KR101101672B1 - Lead pin for semiconductor package and semiconductor package - Google Patents

Abstract

Lead pin for a package substrate according to the present invention is a connection pin for inserting into a hole formed in the external device; A head portion formed at one end of the connection pin and a head portion formed on the flange portion and having a multi-layered protrusion; And a fence portion protruding toward the package substrate at an edge of the flange portion when the head portion is mounted on the package substrate so as to block solder paste from flowing upwards of the head portion. It may be larger than the diameter of the protrusion.

Description

Lead pin for semiconductor package and semiconductor package

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead package for semiconductor packages and a semiconductor package, and more particularly to a lead package for connecting a package substrate on which an integrated circuit is mounted to a main board and a semiconductor package including the same.

Due to the development of the electronics industry, various types of semiconductor packages have been manufactured. In recent years, as the wiring density of semiconductor packages has increased, a number of T boards are used to connect a package board on which an integrated circuit (IC) is mounted to a main board. PGA (Pin Grid Array) type semiconductor package substrates with type lead pins are widely used.

Conventional package substrates are mainly used in the form of insert pins through which holes are inserted and T-type lead pins attached to the package substrate by soldering. Due to this, the use of T-type lead pin is becoming more common.

In recent years, the use of lead (Sn-Ag-Cu, Sn-Sb), which does not use lead, due to the limited use of lead in consideration of environmental effects caused by the solder, results in a high melting temperature of the solder.

At this time, when the melting temperature of the solder is increased, during the reflow process for mounting the IC chip on the package substrate, the lead pin connection solder supporting the lead pin is dissolved by the reflow heat, and the lead pin is inclined. .

In addition, in the reflow process, the solder overflows to the upper portion of the lead pins, and the defects such as spreading to the connection pins often occur. Therefore, there is a need for techniques that can solve this problem.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems of the prior art, and an object thereof is to prevent contamination of the connection pins due to solder paste, and to increase the contact area between the head and the solder paste, thereby improving the bonding efficiency. To provide a lead pin.

The lead pin for a semiconductor package according to the present invention includes a connection pin for inserting into a hole formed in an external device; A flange portion formed at one end of the connection pin and a head portion formed on the flange portion and having a multi-layered protrusion; And a fence part formed on one surface of the head part to block a path thereof in order to prevent the solder paste from flowing to cover the top of the head part when the head part is mounted on the package substrate.

In addition, the protrusion of the lead pin for a semiconductor package according to the present invention includes a first flat portion having a flat shape formed on the flange portion and a second flat portion having a flat shape formed on the first flat portion. It may be characterized by.

In addition, the protrusion of the lead pin for a semiconductor package according to the present invention may be characterized in that it comprises a flat portion having a flat shape formed on the flange portion and a round portion formed on the plane portion.

In addition, the planar portion and the fence portion of the lead pin for a semiconductor package according to the present invention may be characterized in that the ends thereof are in contact with each other.

In addition, a portion where the planar portion and the fence portion of the lead pin for a semiconductor package according to the present invention are in contact with each other may be formed in a curved surface.

In addition, the semiconductor package according to the present invention includes a substrate portion having a pad portion formed on one surface; And a head portion for inserting into a hole formed in an external device, a flange portion formed at one end of the connection pin, and a head portion formed on the flange portion and having a multi-layered protrusion, and the head portion is a package substrate. A lead pin formed on one surface of the head portion to block the path to prevent solder paste from flowing so as to cover the upper portion of the head portion during mounting of the lead pin; and a lead pin electrically connected to the pad portion. Can be.

In addition, the protrusion of the semiconductor package according to the present invention may include a first flat portion having a flat shape formed on the flange portion and a second flat portion having a flat shape formed on the first flat portion. can do.

In addition, the protrusion of the semiconductor package according to the present invention may include a flat portion having a flat shape formed on the flange portion and a round portion formed on the flat portion.

In addition, the protrusion of the semiconductor package according to the present invention may be characterized in that it comprises a flat portion formed on the flange portion and a round portion formed on the plane portion.

In addition, the planar portion and the fence portion of the semiconductor package according to the present invention may be characterized in that the end portions are formed to be spaced apart from each other.

The lead pin and the semiconductor package for a semiconductor package according to the present invention are soldered by the fence portion because the head portion includes a fence portion blocking the path to prevent the solder paste from flowing to cover the top of the head portion when the package substrate is mounted The paste may be prevented from flowing to cover the upper portion of the head, thereby preventing contamination of the connecting pin.

In addition, the present invention is formed on the flange portion having a multi-layered protrusions, so that the contact area between the head portion and the solder paste is increased, thereby improving the joining efficiency.

A lead pin for a semiconductor package and a semiconductor package according to the present invention will be described in more detail with reference to FIGS. 1 to 4. Hereinafter, with reference to the drawings will be described in detail a specific embodiment of the present invention.

However, the spirit of the present invention is not limited to the embodiments presented, and those skilled in the art who understand the spirit of the present invention may deteriorate other inventions or the present invention by adding, modifying, or deleting other elements within the scope of the same idea. Other embodiments that fall within the scope of the inventive concept may be readily proposed, but they will also be included within the scope of the inventive concept.

In addition, components having the same functions within the same or similar scope shown in the drawings of each embodiment will be described using the same or similar reference numerals.

1 is a side cross-sectional view illustrating a semiconductor package according to an embodiment of the present invention, FIG. 2 is a partial cross-sectional view illustrating that the lead pin of FIG. 1 is mounted on a substrate, and FIG. 3 is an embodiment of the present invention. A side view for describing a lead pin mounted to a semiconductor package according to an example.

1 to 3, the semiconductor package 10 may include a substrate 20 and lead pins 100.

The semiconductor chip 30 is electrically connected to the surface of the substrate 20, and an organic substrate or a ceramic substrate such as low temperature co-fired ceramic (LTCC) may be used as the material.

In addition, a pad portion 22 may be formed on the bottom of the substrate portion 20 to be electrically connected to the lead pin 100, and a photoresist layer 50 may be provided around the pad portion 22. . In addition, the substrate 20 may be made of a plurality of layers, and circuit patterns for electrically connecting the plurality of layers may be formed therein.

Therefore, since the semiconductor package 30 is mounted so that the semiconductor chip 30 is electrically connected to the substrate 20, the size of the semiconductor package may be reduced.

In the present embodiment, the lead pin 100 may include a connection pin 110, a head part 120, and a fence part 130.

The connection pin 110 is a portion in which the lead pin 100 is inserted into a socket when the package board is mounted. The connection pin 110 may be formed in a cylindrical shape having a predetermined length according to the type of the package substrate. It is coupled to protrude to the top of the substrate.

And, the connection pin 110 is connected to the end of the head portion 120, it is preferable that the center of the head portion 120 and the center of the connection pin 110 is formed to match.

In this case, the connecting pin 110 and the head 120 may be integrally formed, and may be made of the same material as the conductive metal. However, the material of the connecting pin 110 and the head portion 120 is not limited thereto.

As described above, the head part 120 is integrally formed with the connection pin 110 and is electrically connected by the solder paste 40 at the exposed part of the pad part 20 of the package substrate.

In addition, the head part 120 may be formed on the flange part 122 and the flange part 122 formed at one end of the connection pin 110 and may have a multi-layered protrusion 124.

Here, the multi-layered shape may mean that it is composed of several layers, and for example, it may mean a structure formed in a stepped shape.

At this time, the diameter of the flange portion 122 may be formed to a diameter larger than the diameter of the protrusion 124 protruding in a hemispherical shape on the lower surface. Therefore, when the head part 120 is bonded to the pad part 20, the solder paste 40 flows into the space between the lower surface of the flange part 122 and the outer circumferential surface of the protrusion part 124, and the upper surface of the flange part 122. The outflow may be prevented due to the difference in diameter.

As illustrated in FIG. 3, the protrusion 124 may include a flat portion 124a having a flat end portion and a round portion 124b formed on the flat portion 124a.

At this time, the interface between the flat portion 124a and the round portion 124b may be formed in the same size, but is not limited thereto.

Accordingly, the protrusion 124 of the lead pin 100 is in contact with the solder paste as a whole to increase the contact area, thereby increasing the bonding strength thereof.

In addition, the flange portion 122 and the protrusion 124 constituting the head portion 120 may be formed at different heights, the central portion of the flat portion 124 formed with a predetermined curvature compared to the height of the flange portion 122 The height can be made larger.

The fence portion 130 is formed on the bottom surface of the flange portion 122 so as to be located outside the protrusion 124, and specifically, may be formed at the corner side of the flange portion 122. In this case, the length of the fence portion 130 in the longitudinal direction may be determined according to the difference in diameter between the flange portion 122 and the protrusion 124.

In addition, the fence part 130 may protrude in a tapered shape toward the outer edge of the flange part 122. Accordingly, the height of the edge side of the flange portion 122 is increased by the fence portion 130, and the solder paste 40 may be prevented from flowing to the upper surface of the head portion 120.

In this case, the angle α in which the fence unit 130 is inclined may be in a range of 0 to 45 degrees. Here, when the angle of the fence portion 130 is 45 degrees or more, the solder paste 40 does not block the flow path, but rather enters the solder paste 40 and the solder paste 40 rather than the head portion 120. Will move to the phase of. Therefore, the fence unit 130 is most preferably formed within the above angle.

However, in this embodiment, the fence unit 130 is not limited to being formed to be inclined at an angle, and the cross section may be formed in a quadrangle, semicircle, or polygonal shape according to a designer's intention.

Here, the method of manufacturing the fence portion 130 is to form a groove by processing a portion adjacent to the protrusion 130 is formed so as to protrude to the outside.

In addition, the fence portion 130 and the protrusion 124 may be provided so that the end is connected to each other. In this case, the portion where the fence portion 130 and the protrusion 124 are connected to each other may be provided to be rounded.

Therefore, the semiconductor package and the lead pins for the semiconductor package according to the present exemplary embodiment may prevent the solder paste from flowing to cover the upper portion of the head portion 120 by the fence portion 130 to prevent contamination of the connection pins. .

Figure 4 is a side view for explaining the planar portion and the fence portion in the lead pin according to another embodiment of the present invention.

Referring to FIG. 4, the lead pin 200 may include a connection pin 210, a head portion 220, and a fence portion 230.

Here, the connection pin 210 and the fence portion 230 of the present embodiment is substantially the same as the configuration of the previous embodiment and the detailed description thereof can be omitted.

The head portion 220 includes a protrusion 224, the protrusion 224 is shown in Figure 4, the first flat portion 224a and the first flat portion 224a having a flat end surface, as shown in FIG. It may include a second planar portion (224b) formed on the.

In this case, the fence portion 230 may be formed on the flange portion 222 so as to be spaced apart from the protrusion 224. Here, the fence portion 230 and the protrusion 224 may be formed to be connected to each other, and the fence portion 230 and the protrusion 224 may be formed to be spaced apart from each other by processing a portion adjacent to the protrusion 224. .

Therefore, the protrusion 224 of the lead pin is in contact with the solder paste as a whole to increase the contact area, thereby increasing the bonding strength.

1 is a side cross-sectional view illustrating a semiconductor package according to an embodiment of the present invention.

FIG. 2 is a partial cross-sectional view illustrating that the lead pin of FIG. 1 is mounted on a substrate.

3 is a side view illustrating a lead pin mounted to a semiconductor package according to an embodiment of the present invention.

Figure 4 is a side view for explaining the planar portion and the fence portion in the lead pin according to another embodiment of the present invention.

Explanation of symbols on the main parts of the drawings

110, 210 .... Connection pin 120, 220 .... Head part

122, 222 .... Flange 124, 224 .... Protrusion

130, 230 .... fence 10 .... solder resist

20 .... Pad

Claims (10)

A connection pin for insertion into a hole formed in an external device; A head portion formed at one end of the connection pin and a head portion formed on the flange portion and having a multi-layered protrusion; And A fence portion protruding toward the package substrate at an edge of the flange portion when the head portion is mounted on the package substrate to block solder paste from flowing upwardly of the head portion; Including, A lead pin for a semiconductor package having a diameter of the flange portion larger than a diameter of the protrusion portion. The method of claim 1, The protrusion, And a flat surface first flat portion formed on the flange portion and a flat surface second flat portion formed on the first flat portion. The method of claim 1, The protrusion, And a flat portion having a flat shape formed on the flange portion and a round portion formed on the flat portion. The method of claim 3, The planar portion and the fence portion is a lead pin for a semiconductor package, characterized in that the ends are formed in contact with each other. The method of claim 3, The planar portion and the fence portion is a lead pin for a semiconductor package, characterized in that the ends are formed to be spaced apart from each other. A substrate portion having a pad portion formed on one surface thereof; And A head portion having a connection pin for insertion into a hole formed in an external device, a flange portion formed at one end of the connection pin, and a multi-layered protrusion formed on the flange portion, and the head portion on a package substrate. A lead pin which includes a fence portion protruding toward a package substrate at an edge of the flange portion to block solder paste from flowing upward when the solder paste is mounted, and is electrically connected to the pad portion; Including, And a diameter of the flange portion is larger than a diameter of the protrusion. The method of claim 6, The protrusion, And a first planar portion having a flat shape formed on the flange portion, and a second planar portion having a flat shape formed on the first plane portion. delete The method of claim 6, The protrusion, And a flat portion having a flat shape formed on the flange portion and a round portion formed on the flat portion. 10. The method of claim 9, And the planar portion and the fence portion are formed so that their ends are spaced apart from each other.

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