KR101113507B1 - Ething nozzle device and ething apparatus using the same - Google Patents

Abstract

An etching nozzle apparatus according to a first embodiment of the present invention is provided on both sides of an upright substrate to spray an etching solution; And an etching solution blocking unit provided between the substrate and the etching nozzle and blocking the flow of the residual etching solution of the etching nozzle when the etching solution injection is stopped in the etching nozzle.

Description

Etching nozzle device and etching apparatus using same {Ething nozzle device and ething apparatus using the same}

The present invention relates to an etching nozzle apparatus and an etching apparatus using the same, and more particularly, to an etching nozzle apparatus having an etching solution blocking portion and preventing the flow of residual etching solution on a substrate after an etching process, and an etching apparatus using the same.

Conventional etching apparatuses in a printed circuit board (PCB) manufacturing process include a method of horizontally moving a substrate using a roller and spraying an etching solution on the upper surface of the substrate using an etching nozzle.

However, as the thickness of the printed circuit board becomes thinner and the circuit to be formed is miniaturized, it is difficult to secure mass productivity with the conventional horizontal roller type etching apparatus.

Conventional horizontal roller type etching apparatus employs a plurality of rollers in order to prevent sagging of the substrate when the substrate is a thin plate, horizontally transfer the thin plate between the rollers and inject the etching liquid from above and below.

In this etching step, the injection of the etching solution on the substrate must be stopped at the same time as the etching step is completed. However, the etching liquid sprayed from the etching nozzle set to the fixed during the etching process, the etching liquid remaining in the pipe, even if the etching pump is stopped continuously comes out by the natural pressure due to gravity.

Etching liquid injection due to gravity causes a problem of surface defects, appearance defects and quality defects in the implementation of the microcircuit of the substrate.

SUMMARY OF THE INVENTION An object of the present invention is to provide an etching nozzle apparatus and an etching apparatus using the same, which block the flow of residual etching liquid from the etching nozzles provided on both sides of an upright substrate when the etching liquid injection is stopped.

An etching nozzle apparatus according to a first embodiment of the present invention is provided on both sides of an upright substrate to spray an etching solution; And covering the etching nozzle when the injection of the etching solution stops and exposing the etching nozzle when the etching solution is sprayed between the substrate and the etching nozzle. It may include; etchant blocking portion for blocking the flow.

The etching liquid blocking portion of the etching nozzle apparatus according to the first embodiment of the present invention may include a support positioned on an outer side of the substrate, and may be rotatably coupled to the support.

The etching solution blocking portion of the etching nozzle apparatus according to the first embodiment of the present invention may be coupled to the support and the hinge.

The etching liquid blocking part of the etching nozzle apparatus according to the first embodiment of the present invention may be rotated by a timer.

The etching nozzle apparatus according to the first embodiment of the present invention may further include an etching nozzle unit for supporting the etching nozzle on both sides of the substrate.

The etching nozzle unit of the etching nozzle apparatus according to the first embodiment of the present invention may be provided with a guide groove for moving the etching nozzle.

An etching apparatus according to a second embodiment of the present invention includes the etching nozzle apparatus; A transfer jig supporting the substrate; And a transfer device unit configured to transfer the transfer jig between the etching nozzle devices.

The transfer jig of the etching apparatus according to the second embodiment of the present invention comprises a frame for embedding the substrate; A frame supporter for supporting the frame such that the frame is positioned in a vertical direction; And a substrate fixing part fixed to the frame mounted in the frame in a vertical direction.

The etching nozzle apparatus of the etching apparatus according to the third embodiment of the present invention is provided with two or more, the transfer jig is a frame for embedding the substrate; A frame support part supporting a lower end of the frame such that two or more frames are spaced in parallel and spaced apart in a vertical direction; And a substrate fixing part mounted on the frame to fix the embedded substrate of the frame in a vertical direction.

According to the etching nozzle apparatus and the etching apparatus using the same according to the present invention, when the injection of the etching liquid is stopped, it is possible to block the flow of the residual etching liquid from the etching nozzles provided on both sides of the upright substrate to the substrate. Even if the pump is stopped, it is possible to prevent poor quality due to the etching solution continuously.

Hereinafter, with reference to the drawings will be described in detail a specific embodiment of the present invention. However, the spirit of the present invention is not limited to the embodiments presented, and those skilled in the art who understand the spirit of the present invention may deteriorate other inventions or the present invention by adding, modifying, or deleting other elements within the scope of the same idea. Other embodiments that fall within the scope of the inventive concept may be readily proposed, but they will also be included within the scope of the inventive concept.

In addition, the components with the same functions within the scope of the same idea shown in the drawings of each embodiment will be described using the same reference numerals.

1 is a schematic perspective view showing an etching nozzle apparatus according to a first embodiment of the present invention.

Referring to FIG. 1, the etching nozzle apparatus 100 according to the present invention includes an etching nozzle 10, an etching nozzle unit 50, and an etching solution blocking unit 60.

On the other hand, when defining terms for the direction, the up and down direction means up and down with respect to one surface of the substrate 5 with respect to the upright substrate 5, and the left and right direction is one surface of the substrate 5 It means the left and right as a center, the front and rear direction means the relationship between one surface and the other surface around the substrate (5).

The etching nozzle 10 is provided in the etching nozzle unit 50, which will be described later, and is installed in the nozzle frame 20 constituting the etching nozzle unit 50 so as to be movable in the vertical direction.

Also provided with a hole 15 to move in the nozzle frame (20).

The inside of the hole 15 may be formed in a concave-convex shape corresponding to the guide groove 22 on the nozzle frame 20, the hole 15 is the etching nozzle 10 to the nozzle frame 20 And function to be fixed and supported.

In addition, the etching nozzle 10 may implement a precise movement by the guide groove 22 of the nozzle frame.

Each of the etching nozzles 10 is connected to an external etching solution supply device (not shown) to spray the etching solution on both surfaces of the substrate.

The etching nozzle unit 50 includes a nozzle frame 20, a connecting frame 30, a fixed frame 40, an etching nozzle 10, and guide grooves 22, 32, and 42.

The nozzle frame 20 is formed long along the vertical direction of the upright substrate, and is spaced apart from each other by a predetermined distance from each side of the substrate.

The nozzle frame 20 includes a row of etching nozzles 10 in a vertically extending frame toward the substrate.

However, the degree of inclination of the nozzle frame 20 with respect to the upper and lower sides of the substrate may be changed within the scope of the same idea of those skilled in the art to understand the spirit of the present invention.

The nozzle frame 20 is provided with the etching nozzle 10 for spraying the etching solution on the substrate, the number of the etching nozzle 10 and the number of the nozzle frame 20 is the number of the etching nozzle 10 Injection pressure, the etching nozzle 10 may be changed depending on the degree of radius that can be uniformly sprayed.

Both ends of the nozzle frame 20 is provided with a hole 25 to insert the connecting frame 30 to be described later.

The nozzle frame 20 may move on the connection frame 30 through the hole 25, and the inside of the hole 25 may have an uneven shape corresponding to the guide groove 32 of the connection frame, which will be described later. There is also a function that is fixed and supported by the connection frame (30).

In addition, the nozzle frame 20 is provided with a guide groove 22 for guiding the etching nozzle 10 to move on the nozzle frame 20, the etching groove 10 by the guide groove 22 ) Can accurately move.

The connecting frame 30 is formed long in the left and right directions of the substrate, and is coupled to both ends of the upper and lower ends of the nozzle frame 20.

The connection frame 30 is inserted into holes 25 formed at both ends of upper and lower ends of the plurality of nozzle frames 20, and the hole 25 is connected to the nozzle frame 20 by the connection frame 30. It serves as a guide to move on.

The hole 25 has a function of being fixed and supported by the fixing frame 40 formed of an uneven shape corresponding to the guide groove 42 of the fixing frame to be described later.

In addition, the connecting frame 30 is provided with a guide groove 32 for guiding the nozzle frame 20 to move on the connecting frame 30, the nozzle frame 20 by the guide groove 32 ) Can accurately move.

The fixed frame 40 is formed long in the front and rear direction of the substrate, it is coupled to both ends of the front and rear of the connecting frame 30, respectively.

The fixing frame 40 is inserted into holes 35 formed at both front and rear ends of the connecting frame 30, and the connecting frame 30 is disposed on the fixing frame 40. It is provided with a guide groove 42 for guiding to move, it is possible to implement the accurate movement of the connecting frame 30 by the guide groove (42).

Fig. 2- (a) is a schematic side view showing the etching nozzle apparatus before the etching liquid blocking unit acts according to the first embodiment of the present invention, and Fig. 2- (b) is the etching nozzle according to the first embodiment of the present invention. Fig. 2- (c) is a schematic perspective view showing the effect of the etchant blocking portion of the etching nozzle apparatus according to the first embodiment of the present invention.

Referring to FIGS. 2- (a) to 2- (c), the etching solution blocking unit 60 includes support members 65 respectively provided on left and right sides, which are outer parts of the upright substrate 5, and the support brackets ( 65 is preferably parallel to the plurality of nozzle frames 20 constituting the etching nozzle portion, but is not necessarily limited thereto.

The support 65 may be formed of one member without a protrusion, but may preferably include a protrusion for coupling the etching liquid blocking unit 60, and the shape of the protrusion may be determined by those skilled in the art to understand the spirit of the present invention. It can be changed within the scope of the same idea.

The etchant blocking unit 60 is rotatably coupled on the support 65, and may be coupled through a hinge.

In addition, the etching solution blocking unit 60 may be automatically rotated by a timer when the etching pump (not shown) on the support 65, the blind etching solution blocking unit 60 is the support 65 The position where is combined with is the top of the blind.

However, the position to be combined is not limited to the embodiment, and can be changed within the scope of the same idea of those skilled in the art to understand the spirit of the present invention.

When the etching solution blocking part 60 sprays the etching liquid onto the substrate 5 upright from the etching nozzle 10, the etching part blocking part 60 faces the upper part, and thus, the etching solution blocking part 60 has a problem in spraying the etching liquid onto the substrate 5. Does not become.

However, when the etching pump is stopped and the etching solution injection is stopped in the etching nozzle 10, the etching solution blocking part 60 moves to the lower portion of the substrate 5 as shown in FIGS. 2- (b) and 2- (c). It rotates automatically to block the residual etching liquid from flowing to the substrate 5 by gravity pressure (natural pressure).

Therefore, the etching solution blocking unit 60 may block the flow of the residual etching solution of the etching nozzle to the substrate to prevent surface defects due to the residual etching solution.

Fig. 3- (a) is a schematic side view showing the etching nozzle device before the blocking film according to the second embodiment of the present invention, and Fig. 3- (b) is the etching nozzle device according to the second embodiment of the present invention. Fig. 3- (c) is a schematic perspective view showing the effect of the etchant barrier film of the etching nozzle apparatus according to the second embodiment of the present invention.

3- (a) to 3- (c), the bonding position of the etching solution blocking unit 60 and the support 65 becomes a central portion of the etching solution blocking unit in a blind shape.

Another embodiment of the present invention differs only in the bonding position between the above-described embodiment and the etching solution blocking unit 60 and the support 65, and other configurations and effects are the same as the above-described embodiment.

4 is a schematic perspective view showing an etching nozzle apparatus according to a third embodiment of the present invention, Figure 5 is a schematic perspective view showing the effect of the blocking film of the etching nozzle apparatus according to a third embodiment of the present invention.

4 to 5, the etching solution blocking unit 60 includes support members 65 disposed above and below the upstanding part of the upright substrate 5, and the supporting member 65 constitutes the etching nozzle part. It is preferable that the parallel to the plurality of connection frame 30 is not limited thereto.

The etchant blocking part 60 is formed in a blind shape around the upright substrate 5, and other components except for the position of the support 65 are different from those of the first and second embodiments. Have the same configuration.

The etching process is performed by adjusting the timer, and the movement between the processes is performed by adjusting the timer. When the etching process is completed, the etching solution pump (not shown) is turned off, and the injection of the etching solution by the etching solution pump is stopped.

However, even if the etching solution pump is stopped, the residual etching solution flows through the substrate due to the gravity pressure (natural pressure) in the etching nozzle 10, thus preventing the implementation of the microcircuit of the substrate 5.

Therefore, the etchant blocking unit 60 prevents the flow of the residual etchant by gravity pressure (natural pressure), and the etching solution blocking unit 60 is automatically rotated by a timer at the same time as the etching process is completed.

6 is a schematic perspective view of an etching apparatus according to a fourth embodiment of the present invention.

Referring to FIG. 6, the etching apparatus 200 includes the etching nozzle apparatus 100, the transfer jig 300, and the transfer apparatus unit 400.

The transfer jig 300 includes a frame 310, a frame support 320, and a substrate fixing part 330.

The frame 310 is a skeleton in which the substrate 5 is embedded, and has a hollow central portion.

When the substrate 5 is positioned in the central portion, the frame 310 and the substrate 5 are parallel to each other, and the frame 310 is fixed to the substrate fixing part 330 to be described later to become an integral plane.

When the frame 310 is vertically fixed to the frame support 320, which will be described later, the substrate 5, which is integral with the frame 310, is also vertically moved.

The frame support 320 supports the lower end of the frame 310 so that the frame 310 is positioned in the vertical direction, and has four frame support bars 321 and a frame fixing bar 322 coupled in a rectangular frame shape. It includes. Meanwhile, the frame support part 320 may have a single structure including the frame support bar 321 and the frame fixing bar 322 having a rectangular frame shape.

Here, four frame support bars 321 are combined to form a frame support 320 of a rectangular frame shape. Therefore, the frame support part 320 has a shape in which the center part is empty, and even though the etching liquid is injected during the etching process, the frame support part 320 is discharged without being accumulated in the frame support part 320.

In addition, the frame fixing bar 322 is coupled to the lower portion of the frame 310 to vertically fix the frame 310, the position of the center of each of the frame support bar 321 perpendicular to the frame 310 It is preferably formed in.

The substrate fixing part 320 is mounted on the frame 310 to fix the substrate 5 embedded in the frame 310 in the vertical direction.

Four clamps 330 are mounted on the upper and lower portions of the frame 310, but the clamp 330 is only one embodiment of the substrate fixing part 330, and can fix the substrate. Another fixation device may alternatively be implemented.

The transfer unit 400 includes a driving unit, a connecting unit, a rail, a rail shaft. Since the transfer unit 400 may be implemented by a known technique, a detailed description thereof will be omitted.

7 is a schematic perspective view of an etching apparatus according to another embodiment of the present invention.

Referring to FIG. 7, two or more frames 310 are positioned and supported in parallel to the frame support 320 of the transfer jig 300 described with reference to FIG. 6.

Although two frames 310 are fixed to the frame support 320, this is only one preferred embodiment and two or more frames may be employed.

When two or more frames are employed, two or more substrates 5 can be etched at the same time, and the plurality of substrates 5 are etched at the same time, thereby increasing work efficiency and increasing production yield.

In addition, the two frames 310 are spaced apart and fixed in parallel to uniformly apply the etching solution to the substrate 5, but as described above, the etching nozzle apparatus of the present invention may be each of the etching nozzles 40 and the like. It is not necessarily limited to the movement.

Through the above embodiments, the etching nozzle block and the etching apparatus including the etching solution blocking unit 60 rotate the etching solution blocking unit automatically by a timer when the etching solution pump stops and the etching solution injection to the substrate is stopped.

Therefore, the flow of the residual etching solution due to the gravity pressure (natural pressure) to the substrate by the rotation of the etching solution blocking unit is very effective in implementing a microcircuit.

1 is a schematic perspective view showing an etching nozzle apparatus according to a first embodiment of the present invention.

2 is a view of the etching liquid blocking portion of the etching nozzle apparatus according to the first embodiment of the present invention.

3 is a view of the etching liquid blocking portion of the etching nozzle apparatus according to the second embodiment of the present invention.

4 is a schematic perspective view showing an etching nozzle apparatus according to a third embodiment of the present invention.

Fig. 5 is a schematic perspective view showing the effect of an etchant blocking unit of an etching nozzle apparatus according to a third embodiment of the present invention.

6 is an etching apparatus according to a fourth embodiment of the present invention.

7 is an etching apparatus according to a fifth embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

100: etching nozzle device 10: etching nozzle

20: nozzle frame 30: connecting frame

50: etching nozzle portion 60: etching liquid blocking portion

65: support 200: etching apparatus

300: transfer jig 400: transfer unit

Claims (9)

Etch nozzles provided on both sides of the upright substrate to spray the etching solution; And Between the substrate and the etching nozzle to cover the etching nozzle when the injection of the etching liquid stops and to expose the etching nozzle when the etching liquid is sprayed, And an etching solution blocking unit for blocking the flow of the remaining etching solution of the etching nozzle to the substrate when the etching solution injection is stopped in the etching nozzle. The method of claim 1, And the etchant blocking unit includes a support located on an outer side of the substrate, and is rotatably coupled to the support. 3. The method of claim 2, The etching solution blocking unit is characterized in that the nozzle and the coupling coupled through the hinge. The method of claim 1, The etching solution blocking unit is rotated by a timer, characterized in that the etching nozzle device. The method of claim 1, And an etching nozzle unit for supporting the etching nozzle on both sides of the substrate. The method of claim 5, And the etching nozzle portion comprises a guide groove for moving the etching nozzle. An etching nozzle apparatus according to any one of claims 1 to 6; A transfer jig supporting the substrate; And And a transfer device unit for transferring the transfer jig between the etching nozzle devices. The method of claim 7, wherein The transfer jig is a frame for embedding the substrate; A frame supporter for supporting the frame such that the frame is positioned in a vertical direction; And And a substrate fixing part mounted to the frame to fix the substrate embedded in the frame in a vertical direction. The method of claim 7, wherein The etching nozzle device is provided with two or more, The transfer jig is a frame for embedding the substrate; A frame support part supporting a lower end of the frame such that two or more frames are spaced in parallel and spaced apart in a vertical direction; And And a substrate fixing part mounted on the frame to fix the embedded substrate in the frame in a vertical direction.

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