KR101085537B1 - Led apparatus - Google Patents

Abstract

The present invention relates to a light emitting diode device, and more particularly to a light emitting diode device having a heat radiation structure with improved heat dissipation performance.

A light emitting diode device according to the present invention comprises: a substrate having one or more through holes; A heat sink having a base and at least one heat dissipation protrusion protruding upward from the base; And a light emitting diode chip mounted on an upper surface of the heat dissipation protrusion, wherein the heat dissipation protrusion of the heat dissipation plate is inserted into a through hole of the substrate, and a hollow part is formed inside the heat dissipation protrusion, and the top surface of the heat dissipation protrusion is closed. The lower portion of the heat dissipation protrusion is characterized in that the open.

Light emitting diode, heat sink, heat radiating protrusion, through hole, hollow part

Description

Light Emitting Diode Device {LED APPARATUS}

The present invention relates to a light emitting diode device, and more particularly to a light emitting diode device having a heat radiation structure with improved heat dissipation performance.

As is well known, a light emitting diode (LED) is a semiconductor device that generates a small number of carriers (electrons or holes) injected using a PN junction structure of a semiconductor and emits light energy by recombination thereof. Compared with the conventional light source, it is small and has a long lifespan, and the electrical energy is directly converted into light energy, so the luminous efficiency is high. It is widely used in lighting devices and card readers.

In order to apply to such a display device and a lighting device, a light emitting diode device such as a light emitting diode package and a light emitting diode module having various structures, which are easily mounted and used therein, has been developed. In particular, since the light emitting diode chip has a high luminous efficiency, the amount of heat is also considerable. Therefore, the light emitting diode device must be provided with heat dissipation means capable of dissipating heat from the chip to the outside.

If the heat dissipation means is not provided in the light emitting diode device as described above, the temperature of the light emitting diode chip becomes too high, resulting in deterioration of the chip itself or the packaging resin, resulting in lowering the luminous efficiency and shortening the life of the chip.

On the other hand, the conventional light emitting diode device forms a plurality of through-holes on one side of the circuit board on which the light-emitting diode chip is installed, and each through-hole has a heat dissipation structure that is coupled by joining or riveting after inserting a cylindrical heat dissipation fin. Has been adopted.

However, such a conventional light emitting diode device is not only very disadvantageous in terms of process management due to its complicated and difficult work process in implementing the heat dissipation structure, but also its heat dissipation performance and luminous efficiency are low, and in particular, its manufacturing cost is increased. There were disadvantages that resulted.

The present invention has been made in view of the above-mentioned, it is possible to greatly simplify the work process of the heat dissipation structure, significantly improve the heat dissipation performance and luminous efficiency, and can significantly reduce the manufacturing cost of the light emitting diode module The purpose is to provide.

The light emitting diode device of the present invention for achieving the above object,

A substrate having one or more through holes;

A heat sink having a base and at least one heat dissipation protrusion protruding upward from the base; And

And a light emitting diode chip mounted on an upper surface of the heat dissipation protrusion.

The heat dissipation protrusion of the heat dissipation plate is inserted into a through hole of the substrate, and a hollow part is formed in the heat dissipation protrusion, and the upper surface of the heat dissipation protrusion is closed, and the lower part of the heat dissipation protrusion is open.

The base of the heat sink is characterized in that the plurality of heat dissipation protrusions are continuous and spaced apart in the longitudinal direction of the base.

A plurality of cutouts are formed in the base of the heat sink, and the plurality of cutouts may be disposed between the plurality of heat dissipation protrusions.

At least one fastening part is formed in the base of the heat sink adjacent to the heat dissipation protrusion, and the fastening part is fastened to the substrate side.

An adhesive part is interposed between the heat sink and the substrate in contact with each other.

The heat sink is composed of a pair of left and right split heat sink,

Each of the divided heat sinks includes a base and a heat dissipation protrusion protruding integrally on an upper surface of the base, and the pair of divided heat sinks are installed on the substrate side in a state spaced apart from each other.

The base of each of the divided heat sinks is characterized in that the plurality of heat dissipation protrusions are continuous and spaced apart in the longitudinal direction of the base.

A flip chip type light emitting diode chip is disposed across the upper surface of the pair of divided heat sinks.

An insulating layer is formed on a lower surface of the base of the split heat sink.

A reflector is disposed on an upper surface of the substrate to surround the light emitting diode chip.

The reflector has an inclined reflective side wall portion and a horizontal flat portion extending in the outer diameter direction from the lower end of the reflective side wall portion, wherein the horizontal flat portion is attached to the upper surface of the substrate.

According to the present invention as described above, since the heat sink is formed integrally with the heat sink is inserted into the through-hole of the substrate, the work process of the heat dissipation structure can be made very simple, greatly improving the heat dissipation performance to luminous efficiency. Rather, there is an advantage that can significantly reduce the manufacturing cost.

In addition, the present invention has the advantage that the total weight of the light emitting diode device can be reduced as the hollow portion is formed inside the heat dissipation protrusion.

In addition, the present invention has the advantage that can be applied to various types of light emitting diode chip, such as die bonding type, wire bonding type, as well as flip chip type light emitting diode chip.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 to 2 show a light emitting diode device according to a first embodiment of the present invention.

As shown in FIG. 2, the light emitting diode device according to the present invention includes a substrate 11 having at least one through hole 11a and at least one heat dissipation protrusion 15b inserted into the through hole 11a of the substrate 11. And a heat sink 15 having at least one light emitting diode chip 18 mounted on an upper surface of the heat radiating protrusion 15b of the heat sink 15, and a reflector 21 disposed around the light emitting diode chip 18.

The substrate 11 may be formed of an insulating material such as ceramic, and the like, and various circuit patterns including electrodes, resistors, etc. may be formed on the top surface of the substrate 11 according to the first embodiment.

The substrate 11 may be formed by penetrating one or more through holes 11a up and down, and the heat dissipation structure is installed in the through holes 11a.

The heat sink 15 is made of a metal material having good thermal conductivity, and has a flat base 15a and at least one heat dissipation protrusion 15b integrally formed on the base 15a, as shown in FIG. 15b protrudes in the upper direction of the base 15a, and the upper surface of the heat dissipation protrusion 15b is formed in a closed shape. The heat dissipation protrusion 15b is inserted into the through hole 11a of the substrate 11, and in particular, the heat dissipation protrusion 15b of the heat dissipation plate 15 is processed through dip drawing or the like, and thus the heat dissipation protrusion 15b is provided. Inside the hollow portion 15c is formed, the lower portion of the hollow portion 15c may be formed in an open structure. Meanwhile, although the heat dissipation protrusion 15b is shown in a cylindrical shape on the drawing, the heat dissipation protrusion 15b of the present invention is not limited thereto and may protrude in various other shapes.

The heat dissipation protrusion 15b of the heat dissipation plate 15 may be coupled in such a manner that the heat dissipation protrusion 15b of the heat dissipation plate 15 is inserted into the through hole 11a of the substrate 11, so that the base 15a of the heat dissipation plate 15 is the bottom of the substrate 11. In close contact with the heat dissipation protrusion 15b of the heat dissipation plate 15 may be in close contact with the through hole 11a of the substrate 11. Meanwhile, an insulating layer (see FIGS. 14 and 15) may be formed on the lower surface of the base 15a of the heat sink 15 to secure external insulation.

1 and 2, one or more fastening portions 16 may be integrally formed through a deep drawing process or the like around the heat dissipation protrusion 15b of the heat dissipation plate 15. In response to 16, one or more fastening holes 11b may be formed in the substrate 11. Thus, the fastening portion 16 of the heat sink 15 is fastened to the fastening hole (11b) side of the substrate 11, the heat sink 15 can be firmly coupled to the substrate (11) side. For example, an elastic clip 16a is formed at an end portion of the fastening portion 16, and the fastening portion 16 is elastically supported in the fastening hole 11b of the substrate 11 by the elastic clip 16a. It can be clamped to the (11) side. In addition, the elastic clip 16a may be formed in a structure that is hooked to the substrate 11 side.

Alternatively, the fastening part 16 may be coupled in a manner that is tightly fitted in the fastening hole 11b of the substrate 11, as shown in Figure 2a.

The light emitting diode chip 18 is mounted on an upper surface of the heat radiating protrusion 15b of the heat sink 15, and the light emitting diode chip 18 may be a light emitting diode chip of general die bonding or wire bonding type. 18 may be die bonded or wire bonded to the circuit pattern of the substrate 11. In addition, a phosphor 19 made of silicon may be coated on the top surface of the light emitting diode chip 18.

The heat dissipation structure according to the present invention, the heat dissipation protrusion 15b of the heat dissipation plate 15, the heat generated from the light emitting diode chip 18 as the base 15a side is integrally implemented through deep drawing, etc. It is quickly discharged to the outside through the (15b) and the base (15a), the heat dissipation performance can be improved, and the light emitting efficiency of the light emitting diode chip 18 can be improved due to the improvement of the heat dissipation performance There is this.

In particular, in the first embodiment of the present invention, due to the structure in which the hollow portion 15c of the heat dissipation protrusion 15b is empty, the heat dissipation efficiency of heat generated from the light emitting diode chip 18 may be further improved. In addition, the overall weight reduction effect of the light emitting diode device can be achieved through the hollow portion 15c of the heat sink 15.

In addition, the hollow portion 15c of the heat dissipation protrusion 15b may be filled with a filler material of an insulated or non-insulated material according to its purpose or purpose as in the following embodiments.

The reflector 21 is provided so as to surround the periphery of the light emitting diode chip 18 on the upper surface of the substrate 11, and the reflector 21 has an outer diameter at the lower end of the inclined reflection side wall portion 21a and the reflection side wall portion 21a. It has the horizontal flat part 21b extended in the direction.

On the other hand, the horizontal flat portion 21b is adhered to the upper surface of the substrate 11 through an adhesive or the like, the reflector 21 may be provided on the substrate 11 side.

Alternatively, the mounting protrusion 21d may extend below the horizontal flat portion 21b, and the mounting protrusion 21d may be fitted or hooked to the mounting hole 11d side of the substrate 11. Can be combined.

3 and 4 show a light emitting diode device according to a second embodiment of the present invention. As shown, the light emitting diode device according to the second embodiment of the present invention has a structure in which the base 15a of the heat sink 15 has a length longer than its width, and the base 15a of the heat sink 15. The plurality of heat dissipation protrusions (15b) is characterized in that formed continuously in the longitudinal direction of the base (15a). The light emitting diode chips 18 are individually mounted on the top surfaces of the heat dissipation protrusions 15b of the heat dissipation plate 15.

As described above, the second embodiment of the present invention has a plurality of light emitting diode chips 18 such as fluorescent lamps through a structure in which a plurality of heat dissipation protrusions 15b are successively spaced apart from each other at a base 15a of the heat dissipation plate 15. There is an advantage that can be easily applied to the mounted light emitting diode module.

In addition, a pair of fastening portions 16 may be formed to face each other around each of the heat dissipation protrusions 15b, and the heat dissipation plate 15 may be very easily coupled to the substrate 11 through these fastening portions 16. Can be.

5 and 6, the heat sink 15 forms a plurality of cutouts 15d and 15e on the side of the base 15a, and the plurality of cutouts 15d and 15e provide a plurality of heat radiations. It is arrange | positioned between the protrusion parts 15b. As illustrated in FIG. 5, the cutout 15d may be formed in a quadrangular shape, and as illustrated in FIG. 6, the cutout 15e may be formed in a structure having a curved surface corresponding to the shape of the heat dissipation protrusion 15b. May be By such cut-outs 15d and 15e, the heat sink 15 can obtain the weight reduction effect.

In addition, since the peripheral areas of the cutouts 15d and 15e are easily cut out of the base 15a of the heat sink 15 by the cutouts 15d and 15e, some of the light emitting diode chips 18 in the light emitting diode device. ), There is an advantage that the replacement / repair can be carried out very easily.

The rest of the configuration and operation are the same as in the first embodiment, so detailed description thereof will be omitted.

FIG. 7 is a view showing a light emitting diode device according to a third embodiment of the present invention. As shown in FIG. 7, the heat sink 15 and the substrate 11 are bonded to each other through an adhesive 17. It is characterized by.

In this manner, an adhesive 17 is interposed between the base 15a of the heat sink 15 and the bottom of the substrate 11, the heat dissipation protrusion 15b of the heat sink 15, and the through hole 11a of the substrate 11. By coupling to each other, not only the bonding force between the heat sink 15 and the substrate 11 can be strengthened, but also the airtightness or sealing property of the heat sink 15 and the substrate 11 in contact with each other can be secured. In particular, it will be desirable for the adhesive 17 to use an adhesive capable of meeting various requirements with good thermal conductivity.

On the other hand, the fluorescent substance 19 is formed on the upper surface of the light emitting diode chip 18 by applying a liquid fluorescent material such as silicon to the upper surface of the light emitting diode chip 18 and curing it. However, since the liquid fluorescent material has a relatively low viscosity, when there is a gap between the heat radiating protrusion 15b of the heat sink 15 and the through hole 11a of the substrate 11, the fluorescent material leaks into the gap. Due to the leakage of the fluorescent material, the phosphor 19 may be formed to a thickness thinner than the designed value, or the coating uniformity thereof may be lowered, resulting in poor luminous efficiency.

Thus, in the third embodiment, the adhesive 17 is disposed between the heat dissipating part 15b of the heat dissipating plate 15 and the substrate 11, in particular, between the heat dissipating protrusion 15b of the heat dissipating plate 15 and the through hole 11a of the substrate 11. ), Leakage of the fluorescent material can be prevented.

On the other hand, if the drawing process after partially cutting the predetermined area to form the heat dissipation protrusion 15b of the base 15a to make the drawing process of the heat dissipation plate 15 easier, the upper surface of the heat dissipation protrusion 15b as shown in Figs. A partial cutout 15f may be formed in the. When the cutout 15f is formed on the top surface of the heat dissipation protrusion 15b as described above, the heat dissipation protrusion 15b is partially or entirely filled in the hollow 15c of the heat dissipation protrusion 15b as shown in FIG. 9. The top surface of the heat dissipation protrusion 15b may be flattened along with closing the cutout 15f of FIG.

Since the rest of the configuration and operation are the same as those of the first and second embodiments, detailed description thereof will be omitted.

10 to 12 show a light emitting diode device according to a fourth embodiment of the present invention.

As shown, the heat sink according to the fourth embodiment includes a left and right pair of split heat sinks 25 and 35, and each split heat sink 25 and 35 has a base 25a and 35a and a base 25a and 35a. The heat dissipation protrusions 25b and 35b are formed on the upper surface of the top surface), and the connection portions 25c and 35c are formed around the heat dissipation protrusions 25b and 35b of the divided heat dissipation plates 25 and 35, respectively. The divided heat sinks 25 and 35 are spaced apart from each other, and the heat dissipation protrusions 25b and 35b of the divided heat sinks 25 and 35 are spaced apart from the through holes 11a of the substrate 11. .

As described above, according to the fourth embodiment, since the split heat sinks 25 and 35 are configured to be spaced apart from each other on the substrate 11 side, the flip chip type light emitting diode chip 18 may be easily mounted. .

The flip chip type light emitting diode chip 18 has a structure in which a sapphire 18a is formed at an upper portion thereof, and a positive electrode 18b and a negative electrode 18c are formed at a lower portion thereof. Each of the positive electrode 18b and the negative electrode 18c of (18) may be individually connected to the heat radiating protrusions 25b and 35b of each of the divided heat sinks 25 and 35, which are spaced apart from each other.

A pair of via holes 11h and 11k are formed around the through hole 11a of the substrate 11, and the connection portions 25c and 35c of each of the divided heat sinks 25 and 35 are each via holes 11h and 11k. In the via holes 11h and 11k, the soldering portions 11f and 11g are formed so as to be connected to the connection portions 25c and 35c of the divided heat sinks 25 and 35, respectively.

The positive electrode pattern 41 is formed on one side of the upper edge of the substrate 11, the negative electrode pattern 42 is formed on the opposite edge of the positive electrode pattern 41, and the soldering part 11f is formed. Is connected to the positive electrode pattern 41, and the soldering portion 11g is connected to the negative electrode pattern 42. In addition, a resistor 43 may be interposed between the soldering part 11f and the positive electrode pattern 41.

Thus, in the fourth embodiment, the flip chip type light emitting diode chip 18 is easily mounted by the split heat sinks 25 and 35, and the heat generated from the light emitting diode chip 18 is divided into the respective heat sinks 25. , 35 may be easily radiated to the outside.

The rest of the configuration and operation are the same as those of the first to third embodiments, so detailed description thereof will be omitted.

13 to 15 show a light emitting diode device according to a fifth embodiment of the present invention.

As shown, the heat sink according to the fifth embodiment includes a pair of left and right split heat sinks 25 and 35, and the bases 25a and 35a of the respective split heat sinks 25 and 35 have a width thereof. It is formed longer, a plurality of heat dissipation protrusions (25b, 35b) in the base (25a, 35a) of each of the divided heat sinks (25, 35) spaced apart in the longitudinal direction of the base (25a, 35a) is characterized in that it is formed continuously . The fastening portions 25d and 35d are separately formed adjacent to each of the heat dissipation protrusions 25b and 35b, and each of the fastening portions 25d and 35d is similar to the fastening portion 16 of the first to third embodiments. 11) is fastened to the side.

Accordingly, the heat dissipation protrusions 25b and 35b of each of the heat dissipation plates 25 and 35 are spaced apart from each other in the through-hole 11a of the substrate 11 so that the pair of heat dissipation plates 25 and 35 are on the substrate 11 side. It is installed in a separated state. In addition, flip chip type light emitting diode chips 18 are mounted on the top surfaces of the heat dissipation protrusions 25b and 35b spaced apart from each other, as in the fourth embodiment.

Meanwhile, the split heat dissipation plates 25 and 35 according to the fifth embodiment may not only perform a heat dissipation function in the same manner as in the previous embodiment, but may also function as a power supply line. In particular, since the divided heat sinks 25 and 35 are made of a conductive metal material, when the divided heat sinks 25 and 35 are individually connected to the positive and negative poles of a power supply unit (not shown), Power can be supplied to each light emitting diode chip 18. Therefore, the upper surface of the substrate 11 does not need to have a separate circuit pattern, there is an advantage that the manufacturing process is very simple as a whole.

In addition, as shown in FIG. 14, the insulating layer 55 may be formed on the lower surfaces of the bases 25a and 35a of the divided heat sinks 25 and 35 to ensure external insulation. The insulating layer 55 can ensure its insulation by applying an insulating ink (also referred to as a PSR ink) containing epoxy to the bottom surfaces of the bases 25a and 35a of the divided heat sinks 25 and 35.

In addition, as shown in FIG. 15, the insulating layer 55 includes the finishing insulating layer 55a and the divided heat sinks 25 and 35 filled in the heat dissipation protrusions 25b and 35b of the pair of divided heat sinks 25 and 35. ) May be divided into a lower insulating layer 55b attached to the lower surfaces of the bases 25a and 35a. The finishing insulating layer 55a may be made of an insulating material such as ceramic or silicon to be filled in the heat dissipation protrusions 25b and 35b of the divided heat sinks 25 and 35, and the lower insulating layer 55b may be formed by applying insulating ink. Can be formed. In this way, the application process of the lower insulating layer 55b may be further simplified by dividing it into the finish insulating layer 55a and the lower insulating layer 55b.

The insulating layer 55 may be applied not only to the lower portions of the divided heat sinks 25 and 35 of the fifth embodiment but also to the lower parts of the heat sinks 15 of the first to fourth embodiments.

The rest of the configuration and operation are the same as those of the first to fourth embodiments, so detailed description thereof will be omitted.

1 is a perspective view showing a heat sink applied to a light emitting diode device according to a first embodiment of the present invention.

2 is a cross-sectional view showing a light emitting diode device according to a first embodiment of the present invention.

2A is a cross-sectional view illustrating a modified embodiment of FIG. 2.

3 is a perspective view illustrating a heat sink applied to a light emitting diode device according to a second embodiment of the present invention.

4 is a cross-sectional view showing a light emitting diode device according to a second embodiment of the present invention.

5 and 6 are plan views showing a modified embodiment of the heat sink of FIG.

7 is a cross-sectional view showing a light emitting diode device according to a third embodiment of the present invention.

8 and 8A are perspective views illustrating a modified embodiment of the heat sink of FIG. 3.

9 is a cross-sectional view illustrating a light emitting diode device to which the heat sinks of FIGS. 8 and 8a are applied.

10 is a perspective view illustrating a heat sink applied to a light emitting diode device according to a fourth embodiment of the present invention.

11 is a cross-sectional view of a light emitting diode device according to a fourth embodiment of the present invention.

12 is a plan view showing a light emitting diode device according to a fourth embodiment of the present invention.

13 is a perspective view illustrating a heat sink applied to a light emitting diode device according to a fifth embodiment of the present invention.

14 is a cross-sectional view showing a light emitting diode device according to a fifth embodiment of the present invention.

15 is a cross-sectional view illustrating a modified embodiment of FIG. 14.

Brief description of symbols for the main parts of the drawings

11: substrate 15: heat sink

18: light emitting diode chip 21: reflector

Claims (10)

A substrate having one or more through holes; A heat sink having a base and at least one heat dissipation protrusion protruding upward from the base; And And a light emitting diode chip mounted on an upper surface of the heat dissipation protrusion. The heat dissipation protrusion of the heat dissipation plate is inserted into the through hole of the substrate, and a hollow part is formed inside the heat dissipation protrusion, the upper surface of the heat dissipation protrusion is closed, and the lower part of the heat dissipation protrusion is opened, The base of the heat sink is composed of a structure extending in length longer than its width, the base is a plurality of heat dissipation protrusions are continuous spaced apart in the longitudinal direction of the base, A plurality of cutouts are formed in the base of the heat sink, and the plurality of cutouts are disposed between the plurality of heat dissipation protrusions. delete delete The method of claim 1, At least one fastening portion is formed in the base of the heat sink adjacent to the heat dissipation protrusion, and the fastening portion is fastened to the substrate side. The method of claim 1, The light emitting diode device, characterized in that an adhesive is interposed in the contact portion of the heat sink and the substrate. A substrate having one or more through holes; A heat sink having a base and at least one heat dissipation protrusion protruding upward from the base; And And a light emitting diode chip mounted on an upper surface of the heat dissipation protrusion. The heat sink includes a pair of left and right split heat sinks, each split heat sink has a heat dissipation protrusion protruding integrally on a base and an upper surface of the base, and a connection part is formed around the heat dissipation protrusion of each split heat sink. The pair of divided heat sinks are installed in the through hole of the substrate spaced apart from each other,  A pair of via holes are formed around the through hole of the substrate, and the connection portions of the divided heat sinks are inserted into the via holes individually, and the soldering portions are formed to connect with the connection portions of the divided heat sinks in the via holes. Light emitting diode device. The method of claim 6, A light emitting diode device, characterized in that a plurality of heat dissipation protrusions are continuous to the base of each of the divided heat sinks spaced apart in the longitudinal direction of the base. 8. The method according to claim 6 or 7, A light emitting diode device, characterized in that a flip chip type light emitting diode chip is provided across the upper surface of the pair of divided heat sinks. The method of claim 6, A light emitting diode device, characterized in that an insulating layer is formed on the bottom surface of the divided heat sink. 7. The method according to claim 1 or 6, A reflector is disposed on an upper surface of the substrate to surround the light emitting diode chip. And the reflector has an inclined reflective side wall portion and a horizontal flat portion extending in an outer diameter direction from a lower end of the reflective side wall portion, wherein the horizontal flat portion is attached to an upper surface of the substrate.

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