KR101077771B1 - Semiconductor device for emitting light and method for fabricating the same - Google Patents
Semiconductor device for emitting light and method for fabricating the same Download PDFInfo
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- KR101077771B1 KR101077771B1 KR1020090084086A KR20090084086A KR101077771B1 KR 101077771 B1 KR101077771 B1 KR 101077771B1 KR 1020090084086 A KR1020090084086 A KR 1020090084086A KR 20090084086 A KR20090084086 A KR 20090084086A KR 101077771 B1 KR101077771 B1 KR 101077771B1
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Abstract
The present invention includes a semiconductor layer having a light emitting structure and an ohmic electrode having a nano dot layer, a contact layer, a reflective layer, a diffusion barrier layer, and a capping layer formed on the semiconductor layer, wherein the nano dot layer is nitrogen of the semiconductor layer. Provided are a semiconductor light emitting device formed on a polar plane and formed of at least one of Ag, Al, and Au, and a method of manufacturing the same.
In such a semiconductor light emitting device, a multi-layered ohmic electrode including a nano dot layer, a contact layer, a reflection layer, an anti-diffusion layer, and a capping layer is formed on the nitrogen polarity surface of the nitride semiconductor and has a low temperature even though it is not subjected to an additional heat treatment process. Ohmic resistance and high light reflectivity can be maintained.
Ohmic electrode, LED, light emitting element, n-type electrode, p-type electrode
Description
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor light emitting device and a method of manufacturing the same, and more particularly, to a semiconductor light emitting device having an ohmic electrode formed on a semiconductor layer of a light emitting structure for applying an external driving power source, and a manufacturing method thereof.
A light emitting diode (LED) has a long life, can be miniaturized and light in weight, has a strong light directivity and can be driven at low voltage. In addition, it is resistant to shock and vibration, requires no preheating time and complicated driving circuits, and can be packaged in various forms. In particular, the nitride-based semiconductor light emitting device has a large energy band gap, which enables light output in a wide wavelength band from the ultraviolet region to blue / red, and can achieve high efficiency and high output due to its excellent physical and chemical stability. It is getting a lot of attention. Such nitride semiconductor light emitting devices are capable of emitting white light when combined with existing red and green light emitting devices, and are expected to replace incandescent lamps, fluorescent lamps, mercury lamps and existing white lighting means in the coming years.
However, the nitride semiconductor light emitting devices developed to date are not satisfactory in terms of light output, luminous efficiency, and price, and require further performance improvement. In particular, there is still a need to further increase the low light output compared to the conventional white light source, and thus must overcome the problem of thermal stability.
Meanwhile, a general nitride semiconductor light emitting device is manufactured by forming a nitride based n-type layer, a nitride based active layer, and a nitride based p-type layer on a sapphire substrate, and placing two electrodes horizontally to apply power to the n-type layer and the p-type layer. . Such a light emitting device having a horizontal structure has an advantage of low manufacturing cost due to a relatively simple manufacturing process. However, since a sapphire substrate is used as a non-conductor and has poor thermal conductivity, high power is realized by applying a large current and thermal stability due to heat accumulation. This had the disadvantage of being degraded.
In order to overcome this disadvantage, vertical semiconductor light emitting devices and flip chip type semiconductor light emitting devices have been proposed. In this case, a reflective layer is formed on the p-type electrode so that light generated from the active layer is emitted to the outside through the n-type electrode, and a large-area current can be applied and rapid heat dissipation is possible by using a metal substrate having good thermal conductivity instead of the sapphire substrate. High output and thermal stability can be achieved. The semiconductor light emitting device having a vertical structure can increase the maximum applied current several times more than the semiconductor light emitting device having a horizontal structure, and thus, it is evaluated that high power is possible and can replace the existing white lighting means.
Meanwhile, in order to further improve the light output by injecting a high current, a large area of the semiconductor light emitting device is required. In this case, the area of the electrode, for example, the n-type electrode, is also gradually increased to improve the current diffusion characteristics during the high current injection. However, since the common n-type electrode Cr / Au or Ti / Al uses thick Cr or Ti with low reflectivity, the larger the area of the n-type electrode is, the more the portion absorbs light from the active layer. It can act as an obstacle to output improvement. Therefore, there is an urgent need for the development of an n-type ohmic electrode having low ohmic resistance and high reflectivity.
In the semiconductor light emitting device having a vertical structure, after forming a nitride semiconductor layer on a mother substrate, a p-type electrode is formed on an upper surface of the nitride semiconductor layer, that is, a gallium polarity (Ga-face), and on a p-type electrode. After attaching the auxiliary substrate, the mother substrate is separated to form an n-type electrode on the lower surface of the nitride semiconductor layer, that is, the N-face. However, unlike the Ga-face, the N-face cannot expect good ohmic properties without heat treatment, and the heat treatment itself is due to the difference in the coefficient of thermal expansion between the auxiliary substrate (metal substrate) and the nitride semiconductor layer. Nor is it easy. As described above, the conventional Cr / Au or Ti / Al structure electrode formed on the conventional nitrogen polarity (N-face) has not only poor ohmic characteristics, but also low thermal stability.
The present invention has been made to solve the above problems, and has excellent light reflectivity, and thus has low light loss due to light absorption of the electrode itself, and has excellent ohmic characteristics in terms of nitrogen polarity as well as gallium polarity of the nitride semiconductor layer. It provides a semiconductor light emitting device and a method of manufacturing the same.
A semiconductor light emitting device according to an aspect of the present invention, a semiconductor layer having a light emitting structure; An ohmic electrode having a nano dot layer, a contact layer, a reflective layer, a diffusion barrier layer, and a capping layer formed on the semiconductor layer; The nano dot layer is formed on the nitrogen polarity surface of the semiconductor layer, and formed of at least one material of Ag, Al, Au, the contact layer is Ni, Ni-Ti alloy, Ni-Al alloy , Ti-Al alloy, Mg-Al alloy, Ta, Ti, W, W-Ti alloy is formed of at least one material, the reflective layer is Al, Ag, Ag-Al alloy, Ag-Cu alloy, Ag-In Alloy, Ag-Mg alloy, Al-Cu alloy, Al-In alloy, Al-Mg alloy is formed of at least one material, the diffusion barrier layer is Ti, Cr, Ru, Pt, Ni, Pd, Ir, Rh, At least one metal layer of Nb W and W-Ti alloys or at least one oxide film of RuOx, NiOx, IrOx, RhOx, NbOx, TiOx, TaOx, CrOx, and the capping layer is formed of at least one of Au and Al. Is formed.
The nano dot layer is preferably made of nano-size Ag dots formed by depositing Ag and heat treatment in a nitrogen atmosphere. At this time, it is preferable that the nano dot layer is formed to have a thickness of 5 kPa to 50 kPa.
Preferably, the contact layer is formed of Ni, the reflective layer is made of Al, the diffusion barrier layer is made of Ti, and the capping layer is made of Au. At this time, it is preferable that the contact layer is formed to a thickness of 1 kPa to 50 kPa, and the reflective layer is formed to a thickness of 100 kPa to 8000 kPa.
The semiconductor layer includes an n-type layer, an active layer and a p-type layer, and the ohmic electrode is preferably formed on the nitrogen polarity surface of the n-type layer.
The semiconductor layer is preferably formed on the upper surface of the substrate on which a hemispherical pattern is formed.
According to another aspect of the present invention, a method of manufacturing a semiconductor light emitting device includes: forming a semiconductor layer having a light emitting structure; Forming a nano dot layer on the nitrogen polarity surface of the semiconductor layer; And forming a contact layer, a reflective layer, a diffusion barrier layer, and a capping layer on the nano dot layer. The nano dot layer is formed of at least one material of Ag, Al, Au, and the contact layer is Ni, Ni-Ti alloy, Ni-Al alloy, Ti-Al alloy, Mg-Al alloy, Ta , Ti, W, W-Ti alloy is formed of at least one material, the reflective layer is Al, Ag, Ag-Al alloy, Ag-Cu alloy, Ag-In alloy, Ag-Mg alloy, Al-Cu alloy, It is formed of at least one material of Al-In alloy, Al-Mg alloy, the diffusion barrier layer is at least one metal layer of Ti, Cr, Ru, Pt, Ni, Pd, Ir, Rh, Nb W, W-Ti alloy Or at least one oxide film of RuOx, NiOx, IrOx, RhOx, NbOx, TiOx, TaOx, CrOx, and the capping layer is formed of at least one of Au and Al.
The nano dot layer is preferably formed by depositing Ag on the nitrogen polarity surface of the semiconductor layer and heat-treating it in a nitrogen atmosphere.
Preferably, the contact layer is formed of Ni, the reflective layer is made of Al, the diffusion barrier layer is made of Ti, and the capping layer is made of Au.
The multi-layered ohmic electrode including the nano dot layer / contact layer / reflective layer / diffusion prevention layer / capping layer according to the present invention has excellent reflectivity to prevent a decrease in light output due to light absorption, and does not require additional heat treatment. Its excellent characteristics make it possible to output high currents with high current.
In particular, the multi-layered ohmic electrode including the nano dot layer / contact layer / reflective layer / diffusion prevention layer / capping layer according to the present invention is formed on the nitrogen polarity surface of the nitride semiconductor, and although not subjected to an additional heat treatment process, Ohmic resistance and high light reflectivity can be maintained. Therefore, the n-type electrode (or n-type pad) is formed on the nitrogen polarity surface of the nitride semiconductor, so that the ohmic characteristics are not good, and due to the difference in thermal expansion coefficient between the metal substrate and the nitride semiconductor, it is difficult to improve the ohmic characteristics even through heat treatment. It can be used more suitably for a semiconductor light emitting element.
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various forms, and only the embodiments are intended to complete the disclosure of the present invention, and to those skilled in the art the scope of the invention. It is provided for complete information.
In the drawings, the thickness of layers, films, panels, regions, etc., may be exaggerated for clarity, and like reference numerals designate like elements. In addition, when a part such as a layer, a film, an area, or a plate is expressed as “above” or “above” another part, each part is not only when the part is “right above” or “just above” the other part, This includes the case where there is another part between other parts.
<First Embodiment>
1 is a cross-sectional view illustrating a semiconductor light emitting device according to a first exemplary embodiment of the present invention.
Referring to FIG. 1, the semiconductor light emitting device includes a
The
The n-
The
The n-
In this case, the
The
A manufacturing process of a semiconductor light emitting device having such a configuration will be described below with reference to FIGS. 2 to 5. 2 to 5 are cross-sectional views illustrating a process of manufacturing the semiconductor light emitting device according to the first embodiment of the present invention.
Referring to FIG. 2, an n-
Referring to FIG. 3, a metal film is deposited on the
In this embodiment, a heat adhesion process is performed to attach the
Referring to FIG. 4, the
Referring to FIG. 5 again, Ag is formed on the surface of the n-
In this case, when the Ag
Then, after the formation of the n-
On the other hand, in order to determine the characteristics of the
Figure 6 is a graph showing the current-voltage characteristics of the ohmic electrode according to the experimental example and the comparative example of the present invention, line A is the current of the Ag nano dot layer / Ni / Al / Ti / Au ohmic electrode- It is a voltage graph, and B is a current-voltage graph of the Cr / Au ohmic electrode which concerns on this comparative example.
In order to know the electrical characteristics of the ohmic electrode, ohmic resistance is calculated by the TLM method proposed by Professor shottky. The TLM method obtains a resistance R T at 0V by measuring a current (I) -voltage (V) curve between two metal electrodes whose distances are divided into d 1 , d 2 , d 3 , and d 4 , respectively. After plotting the measured R T according to the distance and extrapolating, the ohmic resistance can be calculated by the following equation.
Where R T is the resistance [Ω] between the respective metal electrodes, R S is the sheet resistance [Ω] of the semiconductor layer, d is the distance between the metal electrodes, Z is the width of the metal electrode, and ρ C is the ohmic resistance. do.)
When the ohmic resistance of the ohmic electrode is calculated using the current-voltage graph of FIG. 6 and the TLM method, the Cr / Au ohmic electrode of the comparative example has an ohmic resistance of about 8.3 × 10 −5 Ωcm 2 , but this experimental example Ag nano dot layer / Ni / Al / Ti / Au ohmic electrode has ohmic resistance of 7.4 x 10 -5 Ωcm 2 to be. As described above, the Ag nano dot layer / Ni / Al / Ti / Au ohmic electrode according to the present experimental example has lower ohmic resistance than the conventional Cr / Au ohmic electrode of the present comparative example without additional heat treatment after deposition, thereby lowering the driving voltage. Can lower the power consumption.
7 is a graph showing the light reflectivity of the ohmic electrode according to the experimental example and the comparative example of the present invention, the light reflectance in the 460nm wavelength band was measured. In the graph of FIG. 7, the A line shows the light reflectivity of the Ag nano dot layer / Ni / Al / Ti / Au ohmic electrode according to the present experimental example, and the B line shows the light reflectance of the Cr / Au ohmic electrode according to the present comparative example. It is shown. In this case, the I line represents the light reflectivity of the Ag mirror as a reference line.
Referring to FIG. 7, the Cr / Au ohmic electrode according to the present comparative example shows a low light reflectivity of approximately 55% (B line), and the Ag nano dot layer / Ni / Al / Ti / Au ohmic according to the present example. The electrode shows high light reflectivity of approximately 88% (line A). Therefore, since the Ag nano dot layer / Ni / Al / Ti / Au ohmic electrode according to the present experimental example can reduce the absorption of light, the light output to the outside can be further improved.
As described above, the
≪ Embodiment 2 >
Meanwhile, the ohmic electrode of the Ag nano dot layer / Ti / Cr / Au structure applied to the semiconductor light emitting device according to the second embodiment of the present invention may be applied to a semiconductor light emitting device having a horizontal structure. In the following, as an example of such a possibility, a semiconductor light emitting device according to a second embodiment of the present invention in which n-type electrodes and p-type electrodes are horizontally disposed will be described. In this case, a description overlapping with the above-described embodiment will be omitted or briefly described.
8 is a cross-sectional view illustrating a semiconductor light emitting device according to a second exemplary embodiment of the present invention.
Referring to FIG. 8, the semiconductor light emitting device includes a
A manufacturing process of a semiconductor light emitting device having such a configuration will be described below with reference to FIGS. 9 to 11. 9 to 11 are cross-sectional views illustrating a manufacturing process of a semiconductor light emitting device according to a second exemplary embodiment of the present invention.
9, an n-
As the
As the
Referring to FIG. 10, some regions of the p-
Referring to FIG. 11, Ag nanoparticles made of nano-sized dots are formed by forming Ag thinly on the exposed n-
After the formation of the n-
Since the semiconductor light emitting device having the horizontal structure manufactured as described above, as the light generated in the
12 is a cross-sectional view illustrating a semiconductor light emitting device according to a first modified example of the present invention.
Referring to FIG. 12, in the semiconductor light emitting device, a
In the horizontal semiconductor light emitting device manufactured as described above, the light generated in the
As mentioned above, although this invention was demonstrated with reference to the above-mentioned Example and an accompanying drawing, this invention is not limited to this, It is limited by the following claims. Therefore, one of ordinary skill in the art will appreciate that the present invention can be variously modified and modified without departing from the technical spirit of the following claims.
1 is a cross-sectional view showing a semiconductor light emitting device according to a second embodiment of the present invention.
2 to 5 are cross-sectional views illustrating a process of manufacturing a semiconductor light emitting device according to a first embodiment of the present invention.
Figure 6 is a graph showing the current-voltage characteristics of the ohmic electrode according to the experimental example and the comparative example of the present invention.
7 is a graph showing the light reflectivity of the ohmic electrode according to the experimental example and the comparative example of the present invention.
8 is a cross-sectional view showing a semiconductor light emitting device according to a second embodiment of the present invention.
9 to 11 are cross-sectional views illustrating a process of manufacturing a semiconductor light emitting device according to a second embodiment of the present invention.
12 is a cross-sectional view of a semiconductor light emitting device according to a first modification of the present invention.
<Explanation of symbols for the main parts of the drawings>
110, 210: base material substrate 170: support substrate
120 and 220: semiconductor layers 121 and 221: n-type layers
122, 222:
130, 240 p-
Claims (11)
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KR1020090084086A KR101077771B1 (en) | 2009-09-07 | 2009-09-07 | Semiconductor device for emitting light and method for fabricating the same |
PCT/KR2010/006056 WO2011028076A2 (en) | 2009-09-07 | 2010-09-07 | Semiconductor light-emitting element and a production method therefor |
CN201080039812.7A CN102484185B (en) | 2009-09-07 | 2010-09-07 | Semiconductor light-emitting element and a production method therefor |
US13/394,714 US8552455B2 (en) | 2009-09-07 | 2010-09-07 | Semiconductor light-emitting diode and a production method therefor |
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