KR101099428B1 - Manufacturing method of light emitting diode module - Google Patents

Manufacturing method of light emitting diode module Download PDF

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Publication number
KR101099428B1
KR101099428B1 KR1020090066750A KR20090066750A KR101099428B1 KR 101099428 B1 KR101099428 B1 KR 101099428B1 KR 1020090066750 A KR1020090066750 A KR 1020090066750A KR 20090066750 A KR20090066750 A KR 20090066750A KR 101099428 B1 KR101099428 B1 KR 101099428B1
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KR
South Korea
Prior art keywords
fluorescent
molding
manufacturing
led
mask
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KR1020090066750A
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Korean (ko)
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KR20100021967A (en
Inventor
이동주
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이익주
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

In order to reduce manufacturing cost and shorten the manufacturing time, prepare a module board with pockets and wirings, mount LED chips in each pocket of the module board, and connect electrodes and wiring of the mounted LED chips with bonding wires. And installing a mask in which application holes are formed at positions corresponding to each pocket on the upper surface of the module substrate, and spraying fine fluorescent powder into each pocket using a spray gun to mold the LED chip. It provides an LED module manufacturing method.

LED, LED, Manufacturing, Molding, Fluorescent, Spray, Coating, Module, Fluorescent Powder

Description

Manufacturing method of LED module {Manufacturing method of light emitting diode module}

The present invention relates to a method for manufacturing an LED module, and more particularly, to a method for manufacturing an LED module which reduces the manufacturing cost and shortens the manufacturing time by mounting an LED chip on a module substrate having a pocket and molding.

In general, LED (LED) is also referred to as a light emitting diode, and is a kind of semiconductor light emitting device that uses the principle that the electrons in the N-type and the P-type holes emit light when the forward current flows through the PN junction.

Recently, in order to take advantage of LED's low power characteristics, it is used for various purposes, such as lighting, backlighting, billboards.

In Korean Patent Publication No. 10-0755612, the LED chip is molded into a dome shape with a resin, and a phosphor-containing coating is applied to the surface of the resin molding part by a spray coating method to form a thin film of a phosphor, so that the LED is scanned to emit light of a specific color. Methods for preparing the same are disclosed.

In the LED manufacturing method, since the molding part is formed in a dome shape and spray-coated a phosphor-containing coating agent, there is a problem in that the content of the fluorescent substance must be reduced in the coating agent for smooth spraying, and the production time is long. In addition, when the molding part is formed in a dome shape, the surface may be bent due to surface curvature or scattering.

In Patent Publication No. 10-0733198, a mounting support portion is fixedly installed around an LED chip, and a fluorescent treatment is performed by spraying fluorescent gelatin (manufactured by mixing fluorescent powder and gelatin) using a nozzle inside the loading support portion to perform molding process. Methods of making are disclosed.

In the case of the LED manufacturing method, since the individual LED chip unit is manufactured, it takes a lot of time for the individual molding, there is a problem that the productivity is bad, the coating surface is not uniform.

The present invention has been made in view of the above point, and is manufactured by mounting the LED chip on the module substrate with a pocket formed by molding, thereby providing an LED module manufacturing method that can reduce the manufacturing cost and shorten the manufacturing time, The purpose is.

In the LED module manufacturing method proposed by the present invention, a module substrate having pockets and wirings is prepared, the LED chips are mounted in each pocket of the module substrate, and then the electrodes and wiring of the mounted LED chips are connected with bonding wires, and sprayed. The method includes molding a LED chip by applying a fine fluorescent powder into each pocket by using a coating device such as a spray gun or a pressurized squeeze. In this case, after the bonding wire connection step, molding may be performed with or without installing a mask having respective application holes formed at positions corresponding to each pocket on the upper surface of the module substrate.

The present invention prepares a module substrate in which pockets and wiring are formed,

After mounting LED chip in each pocket of module board, connect electrode and wiring of mounted LED chip with bonding wire,

The present invention provides a method of manufacturing an LED module, which includes molding a fluorescent chip by spraying fine fluorescent powder into each pocket.

In addition, the present invention is characterized in that after the bonding wire connecting step to install a mask that is formed in each of the application hole corresponding to each pocket on the upper surface of the module substrate after the fine fluorescence powder injection and molding step of the LED It provides a module manufacturing method.

In the present invention, in the step of installing the mask, a mesh mask or a stencil mask having an opening is installed on the upper surface of the module substrate,

The molding step provides an LED module manufacturing method for molding an LED chip by pressing a fluorescent molding liquid mixed with a fluorescent material and a liquid resin supplied in a predetermined ratio with a squeeze.

In the present invention, in the step of installing the mask, a mesh mask or a stencil mask having an opening is installed on the upper surface of the module substrate,

In the molding, the LED module manufacturing method may be performed by molding a LED chip by applying a squeeze to a fluorescent molding solution in which a fluorescent material and a liquid resin are mixed at a predetermined ratio.

In addition, the present invention is a method for manufacturing an LED module for molding the LED chip by spraying the fluorescent molding solution using a spray gun injected with a fluorescent molding solution in which a fluorescent material and a liquid resin is mixed at a predetermined ratio in the molding step. To provide.

In addition, the present invention is to manufacture the LED module for stirring the fluorescent molding liquid by installing a stirring body inside the fluorescent molding liquid container in the step of performing the molding, and by applying rotational force of forward and reverse rotation to the stirring body alternately. Provide a method.

In addition, the present invention provides an LED module manufacturing method for agitating the fluorescent molding liquid by applying a vibration by installing a vibrating device in the coating device or the fluorescent molding liquid container for applying the fluorescent molding liquid in the molding step. .

More preferably, when a plurality of small beads are put together with the fluorescent molding liquid into the fluorescent molding liquid container and subjected to vibration, the fluorescent molding liquid is more smoothly mixed.

In addition, in the molding step in the present invention, the magnetic compact bead in the fluorescent molding liquid container; and the magnet is installed on the upper, lower or side of the fluorescent molding liquid container to act on the magnetic small beads; In accordance with the rapid movement of the magnetic compact beads in the fluorescent molding liquid container to be moved together to induce a mixing operation of the fluorescent molding liquid to provide an LED module manufacturing method for stirring.

In addition, the present invention provides an LED module manufacturing method for improving the omission of the fluorescent molding liquid by applying a vibration device to the mask by applying a vibration.

According to the LED module manufacturing method according to the present invention, the LED module is manufactured by mounting the LED chip on the module substrate with a pocket and then molding, thereby making the LED module easy to manufacture and greatly shortening the manufacturing time, thereby improving productivity and reducing manufacturing costs. It is possible to.

And according to the LED module manufacturing method according to the present invention, as the fluorescent powder is applied to the surface of the LED chip thinly formed by spraying the fine fluorescent powder to form a moisture on the glass surface, it is possible to reduce the consumption of the fluorescent powder As a result, a uniform surface can be obtained, which minimizes light refraction and scattering.

Next, a preferred embodiment of the LED module manufacturing method according to the present invention will be described in detail with reference to the drawings.

First, an embodiment of the LED module manufacturing method according to the present invention, as shown in Figures 1 and 2, the preparation step (S10) for preparing the module substrate 10, the mounting step for mounting the LED chip 20 (S20) ), A mask installation step (S30) for installing the mask 30, and a molding step (S40) for molding the LED chip 20.

In the preparatory step (S10), the pocket 12 is arranged in a predetermined pattern (a pattern to be used by mounting the LED chip 20 on the plate-shaped module substrate 10, for example, an illumination pattern or an advertisement signboard pattern, etc.). To form.

The pocket 12 can be formed by removing a part of the module substrate 10 concave or by forming another member on the module substrate 10 like a wall.

The pockets 12 are partitioned into their respective spaces through partition walls 13.

In the preparation step S10, a wire 14 for supplying power to the LED chip 20 mounted on the bottom surface of each pocket 12 of the module substrate 10 is formed.

In the mounting step (S20), the LED chip 20 is mounted in each pocket 12 of the module substrate 10, and then the electrode 22 and the wiring 14 of the mounted LED chip 20 are bonded to the wires. Connect with (28).

In the mask installation step (S30), the mask 30 is formed on the upper surface of the module substrate 10, the application hole 32 is formed in each position corresponding to each pocket 12.

The application hole 32 is formed in accordance with the pattern of the pocket 12 of the module substrate 10. For example, the application hole 32 is formed in a predetermined pattern corresponding to molding the LED chip 20 mounted in the pocket 12 effectively.

In the molding step (S40) by using a spray gun 48 or a coating device such as a pressure squeeze by applying a method such as spraying the fine fluorescent powder 42 into each pocket 12 to the LED chip 20 Molding is performed.

When the fine fluorescent powder 42 is applied using a spray gun 48 or a coating device such as a pressurized squeeze as described above, the fluorescent molding 42 is made to be thin on the surface of the LED chip 20. Layer 40 is formed.

The fine fluorescent powder 42 applied through the spray gun 48 or a coating device such as a pressurized squeeze is naturally applied to the surface of the LED chip 20 in a minute amount as if moisture forms on the glass.

As shown in FIG. 3, in the molding step S40, the mask 31 is installed while being spaced from the upper surface of the module substrate 10, and the fluorescent molding liquid 43 supplied above the mask 31 is provided. By pressurizing using the pressurizing squeeze 49, it is also possible to comprise the fluorescent molding liquid 43 to be applied through the application hole 32.

In the molding step S40, as shown in FIG. 4, the mask 31 is installed while being spaced from the upper surface of the module substrate 10, and the fluorescent molding liquid 43 is pumped (not shown). It is also possible to configure the fluorescent molding liquid 43 to be applied through the application hole 32 of the mask 31 by the pressure injection using the nozzle 47 connected to the ().

In the case of the nozzle 47, it is preferable that the shape of the discharge port is formed in a horizontally open shape rather than a circular shape because the application of the fluorescent molding liquid 43 is more smoothly performed.

In the case of coating using the squeeze 49 and the nozzle 47 connected to the pump as described above, although not shown in the drawing, the application hole 32 formed in the mask 31 is formed into a mesh shape (net shape). Even if the fluorescent molding liquid 43 is pressed against the mask 31 through the squeeze 49 or the nozzle 47, a large amount of the fluorescent molding liquid 43 does not pass through the application hole 32 at one time. It is preferable as it is. When a large amount of fluorescent molding liquid 43 passes through the coating hole 32 at once, not only the coating of the fluorescent molding liquid 43 is uniformly applied, but also a part that is not partially applied may occur. There is a concern that the consumption of the fluorescent molding liquid 43 increases. In addition to the mesh mask 31, an stencil having an opening may be used as a mask.

The fluorescent molding solution 43 is used by mixing a fluorescent material and a solution (liquid resin) such as silicon or epoxy at a predetermined ratio.

It is also possible to apply the fluorescent molding liquid 43 using the spray gun 48.

As described above, when the fluorescent molding liquid 43 is applied using the spray gun 48, the mixing ratio of the fluorescent molding liquid 43 inside the spray gun 48 is continuously stirred to prevent unevenness. You need to do

For example, as shown in FIG. 5, the fluorescent substance and silicon contained in the fluorescent molding liquid 43 are provided by installing the stirring body 45 inside the spray gun 48 for apply | coating the fluorescent molding liquid 43. FIG. It is preferable to keep the mixing ratio of solutions (liquid resin) such as epoxy and epoxy uniformly.

That is, the magnetic stirring body 45 is inserted into the spray gun 48, and the direction of magnetic force is alternately changed and applied to the stirring body 45 by rotating the magnetic force outside the spray gun 48. It is also possible to perform the stirring of the fluorescent molding liquid 43 by alternately rotating the rotational force of.

Alternatively, the fluorescent molding liquid 43 may be agitated by rotating or moving the stirring body 45 inside the spray gun 48 up or down using a motor or a cylinder.

As shown in FIG. 6, the spray gun 48 is connected to the vibrator 46 such as an ultrasonic vibrating body or attached to the outside to apply the vibration to the spray gun 48 to thereby generate the fluorescent molding liquid 43. It is also possible to comprise so that stirring may be performed.

The vibrator may be used for the purpose of uniformly mixing the fluorescent molding liquid or improving the omission of the fluorescent molding liquid by attaching or connecting to a fluorescent molding liquid container or a mask as well as a coating device such as a spray gun 48.

When the fluorescent molding solution 43 is applied as described above, it is possible to minimize the amount of the discarded solution, it is possible to reduce the manufacturing cost.

In the above, a preferred embodiment of the LED module manufacturing method according to the present invention has been described, but the present invention is not limited thereto, and various modifications can be made within the scope of the claims and the detailed description of the invention and the accompanying drawings. This also belongs to the scope of the present invention.

1 is a block diagram showing an embodiment of an LED module manufacturing method according to the present invention.

2 is a process chart showing an embodiment of an LED module manufacturing method according to the present invention.

3 is a cross-sectional view showing a state of molding using a squeegee in another embodiment of the LED module manufacturing method according to the present invention.

Figure 4 is a cross-sectional view showing a state of molding by using a nozzle connected to the pump in another embodiment of the LED module manufacturing method according to the present invention.

5 is a cross-sectional view showing a state in which a stirring body is installed in the spray gun in another embodiment of the LED module manufacturing method according to the present invention.

6 is a perspective view showing a state in which a vibrator is installed in the spray gun in another embodiment of the LED module manufacturing method according to the present invention.

Claims (11)

Prepare a module board with pockets and wiring, After mounting LED chip in each pocket of module board, connect electrode and wiring of mounted LED chip with bonding wire, LED module manufacturing method comprising the step of molding the LED chip by spraying the fine fluorescent powder into each pocket. The method according to claim 1, After the bonding wire connection step of the LED module manufacturing method characterized in that the fine fluorescence powder injection and molding step after the mask is formed on each of the upper surface of the module substrate to form a coating hole is formed in the position corresponding to each pocket. The method according to claim 2, In the installing of the mask, a mesh mask or a stencil mask having an opening is installed on the upper surface of the module substrate. In the molding step, the LED module manufacturing method for molding the LED chip by pressing a fluorescent molding liquid mixed with a fluorescent material and a liquid resin supplied in a predetermined ratio by a squeeze. The method according to claim 2, In the installing of the mask, a mesh mask or a stencil mask having an opening is installed on the upper surface of the module substrate. In the molding step, the LED module manufacturing method for molding the LED chip by using a nozzle connected to the pump a fluorescent molding liquid mixed with a fluorescent material and a liquid resin supplied in the upper portion of the mask at a constant ratio. The method according to claim 1, In the molding step, the LED module manufacturing method for molding the LED chip by applying a squeeze a fluorescent molding liquid mixed with a fluorescent material and a liquid resin in a predetermined ratio. The method according to claim 1, And molding the LED chip by spraying the fluorescent molding liquid using a spray gun in which the fluorescent molding liquid in which the fluorescent substance and the liquid resin are mixed at a predetermined ratio is injected. The method according to claim 1, The method of manufacturing an LED module for stirring the fluorescent molding liquid by applying a vibration by applying a vibration device to the coating device or the fluorescent molding liquid container for applying the fluorescent molding liquid in the molding step. The method of claim 7, The method of manufacturing an LED module for stirring the fluorescent molding liquid by putting a small beads in the fluorescent molding liquid container and applying vibration to the fluorescent molding liquid container. The method according to claim 1, The method of manufacturing an LED module for installing the stirring body in the fluorescent molding liquid container in the step of performing the molding, and stirring the fluorescent molding liquid by alternately repeatedly applying the rotation force of the forward and reverse rotation to the stirring body. The method according to claim 2, LED module manufacturing method for improving the omission of the fluorescent molding liquid by applying a vibrating device to the mask. The method according to claim 1, In the molding, the magnetic small beads in the fluorescent molding liquid container; And a fluorescent molding liquid that is installed on the upper, lower, or side surface of the fluorescent molding liquid container, and has a magnet for acting on the magnetic small beads to move the magnetic small beads in the fluorescent molding liquid container as the magnetic particles move rapidly. LED module manufacturing method characterized in that the mixing by inducing the mixing operation.
KR1020090066750A 2009-04-06 2009-07-22 Manufacturing method of light emitting diode module KR101099428B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20090029247 2009-04-06
KR1020090029247 2009-04-06

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KR20100021967A KR20100021967A (en) 2010-02-26
KR101099428B1 true KR101099428B1 (en) 2011-12-28

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190087774A (en) * 2018-01-17 2019-07-25 주식회사 루멘스 Micro led module and method for makignt the same

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101547572B1 (en) 2013-11-07 2015-08-27 자화전자(주) Linear vibration generating device
TWI720785B (en) * 2020-01-15 2021-03-01 東貝光電科技股份有限公司 Micro led light emitting device and manufacturing method thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100862532B1 (en) 2007-03-13 2008-10-09 삼성전기주식회사 Method of manufacturing light emitting diode package

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100862532B1 (en) 2007-03-13 2008-10-09 삼성전기주식회사 Method of manufacturing light emitting diode package

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190087774A (en) * 2018-01-17 2019-07-25 주식회사 루멘스 Micro led module and method for makignt the same
KR102519737B1 (en) 2018-01-17 2023-04-11 주식회사 루멘스 Micro led module and method for makignt the same

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