KR101129707B1 - Led lighting apparatus and the manufacturing method - Google Patents

Abstract

PURPOSE: A fluorescent lamp type LED lighting apparatus and a manufacturing method thereof are provided to rapidly discharge heat transferred to a heat dissipation member through a plurality of heat dissipation fins arranged on one side of the heat dissipation member, thereby preventing damage of a plurality of LED lamps due to the heat. CONSTITUTION: A heat dissipation member(110) comprises a plurality of heat dissipation fins on the upper surface of the heat dissipation member. A copper foil pattern circuit member(130) comprises a pattern circuit formed by heat and pressure on the lower surface of the heat dissipation member. A plurality of LED lamps(150) is arranged on the lower surface of the copper foil pattern circuit member. A connection cap(170) comprises an electrode pin(173) which is electrically connected to the copper foil pattern circuit member. A diffusion cover(190) diffuses light emitted from the LED lamps.

Description

Fluorescent lamp type LED lighting device and its manufacturing method {LED lighting apparatus and the manufacturing method}

The present invention relates to a fluorescent lamp type LED lighting apparatus and a method of manufacturing the same, and more specifically, after directly fixing the copper plate etched circuit using the heat and pressure on the other surface of the plate-shaped heat dissipation portion formed with a plurality of heat radiation fins on one surface By arranging a plurality of LED lamps on the copper plate, the LED lighting device can be quickly discharged through the heat dissipation fins and the printed circuit board can be discharged while the heat generated corresponding to the plurality of LED lamps is turned on. The present invention relates to a fluorescent lamp type LED lighting device and a method of manufacturing the same that can significantly lower the manufacturing cost according to the manufacturing.

 In general, fluorescent lights and incandescent lamps are most widely used as lighting devices in various places including homes and offices. In particular, the fluorescent lamps are most used as lighting devices because they have a high luminous efficiency and a long lifespan with less glare than incandescent lamps. There is a situation.

The fluorescent lamp is configured to seal a small amount of mercury vapor and argon gas in a rod-shaped vacuum tube and generate light by discharge of gas by applying voltage through both ends.

However, the fluorescent lamp has to be made in a completely sealed state inside the glass tube, so that a lot of difficulties occur in the manufacturing, it takes a lot of power consumption in accordance with the repeated and frequent switching operation and a problem that the life is sharply shortened. It became.

Recently, various products using LEDs have been developed and applied in various industrial fields. In particular, high brightness LED lamps have the advantages of being semi-permanent and having very low power consumption. Therefore, conventional fluorescent lamps, incandescent lamps, sodium lamps, It is expected to be able to replace various lamps including mercury lamps.

In other words, LED lamps contain various harmful substances and replace existing lamps with short lifespans, which can reduce environmental pollution. Energy savings can also be achieved through the low power consumption of LED lamps. .

Accordingly, fluorescent lamp type lighting apparatuses having various structures have been developed in order to replace the fluorescent lamps, and conventional fluorescent lamp type LED lighting apparatuses have a complicated structure, which increases manufacturing cost and does not provide sufficient heat dissipation. This problem can be shortened.

In consideration of this point, recently, as disclosed in Patent Application No. 10-2009-0102044, the Heidi fluorescent lamp includes a main tube body which is formed in a hollow cylinder shape and has an open groove along a longitudinal direction thereof; An upper cap having a coupling part slidably coupled to the main tube body so that the opening groove is closed through the opening groove of the main tube body, and an extension part extending from the coupling part to enter the main tube body; A light emitting diode module arrayed in a plurality of light emitting diodes and mounted on the extension of the upper cap; Side caps coupled to close the inside of the main tube body at both sides of the main tube body and the upper cap coupled to each other; An electrode pin protruding out of the side cap and electrically connected to the light emitting diode module; and a coupling portion of the upper cap and the main tube and a coupling portion of the side cap and the main tube and the upper cap are sealed. Consists of processed.

However, the conventional LED fluorescent lamps of the related art have a structure in which heat generated by a plurality of light emitting diodes is turned on cannot be quickly released.

That is, in the conventional general LED fluorescent lamp, since the main tube is formed in a hollow cylinder as described above, heat generated by the lighting of a plurality of light emitting diodes is stored in the hollow space of the main tube, so that heat is quickly released. There was a problem that the life of the light emitting diode due to the heat can not be reduced.

In addition, the conventional LED fluorescent lamps of the related art must be provided with a plate-shaped circuit board in order to array a plurality of light emitting diodes, and in order to fix the circuit board to the main tube body, a slide type or a plurality of screws are fixed. As a result, the work process becomes complicated, resulting in a manufacturing cost increase due to the manufacture of LED fluorescent lamps.

Patent Application No. 10-2009-0102044, filed Oct. 27, 2009 The name of the invention; Waterproof LED Fluorescent Tube, 2 pages 3 ~ 11 lines, Fig. 1

Accordingly, the present invention has been made in order to solve the above-described problems, and after directly fixing the copper plate etched circuit using heat and pressure to the bottom surface of the plate-shaped heat dissipation portion formed with a plurality of heat radiation fins on the upper surface, a plurality of the copper plate By arranging the LED lamps of the array, it is possible to quickly dissipate heat generated corresponding to the lighting of a plurality of LED lamps through the heat dissipation fins and to eliminate the printed circuit board, thereby manufacturing cost according to LED lighting device manufacturing It is an object of the present invention to provide a fluorescent lighting type LED lighting device and a method of manufacturing the same to significantly lower the.

The present invention for achieving the above object, in the fluorescent lamp type LED lighting device, the heat dissipation member is provided with a plurality of heat radiation fins formed on the upper surface, and fixed by heat and pressure using a fixing device on the bottom of the heat dissipation member A copper foil pattern circuit member provided with a pattern circuit etched to be etched, a plurality of LED lamps arranged on the bottom surface of the copper foil pattern circuit member so as to be lit to correspond to the application of power, and both ends of the heat dissipation member It is characterized in that it comprises a connection cap which is accommodated inward and provided with each of the electrode pins electrically connected to the copper foil pattern circuit member.

Here, the fluorescent lamp type LED lighting device is characterized in that the diffusion cover is further provided so as to be able to diffuse the light of the plurality of LED lamps which are slide-inserted at both ends to the heat radiation member.

In addition, another invention for achieving the above object is a method of manufacturing a fluorescent lamp type LED lighting device, comprising the steps of manufacturing a heat dissipation member such that a plurality of heat dissipation fins are formed in the longitudinal direction on one surface thereof and the bottom surface has a flat surface. Manufacturing a copper foil pattern circuit member directly fixed to the bottom surface of the heat dissipation member manufactured by the above step; and directly fixing the copper foil pattern circuit member manufactured by the step to the bottom surface of the heat dissipation member through a fixing device; And arranging a plurality of LED lamps on the copper foil pattern circuit member fixed to the bottom surface of the heat dissipation member through the fixing device by the above steps, and applying the power to the plurality of LED lamps arrayed on the copper foil pattern circuit member by the above steps. Slidingly coupling the diffusion cover to the heat dissipation member so as to diffuse the light emitted according to the lighting; and by the step, the copper foil pattern circuit member and the power line are connected to both ends of the heat dissipation member to which the Characterized in that it comprises a step of fixing a connection cap provided on one surface of a pair of electrode pins connected to Shall be.

As described above, according to the fluorescent lamp type LED lighting apparatus according to the present invention and a method for manufacturing the same, after directly fixing the copper plate etched circuit using heat and pressure on the bottom surface of the plate heat radiating portion formed with a plurality of heat radiation fins on the upper surface By arranging a plurality of LED lamps on the copper plate, the LED lighting device can be quickly discharged through the heat dissipation fins and the printed circuit board can be discharged while the heat generated corresponding to the plurality of LED lamps is turned on. There is an effect that can significantly lower the manufacturing cost according to the manufacturing.

1 is an exploded perspective view showing a fluorescent lamp type LED lighting apparatus according to the present invention.
2 is a partial perspective view showing a fluorescent lamp type LED lighting apparatus according to the present invention.
3 is a cross-sectional view showing a fluorescent lamp type LED lighting apparatus according to the present invention.
4 is a flowchart illustrating a method of manufacturing a fluorescent lamp type LED lighting apparatus according to another embodiment of the present invention.
5 is a view showing a process for explaining the raw material manufacturing step in the manufacturing method of the LED lighting apparatus of the fluorescent lamp type according to another embodiment of the present invention.

Hereinafter, an embodiment of a fluorescent lamp type LED lighting apparatus and a method of manufacturing the same according to the present invention will be described in detail.

First, it should be noted that, in the drawings, the same components or parts have the same reference numerals as much as possible. In describing the present invention, detailed descriptions of related well-known functions or configurations are omitted in order not to obscure the subject matter of the present invention.

As shown in the fluorescent lamp type LED lighting apparatus according to the present invention, by forming a plurality of heat radiation fins protruding on the top surface and the circuit is etched on the bottom surface by directly fixing the copper foil pattern circuit member arrayed with a plurality of LED lamps, The circuit is configured to be capable of quickly dissipating heat generated in correspondence with the lighting of a plurality of LEDs arranged in the circuit as it is applied.

That is, the fluorescent lamp type LED lighting device 100 according to the present invention, the heat dissipation member 110 is provided with a plurality of heat dissipation fins 111 formed on the upper surface, and the fixing device on the bottom surface of the heat dissipation member 110 (Not shown) corresponds to the copper foil pattern circuit member 130 provided with a pattern circuit etched so as to be fixed by heat and pressure, and the power is applied to the bottom surface of the copper foil pattern circuit member 130. A plurality of LED lamps 150 and a plurality of LED lamps 150 which are provided to be turned on so as to accommodate each of the both ends of the heat dissipation member 110 into the inner surface of the copper foil pattern circuit member 130 and the electrode pins 173 are respectively provided It comprises a connection cap 170 is provided.

In addition, the fluorescent lamp type LED lighting device 100 is further provided with a diffusion cover 190 so as to be able to diffuse the light of the plurality of LED lamps 130, the both ends of which are slide-inserted into the heat dissipation member 110. .

When described in more detail with reference to the accompanying drawings for the LED lighting device of the fluorescent lamp type according to the present invention made as follows.

First, the heat dissipation member 110 of the fluorescent lamp type LED lighting apparatus according to the present invention is formed in a rectangular plate shape as shown in Figs. 1 and 3 as a plurality of LED lamps 150 is lit on one surface A plurality of heat dissipation fins 111 are formed and provided to enable rapid release of generated heat.

That is, the heat dissipation member 110 has a plurality of heat dissipation fins 111 formed on one surface of the heat dissipation member 110 so as to rapidly discharge heat generated from the plurality of LED lamps 150 that are turned on in response to the application of power. The copper foil pattern circuit member 130 is formed of a flat plate so that the copper foil pattern circuit member 130 can be directly fixed through the fixing device by heat and pressure, and the guide grooves 112 are formed on both sides thereof so as to be coupled by sliding the diffusion cover 190. It is formed and provided.

In addition, the heat dissipation member 110 is preferably formed of a metal material having good heat dissipation efficiency, such as aluminum.

The copper foil pattern circuit member 130, as shown in Figure 1, one surface is fixed to the bottom surface of the heat dissipation member 110 through a fixing device, and the other surface so that a plurality of LED lamps 150 can be arranged on the bottom surface The circuit is patterned and constructed.

The fixing device (not shown) is provided on the bottom surface of the heat dissipation member 110 to uniformly fix the copper foil pattern circuit member 130 with high temperature heat and high pressure.

That is, the fixing device has one surface open to accommodate a fixing cart in which a plurality of heat dissipation members having copper foil pattern circuit members are mounted on the bottom thereof, and a heating capable of dissipating high temperature heat by applying power to the inner peripheral surface. The coil is wired, and an inlet is formed on one side of the outer circumference to introduce compressed air supplied from the compressed air supply unit, and a fixing chamber having an outlet communicating with the inside is formed at the lower end of the inlet, and the opening of the fixing chamber. One end of the door is provided on the outer circumferential surface thereof so as to open and close via a hinge portion, and the inlet and outlet include valves provided for inflow and outflow of compressed air.

At this time, the fixing chamber internal temperature of the fixing device is composed of a temperature of 80 ℃ ~ 200 ℃ so that the copper foil pattern circuit member is fixed to the heat radiation member.

That is, when the internal temperature of the fixing chamber is 80 ° C. or less, the copper foil pattern circuit member is hardly adhered to the heat dissipating member. When the temperature is 200 ° C. or higher, the manufacturing cost increases due to the high power consumption. The temperature range of is preferable.

In addition, the internal pressure of the fixing chamber is configured in the range of 1.5Kgf / ㎠ ~ 15Kgf / ㎠.

That is, when the internal pressure of the fixing chamber is 1.5 Kgf / cm 2 or less, the copper foil pattern circuit member is hardly secured to the heat dissipating member. When the internal pressure is 15 Kgf / cm 2 or more, the fixing chamber is able to withstand high pressure. Since it requires a lot of equipment cost, the internal pressure of the fixing chamber is preferably in the range of 1.5Kgf / ㎠ ~ 15Kgf / ㎠.

The connection cap 150 is provided so as to be installed like a fluorescent lamp by closing both ends of the heat dissipation member 110, the both ends of the diffusion cover 170 is slide coupled.

 In addition, the connection cap 150 is closed at both ends of the heat dissipation member 110, the both ends of the diffusion cover 170 is coupled to the coupling groove 171 is formed on one surface to be installed as a fluorescent lamp, the other end, The pair of electrode pins 173 electrically connected to the circuit patterned on the copper foil pattern circuit member 130 via a power line 172 is provided.

The diffusion cover 190 has a plurality of LED lamps, one end and the other end of each of the guide grooves 112 formed on both sides of the heat dissipation member 110 as shown in the accompanying drawings, FIGS. It is provided to diffuse the light emitted corresponding to the 150 is lit.

That is, the diffusion cover 190 has a "U" shaped cross-section so that one end and the tartan can be slidably coupled to the guide grooves 112 formed on both sides of the heat dissipation member 110, respectively, both ends of which are inward and outward. The slide piece 191 bent upward is formed integrally.

On the other hand, the manufacturing method of the LED lighting device of the fluorescent lamp type according to another embodiment of the present invention as shown in the accompanying drawings, a plurality of heat dissipation fins 111 protrudingly formed on one surface and the heat dissipation member 110 to have a flat surface Manufacturing step (S210) and manufacturing a copper foil pattern circuit member 130 directly fixed to the bottom surface of the heat dissipation member 110 manufactured by the step (S210) (S220) and the step (S220) Fixing directly to the bottom surface of the heat dissipation member 110 by fixing the copper foil pattern circuit member 130 manufactured by the through the fixing device to the bottom of the heat dissipation member 110 (S230). Arranging a plurality of LED lamps 150 on the copper foil pattern circuit member 130 fixed through the apparatus (S240), and a plurality of LED lamps arrayed on the copper foil pattern circuit member 130 by the step (S240) Foot as the 150 is lit correspondingly to the power applied Slide coupling the diffusion cover 190 to the heat dissipation member 110 to diffuse the light (S250), and both ends of the heat dissipation member 110, the diffusion cover 190 is slide-bonded by the step (S250). The copper foil pattern circuit member 130 and a pair of electrode pins 173 connected through the power line 172 are fixed to the connection cap 170 provided on one surface (S260).

Here, the copper foil pattern circuit member 130 is manufactured by coating an epoxy resin on one surface of a thin copper foil as shown in FIG. 4 to prepare a raw material to be wound on a winding drum (S221) and the step ( S221) while peeling off the release paper attached to the other side while releasing the raw material wound on the winding drum, coating the dry film supplied from the dry film supply unit on the other side (S222) and the dry film by the step (S222) Exposing the original coated on the other surface through an exposure unit (S223), developing the raw material exposed by the step (S223) through a developing device (S224), and developing by the step (S224) A step (S225) of nicking the original wire through the nicking part, a step of removing the raw material etched by the step (S225), and the original wire removed by the step (S226), the winding circuit for manufacturing the pattern circuit Winding up on It is prepared by a step (S227).

In addition, the raw material manufacturing step (S221), as shown in Figures 4 and 5, the release paper (C) attached to one side of the copper foil (A) attached to the release paper on both sides while being released from the supply winding drum (B). ) In which step (S2211) is removed and the release paper (C) removed by the step (S2211) is wound on the release paper winding drum (D) and the copper foil (A) is supplied to the surface on which the release paper (C) is removed. Supplying and coating the epoxy resin from the epoxy resin supply unit (E) (S2212), and drying the epoxy resin coated on one surface by the step (S2212) through the dryer (F) while the copper foil (A) is transferred Attaching the release paper supplied from the release paper supply winding drum (G) to prevent foreign matters on the surface of the epoxy resin coated on the surface of the copper foil (A) by the step (S2213) and the step (S2213) ( S2214) and the release paper is transported by the step (S2214) A step (S2215) that the copper foil is wound around the take-up drum (H).

delete

delete

Fluorescent lamp type LED lighting apparatus according to the present invention made as described above is provided with a fluorescent lamp type on the indoor ceiling because a pair of electrode pins 173 at both ends are provided on the other side of the connection cap 150, respectively. Install in the same way.

When the fluorescent type LED lighting device is installed as described above, the power is applied by operating a switch on the indoor wall.

When the power is applied, the plurality of LED lamps 150 arrayed on the other surface of the copper foil pattern circuit member 130 is turned on, and the light generated by the lighting of the LED lamps 150 is radiated by the heat dissipation member 110. Slide piece 191 in the guide groove 112 of the) is spread to the diffusion cover 190 is slide coupled.

As described above, the plurality of LED lamps 150 are turned on to generate heat.

At this time, the generated heat is quickly released through a plurality of heat dissipation fins 111 protruding from one surface of the heat dissipation member 110.

That is, when heat is generated due to the plurality of LED lamps 150 being turned on, the copper foil pattern circuit member 130 is fastened directly to the other surface of the heat dissipation member 110 through a fixing means directly to the heat dissipation member 110. Heat is transferred, and the heat transferred to the heat dissipation member 110 is quickly discharged through a plurality of heat dissipation fins 111 formed on one surface of the heat dissipation member 110.

Therefore, it is possible to prevent the damage of the plurality of LED lamps 150 due to heat.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the inventions. It will be clear to those who have knowledge of.

100; LED lighting
110; Heat dissipation member
130; Copper foil pattern circuit member
150; LED lamp
170; Connection cap
190; Diffusion Cover

Claims (6)

In the fluorescent lighting type LED lighting device,
A heat radiation member 110 having a plurality of heat radiation fins 111 formed on an upper surface thereof;
A copper foil pattern circuit member (130) provided with a pattern circuit etched on the bottom surface of the heat dissipation member (110) so as to be fixed by heat and pressure using a fixing device;
A plurality of LED lamps 150 arranged on a bottom surface of the copper foil pattern circuit member 130 so as to be lit to correspond to the application of power;
A connection cap 170 which is provided with electrode pins 173 electrically connected to the copper foil pattern circuit member 130 by accommodating both ends of the heat dissipation member 110 into one surface thereof;
LED lighting device of the fluorescent lamp type, characterized in that made.
The method of claim 1,
The fluorescent lamp type LED lighting device 100 is characterized in that the diffusion cover 190 is further provided so as to be able to diffuse the light of the plurality of LED lamps 130, the both ends of which are slide-inserted into the heat dissipation member 110 is lit. Fluorescent type LED lighting device.
The method according to claim 1 or 2,
The heat dissipation member 110 has a plurality of heat dissipation fins 111 formed on one surface of the heat dissipation member 110 so as to rapidly discharge heat generated from the plurality of LED lamps 150 that are turned on in response to the application of power. The copper foil pattern circuit member 130 is formed into a flat plate to be directly fixed through the fixing device, and guide grooves 112 are formed on both sides thereof so as to be coupled by sliding the diffusion cover 190. LED lighting device of the fluorescent type.
In the manufacturing method of the LED lighting device of the fluorescent lamp type,
Manufacturing a heat dissipation member 110 such that a plurality of heat dissipation fins 111 are formed on one surface thereof and a bottom thereof has a flat surface (S210);
Manufacturing a copper foil pattern circuit member 130 directly fixed to the bottom of the heat dissipation member 110 manufactured by the step (S210) (S220);
Directly fixing the copper foil pattern circuit member 130 manufactured by the step S220 to a bottom surface of the heat dissipation member 110 through a fixing device (S230);
Arranging a plurality of LED lamps (150) on the copper foil pattern circuit member (130) fixed to the bottom surface of the heat dissipation member (110) by the step (S230);
The plurality of LED lamps 150 arranged in the copper foil pattern circuit member 130 by the step (S240) is diffused cover on the heat dissipation member 110 to diffuse the light emitted by the lighting corresponding to the power applied Slidingly joining 190 (S250);
The pair of electrode pins 173 connected to the copper foil pattern circuit member 130 and the power supply line 172 at both ends of the heat dissipation member 110 to which the diffusion cover 190 is slide-coupled by the step S250. Fixing the connection cap 170 provided on one surface (S260);
Method of manufacturing a fluorescent lighting type LED lighting device comprising a.
The method of claim 4, wherein
Manufacturing of the copper foil pattern circuit member 130, by coating an epoxy resin on one surface of the copper foil of the thin plate to prepare a raw material to be wound on the winding drum (S221) and the raw material wound on the winding drum by the step (S221) While removing the release paper attached to the other side while unwinding, coating the dry film supplied from the dry film supply unit on the other surface (S222), and the raw material coated on the other surface by the step (S222) through the exposure unit Step (S223) during exposure, developing (S224) the raw material exposed by the step (S223) through a developing device, and nicking the raw material developed by the step (S224) through a nicking unit (S225). ), And the step of removing the raw material etched by the step (S225) (S226), and the step of winding the raw material removed by the step (S226) in the winding pattern for manufacturing the circuit (S227) The manufacturing method of the LED lighting apparatus of the fluorescent lamp type.
The method of claim 5,
The raw material manufacturing step (S221), the step of removing the release paper (C) attached to one side of the copper foil (A) attached to the release paper on both sides while being released from the take-up drum (B) (S2211) and the step ( The release paper (C) removed by S2211) is wound on the release paper winding drum (D) and the copper foil (A) is coated by supplying an epoxy resin from the epoxy resin supply unit (E) to one surface from which the release paper (C) is removed. Step (S2212), and the step (S2213) and the step (S2213) to dry through the dryer (F) while the copper foil (A) is coated on the epoxy resin coated on one surface by the step (S2212) Attaching the release paper supplied from the release paper supply winding drum (G) to prevent foreign matter on the surface of the coated dried epoxy resin on one surface of the copper foil (A) (S2214), and the release paper by the step (S2214) The copper foil being transported while being attached is wound on the winding drum (H) (S2 215) characterized in that the manufacturing method of the LED lighting device of the fluorescent lamp type.

Images