KR101077286B1 - Cooling Device and method producing the same - Google Patents

Abstract

The present invention relates to a cooling apparatus and a method of manufacturing the same for forming a side surface of a heat pipe mounted on a heat sink of a cooling apparatus in a planar manner to increase thermal conductivity by surface contact between the heat pipes, thereby improving heat dissipation efficiency.

More specifically, the present invention includes a plurality of heat pipes having side surfaces formed in a flat surface and adjacent to each other; A heat sink configured to mount the plurality of heat pipes, the heat sink configured to be in close contact with a heating element requiring cooling to absorb heat from the heating element, and to release heat absorbed through the plurality of heat pipes; It relates to a cooling device comprising a.

Heat pipe, heat sink, cooling, heat dissipation, sink pad

Description

Cooling device and method producing the same

The present invention relates to a cooling apparatus and a method of manufacturing the same for forming a side surface of a heat pipe mounted on a heat sink of a cooling apparatus in a planar manner to increase thermal conductivity by surface contact between the heat pipes, thereby improving heat dissipation efficiency.

1 is a front view and a perspective view showing a sink pad composed of a base block and a cover block of a conventional cooling device for a computer chip.

With reference to FIG. 1, the cooling apparatus which cools a computer chip is demonstrated to an example. Referring to FIG. 1, a conventional sink pad 1 includes a base block 1a in which a plurality of accommodation holes for receiving and fixing a heat pipe and a cover block 1b serving as a cover of the base block 1a are formed. It consists of. As shown in FIG. 1, a conventional heat pipe in which heat exchange and transfer of heat generated in a semiconductor chip is performed is inevitably mounted on the computer chip 5 so that the base block 1a can be mounted thereon. Due to the structural characteristics of the conventional cooling device, heat generated in the computer chip 5 is primarily transferred to the heat pipe after passing through the base block 1a.

When using a conventional cooling device for cooling a computer chip,

First, as the size of the heating element including the computer chip becomes smaller and the heat generated per unit volume increases, the heat dissipation efficiency should be improved. In the conventional cooling device, a large number of heat pipes cannot be stacked on the heating element, so the heat dissipation efficiency is low. There is a problem.

Second, since the cross-sectional shape of the heat pipe is provided in a circular shape, heat generated in the heating element is sequentially transferred to the sink pad and the heat pipe to release heat from the heat radiating part, which makes it difficult to efficiently transfer heat.

Therefore, it is urgent to develop a cooling device that can load a large number of heat pipes on a heating element and efficiently release heat generated from the heating elements through heat transfer between the heat pipes.

The present invention is to provide a cooling device that forms a side surface of the heat pipe provided in the cooling device to facilitate heat transfer between the heat pipes, and improve the heat radiation efficiency through direct contact with the heating element.

The present invention is to provide a method for manufacturing a cooling device having a heat pipe in which the side surfaces are formed in a planar contact with each other.

The present invention is a side surface 111 is formed in a flat surface contact with each other a plurality of heat pipes 110 are installed adjacently; Mounting parts 121-1 and 121-2 for mounting the plurality of heat pipes 110 are formed, are installed in close contact with the heating element 130 that requires cooling, and absorb heat from the heating element 130. A heat sink 120 releasing heat absorbed through the heat pipe 110; Characterized in that it comprises a.

In the present invention, the mounting parts 121-1 and 121-2 of the heat sink 120 are mounted to penetrate the front and rear surfaces of the heat sink 120 in the longitudinal direction so as to surround all of the circumferential surfaces of the heat pipe 110. It is characterized in that the ball (121-1).

In the present invention, the mounting portions 121-1 and 121-2 of the heat sink 120 are formed in the longitudinal direction through the front and rear surfaces of the heat sink 120, and the mounting groove 121-2 having a lower portion thereof is opened. The heat sink 120 is installed so that the open lower portion of the mounting groove 121-2 is sealed by the heat generating element 130 so that heat transfer is directly performed from the heat generating element 130 to the heat pipe 110. It is done.

On the other hand, the present invention provides a method for manufacturing a cooling device, (a) a compression processing step of compressing the side surface 111 of the heat pipe 110 in a plane; (b) a mounting step of mounting the heat pipe 110 on the mounting parts 121-1 and 121-2 of the heat sink 120; (c) injecting an adhesive solvent into the side surfaces 111 of which the plurality of heat pipes 110 are in surface contact with each other; (d) bonding the plurality of heat pipes 110 to each other by heating the heat pipes 110; Characterized in that it comprises a.

The present invention provides a method of manufacturing a cooling device, comprising: (a) a compression processing step of compressing the side surface 111 of the heat pipe 110 into a plane; (b) injecting an adhesive solvent into the side surfaces 111 of which the plurality of heat pipes 110 are in surface contact with each other; (c) a mounting step of mounting the heat pipe 110 on the mounting parts 121-1 and 121-2 of the heat sink 120; (d) bonding the plurality of heat pipes 110 to each other by heating the heat pipes 110; Characterized in that it comprises a.

The cooling device according to the present invention,

First, since the side surfaces of the heat pipes are formed in a plane so as to allow surface contact between the heat pipes, heat transfer between the heat pipes is easy, and thus the heat dissipation efficiency of the heat generated from the heating element is increased.

Second, the heat sink surrounds the circumferential surface of the heat pipe or covers only one side, so that the heat sink and the heat pipe can be directly contacted with each other according to the amount of heat generated by the heat generator, or heat can be transferred through the heat sink.

Third, since the side surface of the heat pipe is formed in a plane, and a plurality of heat pipes may be provided in close contact with each other, the heating element may be efficiently cooled even in the case of a heating element having a small volume and a large heat generation amount.

Generally, electronic devices are equipped with chip modules capable of processing a large amount of data. Examples include personal or server computers, unmanned surveillance systems to which image compression technology is applied, and mobile communication relay systems. Such a chip module is a heating element that generates a large amount of heat in the process of processing data, and may cause adverse effects such as an error of an electronic device when the heat generated by the heating element rises above a predetermined temperature. Therefore, such a heating element is provided with a cooling device for forcibly dissipating and cooling the generated heat.

The cooling device of the electronic device heating element may be classified into a heat sink type cooling device and a heat pipe type cooling device. The heat sink type cooling device typically includes a sink pad for absorbing heat generated from a heating element and a heat dissipation fin for cooling heat transferred to the sink pad. In addition, the heat pipe type cooling device is generally provided with a heat absorbing portion capable of absorbing heat of the heat generating element and a heat dissipating portion capable of dissipating the heat absorbed to the outside. Recently, in order to improve the cooling efficiency of the heating element, a combined type cooling device combining a heat exchange structure of the heat sink and the heat pipe has been developed.

Hereinafter, with reference to the drawings will be described in detail an embodiment of the present invention.

2 is a perspective view of a cooling apparatus according to the present invention, Figure 3 is a perspective view showing a state in which the heat pipe is mounted on the heat sink of the first embodiment according to the present invention, Figure 4 is a heat of the second embodiment according to the present invention The perspective view which shows the state in which a heat pipe is attached to a sink, and FIG. 5 shows the perspective view which shows an example of the state in which the heat pipe by this invention is formed in surface contact.

Referring to FIG. 2, the cooling device 100 according to the present invention may include a heat pipe 110, a heat sink 120, and a heat radiating fin 140 and a cooling fan 150 for dissipating heat. have. The cooling device 100 is a device that is in close contact with the heating element 130 to release the heat generated by the heating element 130 to cool.

Referring to FIGS. 2 and 5, the heat pipes 110 may have side surfaces 111 formed in a flat surface and may be in surface contact with each other, and a plurality of heat pipes 110 may be installed in the heat sink 120. As is well known, a heat pipe seals a working fluid inside a sealed container, and has excellent characteristics such as a simple structure, a large amount of heat transport, and no need for external power. Such heat pipes are used for heat transfer, heating, cooling and the like. In recent years, R & D has been made with high integration, high capacity, and high speed of electronic components and semiconductors of computers. This tendency also increases the density of heat generated in the device, so a heat pipe for efficiently cooling the heat is required.

To this end, in the present invention, the side surface 111 of the heat pipe 110 is formed in a plane as shown in FIGS. Conventional heat pipes are formed in a tube shape and are installed at a predetermined distance apart, or even when closely contacted, the heat pipes have a circular cross-sectional shape, thereby making point contact between the heat pipes. The heating element 130 may vary, but for example, the heat generated from the surface of the heating element 130 may not be evenly distributed and may be different for each part. In other words, a large amount of heat may be generated at a central portion on the surface of the heating element 130, and a relatively small amount of heat may be generated at both sides of the surface of the heating element 130. When the plurality of heat pipes 110 stacked on the heat generating element 130 are spaced apart from each other or in point contact, heat transfer between the heat pipes 110 is difficult, thereby effectively dissipating heat generated from the heat generating element 130. It becomes impossible. In the heat pipe 110 of the present invention, since the side surfaces 111 are formed in a plane and are in surface contact with each other, active heat transfer occurs. Therefore, there is an advantage that a rapid cooling process may be performed by moving heat between the heat pipes 110 according to the heat distribution of the heating element 130. In addition, since the heat pipes 110 according to the present invention are in surface contact with each other, compared to the heat pipes having point contact as in the past, the heat pipes having the same cross-sectional area may be relatively denser than before. have. Therefore, since the number of heat pipes to be mounted per unit area increases when the heat pipe 110 is mounted on the heat generating element 130, there is an advantage that it can be utilized even when a large amount of heat is generated or very fast cooling is required. A method of attaching the plurality of heat pipes 110 to each other will be described in a method of manufacturing a cooling device to be described later. 5A and 5B illustrate that the side surface 111 of the heat pipe 110 is formed in a flat shape, and the upper and lower surfaces of the heat pipe 110 may be formed flat or curved.

Referring to FIG. 2, the heat pipe 110 may include the heat dissipation fin 140 and the cooling fan 150. The heat dissipation fin 140 and the cooling fan 150 are for the heat pipe 110 to absorb heat from the heating element 130 or the heat sink 120 to release it. The heat pipe 110 is a medium for absorbing high temperature heat generated by the heat generating element 130 and quickly transferring the heat pipe to a low temperature portion. Therefore, the inside of the heat pipe 110 is preferably filled with a low boiling point (methanol), acetone (acetone), ammonia (ammonia) and the like. When heat generated from the heat generator 130 is transferred to the heat pipe 110, the liquefied refrigerant charged inside the heat pipe 110 is changed into a gaseous refrigerant by heat. The gaseous refrigerant filled in the heat pipe 110 transfers heat to the heat dissipation fin 140 and changes to a liquid state. The heat transferred to the heat dissipation fin 140 is forcibly cooled by the cooling fan 150 to complete the cooling process of the cooling device 100. As the heat dissipation means in the cooling device 100, the heat dissipation fins 140 and the cooling fan 150 are just one embodiment, and thus, the heat pipes 110 may emit heat absorbed in various ways. Of course, the heat dissipation means may be provided.

3 and 4, the heat sink 120 may include mounting units 121-1 and 121-2 for mounting the plurality of heat pipes 110. The heat sink 120 is installed in close contact with the heating element 130 that requires cooling, absorbs heat from the heating element 130, and transfers and absorbs heat absorbed through the plurality of heat pipes 110. Since the heat sink 120 needs to quickly absorb heat from the heating element 130, it is preferable to use a material having excellent thermal conductivity. Embodiment 1 and Embodiment 2 may be considered as an embodiment of the heat sink 120.

Example 1

The mounting parts 121-1 and 121-2 for mounting the plurality of heat pipes 110 to the heat sinks 120 surround front and rear surfaces of the heat sinks 120 so as to surround all of the circumferential surfaces of the heat pipes 110. It may be a mounting hole 121-1 penetrating the surface and formed in the longitudinal direction. That is, the heat pipe 110 is installed on the heating element 130, and may be installed surrounded by the heat sink 120. In the case of the first embodiment, the heat sink 120 may be provided as an upper block (not shown) and a lower block (not shown) to surround the circumferential surface of the heat pipe 110. The material of the upper block (not shown) and the lower block (not shown) may vary in material, but the upper block (not shown) is made of aluminum and the lower block (not shown) It is preferable that the impregnation) is made of copper. The mounting hole 121-1 may be a portion on which the heat pipe 110 is mounted, and the mounting hole 121-1 may be formed to surround a circumferential surface of the heat pipe 110. When the shape of the heat sink 120 is the same as in the first embodiment, the heat generating element 130 may be more efficient in the high heat generating element having a large amount of heat.

Example 2

The mounting parts 121-1 and 121-2 for mounting the plurality of heat pipes 110 to the heat sink 120 are formed in a longitudinal direction through the front and rear surfaces of the heat sink 120, but the lower part of the heat sink 120 is opened. It may be a mounting groove 121-2. Therefore, the heat sink 120 has no lower block (not shown) compared to the first embodiment, and the open lower portion of the mounting groove 121-2 is in close contact with the heat generating element 130, thereby generating the heat generating element. It may be installed to be sealed by the 130. Therefore, unlike Example 1, heat transfer is directly performed from the heating element 130 to the heat pipe 110. That is, the second embodiment is an embodiment in which the heat transfer medium is directly reduced by the heat transfer medium, compared with the first heat transfer method from the heat generator 130 to the heat pipe 110 via the heat sink 120. The mounting groove 121-2 surrounds only the upper surface and both side surfaces of the heat pipe 110. When the shape of the heat sink 120 is the same as that of the second embodiment, the heat generation amount of the heat generating body 130 may be more efficient in the heat generating element relatively smaller than the first embodiment.

2 to 5, the method of manufacturing the cooling device 100 is as follows.

step (a)

In order to form the side surface 111 of the heat pipe 110 in a plane, a general heat pipe having a circular cross section is introduced into a mold mold having a side surface formed in a flat shape. The side surface 111 is compressed into the heat pipe 110 having a flat surface through a side compression process of applying pressure to both sides of the mold mold.

(b) step

The heat pipe 110 compressed in the step (a) is mounted on the mounting parts 121-1 and 121-2 of the heat pipe 110.

step (c)

An adhesive solvent is injected into the side surfaces 111 in which the plurality of heat pipes 110 is in surface contact with each other. Soldering and thermal epoxy may be considered as a method of bonding the side surfaces 111 to which the plurality of heat pipes 110 are in contact with each other. Soldering includes hard soldering and soft soldering in a manner of bonding a base material without melting the base metal by using a brazing material. It refers to the operation of bonding the metal pieces of the base material by melting the lead using metal in the state of melting a separate metal or alloy having a lower melting point than that of the metal to be joined with the base metal. In this case, except for a very small portion alloyed with lead, the metal of the base metal does not melt but remains solid. Major brazes include brass lead, silver lead, silver lead, manganese lead and gold lead. Brass lead has a melting point of 740 ~ 900 ℃ as the zinc content changes to 40 ~ 70%. Silver lead adds zinc, cadmium, and tin to bring the melting point back to the silver-copper process alloy. Lead silver is an alloy of copper-nickel-zinc, usually 11-13% zinc and 42-50% nickel. Manganese lead is an alloy of copper-manganese or copper-zinc-manganese, and gold lead is a gold-silver-copper alloy having a melting point of 983 to 1,020 ° C. Zinc and cadmium are added as necessary. On the other hand, representative solder is solder, an alloy of lead-tin, and the more tin, the more expensive it is. Lead solders other than solder include lead-tin-zinc alloys, lead-cadmium, and zinc-cadmium lead, which are bonded together, and lead-tin-bismuth-based solders having lower melting points. Thermal epoxy is a type of thermosetting plastic that is resistant to water and weather changes, quickly hardens, and adheres by applying heat to an epoxy that is strong.

(d) step

An adhesive step of heating the heat pipe 110 so that the heat pipe 110 can be adhered well by the adhesive solvent injected in the step (c).

The cooling apparatus 100 may be manufactured by sequentially performing the above steps (a) to (d), and in some cases, performing the step (c) rather than the step (b) to perform the cooling apparatus 100. Can be prepared. In this case, the cooling device 100 is manufactured in the order of (a), (c), (b) and (d) steps.

The technical idea should not be interpreted as being limited to the above-described embodiment of the present invention. Various modifications may be made at the level of those skilled in the art without departing from the spirit of the invention as claimed in the claims. Therefore, such improvements and modifications fall within the protection scope of the present invention, as will be apparent to those skilled in the art.

1 is a front view and a perspective view showing a sink pad composed of a base block and a cover block of a conventional cooling device for a computer chip.

2 is a perspective view of a cooling apparatus according to the present invention;

3 is a perspective view showing a state in which a heat pipe is mounted on the heat sink of the first embodiment according to the present invention;

4 is a perspective view showing a state in which a heat pipe is mounted on the heat sink of the second embodiment according to the present invention;

5 is a perspective view showing an example of a state in which the heat pipe according to the present invention is formed in surface contact.

<Description of the symbols for the main parts of the drawings>

1: Sync Pad 1a: Base Block

1b: cover block 5: computer chip

100: cooling device 110: heat pipe

111: side 120: heat sink

121-1, 121-2: Mounting portion 121-1: Mounting hole

121-2: mounting groove 130: heating element

140: heat sink fin 150: cooling fan

Claims (5)

delete Cooling unit A heat pipe 110 having a side surface 111 formed in a flat surface such that the entirety of the side surface 111 is in contact with each other and a plurality of neighboring surfaces are installed, and an adhesive solvent is injected into the side surface 111 so as to be in surface contact with each other ; Mounting parts 121-1 and 121-2 for mounting the plurality of heat pipes 110 are formed, are installed in close contact with the heating element 130 that requires cooling, and absorb heat from the heating element 130. A heat sink 120 for dissipating heat absorbed through the heat pipe 110; and is formed by combining a heat exchange structure of the heat pipe 110 and the heat sink 120, Mounting parts 121-1 and 121-2 of the heat sink 120 Cooling apparatus characterized in that the mounting hole (121-1) penetrating the front and rear surfaces of the heat sink 120 and formed in the longitudinal direction to surround all of the circumferential surface of the heat pipe (110). Cooling unit A heat pipe 110 having a side surface 111 formed in a flat surface such that the entirety of the side surface 111 is in contact with each other and a plurality of neighboring surfaces are installed, and an adhesive solvent is injected into the side surface 111 so as to be in surface contact with each other ; Mounting parts 121-1 and 121-2 for mounting the plurality of heat pipes 110 are formed, are installed in close contact with the heating element 130 that requires cooling, and absorb heat from the heating element 130. A heat sink 120 for dissipating heat absorbed through the heat pipe 110; and is formed by combining a heat exchange structure of the heat pipe 110 and the heat sink 120, Mounting parts 121-1 and 121-2 of the heat sink 120 Is formed in the longitudinal direction through the front and rear surfaces of the heat sink 120 is a mounting groove 121-2, the lower portion is open, The heat sink 120 is installed so that the open lower portion of the mounting groove 121-2 is sealed by the heating element 130 so that heat transfer is directly performed from the heating element 130 to the heat pipe 110. Cooling system characterized in that. In the manufacturing method of the cooling apparatus as described in any one of Claims 2-3 , (a) a compression processing step of compressing the side surface 111 of the heat pipe 110 into a plane; (b) a mounting step of mounting the heat pipe 110 on the mounting parts 121-1 and 121-2 of the heat sink 120; (c) injecting an adhesive solvent into the side surfaces 111 of which the plurality of heat pipes 110 are in surface contact with each other; (d) bonding the plurality of heat pipes 110 to each other by heating the heat pipes 110; Method for producing a cooling device comprising a. In the manufacturing method of the cooling apparatus as described in any one of Claims 2-3 , (a) a compression processing step of compressing the side surface 111 of the heat pipe 110 into a plane; (b) injecting an adhesive solvent into the side surfaces 111 of which the plurality of heat pipes 110 are in surface contact with each other; (c) a mounting step of mounting the heat pipe 110 on the mounting parts 121-1 and 121-2 of the heat sink 120; (d) bonding the plurality of heat pipes 110 to each other by heating the heat pipes 110; Method for producing a cooling device comprising a.

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