 18 is a perspective view illustrating a coupling process between a second connector and a first connector of FIG. 17.
19 is a perspective view showing another example of the second connecting portion according to the present invention.
20 is a perspective view illustrating a coupling process between a second connection part and a first connection part of FIG. 19.

Hereinafter, a notebook computer of the present invention will be described with reference to the accompanying drawings.

2 and 3, the notebook computer of the present invention includes a main body 30 having a main board (not shown) receiving input signals from a plurality of input keys 31, and the main body 30 of the main body 30. An edge frame 42 hinged to one end and electrically connected to the main substrate to display an image to the outside, an edge frame 42 surrounding an edge of the image window 41, and the image window 41. Cover portion 40 having a rear frame 43 connected to the edge frame 42 to cover the back of the), and inserted into the cover portion 40 and electrically connected to the main substrate, flexible A high frequency signal transmission sheet 10 (see FIG. 4) made of a material and having a plurality of high frequency line patterns 20 extending toward a plurality of positions of the edge frame 42 to transmit high frequency signals from the outside; , The edge of the frame 42 Of the disposed position, it consists of a plurality of antenna pattern portions 50 are connected to the high frequency line pattern (20) each end and electrically.

[High Frequency Signal Transmission Sheet]

4 to 6, the high frequency signal transmission sheet 10 includes a connection sheet part 200 in which connection holes 201 are electrically connected to the main substrate at one end thereof, and the connection sheet part ( It is connected to the other end of the 200 and consists of a main sheet portion 100 to form a predetermined area to be located on the rear of the image window (41).

The high frequency signal transmission sheet 10 may be made of a flexible circuit board made of a flexible material. Therefore, the main sheet part 100 and the connection sheet part 200 are integrally formed, the main sheet part 100 is formed in a square plate shape, and the connection sheet part 200 is the main sheet part ( It is formed in a neck shape protruding at a predetermined position of the (100).

Therefore, the main seat part 100 is inserted into the cover part 40 so as to be located in the space between the image window 41 and the rear frame 42, and the connection seat part 200 is The main sheet part 100 positioned in the cover part 40 is electrically connected to the high frequency circuit part (not shown) in the main board embedded in the main body part 30. Therefore, the connection sheet part 200 may be located at a hinged portion of the cover part 40 and the main body part 30.

Here, a plurality of high frequency line patterns 20 formed on the high frequency signal transmission sheet 10 are formed, and one end thereof is formed at an end of the connection sheet part 200 to be connected to the main substrate 201. And the other end thereof is extended through the main sheet portion 100 to a plurality of positions of the edge frame 42 through the rear surface of the image window 41 and preferably the center portion of the cover portion 40.

Here, each of the high frequency line patterns 20 formed in the main sheet part 100 may include a ground vane 102 (see FIG. 3) having a predetermined width and width electrically connected to the rear frame 42. Can be.

Therefore, the high frequency line patterns 20 in the present invention are formed in parallel with each other in the connection sheet part 200 and in a shape in which the main sheet part 100 is distributed to a plurality of positions of the edge frame 42.

Here, the high frequency line patterns (the second high frequency line patterns 22) formed in parallel to the connection sheet part 200 are connected to the connection holes 201 at one end thereof, and the other end thereof is described in the main sheet part (described below). It is connected to one end of the first high frequency line patterns 21 formed in 100. In addition, the first high frequency line pattern 21 is formed in the main sheet part 100 in a shape of being distributed to a plurality of positions of the edge frame 42.

Here, the plurality of positions of the antenna pattern portions 50 are positioned at the plurality of positions of the edge frame 42, respectively, and these positions may be selectively changed. In addition, the plurality of positions of the edge frame 42 are portions in which the other ends of the high frequency line patterns (first high frequency line patterns 21) formed in the main sheet part 100 are positioned. The other ends of the first high frequency line patterns 21 extend to a plurality of edge positions of the main sheet part 100.

[Formation of connection protrusion in high frequency signal transmission sheet]

In addition, a plurality of connection protrusions 101 protruding outward are further formed in the main sheet part 100.

The connection protrusions 101 are portions in which the other ends of the first high frequency line patterns 21 are located. Here, the plurality of antenna pattern parts 50 having a predetermined antenna are connected to the connection protrusions 101, respectively.

[Connecting main sheet parts of antenna pattern parts as independent objects]

On the other hand, referring to Figures 4 to 6, the plurality of antenna pattern parts 50 is formed as an object independent of the main sheet portion 100. Accordingly, the plurality of antenna pattern parts 50 may be installed at a plurality of positions of the edge frame 42 and electrically connected to the other ends of the first high frequency line patterns 21.

Here, the antenna pattern portion 50 may be made of any one of an antenna circuit, PIFA, dipole, monopole, and tip antenna plate. Here, the antenna pattern parts 50 are installed at a plurality of positions of the edge frame 42.

[Antenna pattern portions formed integrally with the main sheet portion]

In addition, referring to FIG. 7, the plurality of antenna pattern parts 50 may be integrally formed with the main sheet part 100.

In this case, the plurality of antenna pattern parts 50 may be disposed at a plurality of positions of the edge frame 42 by extending from a plurality of edge positions of the main sheet part 100.

Next, the structures of the high frequency signal transmission sheet according to the present invention will be described.

[1 Example of Structure of High Frequency Signal Transmission Sheet]

Since the high frequency line patterns 20 described below include both the first high frequency line patterns 21 of the main sheet part 100 and the second high frequency line patterns 20 of the connecting sheet part 200. Representatively, the high frequency line patterns 20 are called.

8 and 9, the high frequency signal transmission sheet 10 may include a first line structure and a cover layer 400 that closely surrounds the first line structure by using an adhesive layer 410. have.

The first line structure is formed as follows.

First, a ground conductor layer 310 made of a conductor is prepared. In addition, an internal dielectric layer 320 is formed on the top surface of the ground conductor layer 310. Subsequently, high frequency line patterns 20 having a rectangular shape are formed to have a predetermined width and length so that a high frequency signal can be transmitted to the upper surface of the inner dielectric layer 320.

Here, the ground conductor layer 310, the inner dielectric layer 320, and the high frequency line patterns 20 are simply stacked on each other, and do not use a separate adhesive.

Accordingly, the first line structure may include a ground conductor layer 310, an inner dielectric layer 320 disposed on an upper surface of the ground conductor layer 310, and an upper surface of the inner dielectric layer 320. The high frequency line patterns 20 may be provided.

In addition, the cover layer 400 may be used to enclose the first line structure.

That is, the cover layer 400 is formed in a pair and is formed of an adhesive layer 410 and an outer dielectric layer 420 formed on one surface of the adhesive layer 410. Here, one cover layer 400 is positioned above the first line structure among the pair of cover layers 400, and the other cover layer 400 is positioned below the first line structure.

Accordingly, the pair of cover layers 400 are disposed to face each other at the top and bottom of the first line structure, wherein one of the adhesive layers 410 of each of the pair of cover layers 400 is It is located above the first line structure, the other is located below the first line structure.

In this state, when a certain temperature condition is achieved outside of the cover layer 400, for example, when the external temperature condition is raised to a constant temperature so that the cover layer 400 is heated, the pair of cover layers 400 Can come together so that they can work together.

Accordingly, the pair of cover layers 400 may grip the first line structure while in close contact with the outer surface of the first line structure configured as described above.

Therefore, according to an example of the structure of the high frequency signal transmission sheet 10, the components separated from each other (the ground conductor layer 310, the internal dielectric layer 320 disposed on the upper surface of the ground conductor layer 310, and By fixing the high frequency line patterns 20 disposed on the upper surface of the inner dielectric layer 320 using the pair of cover layers 400, the high frequency line pattern 20 is fixed to the high frequency signal transmission line. Can be implemented as:

[Auxiliary Adhesive Coating in One Example of Structure of High Frequency Signal Transmission Sheet]

Meanwhile, referring to FIG. 10, an auxiliary adhesive layer is formed between the ground conductor layer 310 and the inner dielectric layer 320 and between the inner dielectric layer 320 and the high frequency line patterns 20. 330 may be further formed.

That is, the auxiliary adhesive layer 330 is applied to the top surface of the ground conductor layer 310, and the internal dielectric layer 320 is disposed on the top surface of the auxiliary adhesive layer 330. Thus, the ground conductor layer 310 and the inner dielectric layer 320 may be adhesively fixed to each other.

In addition, another auxiliary adhesive layer 330 is coated on the top surface of the inner dielectric layer 320, and a high frequency line pattern 20 is disposed on the top surface of the other auxiliary adhesive layer 330. Therefore, the high frequency line pattern 20 may be bonded and fixed on the upper surface of the inner dielectric layer 320.

Therefore, in one example of the structure of the high frequency signal transmission sheet 11, the ground conductor layer 310 formed in a stacked state separated from each other, and the internal dielectric layer 320 disposed on the upper surface of the ground conductor layer 310 After the first high-frequency line patterns 20 disposed on the upper surface of the inner dielectric layer 320 are first adhesively fixed to each other, the pair of cover layers 400 are overlapped to overlap the ground conductor layer 310. The inner dielectric layer 320 disposed on the upper surface of the ground conductor layer 310 and the high frequency line patterns 20 disposed on the upper surface of the inner dielectric layer 320 may be fixed.

Therefore, according to the high frequency signal transmission sheet 11, components separated from each other (the ground conductor layer 310, the inner dielectric layer 320 disposed on the upper surface of the ground conductor layer 310, and the inner dielectric The high frequency line patterns 20 disposed on the top surface of the layer 320 are first fixed using the auxiliary adhesive layer 330, and the auxiliary adhesive layer is formed using the pair of cover layers 400. By fixing the first line structures fixed to each other through 330, the high frequency line pattern 20 may be implemented as a high frequency signal transmission line.

[2 Structures of High Frequency Signal Transmission Sheet]

Referring to FIG. 11, the high frequency signal transmission sheet 12 according to the present invention may include a second line structure and a cover layer 400 disposed on an upper surface of the second line structure.

In this case, the second line structure includes an inner dielectric layer 320, the high frequency line patterns 20 formed on the upper surface of the inner dielectric layer 320, and the rear frame 43 mentioned above. And an auxiliary adhesive layer 330 formed between the inner dielectric layer 320.

Referring to FIG. 12, a method of forming the same is described below. First, an inner dielectric layer 320 is provided, a signal conductor layer 20 'is formed on the upper surface of the inner dielectric layer 320, and the signal conductor layer 20 is formed. ') Is etched to have a predetermined width to form the high frequency line patterns 20. In this case, the high frequency line pattern 20 is formed in a square shape having a predetermined width and a predetermined length.

In addition, a cover layer 400 is formed to surround the high frequency line patterns 20 at the upper end of the inner dielectric layer 320. Here, the cover layer 400 is an adhesive layer 410 adhered to an outer surface of the high frequency line pattern 20 and an upper surface of the inner dielectric layer 320 and an outer surface formed on the upper surface of the adhesive layer 410. It is composed of a dielectric layer 420, the cover layer 400 is formed in a single piece.

Subsequently, an auxiliary adhesive layer 330 is applied to the top surface of the rear frame 43 of the cover part 40, and the inner dielectric layer 320 is laminated on the top surface of the auxiliary adhesive layer 330. Therefore, the inner dielectric layer 320 may be adhered to and fixed to an upper surface of the rear frame 43.

That is, the auxiliary dielectric layer 320 and the rear frame 43 may be bonded to each other by forming the auxiliary adhesive layer 330 between the inner dielectric layer 320 and the rear frame 43. .

Accordingly, by using the rear frame 43 made of a chassis which is one of the configurations of the notebook computer as it is, it is possible to reduce the manufacturing cost of the notebook computer.

[Formation of Air Layer in Two Structures of High Frequency Signal Transmission Sheet]

In addition, referring to FIG. 13, an air layer 43a may be further formed on the upper surface of the rear frame 43 so as to have a predetermined width and a predetermined depth wider than the width of the high frequency line pattern 20.

Therefore, an air layer 43a is formed in the rear frame 43 and is formed to have a predetermined width wider than the width of the high frequency line pattern 20, and the auxiliary adhesive layer 330 is formed in the air layer 43a. Is applied to areas other than openings that expose the bottom of the inner dielectric layer 320.

As a result, the high frequency loss transmitted through the high frequency line pattern 20 can be remarkably reduced due to the air layer 43a having a groove shape. The high frequency loss transmitted through the line pattern 20 can be reduced.

In addition, the air layer 43a may be formed so as to gradually widen the width between both sidewalls from the bottom thereof upward. The larger the area of application of the air layer with lower dielectric constant and dielectric loss, the more effective the reduction of high frequency losses.

Next, the connection relationship between the main sheet portion and the connection sheet portion in the high frequency signal transmission sheet according to the present invention will be described.

The main sheet unit 100 and the connection sheet unit 200 according to the present invention may be integrally formed with each other.

On the other hand, the main sheet unit 100 and the connection sheet unit 200 according to the present invention, as shown in Figure 14, may be composed of the independent objects from each other selectively connected and disconnected.

The configuration thereof will be described in detail.

Referring to FIG. 14, the main sheet part 100 and the connection sheet part 200 form an independent object, and the first connection part 110 and the connection sheet part 200 of the main sheet part 100 are formed. The second connecting portion 210 of) may be fastened and connected to each other by a connecting means.

[First Example of Separated Connection Method of High Frequency Signal Transmission Sheet]

15 and 16, the high frequency line pattern 20 includes a first high frequency line pattern 21 formed in the main sheet part 100 and a second high frequency formed in the connection sheet part 200. It may be divided into a line pattern 22.

The configuration of the first connecting portion 110 formed at a predetermined position of the main sheet portion 100 is as follows.

The first connector 110 may include a first inner dielectric layer 320 formed on an upper surface of the rear frame 43 and a first high frequency line pattern formed on an upper surface of the first inner dielectric layer 320. 21) and a pair of first ground conductor patterns 51 formed on an upper surface of the first inner dielectric layer 21 so as to be positioned side by side on both sides of the first high frequency line pattern 21, and the pair A pair of first fastening holes 51a formed at an end of the first grounding conductor pattern 51 of the pair, an end of the pair of first grounding conductor patterns 51, and the first high frequency line pattern 21 The first cover layer 400 covers the upper portion of the pair of first ground conductor patterns 51 and the first high frequency line pattern 21 so that the ends of the exposed portions are exposed to the outside. The first inner dielectric layer 320 may be substantially the same as the inner dielectric layer 320 mentioned above, and the first cover layer 400 may be substantially the same as the cover layer 400 mentioned above. have.

Here, the first high frequency line pattern 21 is formed of a rectangular block having a predetermined width and length. The first high frequency line pattern 21 may be formed by an etching process.

The pair of first grounding conductor patterns 51 are formed at both sides of the first high frequency line pattern 21 to form a rectangular block having a predetermined width and a predetermined length, and the first high frequency line It is formed in parallel with the pattern 21.

In addition, an upper surface of the first high frequency line pattern 21 and an upper surface of the pair of first ground conductor patterns 51 are substantially positioned on the same line.

In addition, the pair of first fastening holes 51a are formed in the pair of first grounding conductor patterns 51 at the ends of the first connecting portion 110, respectively, one by one, preferably, the pair of It is preferable that a screw thread is formed on the inner circumference of the first fastening hole 51a.

Then, the configuration of the second connection portion 210 formed at a predetermined position of the connection sheet portion 200 is as follows.

The second connector 210 is formed on a second inner dielectric layer 320 and a lower surface of the second inner dielectric layer 320 and is in contact with a top surface of the first high frequency line pattern 21. A pattern 22, a pair of second ground conductor patterns 52 formed on both sides of the second high frequency line pattern 22 and in contact with the top surface of the pair of first ground conductor patterns 51; A third high frequency line pattern 23 formed on an upper surface of the second inner dielectric layer 320 and connected to the second high frequency line pattern 22 and parallel to both sides of the third high frequency line pattern 23. A pair of third ground conductor patterns 53 formed, an end portion of the second inner dielectric layer 320, an end portion of the second ground conductor pattern 52, and an end portion of the third ground conductor pattern 53. It consists of a pair of second fastening holes 52a formed therethrough. Here, the thread is formed on the inner circumference of the pair of second fastening holes 52a.

Here, the third high frequency line pattern 23 and the pair of third ground conductor patterns 53 have a length connecting the one end and the other end of the second connection part 200 to have a rectangular shape.

The length of the pair of second high frequency line patterns 22 is shorter than the length of the third high frequency line pattern 23, and the length of the pair of second ground conductor patterns 52 is increased. Is shorter than a length of the pair of third grounding conductor patterns 53 by a predetermined length. Accordingly, the second high frequency line pattern 22 and the pair of second ground conductor patterns 52 are formed in a rectangular block.

In particular, exposed portions of the first high frequency line pattern 21 and the pair of first grounding conductor patterns 51 in the first connection portion 110 are cut off at an end portion of a predetermined first connection portion 110 region. The second high frequency line pattern 22 and the pair of second ground conductor patterns 52 formed as the rectangular blocks are formed at the ends of the first connection part 110 formed by being cut. The first high frequency line pattern 21 and the exposed first ground conductor pattern 51 may be disposed to be in contact with each other.

In this case, the pair of first fastening holes 51a and the pair of second fastening holes 52a may be coincident with each other.

In addition, the first connecting portion 110 and the second connecting portion 210 may be fastened to each other by the connecting means 600.

The connecting means 600 is fitted into the pair of first fastening holes 51a and the pair of second fastening holes 52a to bind the first connection part 110 and the second connection part 210. It is a pair of bolts. The pair of coupling bolts may be angled to the pair of first fastening holes 51a and the pair of second fastening holes 52a to be screwed with the screw thread.

The first and second connection parts 110 and 210 may be fastened to each other by the connection means 600, and the first high frequency line pattern 21 may be electrically connected to the third high frequency line pattern 23. It is electrically connected to the line pattern 22 to transmit high frequency, and the pair of first grounding conductor patterns 51 are electrically connected to the pair of third grounding conductor patterns 53 through the connecting means 600. The second ground conductor pattern 52 is connected to implement the state that can be grounded.

Although not shown in the drawing, the second high frequency line pattern 22 and the third high frequency line pattern 23 are formed on both sides of the second inner dielectric layer 320 and are formed on the second high frequency line pattern. A via hole penetrating the 52 and the third high frequency line pattern 53 and the second inner dielectric layer 320 and a metal body such as copper filled in the via hole may be used to energize each other.

[Second example of split connection of high frequency signal transmission sheet]

Next, a second example of the detachable connection method of the high frequency signal transmission sheet will be described.

17 and 18, the first connection part 110 formed at the end of the main sheet part 100 according to the present invention is the first internal dielectric layer 320 formed on the upper surface of the rear frame 43. And the first high frequency line pattern 21 formed on an upper surface of the first inner dielectric layer 320 and the first inner dielectric layer so as to be positioned side by side on both sides of the first high frequency line pattern 21. A pair of first grounding conductor patterns 51 formed on the upper surface of 320, a pair of first fastening holes 51a formed at ends of the pair of first grounding conductor patterns 51, and The pair of first grounding conductor patterns 51 and the first high frequency line patterns so that the ends of the pair of first grounding conductor patterns 51 and the ends of the first high frequency line patterns 21 are exposed to the outside. And a first cover layer 400 covering the top of 21.

Here, the first high frequency line pattern 21 is formed of a rectangular block having a predetermined width and length. The first high frequency line pattern 21 may be formed by an etching process.

The pair of first grounding conductor patterns 51 are formed at both sides of the first high frequency line pattern 21 to form a rectangular block having a predetermined width and a predetermined length, and the first high frequency line It is formed in parallel with the pattern 21.

In addition, an upper surface of the first high frequency line pattern 21 and an upper surface of the pair of first ground conductor patterns 51 are substantially positioned on the same line.

In addition, the pair of first fastening holes 51a are formed in the pair of first grounding conductor patterns 51 at the ends of the first connecting portion 110, respectively, one by one, preferably, the pair of The thread is formed on the inner circumference of the first fastening hole 51.

Then, the configuration of the second connection portion 210 formed at the end of the connection sheet portion 200 is as follows.

The second connector 210 ′ is formed on the second inner dielectric layer 320 and the lower surface of the second inner dielectric layer 320 and is in contact with the upper surface of the first high frequency line pattern 21. A pair of second ground conductor patterns 52 'formed on both sides of the pattern 22' and the second high frequency line pattern 52 'and in contact with a top surface of the pair of first ground conductor patterns 51; ), A ground conductor layer 310 stacked on the top surface of the second inner dielectric layer 320 ', and the second inner dielectric layer so as to coincide with the pair of first fastening holes 51a. And a pair of second fastening holes 52a penetrating through 320 ', the pair of second ground conductor patterns 52', and the ground conductor layer 310. Referring to FIG. Here, a screw thread may be formed on the inner circumference of the pair of second fastening holes 52a.

In addition, the second high frequency line pattern 22 ′ and the pair of second ground conductor patterns 52 ′ may have a length that connects one end of the second connection portion 210 ′ with the other end and has a rectangular shape. have.

In addition, the first connecting portion 110 and the second connecting portion 210 ′ may be fastened to each other by the connecting means 600.

The connecting means 600 is fitted into the pair of first fastening holes 51a and the pair of second fastening holes 52a to bind the first connection part 110 and the second connection part 210 '. Is a pair of coupling bolts. The pair of coupling bolts may be angled to the pair of first fastening holes 51a and the pair of second fastening holes 52a to be screwed with the screw thread.

The first and second connection parts 110 and 210 'are fastened to each other by the connection means 600, and the first high frequency line pattern 21 is electrically connected to the second high frequency line pattern 22' to transmit high frequency. The pair of first ground conductor patterns 51 may be connected to a pair of second ground conductor patterns 52 ′ and a ground conductor layer 310 electrically connected through the connecting means 600 to establish a ground. You can implement states that can be achieved.

[Third example of split type connection of high frequency signal transmission sheet]

Next, referring to FIGS. 19 and 20, a second example of a detachable connection method of the high frequency signal transmission sheet will be described.

The first connection part 110 formed at the end of the main sheet part 100 according to the present invention includes a first internal dielectric layer 320 formed on the top surface of the rear frame 43 and the first internal dielectric layer ( A pair is formed on the upper surface of the first inner dielectric layer 320 so that the first high-frequency line pattern 21 formed on the upper surface of the 320 and parallel to both sides of the first high-frequency line pattern 21. The first grounding conductor pattern 51, a pair of first fastening holes 51a formed at an end of the pair of first grounding conductor patterns 51, and the pair of first grounding conductor patterns ( A first covering the upper portion of the pair of first ground conductor patterns 51 and the first high frequency line pattern 21 so that an end portion of the first line 51 and an end portion of the first high frequency line pattern 21 are exposed to the outside. Cover layer 400.

Here, the first high frequency line pattern 21 is formed of a rectangular block having a predetermined width and length. The first high frequency line pattern 21 may be formed by an etching process.

The pair of first grounding conductor patterns 51 are formed at both sides of the first high frequency line pattern 21 to form a rectangular block having a predetermined width and a predetermined length, and the first high frequency line It is formed in parallel with the pattern 21.

In addition, an upper surface of the first high frequency line pattern 21 and an upper surface of the pair of first ground conductor patterns 51 are substantially positioned on the same line.

In addition, the pair of first fastening holes 51a are formed in the pair of first grounding conductor patterns 51 at the ends of the first connecting portion 110, respectively, one by one, preferably, the pair of It is preferable that a screw thread is formed on the inner circumference of the first fastening hole 51a.

In addition, the configuration of the second connection portion 210 ″ formed at the end of the connection sheet part 200 is as follows.

The second connector 210 ″ is formed on a lower surface of the second inner dielectric layer 320 ″ and the second inner dielectric layer 320 ″ and contacts the upper surface of the first high frequency line pattern 21. A pair of second high frequency line patterns 22 "and a pair of second ground conductor patterns formed on both sides of the second high frequency line pattern 22" and in contact with an upper surface of the pair of first ground conductor patterns 51 52 ", the ground conductor layer 310 stacked on the upper surface of the second inner dielectric layer 320", and the second pair of first fastening holes 51a so as to coincide with each other. And an inner dielectric layer 320 ", the pair of second ground conductor patterns 52 " and a pair of second fastening holes 52a penetrating through the ground conductor layer 310.

Here, the second high frequency line pattern 22 ″ and the pair of second ground conductor patterns 52 ″ may have a length shorter than a length between one end and the other end of the second connection portion 210 ″ and may be square. It may be formed into a block of shape.

In particular, exposed portions of the first high frequency line pattern 21 and the pair of first grounding conductor patterns 51 in the first connection portion 110 are cut off at an end portion of a predetermined first connection portion 110 region. The second high frequency line pattern 22 ″ and the pair of second ground conductor patterns 52 ″ formed of the rectangular block may be formed in the cut-out area of the first connection portion 110. The first high frequency line pattern 21 exposed at the end and the pair of first ground conductor patterns 51 ″ may be disposed to be in contact with each other.

In this case, the pair of first fastening holes 51a and the pair of second fastening holes 52a may be coincident with each other.

In addition, the first connecting portion 110 and the second connecting portion 210 ″ may be fastened to each other by the connecting means 600.

The connecting means 600 is fitted into the pair of first fastening holes 51a and the pair of second fastening holes 52a to bind the first connection part 110 and the second connection part 210 ". The pair of coupling bolts may be angled to the pair of first fastening holes 51a and the pair of second fastening holes 52a to be screwed with a screw thread.

The first and second connection parts 110 and 210 ″ are fastened to each other by the connection means 600, and the first high frequency line pattern 21 is electrically connected to the second high frequency line pattern 22 ″ to transmit high frequency. The pair of first grounding conductor patterns 51 may be connected to a pair of second grounding conductor patterns 52 "and a grounding conductor layer 310 electrically connected through the connecting means 600 to provide grounding. You can implement states that can be achieved.

Referring to the above configuration, the main sheet part 100 according to the present invention is a sheet in which the first high frequency line patterns 21 are formed, and the image window 41 and the rear frame 42 of the cover part 40 are formed. By being located in the space between the, it can be made of a hard type material, the connection sheet portion (210, 210 ', 210 ") is to be located in the connection region which is an area between the hinge portion of the body portion 30 and the cover portion 40 Therefore, the main sheet part 10 and the connection sheet parts 210, 210 ′ and 210 ″ may be made of different materials.

In this case, the present invention can simultaneously implement the high frequency line and the common ground by connecting the main sheet portion 110 and the connecting sheet portions 210, 210 ′, 210 ″ to each other using the above-mentioned connection schemes. .

In addition, as described above, the high frequency line patterns in the two sheet portions of the release material may be stably connected using the connection means 600.

In addition, since the main sheet portion 110 and the connection sheet portions 210, 210 ′ and 210 ″ are manufactured as independent objects so as to be connected to each other, the connection sheet portions 210, 210 ′ and 210 ″ may be connected to the main sheet portion 110. It is possible to reduce the loss of raw materials due to the occurrence of cutout portions other than the connection sheet portions 210, 210 'and 210 "so as to protrude in the shape of the neck from the end.

In addition, any one of the first high frequency line pattern 21 of the main sheet part 100 and the second high frequency line pattern 21, 21 ′, 21 ″ of the connecting sheet parts 210, 210 ′ and 210 ″ may be abnormal. In this case, it can be easily separated from each other using the connecting means 600, it is possible to replace only the sheet portion to be replaced.

10, 11, 12, 13: high frequency signal transmission sheet 20: high frequency line pattern
21: first high frequency line pattern 22: second high frequency line pattern
30: main body 40: cover
41: image window 42: edge frame
43: rear frame 51, 51 ', 51 ": first ground conductor layer
52. 52 ', 52 ": second ground conductor layer 50: antenna pattern portion
100: main seat portion 110: first connection portion
200: connection sheet portion 210,210 ', 210 ": second connection portion
310: ground conductor layer 320: internal dielectric layer
330: auxiliary adhesive layer 400: cover layer
410: adhesive layer 420: outer dielectric layer

Claims (18)

A main body having a main board receiving an input signal from a plurality of input keys;
An edge frame which is hingedly connected to one end of the main body and has an image window electrically connected to the main substrate to display an image, and surrounds the edge of the image window, and the edge frame to cover a rear surface of the image window. A cover part having a rear frame connected to the cover;
A high frequency signal transmission sheet inserted into the cover part and electrically connected to the main substrate, the high frequency signal transmission sheet having a plurality of high frequency line patterns extending toward a plurality of positions of the edge frame to transmit high frequency signals from the outside; And
And a plurality of antenna pattern portions disposed at a plurality of positions of the edge frame and electrically connected to ends of each of the high frequency line patterns. The method of claim 1,
The high frequency signal transmission sheet,
A connection sheet part at one end of which connection holes are electrically connected to the main substrate, and a main sheet part which is connected to the other end of the connection sheet part and forms a predetermined area to be located at the rear of the image window,
The high frequency line patterns, one end is connected to the connection holes and the other end is extended to the plurality of positions of the edge of the main sheet portion toward the plurality of positions in the connecting sheet portion. The method of claim 2,
Each of the high frequency line patterns formed in the main sheet portion has a ground blade having a predetermined width and width electrically connected to the rear frame. The method of claim 1,
And said high frequency signal transmission sheet is a flexible circuit board. The method of claim 2,
In many positions of the edge of the said main sheet part,
And a plurality of connection protrusions extending from the other end of the high frequency line patterns. The method of claim 2,
And the plurality of antenna pattern parts are formed independently of the main sheet part, are installed at a plurality of positions of the edge frame, and are electrically connected to the other ends of the high frequency line patterns. The method of claim 2,
And the plurality of antenna pattern portions are integrally formed with the main sheet portion and extend from an edge portion of the main sheet portion to be disposed at a plurality of positions of the edge frame. The method of claim 1,
The high frequency signal transmission sheet,
A first layer structure and a cover layer which closely surrounds the first line structure using an adhesive layer,
The first line structure includes a ground conductor layer, an inner dielectric layer disposed on an upper surface of the ground conductor layer, and the high frequency line patterns disposed on an upper surface of the inner dielectric layer,
And the cover layer is formed of the adhesive layer and an outer dielectric layer formed on one surface of the adhesive layer. The method of claim 8,
And an auxiliary adhesive layer is formed between the ground conductor layer and the inner dielectric layer and between the inner dielectric layer and the high frequency line patterns. The method of claim 1,
The high frequency signal transmission sheet,
A second line structure and a cover layer disposed on an upper surface of the second line structure,
The second line structure includes an inner dielectric layer, the high frequency line patterns formed on an upper surface of the inner dielectric layer, and an auxiliary adhesive layer formed between the rear frame and the inner dielectric layer,
And the cover layer comprises an adhesive layer formed on top of the inner dielectric layer and surrounding the high frequency line patterns and an outer dielectric layer formed on top of the adhesive layer. The method of claim 10,
The rear frame,
Notebook computer, characterized in that the air layer is formed to be a wider width than the width of the high-frequency line pattern and a certain depth is formed.
The method of claim 10,
The high frequency signal transmission sheet,
Providing the inner dielectric layer, forming a signal conductor layer on an upper surface of the inner dielectric layer, and etching the signal conductor layer to form the high frequency line patterns to form the high frequency line patterns, and at the top of the inner dielectric layer. The cover layer is formed to surround the high frequency line patterns, and the auxiliary adhesive layer is formed between the inner dielectric layer and the back frame to bond the inner dielectric layer and the back frame to each other. Laptop computer. The method of claim 12,
And an air layer formed on an upper surface of the rear frame so as to have a predetermined width and a predetermined depth wider than the width of the high frequency line pattern to form an air layer between the dielectric layer and the rear frame. The method of claim 2,
And the main sheet portion and the connection sheet portion are integral with each other. The method of claim 2,
The main sheet portion and the connection sheet portion form an independent object from each other,
And a first connecting portion of the main sheet portion and a second connecting portion of the connecting sheet portion are fastened and connected to each other by a connecting means. 16. The method of claim 15,
The high frequency line pattern may include a first high frequency line pattern formed on the main sheet part and a second high frequency line pattern formed on the connecting sheet part.
The first connection portion,
A first inner dielectric layer formed on an upper surface of the rear frame, the first high frequency line pattern formed on an upper surface of the first inner dielectric layer, and the first high frequency line pattern so as to be parallel to both sides of the first high frequency line pattern; A pair of first grounding conductor patterns formed on an upper surface of an inner dielectric layer, a pair of first fastening holes formed at ends of the pair of first grounding conductor patterns, and the pair of first grounding conductor patterns A first cover layer covering an upper portion of the pair of first ground conductor patterns and the first high frequency line pattern such that an end portion of the first high frequency line pattern and an end of the first high frequency line pattern are exposed to the outside;
The second connection portion may include a second inner dielectric layer, a second high frequency line pattern formed on a bottom surface of the second inner dielectric layer and in contact with an upper surface of the first high frequency line pattern, and both sides of the second high frequency line pattern A pair of second ground conductor patterns formed on the second ground conductor patterns contacting the upper surfaces of the pair of first ground conductor patterns and the third high frequency lines formed on the upper surfaces of the second inner dielectric layers and connected to the second high frequency line patterns; A line pattern, a pair of third ground conductor patterns formed on both sides of the third high frequency line pattern, an end of the second inner dielectric layer, an end of the second ground conductor pattern, and the third ground conductor It has a pair of second fastening holes to penetrate the end of the pattern,
The connecting means is a pair of coupling bolts fitted in the pair of first fastening holes and the pair of second fastening holes to bind the first connection part and the second connection part,
The third high frequency line pattern and the pair of third grounding conductor patterns may have a length of connecting the second high frequency line pattern and the pair of second grounding conductor patterns to one end and the other end of the second connection part and have a rectangular shape. Formed,
The length of the pair of second high frequency line patterns is formed to be shorter than the length of the third high frequency line pattern, and the length of the pair of second ground conductor patterns is the pair of third ground conductor patterns. Notebook computer, characterized in that formed a shorter length than the length of. 16. The method of claim 15,
The high frequency line pattern includes a first high frequency line pattern formed on the main sheet portion and a second high frequency line pattern formed on the connecting sheet portion,
The first connection portion,
A first inner dielectric layer formed on an upper surface of the rear frame, the first high frequency line pattern formed on an upper surface of the first inner dielectric layer, and the first high frequency line pattern so as to be parallel to both sides of the first high frequency line pattern; A pair of first grounding conductor patterns formed on an upper surface of an inner dielectric layer, a pair of first fastening holes formed at ends of the pair of first grounding conductor patterns, and the pair of first grounding conductor patterns A first cover layer covering an upper portion of the pair of first ground conductor patterns and the first high frequency line pattern such that an end portion of the first high frequency line pattern and an end of the first high frequency line pattern are exposed to the outside;
The second connection portion may include a second inner dielectric layer, a second high frequency line pattern formed on a bottom surface of the second inner dielectric layer and in contact with an upper surface of the first high frequency line pattern, and both sides of the second high frequency line pattern A pair of second ground conductor patterns formed on and in contact with a top surface of the pair of first ground conductor patterns, a ground conductor layer stacked on a top surface of the second inner dielectric layer, and the pair of first And a pair of second fastening holes penetrating the second inner dielectric layer, the pair of second grounding conductor patterns, and the ground conductor layer so as to coincide with the first fastening hole.
The connecting means is a pair of coupling bolts fitted in the pair of first fastening holes and the pair of second fastening holes to bind the first connection part and the second connection part,
And the second high frequency line pattern and the pair of second ground conductor patterns have a length connecting the one end and the other end of the second connection part and have a rectangular shape. 16. The method of claim 15,
The high frequency line pattern includes a first high frequency line pattern formed on the main sheet portion and a second high frequency line pattern formed on the connecting sheet portion,
The first connection portion,
A first inner dielectric layer formed on an upper surface of the rear frame, the first high frequency line pattern formed on an upper surface of the first inner dielectric layer, and the first high frequency line pattern so as to be parallel to both sides of the first high frequency line pattern; A pair of first grounding conductor patterns formed on an upper surface of an inner dielectric layer, a pair of first fastening holes formed at ends of the pair of first grounding conductor patterns, and the pair of first grounding conductor patterns A first cover layer covering an upper portion of the pair of first ground conductor patterns and the first high frequency line pattern such that an end portion of the first high frequency line pattern and an end of the first high frequency line pattern are exposed to the outside;
The second connection portion may include a second inner dielectric layer, a second high frequency line pattern formed on a bottom surface of the second inner dielectric layer and in contact with an upper surface of the first high frequency line pattern, and both sides of the second high frequency line pattern A pair of second ground conductor patterns formed on and in contact with a top surface of the pair of first ground conductor patterns, a ground conductor layer stacked on a top surface of the second inner dielectric layer, and the pair of first And a pair of second fastening holes penetrating the second inner dielectric layer, the pair of second grounding conductor patterns, and the ground conductor layer so as to coincide with the first fastening hole.
The connecting means is a pair of coupling bolts fitted in the pair of first fastening holes and the pair of second fastening holes to bind the first connection part and the second connection part,
And the second high frequency line pattern and the pair of second grounding conductor patterns have a length shorter than a length between one end and the other end of the second connection portion and are formed in a quadrangular shape.

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