KR101071270B1 - Apparatus for providing cleaning liquid - Google Patents

Abstract

The cleaning liquid supply unit communicates with a supply pump and a supply pump in which a flow path is formed, and a cleaning liquid supply unit for supplying a cleaning liquid into a storage tank, a gas supply unit communicating with a supply pump, and supplying a corrector-suppressing gas into the storage tank, inside the supply pump. And an ionization member which ionizes the gas so that the ionized gas is dissolved in the cleaning liquid flowing in the flow path to form a gas dissolving liquid, and an injection unit in communication with the supply pump to inject the gas dissolving liquid from the supply pump. Therefore, the cleaning liquid supplying unit can suppress static electricity generated when the gas dissolving liquid collides with the substrate, thereby improving the cleaning efficiency.

Description

Cleaning liquid supply unit {Apparatus for providing cleaning liquid}

The present invention relates to a cleaning liquid supply unit. More particularly, the present invention relates to a cleaning liquid supply unit for supplying a cleaning liquid onto the substrate to remove contaminants remaining on the substrate.

Generally, a semiconductor device is manufactured through the formation of an electrical circuit pattern including electrical elements on a semiconductor substrate such as a silicon wafer, and the circuit pattern is manufactured by repeatedly performing various unit processes.

The manufacturing process of the semiconductor device essentially includes a cleaning process for removing impurities generated by various contaminants such as contamination from equipment, contamination by reactants or products during the process, as well as particles generated during a unit process. Recently, the importance of the cleaning process continues to increase as the semiconductor device becomes smaller and more highly integrated, and even very small pollutants have a great effect on performance.

One of the cleaning methods for cleaning the semiconductor substrate is a physical cleaning method using a cleaning liquid. In the cleaning method using the cleaning liquid, the cleaning of the substrate is performed by spraying the cleaning liquid onto the substrate to remove impurities by the collision energy of the cleaning liquid impinging on the substrate. In particular, in order to increase the collision energy to the cleaning solution, a method of changing the cleaning solution into droplets and supplying the substrate to the substrate by mixing the cleaning solution and gas has been developed. Here, in the cleaning method using the cleaning liquid, the cleaning liquid is generally supplied to the substrate while the substrate is rotated at a constant speed.

However, as the cleaning liquid changed into the droplet form is supplied to the rotating substrate, static electricity is generated by friction of the cleaning liquid in the droplet form with the substrate. Impurity removed from the substrate by the cleaning liquid by the static electricity generated in this way has a problem of reducing the cleaning efficiency by recontaminating the substrate. In addition, there is a problem of physically damaging the generated static electricity direct substrate.

One problem to be solved through embodiments of the present invention is to provide a cleaning solution supply unit for improving the cleaning effect by suppressing the generation of static electricity generated by the cleaning solution and the friction of the substrate.

In order to achieve the object of the present invention, the cleaning liquid supply unit according to the present invention is in communication with the supply pump, the supply pump is formed with a flow path, the cleaning liquid supply unit for supplying the cleaning liquid into the storage tank, the supply pump, A gas supply unit for supplying a corrector inhibiting gas into the storage tank, an ionization member disposed in the supply pump and ionizing the gas so that the ionized gas is dissolved in the cleaning liquid flowing in the flow path to form a gas dissolving liquid; And an injector communicating with the feed pump to inject the gas solution from the feed pump. Here, the washing liquid may include deionized water, and the gas may include carbon dioxide. In addition, the cleaning liquid supply unit may be in communication with the lower portion of the supply pump, the gas supply unit may be in communication with the side wall of the supply pump, the ionizing member may be disposed in the extension direction of the supply pump inside the supply pump. In addition, the ionizing members may each include a resin material. In addition, the ionization member may be inserted into the outer body portion and the outer body portion and have a hollow fiber layer.

The cleaning solution supply unit according to the exemplary embodiment of the present invention may be disposed at an end of the flow path and further include a sensor for detecting a specific resistance of the gas dissolving solution.

The cleaning solution supply unit according to the present invention supplies the cleaning solution in which the antistatic gas is dissolved to the substrate through the spray nozzle, thereby suppressing the generation of static electricity that may be generated when the cleaning solution containing the antistatic gas collides with the substrate. Can be. Thus, when the cleaning liquid supply unit is applied to perform the cleaning process, it may have an improved cleaning effect.

Hereinafter, a cleaning liquid supply unit according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings. As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. Like reference numerals are used for like elements in describing each drawing. In the accompanying drawings, the dimensions of the structures are shown in an enlarged scale than actual for clarity of the invention.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprises", "having", and the like are used to specify that a feature, a number, a step, an operation, an element, a part or a combination thereof is described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

1 is a cross-sectional view for explaining a cleaning liquid supply unit according to an embodiment of the present invention. FIG. 2 is a partially cutaway perspective view illustrating an arrangement relationship of the ionization members of FIG. 1. FIG. FIG. 3 is a partially cutaway perspective view illustrating the ionization member of FIG. 1. FIG.

1 to 3, the cleaning solution supply unit 100 according to an exemplary embodiment of the present invention is used to remove residues, particles, and the like remaining on a semiconductor substrate W such as a silicon wafer using the cleaning solution. It can be used to carry out the cleaning process.

The cleaning solution supply unit 100 includes a supply pump 130, a cleaning solution supply unit 140, a gas supply unit 150, an ionization member 160, and an injection unit 110.

The supply pump 130 has a flow path 135 formed therein. The cleaning liquid may flow through the flow path 135. The flow path 135 may be formed to communicate from the top to the bottom. Examples of the cleaning solution may be a mixed solution including a LAL solution and deionized water. The supply pump 130 allows the chemical liquid to be supplied at a constant hydraulic pressure through the injection unit 110. Therefore, the chemical liquid can be supplied onto the substrate at a constant hydraulic pressure. On the other hand, the supply pump 130 may adjust the hydraulic pressure.

The cleaning liquid supply unit 140 is in communication with the supply pump 130. The cleaning solution supply unit 140 is connected to the first storage tank 141, the first storage tank 141, and the supply pump 130 to store the cleaning solution, and the cleaning solution stored in the first storage tank 141. It may include a cleaning solution supply line 143 for supplying the supply to the supply pump 130 and the cleaning liquid supply line, the first valve 145 to determine whether to supply the cleaning solution. Furthermore, the cleaning liquid supply unit 140 is disposed on the cleaning liquid supply line 141 adjacent to the first valve 145 and purifies the cleaning liquid to the first storage tank when the first valve 145 is turned off. A bypass line (not shown) may be further included.

In one embodiment of the present invention, the cleaning solution supply line 140 may be disposed below the supply tank 130.

The gas supply unit 150 communicates with the supply tank 130. For example, the gas supply unit 150 is disposed to be adjacent to one side wall of the supply tank 130. The gas supply unit 150 may be disposed to communicate with a lower side of the supply tank 130.

The gas supply unit 150 supplies an antistatic gas to the supply tank 130. Examples of the static electricity suppressing gas include carbon dioxide gas. The supply amount of the static electricity suppressing gas supplied to the gas supply unit 150 may be adjusted in consideration of the capacity of the supply tank, the hydraulic pressure of the cleaning liquid flowing through the flow path 135.

The gas supply unit 150 provides a flow path to flow the static electricity suppressing gas into the supply pump 130 from the second storage tank 151 storing the static electricity suppressing gas and the second storage tank 151. The gas supply line 153 and the gas supply line 153 may be disposed, and may include a second valve 155 to control whether the gas is supplied.

On the other hand, the gas supply unit 150 is arranged in a plurality so that the first gas supply line 153 and the second gas supply line 154 can communicate with the second storage tank 151 and the supply pump 130 mutually. Can be. The first gas supply line 153 may communicate with a lower portion of the supply pump 130, and the second gas supply line 154 may communicate with an upper portion of the supply pump 130.

The ionization member 160 is disposed inside the supply pump 130. When the feed pump 130 has a hollow pipe shape, the ionization member may be disposed adjacent to an inner wall of the feed pump 130. The ionization member 160 may be arranged in the extending direction of the supply pump 130. In this case, the ionization member 160 may also have a hollow pipe shape.

The ionization member 160 ionizes the static suppression gas supplied from the gas supply unit 150. The static electricity suppressing gas may be ionized while the static electricity suppressing gas passes through the ionization member 160. The ionized static electricity suppressing gas can be easily dissolved in the cleaning liquid. The gas dissolving liquid is formed as the static electricity suppressing gas is dissolved in the cleaning liquid. The gas solution may have a lower resistivity than the cleaning solution. Therefore, the corrector generated when the gas solution is supplied to the substrate can be suppressed.

The ionization member 160 may include a porous resin. The static electricity suppressing gas may be ionized while the static electricity suppressing gas passes through the ionization member 160 including the porous resin.

In one embodiment of the present invention, the ionization member 160 may be arranged in plurality. The static suppression gas may pass through the first ionizing member 161 and the second ionizing member 166 spaced apart from each other, and thus ionization of the static suppression gas may be more efficiently performed. For example, the first ionizing member 161 is disposed adjacent to the central axis of the storage tank 130, and the second ionizing member 166 is spaced apart from the first ionizing member 161 at a predetermined interval. And may surround the first ionization member 161.

In one embodiment of the present invention, each of the first ionizing members 161 may include an outer body portion 162 having a hollow and a hollow fiber layer 163 having a hollow therein while filling the hollow. .

The injection unit 110 communicates with an upper portion of the supply tank 130. The injection unit 110 supplies the gas solution on a substrate. The injection unit 110 includes an injection line 113 communicating with the supply tank 130 and an injection nozzle 111 disposed at an end of the injection line 113. The injection line 113 provides a flow path through which the gas solution flows. The spray nozzle 111 injects the gas dissolving liquid onto the substrate.

The cleaning liquid supply unit 100 according to an embodiment of the present invention is disposed at the upper end of the supply tank 130, the sensor for detecting the specific resistance of the gas dissolved in the flow path 135 of the supply tank 130 It may further include 180. After the sensor 180 detects the specific resistance of the gas dissolving liquid, the gas supply amount of the gas supply unit 150 may be adjusted by comparing the specific resistance value with a reference value. That is, when the specific resistance value is higher than the reference value, the gas supply amount may be increased to lower the specific resistance value. On the contrary, when the specific resistance value is lower than the reference value, the gas supply amount may be decreased to increase the specific resistance value.

Hereinafter, the substrate cleaning apparatus including the mentioned cleaning liquid supply unit will be described.

4 is a schematic diagram illustrating a substrate cleaning apparatus according to an embodiment of the present invention.

Here, since the cleaning solution supply unit shown in FIG. 4 is similar to the cleaning solution supply unit described with reference to FIG. 1, the same reference numerals are used for the same members, and detailed descriptions thereof will be omitted.

The substrate cleaning apparatus includes a cleaning liquid supply unit 100, a cleaning container 200, and a substrate holding part 300.

The cleaning solution supply unit 100 may further include a moving unit 170 for moving the spray nozzle 111 on the horizontal plane on the substrate W. The moving part 170 is largely divided into a support 172 and a support shaft 174. The support 172 is disposed above the substrate W in a horizontal plane, and the nozzle 102 is positioned at the front end thereof. The other end of the support 172 is connected to the support shaft 174. The support shaft 174 is disposed adjacent to the outside of the cleaning container 200, and has a rod structure vertically disposed up and down. The support shaft 174 supports and rotates the support 172 to move the spray nozzle 111 on the substrate W in a horizontal plane. For example, the moving unit 170 rotates the spray nozzle 111 from the center portion of the substrate W to the edge portion (or reciprocating the center portion and the edge portion) based on the support shaft 174. Let's do it. Here, the first flow path 110 and the second flow path 120 may be formed in the moving part 170, and may be connected to the injection nozzle 111.

The cleaning container 200 provides a process space for performing a series of processes (for example, a cleaning process) on the substrate W. For example, the cleaning container 200 may have a cylindrical shape open in an upper direction, and an upper end thereof may have a cornice structure. Unlike this, the cleaning container 200 may have various shapes. The cleaning container 200 accommodates the substrate holding part 300 therein. The cleaning container 200 may prevent fluids, such as a cleaning liquid, supplied to the substrate W from being scattered while the cleaning process for the substrate W is in progress. That is, to prevent contamination of other external devices and the environment. In addition, the cleaning container 200 may be formed on a bottom surface or sidewall, and may include a discharge part (not shown) for discharging a fluid such as a cleaning liquid used in the process space to the outside.

The substrate holding part 300 is disposed inside the cleaning container 200 and grips the substrate W. The substrate holding part 300 may be largely divided into a holding part 310 and a driving shaft 320. The gripping portion 310 has a flat stage on which the substrate W is placed. The drive shaft 320 is disposed (eg coupled) to the lower portion of the grip portion 310, and moves the grip portion 310 up and down as the process proceeds, and when the cleaning process for the substrate (W) is performed By rotating the gripping portion 310 at a constant speed, the substrate W is rotated at a constant speed. To this end, a rotary motor for rotating the drive shaft 320 may be connected to the lower portion of the drive shaft 320.

As described above, the cleaning liquid supply unit and the substrate cleaning apparatus having the same according to the preferred embodiment of the present invention prevent static electricity by supplying the gas dissolving liquid dissolved in the cleaning liquid onto the substrate by supplying the static suppression gas into the supply pump. . Therefore, re-contamination of the substrate by static electricity is prevented and the cleaning efficiency is improved.

While the foregoing has been described with reference to preferred embodiments of the present invention, those skilled in the art will be able to variously modify and change the present invention without departing from the spirit and scope of the invention as set forth in the claims below. It will be appreciated.

1 is a cross-sectional view for explaining a cleaning liquid supply unit according to an embodiment of the present invention.

FIG. 2 is a partially cutaway perspective view illustrating an arrangement relationship of the ionization members of FIG. 1. FIG.

FIG. 3 is a partially cutaway perspective view illustrating the ionization member of FIG. 1. FIG.

4 is a cross-sectional view illustrating a substrate cleaning apparatus according to an embodiment of the present invention.

Explanation of symbols on the main parts of the drawings

100: cleaning liquid supply unit 110: injection unit

130: supply pump 140: cleaning liquid supply unit

150: gas supply unit 160: ionization member

161: outer body portion 165: hollow fiber layer

170: sensor

Claims (6)

A feed pump in which a flow path is formed; A cleaning liquid supply unit communicating with the supply pump and supplying a cleaning liquid into the supply pump; A gas supply unit communicating with the supply pump and supplying an electrostatic suppression gas into the supply pump; An ionization member disposed inside the supply pump and ionizing the gas so that the ionized gas is dissolved in the cleaning liquid flowing in the flow path to form a gas dissolving liquid; And And an injection unit in communication with the supply pump for injecting the gas dissolving liquid from the supply pump, The ionizing member is inserted into the outer body portion and the outer body portion cleaning liquid supply unit having a hollow fiber layer. The cleaning liquid supply unit according to claim 1, wherein the cleaning liquid includes deionized water and the gas contains carbon dioxide. The cleaning liquid supply unit of claim 1, wherein the cleaning liquid supply unit communicates with a lower portion of the supply pump, the gas supply unit communicates with a side wall of the supply pump, and the ionization member is disposed in an extension direction of the supply pump inside the supply pump. Washing liquid supply unit, characterized in that.  The cleaning liquid supply unit according to claim 1, wherein the ionizing members each comprise a resin material. delete  The cleaning liquid supply unit according to claim 1, further comprising a sensor disposed at an end of the flow path and detecting a specific resistance of the gas dissolving liquid.

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