KR101131830B1 - A device for fixing the board of led light - Google Patents

A device for fixing the board of led light Download PDF

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Publication number
KR101131830B1
KR101131830B1 KR1020110109970A KR20110109970A KR101131830B1 KR 101131830 B1 KR101131830 B1 KR 101131830B1 KR 1020110109970 A KR1020110109970 A KR 1020110109970A KR 20110109970 A KR20110109970 A KR 20110109970A KR 101131830 B1 KR101131830 B1 KR 101131830B1
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KR
South Korea
Prior art keywords
substrate
heat cover
fluorescent lamp
led fluorescent
diffusion plate
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KR1020110109970A
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Korean (ko)
Inventor
강성구
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에스지디지털주식회사
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Priority to KR1020110109970A priority Critical patent/KR101131830B1/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/104—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening using feather joints, e.g. tongues and grooves, with or without friction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Abstract

PURPOSE: A substrate holding apparatus of an LED fluorescent lamp is provided to smoothly transfer heat by uniformly maintaining adhesive force between a substrate and a heat cover and to reduce costs by improving an assembling process of a product. CONSTITUTION: A plurality of LED devices(110) is attached to a substrate(100). At least one side of the substrate is supported by a diffusing plate(200). The other side of the substrate is installed in order to maintain constant pressing force with one side of a heat cover(300). The heat cover comprises a curvature portion. The curvature portion adheres closely to one side of the substrate. The heat cover comprises an uneven region. The uneven region magnifies an air contact area.

Description

엘이디 형광등의 기판 고정장치{a device for fixing the board of led light}A device for fixing the board of led light}

본 발명은 복수의 엘이디소자를 갖는 기판의 일면이 확산판에 의해 지지하면서 확산판에 의해 일면이 지지되는 기판의 타면이 히트커버에 일정한 탄성을 갖도록 밀착되는 구성을 통하여 기판과 히트커버가 항상 일정한 밀착력을 갖도록 되어 열전달이 원활하면서 기판의 견고한 결합이 가능토록 하는 엘이디 형광등의 기판 고정장치에 관한 것이다.According to the present invention, one surface of a substrate having a plurality of LED elements is supported by a diffusion plate while the other surface of the substrate supported by one of the diffusion plates is in close contact with the heat cover to have a constant elasticity. The present invention relates to a substrate fixing device such as an LED fluorescent lamp, which has adhesiveness and enables heat transfer to be smoothly coupled to a substrate.

일반적으로 엘이디 형광등은, 복수의 엘이디소자가 발광하여 원하는 조도를 형성토록 설치되고, 상기 엘이디소자는 기판을 통하여 열을 금속재의 히트커버에 발산토록 하고, 상기 히트커버에 결합되는 확산판을 통하여 엘이디소자의 빛이 외부에 확산토록 되는 것이다.In general, an LED fluorescent lamp is installed so that a plurality of LED elements emit light to form a desired illuminance, and the LED element emits heat to a metal heat cover through a substrate and is led through a diffusion plate coupled to the heat cover. The light of the device is to be diffused to the outside.

이와같은 기술과 관련되어 종래의 등록특허 제026770호에 엘이디형광등의 기술이 제시되고 있으며 그 구성은 도1에서와 같이, 엘이디모듈이 구비되는 장착부(111)와 상기 장착부(111)의 양측에 삽입홈(112)이 형성되는 본체(110); 본체(110)의 삽입홈(112)에 슬라이딩 삽입되도록 삽입홈(112)에 대응되는 삽입돌기(133)가 형성되고, 오목부(131)가 형성된 투광부(132)를 가지는 캡(130); 및 본체(110)와 캡(130)의 양단을 폐쇄하고 형광등 설치를 위한 소켓에 접속되어 엘이디모듈(120)에 동작전원이 공급되도록 하는 고정소켓(140)을 포함하며, 상기 복수개의 오목부(131)는 상기 투광부(132)에 빛의 투과시 상기 빛을 집중시키고 빛의 진행방향에 따른 복수개의 구면파가 형성되도록 하는 일정 길이를 가지며 캡(130)의 길이방향으로 반복 형성되어 상기 투광부(132)가 꼬불꼬불한 단면을 갖도록 설치된다.In connection with such a technique, a conventional LED fluorescent lamp is disclosed in the related patent No. 026770. The configuration thereof is inserted into both sides of the mounting portion 111 and the mounting portion 111 provided with the LED module, as shown in FIG. A main body 110 in which a groove 112 is formed; A cap 130 having an insertion protrusion 133 corresponding to the insertion groove 112 to be slidably inserted into the insertion groove 112 of the main body 110, and a light transmitting part 132 having a recess 131 formed therein; And a fixing socket 140 which closes both ends of the main body 110 and the cap 130 and is connected to a socket for installing a fluorescent lamp so that operating power is supplied to the LED module 120. 131 has a predetermined length for concentrating the light and transmitting a plurality of spherical waves according to the traveling direction of the light when the light is transmitted to the light transmitting portion 132 and is repeatedly formed in the longitudinal direction of the cap 130, the light transmitting portion 132 is installed to have a tortuous cross section.

그리고, 상기 고정소켓(140)은, 상기 본체(110)의 단부와 캡(130)의 단부를 포위하는 방식으로 결합되는 몸체(141); 상기 몸체(141)의 일측단으로 돌출 형성되며 엘이디모듈의 전극단자에 각각 전기적으로 연결되고 형광등 설치용 소켓에 삽입되는 접속단자; 및 상기 본체(110)와 캡(130)의 단부 포위시 몸체(141)의 내부에 본체(110)와 방열핀(113) 사이의 간격과 방열핀(113) 상호간의 간극에 끼워지는 가이드돌기(143)를 포함하는 구성으로 이루어 진다.And, the fixed socket 140, the body 141 is coupled in a manner surrounding the end of the main body 110 and the end of the cap 130; A connection terminal protruding to one side end of the body 141 and electrically connected to an electrode terminal of the LED module and inserted into a socket for installing a fluorescent lamp; And a guide protrusion 143 fitted into a gap between the main body 110 and the heat dissipation fin 113 and a gap between the heat dissipation fins 113 in the interior of the body 141 when the end of the main body 110 and the cap 130 are surrounded. It is made of a configuration including a.

그러나, 상기와 같은 엘이디 형광등은, 기판이 본체(110)에 본딩액 등을 통하여 연결되는 구성으로 장시간 사용시 열에 의한 접합력 저하나 자중에 의한 처짐현상으로 본체를 통한 열전달이 원활하게 이루어 지지 못하는 단점이 있는 것이다.However, the LED fluorescent lamp as described above, the substrate is connected to the main body 110 through a bonding liquid, etc., a disadvantage that the heat transfer through the main body can not be made smoothly due to the degradation of the bonding force due to heat or sag due to self-weight when used for a long time. It is.

또한, 상기 본체(110)에서 기판이 분리될 염려가 있어 본체(110)에 기판 결합에 따른 신뢰성을 저하시키게 됨은 물론 별도의 고정부재를 필요로 하여 부품수 및 작업공정을 증가시키게 되는 문제점이 있는 것이다.In addition, there is a concern that the substrate is separated from the main body 110, thereby reducing the reliability due to the bonding of the substrate to the main body 110, as well as the need for a separate fixing member to increase the number of parts and work process will be.

상기와 같은 종래의 문제점들을 개선하기 위한 본 발명의 목적은, 기판이 상대적으로 유연한 플라스틱재의 확산판에 먼저 장착되어 결합이 손쉽게 이루어질 수 있도록 하고, 기판과 히트커버가 항상 일정한 밀착력을 갖도록 되어 열전달이 원활하게 이루어질수 있도록 하며, 제품의 조립공정을 개선토록 하면서 별도의 부자재를 사용하지 않아도 조립이 가능하여 원가절감할 수 있도록 하고, 기판이 히트커버에 불완전 접촉되거나 처짐등에 의해 발생되는 열전달불량을 해소하여 내구성 향상시킬 수 있도록 하는 엘이디 형광등의 기판 고정장치를 제공하는 데 있다.An object of the present invention for improving the conventional problems as described above, the substrate is first mounted on a diffusion plate of a relatively flexible plastic material so that the bonding can be easily made, the heat transfer is always made to have a constant adhesion between the substrate and the heat cover It can be made smoothly, improves the assembly process of the product, and can be assembled without using additional subsidiary materials, thereby reducing the cost, and eliminating heat transfer defects caused by incomplete contact with the heat cover or sag. It is to provide a substrate fixing device such as an LED fluorescent lamp to improve the durability.

본 발명은 상기 목적을 달성하기 위하여, 엘이디소자가 부착되는 기판의 적어도 일측면 양측을 확산판에 의해 지지하고, 상기 확산판에 의해 적어도 일측면 양측이 각각 지지되는 기판의 다른 일측면을 확산판이 히트커버에 연결될 때 일정한 압착력을 갖도록 밀착되는 구성으로 이루어진 엘이디 형광등의 기판 고정장치를 제공한다.In order to achieve the above object, the present invention supports both sides of at least one side of a substrate to which an LED element is attached by a diffusion plate, and the other side of the substrate on which at least one side of both sides is respectively supported by the diffusion plate. Provided is a substrate fixing device of an LED fluorescent lamp, which is configured to be in close contact with a certain pressing force when connected to the heat cover.

그리고, 본 발명의 기판의 지지하는 확산판은 위치결정바의 상단이 그리는 수평선상에서 돌출되도록 히트커버의 후크에 지지되는 지지홈에 연장되어 지지바가 내경측에 돌출되는 엘이디 형광등의 기판 고정장치를 제공한다.In addition, the diffusion plate supporting the substrate of the present invention extends to a support groove supported on the hook of the heat cover so that the top of the positioning bar protrudes on the horizontal line drawn, thereby providing a substrate fixing device such as an LED fluorescent lamp in which the support bar protrudes toward the inner diameter side. do.

또한, 본 발명의 기판을 지지하는 확산판은 위치결정바에서 내경측으로 연장되어 형성되는 지지홈의 일측에 기판이 삽입되는 ㄷ자 형상의 가이드레일이 더 구비되는 엘이디 형광등의 기판 고정장치를 제공한다.In addition, the diffusion plate for supporting the substrate of the present invention provides a substrate fixing device of the LED fluorescent lamp is further provided with a U-shaped guide rail for inserting the substrate on one side of the support groove is formed extending from the positioning bar to the inner diameter side.

더하여, 본 발명의 가이드레일은 기판에 일정한 탄성을 부여토록 상향 경사지게 설치되는 구성으로 이루어진 엘이디 형광등의 기판 고정장치를 제공한다.In addition, the guide rail of the present invention provides a substrate fixing device of the LED fluorescent lamp consisting of a configuration that is installed inclined upward to give a constant elasticity to the substrate.

그리고, 본 발명의 히트커버는 기판에 밀착되는 부분에 대응되어 만곡부가 구비되고, 공기접촉면적을 확대토록 요철부가 구비되는 엘이디 형광등의 기판 고정장치를 제공한다.In addition, the heat cover of the present invention provides a substrate fixing apparatus such as an LED fluorescent lamp having a curved portion corresponding to a portion in close contact with the substrate and having an uneven portion to enlarge the air contact area.

또한, 본 발명의 히트커버는 만곡부가 일정한 탄성을 갖도록 두께가 축소되는 라운드부가 더 구비되는 구성으로 이루어진 엘이디 형광등의 기판 고정장치를 제공한다.In addition, the heat cover of the present invention provides a substrate fixing device of the LED fluorescent lamp made of a configuration that is further provided with a round portion is reduced in thickness so that the curved portion has a constant elasticity.

이상과 같이 본 발명에 의하면, 기판이 상대적으로 유연한 플라스틱재의 확산판에 먼저 장착되어 결합이 손쉽고, 기판과 히트커버가 항상 일정한 밀착력을 구비하여 열전달이 원활하게 이루어지며, 제품의 조립공정을 개선하면서 별도의 부자재를 사용하지 않아도 조립이 가능하여 원가를 절감하고, 기판이 히트커버에 불완전 접촉되거나 처짐등에 의해 발생되는 열전달불량을 해소하여 내구성 향상시키는 효과가 있는 것이다.According to the present invention as described above, the substrate is first mounted on a relatively flexible plastic diffuser plate, the bonding is easy, the substrate and the heat cover is always provided with a constant adhesion to smooth heat transfer, while improving the assembly process of the product It is possible to assemble without using additional subsidiary materials to reduce the cost, and to improve durability by eliminating heat transfer defects caused by incomplete contact or deflection of the substrate with the heat cover.

도1은 종래의 엘이디 형광등을 도시한 측면도이다.
도2는 본 발명에 따른 엘이디 형광등을 도시한 사시도이다.
도3 및 도4는 각각 본 발명에 따른 엘이디 형광등을 도시한 분해도 및 측면도이다.
도5는 본 발명의 제1실시예에 따른 형광등의 결합상태를 도시한 측면도이다.
도6은 본 발명의 제2실시예에 따른 엘이디 형광등의 조립구조를 도시한 측면도이다.
도7은 본 발명의 제3실시예에 따른 엘이디 형광등의 조립구조를 도시한 측면도이다.1 is a side view showing a conventional LED fluorescent lamp.
Figure 2 is a perspective view of the LED fluorescent lamp according to the present invention.
3 and 4 are exploded and side views of the LED fluorescent lamp according to the present invention, respectively.
5 is a side view showing a bonding state of the fluorescent lamp according to the first embodiment of the present invention.
6 is a side view showing the assembly structure of the LED fluorescent lamp according to the second embodiment of the present invention.
7 is a side view showing the assembly structure of the LED fluorescent lamp according to the third embodiment of the present invention.

이하, 첨부된 도면에 의거하여 본 발명의 실시예를 상세하게 설명하면 다음과 같다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도2는 본 발명에 따른 엘이디 형광등을 도시한 사시도이고, 도3 및 도4는 각각 본 발명에 따른 엘이디 형광등을 도시한 분해도 및 측면도이며, 도5는 본 발명의 제1실시예에 따른 형광등의 결합상태를 도시한 측면도이고, 도6은 본 발명의 제2실시예에 따른 엘이디 형광등의 조립구조를 도시한 측면도이며, 도7은 본 발명의 제3실시예에 따른 엘이디 형광등의 조립구조를 도시한 측면도이다.Figure 2 is a perspective view of the LED fluorescent lamp according to the present invention, Figures 3 and 4 are exploded and side views respectively showing the LED fluorescent lamp according to the present invention, Figure 5 is a fluorescent lamp according to a first embodiment of the present invention Figure 6 is a side view showing a coupling state, Figure 6 is a side view showing the assembly structure of the LED fluorescent lamp according to a second embodiment of the present invention, Figure 7 shows an assembly structure of the LED fluorescent lamp according to a third embodiment of the present invention One side view.

본 발명은, 복수의 엘이디소자(110)가 부착되는 기판(100)의 적어도 일측면 양측이 확산판(200)에 의해 지지되도록 설치된다.The present invention is provided such that at least one side of both sides of the substrate 100 to which the plurality of LED elements 110 is attached is supported by the diffusion plate 200.

그리고, 상기 확산판(200)에 의해 적어도 일측면 양측이 각각 지지되는 기판(100)의 다른 일측면을 확산판(200)이 히트커버(300)에 연결될 때 일정한 압착력을 갖도록 설치된다.In addition, the diffusion plate 200 is installed to have a predetermined compressive force when the diffusion plate 200 is connected to the heat cover 300 on the other side of the substrate 100 on which both sides of the substrate 100 are supported by the diffusion plate 200.

또한, 상기 기판(100)의 지지하는 확산판(200)은 위치결정바(210)의 상단이 그리는 수평선(h)상에서 일정높이(t) 돌출되도록 히트커버(300)의 후크(310)가 삽입 지지되는 지지홈(230)에 연장되어 지지바(250)가 내경측에 돌출된다.In addition, the hook 310 of the heat cover 300 is inserted into the diffusion plate 200 supporting the substrate 100 so as to protrude a predetermined height (t) on the horizontal line h drawn by the top of the positioning bar 210. The support bar 250 extends to the support groove 230 that is supported to protrude to the inner diameter side.

또한, 상기 기판(100)을 지지하는 확산판(200)은 위치결정바(210)에서 내경측으로 연장되어 형성되는 지지홈(230)의 일측에 기판(100)이 양단이 각각 삽입토록 ㄷ자 형상의 가이드레일(270)이 더 구비된다.In addition, the diffusion plate 200 supporting the substrate 100 has a c-shape so that both ends of the substrate 100 are inserted into one side of the support groove 230 extending from the positioning bar 210 to the inner diameter side. The guide rail 270 is further provided.

더하여, 상기 가이드레일(270)은 기판(100)에 일정한 탄성을 부여토록 상향 경사를 갖도록 설치된다.In addition, the guide rail 270 is installed to have an upward inclination to impart a constant elasticity to the substrate 100.

그리고, 상기 히트커버(300)는 기판(100)에 밀착되는 부분에 대응되어 만곡부(330)가 구비되고, 공기접촉면적을 확대토록 요철부(350)가 구비된다.In addition, the heat cover 300 has a curved portion 330 corresponding to a portion in close contact with the substrate 100, and has an uneven portion 350 to enlarge an air contact area.

또한, 상기 히트커버(300)는 만곡부(330)가 일정한 탄성을 갖도록 두께가 축소되는 라운드부(335)가 더 구비되는 구성으로 이루어진다.In addition, the heat cover 300 is configured to further include a round portion 335 is reduced in thickness so that the curved portion 330 has a certain elasticity.

상기와 같은 구성으로 이루어진 본 발명의 동작을 설명한다.The operation of the present invention having the above configuration will be described.

도2 내지 도7에서 도시한 바와같이 본 발명은, 복수의 엘이디소자(110)가 부착되는 기판(100)은 확산판(200)과 히트커버(300)가 후크(310)와 지지홈(230)에 의해 상호 결합될 때 지지홈(230)의 일측에 연장되어 형성되는 지지바(250)가 기판(100)의 저부 양측면을 각각 지지하여 기판(100)의 처짐에 의한 결합불량을 방지토록 한다.As shown in FIG. 2 to FIG. 7, in the substrate 100 to which the plurality of LED elements 110 are attached, the diffusion plate 200 and the heat cover 300 include the hook 310 and the support groove 230. When coupled to each other by the support bar 250 is formed to extend to one side of the support groove 230 to support both sides of the bottom of the substrate 100, respectively, to prevent the coupling failure due to the sag of the substrate 100. .

이때, 상기 지지바(250)에 의해 저면이 지지되는 기판(100)은 그 상면이 히트커버(300)에 밀착토록 되어 열전달이 확실하게 수행되면서 결합에 따른 신뢰성을 높이게 된다.At this time, the bottom surface of the substrate 100 is supported by the support bar 250, the upper surface is in close contact with the heat cover 300, so that the heat transfer is surely performed to increase the reliability of the coupling.

또한, 상기 지지바(250)는 위치결정바(210)의 상단이 그리는 수평선(h)상에서 일정높이(t) 돌출되도록 되어 히트커버(300)의 후크(310)와 확산판(200)의 지지홈(230)을 통하여 히트커버와 확산판이 상호 결합될 때 기판의 히트커버에 대한 압착력을 일정하게 유지할 수 있도록 된다.In addition, the support bar 250 is projected to a predetermined height (t) on the horizontal line (h) drawn by the top of the positioning bar 210 to support the hook 310 and the diffusion plate 200 of the heat cover 300. When the heat cover and the diffusion plate are coupled to each other through the groove 230, the pressing force on the heat cover of the substrate may be kept constant.

또한, 상기 기판(100)을 지지하는 확산판(200)은 위치결정바(210)에서 내경측으로 연장되어 형성되는 지지홈(230)의 일측에 기판(100)이 양단이 각각 삽입토록 ㄷ자 형상의 가이드레일(270)이 더 구비되어 기판(100)의 결합이 용이하게 된다.In addition, the diffusion plate 200 supporting the substrate 100 has a c-shape so that both ends of the substrate 100 are inserted into one side of the support groove 230 extending from the positioning bar 210 to the inner diameter side. The guide rail 270 is further provided to facilitate bonding of the substrate 100.

더하여, 상기 지지홈(230)의 일측에 기판(100)이 양단이 각각 삽입토록 하면서 상향 경사를 갖는 ㄷ자 형상의 가이드레일(270)을 통하여 가이드레일(270)에 기판(100)의 양단이 각각 삽입될 때 기판(100)을 상향시키는 힘이 작용토록 되어 기판의 히트커버에 대한 압착력을 일정하게 유지할 수 있도록 된다.In addition, both ends of the substrate 100 on the guide rail 270 through the c-shaped guide rail 270 having an upward inclination while allowing both ends of the substrate 100 to be inserted into one side of the support groove 230, respectively. When inserted, a force that raises the substrate 100 may act to maintain a constant pressing force on the heat cover of the substrate.

그리고, 상기 히트커버(300)는 기판(100)에 밀착되는 부분에 대응되어 만곡부(330)가 구비되어 기판과의 밀착력을 더욱 높일 수 있게 되어 열전달이 원활하게 된다.In addition, the heat cover 300 is provided with a curved portion 330 corresponding to the portion in close contact with the substrate 100 to further increase the adhesion to the substrate to facilitate heat transfer.

또한, 상기 히트커버(300)는 만곡부(330)가 일정한 탄성을 갖도록 두께가 축소되는 라운드부(335)가 더 구비되어 상향되는 기판(100)에 반대방향의 압착력이 작용토록 되어 기판(100)의 두께에 대응되는 밀착력의 유지가 가능토록 되는 것이다.In addition, the heat cover 300 is further provided with a round portion 335 which is reduced in thickness so that the curved portion 330 has a constant elasticity, the pressing force in the opposite direction to the substrate 100 to the upward acting substrate 100 It is possible to maintain the adhesion corresponding to the thickness of the.

100...기판 110...엘이디소자
200...확산판 210...위치결정바
230...지지홈 270...가이드레일
300...히트커버100 ... substrate 110 ... LED element
200 Diffusion plate 210 Positioning bar
230 ... support groove 270 ... guide rail
300 ... Heat Cover

Claims (7)

복수의 엘이디소자(110)가 부착되는 기판(100)의 적어도 일측면 양측이 확산판(200)에 의해 지지되도록 설치되고,
상기 확산판(200)에 의해 적어도 일측면 양측이 각각 지지되는 기판(100)의 다른 일측면을 확산판(200)이 히트커버(300)에 연결될 때 히트커버의 일측면과 일정한 압착력을 유지하도록 설치되며,
상기 히트커버(300)는, 기판(100)의 일측면에 밀착되는 만곡부(330)가 구비되고, 공기접촉면적을 확대토록 요철부(350)가 구비되는 구성으로 엘이디 형광등의 기판 고정장치.At least one side of both sides of the substrate 100 to which the plurality of LED elements 110 is attached is installed to be supported by the diffusion plate 200.
When the diffuser plate 200 is connected to the heat cover 300, the other side of the substrate 100 supported by at least one side of each side by the diffuser plate 200 maintains a constant pressing force with one side of the heat cover. Installed,
The heat cover 300 is provided with a curved portion 330 in close contact with one side of the substrate 100, the concave-convex portion 350 is provided to enlarge the air contact area, the substrate fixing apparatus of the LED fluorescent lamp. 제1항에 있어서, 상기 기판(100)의 지지하는 확산판(200)은, 기판의 일측면을 각각 지지토록 지지바(250)가 내경측에 돌출되는 것을 특징으로 하는 엘이디 형광등의 기판 고정장치.According to claim 1, The diffusion plate 200 for supporting the substrate 100, the substrate fixing device for the LED fluorescent lamp, characterized in that the support bar 250 is projected to the inner diameter side so as to support one side of the substrate, respectively. . 제2항에 있어서, 상기 확산판(200)은, 상기 히트커버(300)에 밀착되는 위치결정바(210)의 상단이 그리는 수평선(h)상에서 일정높이(t) 돌출되도록 히트커버(300)의 후크(310)가 삽입 지지되는 지지홈(230)에 연장되어 지지바(250)가 내경측에 돌출되는 것을 특징으로 하는 엘이디 형광등의 기판 고정장치.3. The heat cover 300 of claim 2, wherein the diffusion plate 200 protrudes a predetermined height t on a horizontal line h at which an upper end of the positioning bar 210 closely contacts the heat cover 300. The hook 310 is extended to the support groove 230 is inserted into the support bar 250 is a substrate fixing device, characterized in that the support bar 250 protrudes on the inner diameter side. 제1항에 있어서, 상기 기판(100)을 지지하는 확산판(200)은 위치결정바(210)에서 내경측으로 연장되어 형성되는 지지홈(230)의 일측에 기판(100)이 양단이 각각 삽입토록 ㄷ자 형상의 가이드레일(270)이 더 구비되는 것을 특징으로 하는 엘이디 형광등의 기판 고정장치.According to claim 1, The diffusion plate 200 for supporting the substrate 100 is inserted into both ends of the substrate 100 in one side of the support groove 230 is formed extending from the positioning bar 210 to the inner diameter side The substrate fixing device of the LED fluorescent lamp, characterized in that the c-shaped guide rail 270 is further provided. 제4항에 있어서, 상기 가이드레일(270)은 기판(100)에 일정한 탄성을 부여토록 상향 경사를 갖도록 설치되는 것을 특징으로 하는 엘이디 형광등의 기판 고정장치.According to claim 4, The guide rail 270 is a substrate fixing device of the LED fluorescent lamp, characterized in that it is installed to have an upward inclination to give a constant elasticity to the substrate (100). 삭제delete 제1항에 있어서, 상기 히트커버(300)는 만곡부(330)가 일정한 탄성을 갖도록 두께가 축소되는 라운드부(335)가 저면에 더 구비되는 것을 특징으로 하는 엘이디 형광등의 기판 고정장치.The apparatus of claim 1, wherein the heat cover (300) further includes a round portion (335) on the bottom of which the thickness is reduced so that the curved portion (330) has a constant elasticity.
KR1020110109970A 2011-10-26 2011-10-26 A device for fixing the board of led light KR101131830B1 (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130128515A (en) * 2012-05-17 2013-11-27 엘지이노텍 주식회사 Lighting device
KR101799344B1 (en) 2016-02-23 2017-12-20 경희대학교 산학협력단 Bonding appratus and method of led light using plastic deformation
JP2018129314A (en) * 2018-05-25 2018-08-16 株式会社ニコン Lighting device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009302028A (en) 2008-06-16 2009-12-24 Msm Tech Co Ltd Fluorescent lamp type led lamp

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009302028A (en) 2008-06-16 2009-12-24 Msm Tech Co Ltd Fluorescent lamp type led lamp

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130128515A (en) * 2012-05-17 2013-11-27 엘지이노텍 주식회사 Lighting device
KR101799344B1 (en) 2016-02-23 2017-12-20 경희대학교 산학협력단 Bonding appratus and method of led light using plastic deformation
JP2018129314A (en) * 2018-05-25 2018-08-16 株式会社ニコン Lighting device

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