KR101103908B1 - Light emitting device package - Google Patents

Light emitting device package Download PDF

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Publication number
KR101103908B1
KR101103908B1 KR1020090099926A KR20090099926A KR101103908B1 KR 101103908 B1 KR101103908 B1 KR 101103908B1 KR 1020090099926 A KR1020090099926 A KR 1020090099926A KR 20090099926 A KR20090099926 A KR 20090099926A KR 101103908 B1 KR101103908 B1 KR 101103908B1
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KR
South Korea
Prior art keywords
light emitting
emitting device
cavity
lens unit
package body
Prior art date
Application number
KR1020090099926A
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Korean (ko)
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KR20110043015A (en
Inventor
장지원
Original Assignee
엘지이노텍 주식회사
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Priority to KR1020090099926A priority Critical patent/KR101103908B1/en
Priority to PCT/KR2010/007203 priority patent/WO2011049373A2/en
Publication of KR20110043015A publication Critical patent/KR20110043015A/en
Application granted granted Critical
Publication of KR101103908B1 publication Critical patent/KR101103908B1/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58Optical field-shaping elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

An embodiment relates to a light emitting device package.

The light emitting device package according to the embodiment includes a package body having a cavity; A plurality of lead electrodes disposed in the cavity; A light emitting device electrically connected to the plurality of lead electrodes; A resin material on the light emitting element disposed in the cavity; And a lens part on which a concentric pattern is formed on the resin material.

Light emitting element, package

Description

Light emitting device package {LIGHT EMITTING DEVICE PACKAGE}

An embodiment relates to a light emitting device package.

Group III-V nitride semiconductors are spotlighted as core materials of light emitting devices such as light emitting diodes (LEDs) or laser diodes (LDs) due to their physical and chemical properties. Ⅲ-Ⅴ nitride semiconductor is made of a semiconductor material having a compositional formula of normal In x Al y Ga 1 -x- y N (0≤x≤1, 0≤y≤1, 0≤x + y≤1).

A light emitting diode (LED) is a kind of semiconductor device that transmits and receives a signal by converting electricity into infrared light or light using characteristics of a compound semiconductor.

LEDs or LDs using such nitride semiconductor materials are widely used in light emitting devices for obtaining light, and have been applied to light sources of various products such as keypad light emitting units, electronic displays, and lighting devices of mobile phones.

The embodiment provides a light emitting device package having a new structure.

The embodiment provides a light emitting device package that can improve color deviation.

The embodiment provides a light emitting device package having a concentric pattern.

The light emitting device package according to the embodiment includes a package body having a cavity; A plurality of lead electrodes disposed in the cavity; A light emitting device electrically connected to the plurality of lead electrodes; A resin material on the light emitting element disposed in the cavity; And a lens part on which a concentric pattern is formed on the resin material.

The embodiment can provide a light emitting device package having a new structure.

The embodiment can provide a light emitting device package that can improve color deviation.

The embodiment can improve the thickness of the light emitting device package.

In the description of an embodiment, each layer, region, pattern or structure may be "under" or "under" the substrate, each layer, region, pad or pattern. In the case where it is described as being formed at, "up" and "under" include both "directly" or "indirectly" formed through another layer. do. In addition, the criteria for up / down or down / down each layer will be described with reference to the drawings.

In the drawings, the thickness or size of each layer is exaggerated, omitted, or schematically illustrated for convenience and clarity of description. In addition, the size of each component does not necessarily reflect the actual size.

Hereinafter, a light emitting device package according to an embodiment will be described in detail with reference to the accompanying drawings.

1 is a perspective view illustrating a light emitting device package according to a first embodiment, and FIG. 2 is a cross-sectional view taken along the line A-A of FIG.

1 and 2, the light emitting device package 100 according to the first embodiment may include a first lead electrode 121, a second lead electrode 123, a package body 110, a light emitting device 125, The resin material 130 and the lens unit 140 is included.

The package body 110 may be formed using a polymer-based resin that is easy to inject, and as the polymer-based resin, for example, PPA (Polyphthal amide), LCP (Liquid Crystal Polymer), PPS (Poly) Materials such as phenylene sulfide) or polyetheretherketone (PEEK) may be used. Of course, the material of the package body 110 is not limited to such a resin material, and various resin materials may be used as the material. In addition, the package body 110 may be implemented as a wafer level package (WLP) using a silicon-based material, but is not limited thereto. The outer shape of the package body 110 may be formed in a circular columnar shape, a polyhedral shape, and the like, and the shape may be changed by an injection molding or / and etching process of the body material. In the embodiment, the package body 110 is illustrated that the cavity 115 of at least one structure is formed.

The first lead electrode 121 and the second lead electrode 123 are electrically separated from each other, one side is disposed in the first cavity 115 and the other side is exposed to the bottom surface of the package body 110. In an embodiment, each of the first lead electrode 121 and the second lead electrode 123 may be exposed to one or more branches on the outer side surface of the package body 110.

The first lead electrode 121 and the second lead electrode 123 may be selectively formed using a lead frame, a metal plating layer, a via structure, or the like. For convenience of description, the lead frame type will be described as an example. Shall be. The first lead electrode 121 and the second lead electrode 123 may be disposed under the package body 110.

At least a portion of the first lead electrode 121 and the second lead electrode 123 may be exposed to the bottom surface of the package body 110 or may extend in the same plane as the bottom surface.

One end of the first lead electrode 121 and the second lead electrode 123 may be disposed in the first cavity 115 of the package body 110, and a circumference thereof is a bottom of the first cavity 115. It may be formed perpendicular or inclined with respect to the surface. The light emitting device 125 may be disposed in the first cavity 115, and the light emitting device 125 may be disposed on at least one lead electrode 121, and the first lead electrode 121 and the second lead electrode may be disposed on the first cavity 115. Is electrically connected to 123. The first lead electrode 121 and the second lead electrode 123 may be separated by the separating unit 112. The separating part 112 may be a material of the package body 110 or another material, but is not limited thereto.

In addition to providing power to the light emitting device 125, the first lead electrode 121 and the second lead electrode 123 emit heat generated by the light emitting device 125 and the light emitting device 125. It can serve to reflect the light generated from).

The light emitting device 125 may include a wire bonding method using one or more wires 127, or a flip or die bonding method, according to a chip type, and the first lead electrode 121 and the second lead electrode ( 123).

The light emitting device 125 may include a colored LED chip such as a blue light emitting diode (LED) chip, a green LED chip, a red LED chip, or include an ultraviolet (Ultraviolet) LED chip. The embodiment will be described with the blue LED chip as an example.

A second cavity 117 may be formed in the package body 110, and the second cavity 117 may be formed on the first cavity 115. An upper diameter of the first cavity 115 may be smaller than an upper diameter of the second cavity 117. The second cavity 117 is disposed above the package body 110, and the first cavity 115 is disposed below the center of the second cavity 117.

The space of the first cavity 115 and / or the second cavity 117 may be formed by the package body 110 or / and at least one lead electrode 121, 123, and the cavity space may be defined by the embodiment of the present invention. Various changes can be made within the scope.

At least one light emitting device 125 may be disposed in the first cavity 115, and patterns of the lead electrodes 121 and 123 may be changed when a plurality of LED chips are mounted.

The resin material 130 is formed in the first cavity 115. The resin material 130 may include a silicon or epoxy material, and at least one phosphor or / and a diffusing agent may be added to the resin material 130, but is not limited thereto. The phosphor may include a yellow phosphor, a green phosphor, a red phosphor, and a blue phosphor. Types of the LED chip and the phosphor in the first cavity 115 may be changed depending on the target light of the package, but is not limited thereto.

The surface of the resin material 130 may be formed in a concave shape, convex shape, or a flat shape, the pattern may be formed on the surface.

The first cavity 115 and the second cavity 117 in the package body 110 may be formed in a groove shape having a circular shape or a polygonal shape in planar shape, and emitted from the light emitting device 125. The circumferential surface may be formed as an inclined surface or a multistage inclined surface so that light can be easily emitted to the outside. In addition, a reflective layer may be formed on the circumferential surface of the first cavity 115 and / or the second cavity 117. The package body 110 may be implemented in a glass material, it may be released through the body of the glass material in the cavity.

Between the resin material 130 and the lens unit 140 may include another light-transmissive resin layer or a light-transmitting phosphor layer, but is not limited thereto.

The lens unit 140 is disposed on the light emitting device 125 and has a directing angle of light emitted from the light emitting device 125 or light emitted from the light emitting device 125 to be reflected in the cavities 115 and 117. It acts as a lens to change. For example, the lens unit 140 may be formed in the second cavity 117 by including a resin material such as silicon or epoxy, a polymer material, or a glass material. In addition, the lens unit 140 may include at least a portion of a phosphor or a color conversion material.

The lens unit 140 may be formed in the second cavity 117, and an upper portion thereof may have a convex lens shape. The lens unit 140 may be formed of a resin material in the second cavity 117 or by attaching a separate lens.

One of the first cavity 115 and the second cavity 117 may not be formed, and the position of the light emitting device 125 may also be changed.

The lens unit 140 may be disposed in direct contact with or spaced apart from the light emitting device 125, and a part of the lens unit 140 may be disposed in an area of the first cavity 115, but is not limited thereto.

A plurality of patterns 142 are formed on an upper surface of the lens unit 140, and the plurality of patterns 142 are arranged in a concentric shape. The concentric pattern 142 may be formed on the entire upper surface of the lens unit 140, or may be formed on at least one of an image center portion, an image circumference portion, or an area between the image center portion and the image circumference portion. Hereinafter, the embodiment will be described as an example that the concentric pattern 142 is disposed on the entire upper surface of the lens unit 140, but is not limited thereto.

The concentric pattern 142 of the lens unit 140 has a center shape, protrudes with at least one of a circular shape, an elliptic shape, an aspherical shape, and a polygonal shape having different diameters. The concentric pattern 142 may be disposed on different planes or on the same plane according to the surface shape of the lens unit 140. The shape of each pattern 142 may be formed in a polygonal horn shape or a prism pattern of symmetry or asymmetry.

The concentric pattern 142 is formed along the shape of the upper surface of the lens unit 140, the size of each pattern is formed to gradually decrease from the center of the upper surface of the lens unit 140 toward the outside, or each pattern The height of the may be formed to gradually lower toward the outside.

The concentric pattern 142 may include a prism pattern, and the intervals between the patterns may be arranged at regular intervals, at irregular intervals, or at random intervals.

The concentric circular pattern 142 of the lens unit 140 refracts or disperses the light emitted from the light emitting element 125 when it is transmitted or reflected, so that light of the center and side portions of the lens unit 140 is reduced. It may have a uniform distribution of luminosity. In addition, there is almost no color deviation between the center portion and the side portion of the lens unit 140, the degree of the color deviation may be changed by the concentric pattern 142.

2 and 3, the center P0 of the patterns may be a groove or a pattern may be disposed, but is not limited thereto. The centers P0 of the patterns correspond to the light emitting device 125 and may be formed in a concave horn shape.

The first pattern P1 and the second pattern P2 of the lens unit 140 may be adjacent to each other, and two side surfaces S1 and S2 may be formed in a triangular prism shape. The first side surface S1 of the first pattern P1 and the first side surface S1 of the second pattern P2 may be formed at right angles (θ1 = 90 °) with respect to the bottom surface. The second side surface S2 of the first pattern P1 and the second side surface S2 of the second pattern P2 may be inclined with respect to the vertical axis Y of the bottom surface 118.

The angle θ2: 30 to 60 ° of the second side surface S2 of the first pattern P1 may be greater than the angle θ3 of the second side surface S2 of the second pattern P2 adjacent in the outward direction. Accordingly, the inclined second side surface S2 of each pattern may be formed such that its inclination angle gradually decreases toward the outer direction X. FIG. The θ2 is about 30 to 80 °, the θ3 is less than θ2 may be formed of 20 ~ 70 °. Accordingly, the inclined direction of each pattern is formed in a form inclined outward from the pattern center.

The heights H1 and H2 of the adjacent first pattern P1 and the second pattern P2 may be the same or different from each other, and in other cases, may be gradually lowered toward the outer direction X. The inclination angles of the patterns P1 and P2 of the lens unit 140 may be the same, and in this case, the heights H1 and H2 of the patterns may be gradually lowered. The inclined side surface may be formed in a concave or convex curved shape having a flat or predetermined curvature.

The gap G between the pattern of the lens unit 140 and the cavity bottom surface 118 (the second cavity bottom surface) may be gradually lowered from the pattern center P0 toward the outside direction X. For example, The gap G between the low points RO, R1 and R2 and the bottom of the cavity may be gradually lowered. This may vary depending on the surface shape of the lens unit 140.

4 is a side sectional view showing a light emitting device package according to the second embodiment and an enlarged pattern thereof. In the description of the second embodiment, the same parts as the first embodiment will be denoted by the same reference numerals, and redundant description thereof will be omitted.

Referring to FIG. 4, the light emitting device package 100A includes a concentric pattern 142A of the lens unit 140, and the concentric pattern 142A has an inclined direction of each pattern instead of an outward direction. It is formed in the form inclined in the inward direction.

In addition, the concentric pattern 142A of the lens unit 140 is inclined in a direction opposite to the direction in which the pattern of FIG. 2 is inclined, and the inclined direction of the pattern may be variously changed within the technical scope of the embodiment. Each inclined surface may be flat or formed as a concave curved surface or a convex curved surface having a predetermined curvature.

The concentric pattern 142A of the lens unit 140 has a protrusion pattern disposed at the center of the pattern, and is formed such that at least one element of the pattern size, pattern spacing, and pattern height gradually decreases from the pattern center toward the outside. Can be.

In addition, the size and height of the concentric pattern 142A may be adjusted to become smaller or larger at an angle of the inclined side, and the inclined side may be formed to have a flat or curvature.

The light emitting device package 100A may widen the light distribution and the directing angle by the lens unit 140, and color deviation between the center part and the side part in the light distribution area is hardly generated. That is, the concentric pattern 142A of the lens unit 140 may be adjusted to have the same color distribution at any angle when viewed from the package top side.

In addition, the thickness of the light emitting device package 100A may be thinner than a package thickness having a convex lens shape. In this case, the thickness of the light emitting module and the light unit applied to the display device, the indicator device, or the lighting device may be reduced.

5 is a side cross-sectional view illustrating a light emitting device package according to a third embodiment, and FIG. 6 is a partially enlarged view of the pattern of FIG. 5. In the description of the third embodiment, the same parts as the first embodiment will be denoted by the same reference numerals, and redundant descriptions thereof will be omitted.

5 and 6, in the light emitting device package 100B, a concentric pattern 142B of the lens unit 140 is formed, and the concentric pattern 142B is formed between the patterns P8 and P9. The intervals may be equally spaced or the internal angles θ4 of each pattern may be formed at the same angle. In this case, the shape of the pattern 142B of the lens unit 140 may be formed of an equilateral triangular prism. The pattern 142B of the lens unit 140 may have a positive triangle vertex, and one side or both sides may be formed to have a predetermined curvature.

7 to 10 are diagrams illustrating an example of a pattern of a lens unit according to an exemplary embodiment.

Referring to FIG. 7, the pattern of the lens unit may be formed such that the distance T1 between the patterns is gradually smaller from the pattern center O toward the outer direction X, and the pattern size is the outer direction (from the pattern center O). It can be formed gradually smaller toward X).

Referring to FIG. 8, the pattern of the lens unit may be formed such that the distance T2 between the patterns gradually increases from the pattern center O toward the outward direction X, and the pattern size may be increased from the pattern center O to the outward direction ( It can be formed to gradually increase toward X).

Referring to FIG. 9, the pattern of the lens unit may be formed to have the same interval T3 and size between the patterns, and the upper portion of the lens unit may be formed in the shape of a convex lens as shown in FIG. 2 or may be formed flat. .

Referring to FIG. 10, the patterns of the lens unit may have different intervals (T4, T5, T6) and sizes between the regions A1, A2, A3. In addition, the pattern interval T4 of the first region A1 adjacent to the pattern center O of the lens unit is the same, and the pattern interval T5 of the second region A2 adjacent to the outside of the first region A1. Is smaller than the pattern spacing of the first region A1 and smaller than the pattern size of the first region. The pattern spacing T6 of the third region A3 adjacent to the outside of the second region A2 is the same. It may be formed to have the same size as the pattern size of the first region A1.

Such an embodiment may control the color deviation of the lens center and the lens side by varying the light distribution of the first area A1, the second area A2, and the third area A3.

In the light emitting device package according to the embodiment, the pattern of the lens portion formed on the upper portion is formed in a concentric shape, the inclination angle of each concentric pattern, the curvature of the inclined surface (one side or both sides), the spacing between the patterns, the size of the patterns, According to the array direction of the patterns, the desired light distribution shape can be realized without generating color deviation.

11 is a cross-sectional view illustrating a light emitting device package according to a fourth embodiment. In describing the fourth embodiment, the same parts as the above-described embodiments refer to the above-described embodiment, and the concentric pattern described above may be selectively applied.

Referring to FIG. 11, the light emitting device package 100C includes a package body 110A, first and second lead electrodes 121A and 123A, a light emitting device 125, a resin material 130, and a lens unit 140. It includes.

One end of the first lead electrode 121A is disposed in the cavity 115 of the package body 110A, and the other end penetrates through the package body 110A and is exposed to the other side of the package body 110A and the package. It extends to the other bottom surface of the body 110A.

The other end of the second lead electrode 123A is disposed in the cavity 115 of the package body 110A, and one end thereof passes through the package body 110A and is exposed to one side of the package body 110A and the package. It extends to the bottom of one side of the body (110A).

The other end of the first lead electrode 121A and one end of the second lead electrode 123A may be trimmed and / or formed after being exposed to the outside of the package body 110. The trimming and forming process can be changed.

The package body 110A may include at least one heat dissipation via, and the heat dissipation via may extend from the first lead electrode 121A to the bottom surface of the package body 110A.

12 and 13 are diagrams illustrating a light distribution distribution according to the first embodiment. In the first embodiment, the measurement was carried out under the conditions of providing a resin in which a light emitting element and a yellow phosphor of a blue LED chip were added.

FIG. 12 is a light distribution distribution of blue light emitted from the light emitting device package of FIG. 1, and has a peak-to-peak directivity angle of 90 to 120 degrees, and color in all regions of the light distribution. Deviation does not occur.

FIG. 13 is a light distribution distribution of yellow light emitted from the light emitting device package of FIG. 1, and has a peak-to-peak directivity angle of 70 to 120 degrees, and color in all regions of the light distribution. Deviation does not occur.

The orientation angle distribution and the color deviation are examples, and the color deviation distribution and the orientation angle may be changed according to the pattern shape according to the embodiment disclosed above, but are not limited thereto.

The light emitting device package may be implemented as a light emitting module through an array structure using at least one or a plurality of light emitting devices, and may be used as a light source for an illumination device, an indicator device, a display device, and the like. .

Features, structures, effects, and the like described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, and the like illustrated in the embodiments may be combined or modified with respect to other embodiments by those skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

Although the above description has been made based on the embodiments, these are only examples and are not intended to limit the present invention. Those skilled in the art to which the present invention pertains should not be exemplified above without departing from the essential characteristics of the present embodiments. It will be appreciated that many variations and applications are possible. For example, each component specifically shown in the embodiment can be modified. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

1 is a perspective view of a light emitting device package according to a first embodiment.

2 is a cross-sectional view taken along the line A-A of FIG.

FIG. 3 is a view illustrating some patterns of the lens unit of FIG. 2.

4 is a side cross-sectional view of a light emitting device package according to the second embodiment.

5 is a side cross-sectional view of a light emitting device package according to a third embodiment.

FIG. 6 is a view illustrating some patterns of the lens unit of FIG. 5.

7 to 10 are diagrams illustrating an example of a pattern of a lens unit according to an exemplary embodiment.

11 is a side cross-sectional view of a light emitting device package according to the fourth embodiment.

12 and 13 are diagrams illustrating a light distribution of FIG. 1.

Claims (13)

A package body having a cavity; A plurality of lead electrodes disposed in the cavity; A separator between the plurality of lead electrodes; A light emitting element disposed in the cavity and electrically connected to the plurality of lead electrodes; A resin material disposed in the cavity and covering the light emitting element; And A lens part having a lower surface contacting the upper surface of the package body and the resin material; The lens unit includes a central concave in the direction of the light emitting element and circular protrusions having different radii around the central portion, The package body includes an outer portion protruding more than an upper surface of the package body and an accommodating portion in which a lower portion of the lens portion is accommodated inside the outer portion. The cavity is disposed below the center of the receiving portion, The central portion of the lens unit corresponds to the light emitting device and comprises a concave shape concave in the direction of the light emitting device. A package body having a cavity; A plurality of lead electrodes disposed in the cavity; A separator between the plurality of lead electrodes; A light emitting element disposed in the cavity and electrically connected to the plurality of lead electrodes; A resin material disposed in the cavity and covering the light emitting element; A lens unit on the package body and the resin material; And It includes a light-transmitting phosphor layer between the lens portion and the resin, The lens unit includes a central concave in the direction of the light emitting element and circular protrusions having different radii around the central portion, The package body includes an outer portion protruding more than an upper surface of the package body and an accommodating portion in which a lower portion of the lens portion is accommodated inside the outer portion. The cavity is disposed below the center of the receiving portion, The central portion of the lens unit corresponds to the light emitting device and comprises a concave shape concave in the direction of the light emitting device. The light emitting device package of claim 1 or 2, wherein the protrusions have the same center as the center of the lens unit. The light emitting device package of claim 3, wherein the protrusions are arranged at a height gradually lowering toward the outer side from the first protrusion closest to the center of the lens unit. The light emitting device package of claim 3, wherein the protrusions have an interval gradually narrowing toward the outer side from the first protrusion closest to the center of the lens unit. The light emitting device package of claim 3, wherein the protrusions are arranged at equal intervals or at different intervals. The light emitting device package of claim 3, wherein the size of the protrusions is gradually smaller or larger from the center portion of the lens portion toward the outer side. The light emitting device package of claim 1 or 2, wherein the package body is formed of a material that emits light through the package body. The light emitting device package according to claim 1 or 2, wherein the package body comprises a polymer resin. The light emitting device package of claim 1 or 2, wherein the lens unit comprises at least one of epoxy, silicon, a polymer material, and a glass material. The light emitting device package according to claim 1 or 2, wherein the resin comprises a phosphor. The circular protrusions of the lens portion have the same spacing between the protrusions of the first region adjacent to the center of the lens portion, and the spacing of the second region adjacent to the outside of the first region. The gap between the protrusions of the first area is smaller than the gap between the protrusions of the first area and smaller than the protrusion size of the first area. The distance between the protrusions of the third area adjacent to the outside of the second area is the same and the same as the protrusion size of the first area. Light emitting device package formed in size. The light emitting device package according to claim 1 or 2, wherein the plurality of lead electrodes is disposed on the same plane as a lower surface of the package body, and the light emitting element is disposed on at least one of the plurality of lead electrodes.
KR1020090099926A 2009-10-20 2009-10-20 Light emitting device package KR101103908B1 (en)

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PCT/KR2010/007203 WO2011049373A2 (en) 2009-10-20 2010-10-20 Light emitting device package and lighting system including same

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101515439B1 (en) * 2013-12-26 2015-05-04 (주)한성스마트엘이디 LED lighting device
KR101540106B1 (en) * 2013-12-26 2015-07-30 (주)한성스마트엘이디 LED lighting device
WO2016014450A1 (en) * 2014-07-21 2016-01-28 CoreLed Systems, LLC Led luminaire
US9793450B2 (en) 2015-11-24 2017-10-17 Samsung Electronics Co., Ltd. Light emitting apparatus having one or more ridge structures defining at least one circle around a common center

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014116687A1 (en) * 2014-11-14 2016-05-19 Osram Opto Semiconductors Gmbh Optoelectronic component and lighting device
JP2017098414A (en) * 2015-11-24 2017-06-01 三星電子株式会社Samsung Electronics Co.,Ltd. Light-emitting device
JP7126949B2 (en) 2016-05-04 2022-08-29 エルジー イノテック カンパニー リミテッド Lighting module and lighting device provided with the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03148493A (en) * 1989-10-21 1991-06-25 Ngk Insulators Ltd Device for enlarging band of drum can
JP2007088093A (en) * 2005-09-20 2007-04-05 Matsushita Electric Works Ltd Light-emitting device
KR100744031B1 (en) * 2005-12-21 2007-08-01 서울반도체 주식회사 Luminescent device having fresnel lens
KR100869573B1 (en) * 2007-05-29 2008-11-21 삼성전기주식회사 Difussion lense, optical device and lighting apparutus thereof

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8297801B2 (en) * 2004-07-16 2012-10-30 Osram Sylvania Inc. Light emitting diode disc optic with heat sink housing
US7595515B2 (en) * 2005-10-24 2009-09-29 3M Innovative Properties Company Method of making light emitting device having a molded encapsulant
TWM318731U (en) * 2007-03-02 2007-09-11 Everlight Electronics Co Ltd Illumination device
JP3148493U (en) * 2008-11-07 2009-02-19 一品光学工業股▲ふん▼有限公司 Convex Fresnel LED lens and its LED assembly

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03148493A (en) * 1989-10-21 1991-06-25 Ngk Insulators Ltd Device for enlarging band of drum can
JP2007088093A (en) * 2005-09-20 2007-04-05 Matsushita Electric Works Ltd Light-emitting device
KR100744031B1 (en) * 2005-12-21 2007-08-01 서울반도체 주식회사 Luminescent device having fresnel lens
KR100869573B1 (en) * 2007-05-29 2008-11-21 삼성전기주식회사 Difussion lense, optical device and lighting apparutus thereof

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101515439B1 (en) * 2013-12-26 2015-05-04 (주)한성스마트엘이디 LED lighting device
KR101540106B1 (en) * 2013-12-26 2015-07-30 (주)한성스마트엘이디 LED lighting device
WO2016014450A1 (en) * 2014-07-21 2016-01-28 CoreLed Systems, LLC Led luminaire
US9285098B2 (en) 2014-07-21 2016-03-15 CoreLed Systems, LLC LED luminaire
US9793450B2 (en) 2015-11-24 2017-10-17 Samsung Electronics Co., Ltd. Light emitting apparatus having one or more ridge structures defining at least one circle around a common center

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