KR101132183B1 - Organic electroluminescent display device - Google Patents

Abstract

The present invention relates to an organic light emitting display device, and more particularly, to a method of forming ground wiring.

A feature of the present invention is that a ground contact pad portion (GND contact PAD) for applying a common voltage to the second electrode (cathode electrode) deposited on the front surface of the substrate is configured on one side of the driver IC of the substrate.

Thus, by constructing the ground contact pad portion, the ground wiring is conventionally formed on both sides of the substrate along the longitudinal direction of the substrate, thereby widening the bezel area of the organic EL device, making it difficult to reduce the light weight of the organic EL device. There is an effect that can solve the problem.

In addition, there is an effect that can prevent the circuit malfunction and failure caused by the interference between the circuit portion and the second electrode.

Ground wiring, cathode electrode, circuit part, organic light emitting device

Description

Organic electroluminescent display device

1 is a schematic cross-sectional view of a general organic light emitting display device.

FIG. 2A is a plan view schematically illustrating how the ground wiring of FIG. 1 is configured on a substrate. FIG.

FIG. 2B is a schematic cross-sectional view taken along the line II-II of FIG. 2A. FIG.

3A is a plan view schematically illustrating a structure in which a ground wiring of an organic light emitting diode according to an exemplary embodiment of the present invention is configured on a substrate.

3B is a schematic cross-sectional view taken along the line III-III of FIG. 3A.

4 is a plan view schematically showing a state in which the ground wiring of a large area organic light emitting display device is formed on a substrate;

FIG. 5 is a view schematically showing how the thin ground wiring of the large area organic light emitting display device is configured on the left and right sides of the substrate. FIG.

<Description of the symbols for the main parts of the drawings>

112: substrate 160: ground contact pad portion

139: ground wiring 120: second electrode

The present invention relates to an organic light emitting display device, and more particularly, to a method of forming ground wiring.

Until recently, cathode ray tubes (CRT) have been mainly used as display devices. However, recently, flat panel display devices such as plasma display panels (PDPs), liquid crystal display devices (LCDs), and organic light emitting diodes, which can replace CRTs, have been widely studied and used. to be.

Among the flat panel display devices as described above, the organic light emitting display device is a self-light emitting device, and since the backlight used in the liquid crystal display device, which is a non-light emitting device, is not necessary, it is possible to have a light weight. In addition, the viewing angle and contrast ratio are superior to those of the liquid crystal display, and are advantageous in terms of power consumption. In addition, DC low voltage drive is possible, the response speed is fast, and the internal component is solid, so it is strong against external shock, and has a wide range of use temperature range.

In particular, since the manufacturing process is simple, there is an advantage that can reduce the production cost more than the conventional liquid crystal display device.

 1 is a schematic cross-sectional view of a general organic light emitting display device.

As illustrated, the organic light emitting display device may include a thin film transistor array portion T _D and a first electrode 16 electrically connected to the thin film transistor array portion T _D on the transparent first substrate 12. The light emitting layer 18 and the second electrode 20 are constituted.

In more detail, the thin film transistor T _D , which is a driving device including the gate electrode 38, the active layer 42, the source electrode 48, and the drain electrode 52, is configured, and the upper portion of the driving device is formed. The light emitting layer which emits light of the color measured on the upper part of the 1st electrode (anode electrode) 16 which contact | connects the drain electrode 52 of a drive element with the insulating film 57 in between, and 18 and a second electrode (cathode electrode) 20 are formed on the light emitting layer 18.

The light emitting layer 18 expresses colors of red, green, and blue. In general, a separate organic material emitting red, green, and blue is used for each pixel.

The organic electroluminescent device recombines electrons and holes while moving through a pn junction between an anode electrode 16 serving as a hole providing layer and a cathode electrode 20 serving as an electron providing layer. Use the principle of emitting light due to the car.

In addition, the storage capacitor C _ST is configured in parallel with the driving element, and the source electrode 48 is configured to contact the second electrode 35 of the storage capacitor C _ST , and the second electrode 35 is formed. The first electrode 15 is formed under the).

A second electrode 20 is formed on the front surface of the substrate 12 including the driving device, the storage capacitor C _ST , and the light emitting layer 18, and the second electrode 20 is disposed at the outermost side of the substrate 12. The ground wire 39 for applying a common voltage to the gate electrode 38 is made of the same layer and the same material as the gate electrode 38 of the driving element and the switching element.

The ground wire 39 comes into contact with the second electrode 20 through a contact hole 50 obtained by etching a plurality of insulating layers formed thereon.

FIG. 2A is a plan view schematically illustrating a structure in which the ground wiring of FIG. 1 is formed on a substrate, and FIG. 2B is a cross-sectional view schematically illustrating a cross section taken along line II-II of FIG. 2A.

As shown in FIG. 2A, a driver IC in which a driving circuit is mounted is formed at one side of the substrate 12, and ground wires 39 connected to the driver IC are formed at both sides of the substrate 12.

The ground wiring 39 is disposed along the longitudinal direction of the substrate 12 from several hundred micrometers to several millimeters on the left side and / or the right side of the substrate 12 which is an area outside the light emitting area, and the second electrode 20 ) To maintain the potential of the second electrode 20 by applying a common voltage.

As shown in FIG. 2B, organic light emitting layers 16 and 18 including a driving element, a first electrode, and a light emitting layer are formed on the substrate 12, and are disposed on both sides of the organic light emitting layers 16 and 18. The circuit portion 54 in which the scan driver and the gate driving circuit are mounted is located, and one side of the circuit portion 54 has a ground wiring 39.

Since the ground wiring 39 is made of the same layer and the same material as that of the gate electrode (38 of FIG. 1) of the driving device and the switching device, the circuit part 54 in which the gate driving circuit is mounted is also the same material in the same process. It consists of.

Therefore, the ground wiring 39 is formed outside the circuit portion 54 by a gate line (38 in FIG. 1) connected to the gate driving circuit of the circuit portion 54.

The second electrode 20 is entirely deposited on the first electrode, the light emitting layers 16 and 18, the circuit unit 54, and the ground wiring 39, and the second electrode 20 is the ground wiring 39. ) Is contacted through the contact hole.

The first substrate 12 is bonded to the second substrate 56 having the moisture absorbent attached thereto through the sealant 58, thereby completing an encapsulated organic light emitting display device.

However, as described above, the bezel area of the organic light emitting diode is widened by the ground wiring 39 positioned on the left side and / or the right side of the substrate 12, so that the light weight and thinness of the organic light emitting diode are difficult. There is this.

In addition, since the second electrode 20 must be in contact with the ground wiring 39, the second electrode 20 must be entirely deposited on the circuit portion 54 formed inside the ground wiring 39 so that the circuit portion 54 and the second electrode are formed. There is a problem in that a parasitic capacitance may be generated by interference with (20), which may cause malfunction and failure of the circuit.

The present invention is to solve the above problems, it is an object to reduce the bezel area of the organic light emitting device.

Moreover, it aims at reducing circuit part malfunction and defect.

In order to achieve the object as described above, the present invention comprises a first substrate; A driver IC configured at one side of the first substrate; A ground contact pad unit connected to the driver IC and configured on the same side as the driver IC; An organic light emitting layer including a second electrode receiving a common electrode through the ground contact pad part; Circuit portions formed at both sides of the organic light emitting layer; And a second substrate bonded to the first substrate through a sealant, wherein the ground contact pad part is an area including a ground line and a contact hole exposing a part of the ground line. .

The light emitting layer may include a first electrode, a light emitting layer, and the second electrode. The second electrode may include an extension part having a protruding structure at one corner thereof, and the ground contact pad part may be formed at the extension part. It is characterized by.

In addition, the extension part may be formed on at least two locations on a substrate, and the extension part and the ground wire may contact each other through a contact hole, and the first electrode may be an anode electrode that provides holes to the light emitting layer. And the second electrode is a cathode electrode for providing electrons to the light emitting layer.

In addition, the circuit unit is characterized in that the scan driver and the gate driving circuit is mounted, the second substrate is characterized in that the absorbent is attached.

Hereinafter, embodiments according to the present invention will be described in detail with reference to the drawings.

3A is a plan view schematically illustrating a structure in which ground wires of an organic light emitting diode according to an exemplary embodiment of the present invention are configured on a substrate, and FIG. 3B schematically illustrates a cross section taken along line III-III of FIG. 3A. One cross section.

As shown in FIG. 3A, one side of the substrate 112 constitutes a driver IC having a driving circuit mounted thereon, and a ground contact pad part GND connected to one side of the substrate 112 having the driver IC connected to the driver IC. contact PAD) 160.

The ground contact pad unit 160 may include a second electrode 120 deposited on the entire surface of the emission area through a contact hole through which a ground line 139 connected to the driver IC exposes a part of the ground line 139. As an area configured to be in contact with one side, the contact hole is formed in at least two places on the substrate 112, and the contact portion 160 is also formed in at least two places on the substrate 112.

The ground wiring 139 is formed of the same layer and the same material as the gate electrode (not shown) of the driving device and the switching device, and a plurality of insulating layers formed on the ground wiring 139 are etched to form the ground wiring. By forming a contact hole through which a portion of the portion 139 is exposed, the second electrode 120 comes into contact with the second electrode 120.

In this case, the second electrode 120 is composed of an extension part in which both edges protrude to one side of the substrate 112 having the driver IC, and the ground wire 139 is an extension part of the second electrode 120. And a contact hole through the contact hole to apply a common voltage to the second electrode 120 to maintain the potential of the second electrode 120.

As described above, the bezel of the organic light emitting diode is formed by arranging the ground wiring 139 on one side of the substrate 112 without arranging the ground wiring 139 along the longitudinal direction of the substrate 112 on the left side and / or the right side of the substrate 112. The area can be reduced, so that the light weight and thinness can be achieved.

3B is a cross-sectional view of FIG. 3A. A driving device and a first electrode, a light emitting layer (not shown), and a second electrode that is entirely deposited to cover the light emitting layer (not shown) on the substrate 112. An organic light emitting layer including the organic light emitting layer 120 is configured, and circuit portions 154 on which scan drivers and gate driving circuits are mounted are disposed on both sides of the organic light emitting layer.

 Since the circuit unit 154 is configured outside the organic light emitting layer, there is an effect of preventing a problem of generating a parasitic capacitor due to the interference with the second electrode 120 as in the prior art.

The first substrate 112 is bonded to the second substrate 156 on which the moisture absorbent is attached through the sealant 158, thereby completing an encapsulated organic light emitting display device.

 The ground contact pad part 160 is disposed inside the sealant 158.

4 is a plan view schematically illustrating a state in which ground wirings of a large area organic light emitting diode are configured on a substrate.

As shown, when the driver IC is configured on both sides of the substrate 112, the ground contact pad unit 160 is also formed on each side of the driver IC is configured on two sides, the ground contact pad unit 160 is It may vary depending on the number of the driver ICs and the size of the panel.

In addition, in the large area organic light emitting display device, as shown in FIG. 5, thin ground wires may be further included on both sides of the substrate 112.

The thinly constructed ground line 162 is configured to contact the second electrode 120 by forming a contact hole at a predetermined interval.

The thin ground wire 162 may be further included because the large area organic light emitting diode is hard to apply the common electrode for maintaining the potential of the second electrode 120 only by the contact region of the ground contact pad unit 160. to be.

 As described above, by configuring the ground contact pad part 160 on one side of the organic light emitting diode driver IC, the bezel area of the organic light emitting diode can be reduced, and the circuit unit 154 of FIG. ) By preventing interference between the second electrode 120 and the second electrode 120.

The present invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit of the present invention.

As described above, the bezel area of the organic light emitting diode is enlarged by eliminating the ground wiring formed along the light emitting region and configuring the ground contact pad portions on both sides of the driver IC according to the present invention. It is effective to solve the problem of thin thin.

In addition, there is an effect that can prevent the circuit malfunction and failure caused by the interference between the circuit portion and the second electrode.

Claims (7)

A first substrate; A driver IC configured at one side of the first substrate; A ground contact pad unit connected to the driver IC and configured on the same side as the driver IC; An organic light emitting layer including a second electrode receiving a common electrode through the ground contact pad part; Circuit portions formed at both sides of the organic light emitting layer; A second substrate bonded to the first substrate through a sealant And the ground contact pad part comprising a ground wiring and a contact hole exposing a part of the ground wiring. The method of claim 1, The organic electroluminescent layer is composed of a first electrode, a light emitting layer, and the second electrode. The method of claim 2, The second electrode includes an extension part having a structure in which one side protrudes, and the ground contact pad part is configured in the extension part. The method of claim 3, wherein And the extension part is formed on at least two places on the substrate, and the extension part and the ground wiring contact through a contact hole. The method of claim 2, And the first electrode is an anode electrode for providing holes to the light emitting layer, and the second electrode is a cathode electrode for providing electrons to the light emitting layer. The method of claim 1, The circuit unit is an organic light emitting display device, characterized in that the scan driver and the gate driving circuit is mounted. The method of claim 1, The second substrate is an organic light emitting device, characterized in that the moisture absorbent is attached.

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