KR101055600B1 - Processing Method of Thin Film Substrate - Google Patents

Abstract

The present invention comprises a processed thin film substrate ( 10 ) and a method therefore, in order to produce a flexible printed circuit card, having a plurality of microvias going or passing through the thin film substrate and electrically connected along faced-away surfaces, in order to form an electric circuit. A first a number of real nano-tracks are filled with a first material (M 1 ), having good electric properties, for the formation of a first number of, here denominated, first vias (V 10 , V 30 , V 50 ), that a second number of real nano-tracks are filled with a second material (M 2 ), having good electric properties, for the formation of a second number of, here denominated, second vias (V 20 , V 40 , V 60 ). The first material (M 1 ) and the second material (M 2 ) of said first and second vias (V 10 -V 60 ) are chosen having mutually different thermoelectric properties. A material surface-applied to the thin film substrate, coated on both sides ( 10 a , 10 b) of the thin film substrate ( 10 ), is distributed and/or adapted in order to allow the electrical interconnection of first vias, allocated the first material (M 1 ), with second vias, allocated the second material (M 2 ), and that a first via (V 10 ) included in a series connection and a last via (V 60 ) included in the series connection are serially co-ordinated in order to form an electric thermocouple ( 100 ) or other circuit arrangement.

Description

A method for processing a thin film substrate

BACKGROUND OF THE INVENTION The present invention generally relates to thin film substrates processed in a plurality of process or processing steps to produce one or more printed circuit boards or cards.

The thin film substrate of the present invention is for processing a substrate having a thickness thinner than 500 mu m.

The term "printed circuit board" is firstly processed in the manner described below, and secondly to make a single thin film substrate capable of joining together a plurality of the thin film substrates so treated, in this way, Printed circuit boards that have been treated with advantages in accordance with the description and teachings of can provide a multilayer printed circuit board that can be attached very far from the surface associated with such layer structures.

The use of thin film substrates makes it possible to produce flexible printed circuit boards, where flexibility is reduced by the choice of the number of layers and the thickness of each layer.

In order to simplify the countermeasure or purpose, the following description will be limited only to the description of a single flexible printed circuit board formed on a thin film substrate.

The flexible printed circuit board thus produced will each comprise a plurality of vias that pass through (or pass through) a thin film substrate, so as to form one or more electrical circuits. Through, form an electrical connection along the faced-away surfaces at a distance.

The present invention essentially establishes and based on continuous processing of a thin film substrate as a bulk material, which is carried out in a plurality of processing steps, to enable provision of a one-layer printed circuit board. Shall be.

Such continuous processing carried out in a plurality of processing steps can be advantageously made according to known methods and in the following order of the invention:

a; Subjecting the entirety or at least selected surface sections of the thin film substrate as bulk material to accelerated particles, such as in the form of ions,

b; At least some of the particles, with very high certainty, pass through the thin film substrate and subsequently form so-called nano-wires, and potentially nano-tracks across the thin film substrate. When the particles strike a selected area of the surface of the thin film substrate so that the kinetic energy bound or disposed on the particle is selected so that it is sufficient to form tracks considered to be), and the particle's velocity Allowing the selection of their mutual related mass,

c; Many of these nanowires or selected potential transverse nanos, as in known methods, to form a plurality of real and co-ordinated nano-tracks completely across the thin film substrate. Allowing the processing of latent traversing nano-tracks,

d; For the formation of vias through the thin film substrate, at least selected real nano-tracks are, in a known manner, filled with a good material having good or semi-good electrical conducting properties. Step, and

e; Through surface-oriented electric circuitry by one or preferably two strings of material attached to opposite surfaces of a thin film substrate having good or quasi-conductivity properties. Allowing electrical interconnection of the plurality of through-passing vias.

Justice:

Vertical nanowires, such as anisotropy, typically penetrate through thin film substrates used as bulk materials called latent nano-tracks or nano-wires, thereby penetrating thin film substrates. It is intended to indicate thin wire-like material modification caused by accelerated particles, preferably ions, wherein the material configuration of such nano-wires is higher than the rest of the material configuration of the thin film substrate. It has been found that the material composition has energy, and that changed material composition is capable of etching, such as chemical etching, in the direction of movement of particles or ions through the thin film substrate.

The term "al nano-tracks" means that through the etching, the material composition of the nano-tracks or nano-wires described above is changed, and thus thin through-holes or This is to indicate that a real track is being created.

The term via or microvia means that the co-ordination of at least one real nano-track, preferably a plurality of through-holes or real nano-tracks, is directed against each other in the thin film substrate. It is intended to be filled with a material extending between the surface portions. The material selected herein is preferably a material with remarkably good conductivity and / or a material with selected quasi-excellent conductivity.

The methods and apparatus of the above-described features are already known as a plurality of different embodiments.

Introducing this, the knowledge of the accelerating particles or ions that penetrate electrically insulating materials to form nano-tracks or nano-wires was already apparent and used in the 1960s, when space particles reached through the Earth's atmosphere. It can be said that they were considered important within geology and cosmology in that they made permanent tracks in numerous insulating materials, which would be used in the present invention.

As an example more closely related in time to the background of the present invention and the technical conditions upon which the present invention is based, Michael Lindeberg's "High Aspect Ratio Microsystem by Ion Track Lithography" References may be made to publications entitled International Standard Serial Number (ISSN) 1104-232X or International Standard Book Number (ISBN) 91-554-5515-8 entitled "Fabrication by Ion Track Lithography."

On page 52 and FIG. 49 of the document, there is shown a method in which a solenoid-shaped inductor coil is composed of a plurality of vias or microvias connected in series, where all microvias are described above. It is formed in a known manner and made of one and the same metal material, oriented through the thin film substrate and in parallel with the opposite surfaces of the thin film substrate, wherein And microvias formed by the same metal material as one coil, thereby providing requisite circuitry for forming a flexible circuit arrangement.

Flexible circuit devices manufactured in this manner should be comparable to the application of printed circuits to printed circuit boards.

TECHNICAL FIELD AND PROJECTABLE ADVANTAGES Many applications are shown and described in WO-A1-99 / 41592.

Various methods and gas sensor-coupled detectors are shown and described herein.

Among other things, a method is provided for enabling the production of a gas sensor-coupled detector and for enabling the detection of electromagnetic waves, such as infrared light rays penetrating the gas cell 2, the gas cell being Wall portions 21C and 21D inside the gas cell 2 or cavity 21 coated with one or more different metal layers M1 and M2 so as to form a surface having a high reflection characteristic against the electromagnetic waves. , 21E) forms one cavity 21 that can accommodate a certain amount of gas G for the purpose of measurement or evaluation.

The detector 3 has a surface area or surface parts exhibiting a topographic structure and is formed on an electrically non-conducting substratum. And one or more light-receiving means in the form of a first surface portion which is attached to the topographic surface structures at an angle of incidence separated by 90 ° from each other. And a second electrically conductive metal layer.

In particular, the gas cell-binding cavity 21 is formed by a cup-shaped substratum B consisting of a first part 2A and a part portion 2B designated as a second part. It must be formed.

The detector-coupled local structure 3 should be arranged with one part part for the foundation and / or one part part with the cup-shaped part.

The foundation B should likewise have one or more additional part parts suitable for forming the detector-coupled circuit arrangement 1b.

Summary of the Invention

Technical issues

Technical considerations initially made by those skilled in the art to provide a solution to one or more of the technical issues raised are not only an essential choice of necessary means, but also measures and / or a sequence of measures to be taken. In view of the fact that it is an essential insight into the following, the following technical problems should be appropriate to the creation and formation of the present invention.

In view of the prior art as described above, according to known basic conditions, toroidal to the thin film substrate using the same metal material by using and treating the thin film substrate as a bulk material as one and introduced above. in forming one electrical thermocouple with cold and hot joints and / or using a plurality of conductive or semiconducting materials to create the inductance, while creating conditions for forming the electrical circuit device, It should be viewed as a technical problem to be able to realize the steps to be taken and / or the importance and advantages associated with it.

In that regard, at least two different materials, such as metal materials, are provided inside the thin film substrate and provide a light-detecting unit suitable for the technical field described in the above-mentioned International Patent Publication. It should be viewed as a technical problem.

In addition, one surface must be able to serve as one hot joint and the other surface facing in the opposite direction must be oriented through the thin film substrate so that it can serve as one cold joint. It should be seen as a technical problem to enable the formation of a single electrical thermocouple using or based on a microvia.

By using a thin substrate with a plurality of nano-tracks and microvias extending therethrough, the real nano-tracks processed to form the microvias can be used to select the same or different metal materials or selected end areas or results. It should be seen as a technical problem to be able to realize the advantages and importance associated with being able to provide a plurality of electrical circuit devices with other suitable materials.

In that regard, causing a first metal material to be selected for the first selected particular microvia, causing a second other metal material to be selected for the second selected particular microvia, and a third selected There is a technical problem to be able to realize the advantages and importance associated with selecting a third material or the like for a particular microvia.

In addition, it should be considered a technical issue to be able to realize the advantages and importance associated with selecting a material that is electrically semiconducting for a particular selected microvia.

In that regard, there is a technical problem in that it is possible to realize the advantages and importance associated with allowing different metal materials to be included in the thermal element to be formed and supplied in adjacent and bonded microvias extending completely through the thin film substrate.

For such thermocouples, the plurality of first real nano-tracks thus formed are filled with a first material having electrical or other selected properties for the formation of the plurality of first vias or microvias, There is a technical problem in that it is possible to realize the advantages and importance associated with having 2 nano-tracks filled with a second material having electrical or other selected properties for the formation of a plurality of second vias or microvias, wherein The first and second materials of the first and second vias should be selected to have different thermoelectric properties for the generation of temperature-dependent electromotive force (EMF).

Therefore, the electrically conductive material surface-attached to the thin film substrate as a circuit is attached to both sides of the thin film substrate, and further, by the selected and designated circuit, the first via and the second material on which the first material is disposed are disposed. The advantages and importance associated with being distributed and / or adapted to electrically connect the second vias to be interconnected as a series connection and / or to provide a parallel connection such as a plurality of such series connections. There is a technical problem with what can be realized.

In addition, the first via included in the series connection and the last via included in the series connection have a plurality of hot joints located on one of the sides or surfaces of the thin film substrate, the other side facing the opposite direction of the thin film substrate. It is possible to realize the advantages and importance associated with being coupled through specific surface-related circuitry to form one electrical thermocouple suitable for the purpose, having a plurality of cold joints located on the side or surface. There is a technical problem.

The thin film substrate thus processed can serve as one or more optical receivers, such as frequency-adapted light receivers inside a detector suitable for spectral analysis, wherein the first surface of the thin film substrate Additional advantages and importance associated with being able to be adapted to the first electrical thermocouple for the first selected frequency, and that the second surface portion of the same thin film substrate can be adapted to the second electrical thermocouple for the second selected frequency. There is a technical problem with what can be realized.

The selected surface portion, ie, most or a small portion or the entirety of the outer surface of the thin film substrate, after the treatment of the nano-wires with the real nano-tracks and microvias, in addition to the thermocouple, likewise comprises a semiconductor component It is also technical to realize the advantages and importance associated with being treated with heavy accelerated particles or ions to create conditions for electrical circuits that may be advantageous for other electrical circuits and / or circuit devices that are advantageous. there is a problem.

Potential nano-wires traversing and completely penetrating latent at least some of the selected kinetic energy given to the particles or ions, such as 80% of the particles with sufficient certainty, penetrate, thus traverse and fully penetrate the thin film substrate There is a technical problem in being able to realize the advantages and importance associated with having a large enough selection to form nano-wires, thereby forming one or more microvias with selected density and / or selected resistance values. Combined and processed.

Firstly, causing the first selected, coupled, adjacently related microvia to form the electrical thermocouple, and secondly, the second selected, coupled, adjacently associated microvia. In order for the real nano-track to form an electrical circuit other than the electrical thermocouple, in the following named " tenting " process (meaning to process only surface portions), It is also a technical problem to realize the advantages and importance associated with being formed and / or combined by a method similar to the masking process.

Causing a first selected real nano-track to be filled with a first electrically conductive material by a selected treatment and first masking or tenting to form the first via and to form the second via. It is possible to realize the advantages and importance associated with having a selected real nano-track of 2 filled with a second electrically conductive material by selected treatment and other masking or tenting selected, but preferably through the same treatment. there is a problem.

The selected plurality of adjacently associated first microvias and the selected plurality of adjacently associated first microvias are formed by an electrically conductive material attached to one of two surfaces of the thin film substrate through a masking or tenting process. There is a technical problem in realizing the advantages and the importance associated with being electrically interconnected by an electrical circuit, where the same material can be used for another electrical circuit as well, via one electrical circuit.

Causing the plurality of first microvias and the plurality of second microvias to be electrically interconnected by an electrical circuit formed by a material attached to the second of the two surfaces of the thin film substrate by masking or tenting; Similarly, there is a technical problem in realizing the advantages and importance associated with being able to be used and formed through one electrical circuit for an electrical connection other than an electrical thermocouple.

Therefore, it is basically composed of co-ordinated nano-wires of the treated bulk material, and chemical etching for the formation of real nano-tracks is possible and thus processed to form microvias, Enabling the potential transverse nano-track to simultaneously select the microvias and / or combine such microvias to form the necessary electrical circuits for the electrical circuits and components outside the electrical circuits required for the electrical thermocouple. There is a technical problem in achieving the relevant advantages and importance.

Gas detection inside the cavity and selected for each microvia to be included in one active thermocouple during the use of pulsated light waves with a suitable selected frequency and / or during evaluating the gas concentration at the time. In order to match the thickness to length, there is a technical problem in enabling the thin film substrate to realize the advantages and importance associated with selecting the plastic material and giving the overall thickness between 200 and 30 μm.

Allow the thin film substrate to consist of an aromatic polymer material and etch in an alkaline and / or oxidizing wet environment while using chemicals for the formation of open real nano-tracks. There is a technical problem in realizing the advantages and importance associated with what can be done.

Therefore, in the applications described herein, it is a technical problem to be able to realize the advantages and importance associated with making conditions such that the kinetic energy is chosen between 200 and 7000 MeV per ion, but usually less than 2000 MeV per ion. to be.

There is also a technical problem in realizing the advantages and importance associated with forming the nano-wires inside the plastic by "Coulomb" explosions and / or thermal transients.

Therefore, treatment of transverse potential nano-wires or potential nano-tracks to form real nano-tracks across thin film substrates is accomplished using sodium hypochlorite (NaOHCI)-and / or potassium oxide (KOH) -containing solutions. It is a technical issue to be able to realize the advantages and the importance associated with this.

There is a technical problem in enabling the real cross-opening nano-tracks thus formed to realize the advantages and importance associated with allowing the pretreatment of the inner track surface, for example, by wetting.

Resolution

The present invention relates to a treated thin film substrate and a method for manufacturing such a thin film substrate, including, including, related thereto, and known in the preamble of the appended claims, and introduced by way of example. Based on technology.

In order to be able to solve one or more of the technical problems described above, the present invention, in particular, allows the first plurality of real nano-tracks to form the plurality of first vias or microvias, in particular, such a known technique. In order to form a plurality of second real nano-tracks with a second material having selected electrical properties, for the formation of a plurality of second vias or microvias, And by the fact that the first and second materials of the first and second vias are selected to have different electrical properties, to enable the formation of one or more electrical thermocouples or electrical circuit devices for the thin film substrate. It should be supplemented.

In addition, a surface-attached material coated on both sides of the thin film substrate may include a second via disposed with the second material of the first via on which the first material is disposed, and electrical conduction or semiconductor characteristics, and the like. It teaches and suggests that the material having should be distributed and / or adapted to allow electrical interconnection with the disposed third vias, through the circuits formed.

It also teaches and suggests that the first via included in the series connection and the last via included in the series connection can be combined to form an electrical thermocouple and / or other electrical connection device.

As with the proposed embodiment, within the scope of the basic idea of the present invention, a thermocouple treated thin film substrate is included as one or more frequency significative signal receivers of a detector suitable for spectral analysis. Teach and suggest that they should be appropriate.

In addition, most or the entire outer surface of the thin film substrate should be treated with high specific gravity acceleration particles, and the kinetic energy given to the particles or ions should be selected so that at least 80% of the particles penetrate the thickness of the thin film substrate completely. Teach

In addition, the real nano-tracks must be able to be formed by masking or tenting, and the selected real nano-tracks must be able to be filled with the first electrically conductive material to form the first vias through the selected treatment, It teaches and suggests that the second selected real nano-track should be able to be filled with a second electrically conductive material to form a second via, through the selected treatment.

Thus, according to the present invention, the plurality of first vias and the plurality of second vias must be able to be electrically interconnected by a material in the form of a circuit and attached to one of the two surfaces of the thin film substrate by masking or tenting. Teach that you can be.

In addition, the present invention requires that the plurality of first vias and the plurality of second vias are electrically interconnected by a material in the form of a circuit and attached to the other one of the two surfaces of the thin film substrate by masking or tenting. Teach and suggest.

In addition, the present invention is in the form of a vertical wire of anisotropic material, in which potential transverse nano-tracks are initially capable of chemical etching for the formation of sub-micron capillaries, or instead of real nano-tracks. Teach and suggest what consists of phosphorus-coupled nano-wires.

In addition, the present invention teaches and suggests that the thin film substrate should be selected from a plastic material (polymer) and given a thickness between 200 μm and 30 μm.

In addition, the present invention provides that the thin film substrate may be etched in an alkaline and / or oxidizing wet environment while using chemicals for the formation of open or real nano-tracks, and selected particles or ions and thin film substrates. It is taught and suggested that the kinetic energy should be composed of aromatic polymer materials, which should be chosen between 200 and 7000 MeV per ion, depending on the material chosen and its specified thickness.

In addition, the present invention provides that selected nano-wires or potentially transverse nano-tracks form real nano-tracks in polyimide and / or polycarbonate plastics, and are capable of sodium hypochlorite-containing and / or Teach and suggest that it should be treated to cross thin film substrates with potassium oxide-containing solutions.

The present invention further teaches and suggests that the real transverse open nano-tracks formed as described above can be pretreated, for example with ethanol, for wetting of the inner track surface.

Advantages

First and foremost, it may be considered a characteristic of the present invention, and the particular meaningful properties provided thereby are such that, by means of a treated thin film substrate, such as an electrical thermocouple and / or one or more circuit devices, a detector such thermocouple is suitable for spectral analysis. A condition is created to allow a condition to be created that can be included in one or more circuit devices, such as one or more signal receivers.

In thermocouple applications, a plurality of hot joints are allowed to be exposed to light rays or waves having a frequency selected by spectral analysis, and a plurality of cold joints are positioned in the shadow of the light beams, thereby thermocouples. The simple possibility of directly matching the length of the microvia included in the thickness of the thin film is provided, thus creating conditions that can be adapted to the temperature differences that occur during the use of a pulsed light source.

In addition, the controlled thermal conduction to the thin film substrate, the adaptation of the resistance value of each microvia, and the fit of the thermal conduction generated between the hot joint and the cold joint through the structure of the microvia used and the material and thickness of the thin film substrate Conditions for anger are made.

The main points which can be regarded as characteristics of the present invention are defined in the claus which characterizes the following claims.

Now, for the purpose of illustrating an embodiment of the present invention, together with the presently proposed embodiment having important properties related to the present invention, a conventional known method, in order to allow processing of the thin film substrate in a manner suitable for the present invention. Only, with reference to the accompanying drawings will be described in more detail, where:

1 processes a thin film substrate in the order of "a"-"f" to form a toroidal inductor coil using microvias oriented to penetrate the thin film material from one and the same metal material. A known method for

2 is a perspective view showing an inductor coil made according to the method of FIG. 1,

FIG. 3 shows a plurality of vias of an inductor coil having associated surface-structured circuitry, with a bulk material not shown,

4 is a perspective view showing an electric thermocouple according to a provision related to the present invention,

5 shows the time-dependent temperature difference that can be imparted to a hot joint of a thermocouple and a cold joint of a thermocouple in an application according to the invention. Is a graph showing one example,

FIG. 6 is a graph showing the time-dependent change in temperature and the variation corresponding to the voltage or electromotive force (EMF) given by the thermocouple;

7 is a graph showing the relationship between the points of time at which the maximum temperature difference occurs and the selected thickness of the thin film substrate,

8 is a sequence, similar to that shown in FIG. 1, of a method consisting of a plurality of processing steps to enable formation of one thermocouple or other circuit device by at least two different metallic materials from a bulk material configured as a thin film. Is a diagram showing

FIG. 9 is a sequence diagram similar to that shown in FIG. 8 of another method composed of a plurality of processing steps,

FIG. 10 shows another example of combining the first two processing steps of FIG. 9 into one single processing step.

Description of the related prior art

In connection with FIGS. 1 to 3, in FIG. 1, a conventionally known method for enabling the processing of a thin film substrate is shown in a plurality of processing steps, in accordance with the technical requirements indicated in the literature mentioned for introduction. have.

Thus, surfaces 1a and 1b which are fully passed through or arranged through the thin film substrate 1 and which face each other in order to enable the formation of an electrical circuit device in the form of a toroidal inductor coil 2a. In order to enable the production of the printed circuit board 2 of FIG. 2, having a plurality of microvias electrically connected to the substrate, the processing of the thin film substrate 1 is carried out in different processing steps designated as "a" to "f". The proposed order to allow is shown in FIG. 1.

For the sake of simplicity, only the use of five microvias labeled "V1", "V2" through "V5" is shown in FIG. 2, but in practice there are considerably more and significantly more than those shown here. There is a need for a dense structure.

In FIG. 1A, the entire thin film substrate 1 is treated with accelerated particles in the form of ions “J”, in which a plurality of nano-wires 1d or potential nano-tracks 1d penetrate these ions. It is shown that is formed.

The ion “J”, 1000 MeV ¹²⁹ Xe ²⁷⁺ can be advantageously used, which has proven to be suitable for penetrating polyimide-structured plastic in the form of a thin film substrate 1.

In FIG. 1A, the thin film substrate 1 is covered with a thin first copper layer 1 ′ and a thin second copper layer 1 ″ at the bottom.

FIG. 1B shows that the upper side 1 ′ and the lower side 1 ″ of the thin film substrate 1 are covered with copper layers 12 and 13, respectively, and the opening 12a is formed in the upper copper layer 12. Indicates.

In particular, the copper layer 12 is processed to partition the opening 12a in contact with the preferred microvia (via “V1” in FIG. 2).

Nano-wire 1d is processed to form a real nano-track 1e in FIG. 1c.

FIG. 1C shows the velocity of the ion or particles “J” as it hits a surface portion to allow formation of a plurality of nano-wires 1d or potential nano-tracks across the thin film substrate. And the mass of the particles is adapted to such a value that the kinetic energy associated with the particle "J" is selected such that at least some of the particles are very sure to penetrate the thin film substrate completely.

FIG. 1D is a metal material 1f in which the real nano-track 1e has very good electrical conduction properties for the formation of through-hole related microvias, such as via “V1”. To be filled in the correct way.

In addition, FIG. 1D shows that nickel or copper is deposited inside pores or real nano-tracks 1e by a known process such as electrodeposition in two steps.

Since the hole or real nano-track 1e extends through the entire thickness of the thin film substrate 1 to the lower layer 1 ", this can constitute one support, optionally using an adhesive tape. do.

In FIG. 1C, through holes or real-nano tracks 1e may be made using ethanol to enhance wetting of the real nano-tracks.

1e shows that the upper copper layer 1 'is removed before the material reaches through electrodeposition.

The first electrodeposition is suitable to serve to protect the copper layer or copper film 1 "against etching liquid.

This is followed by electrodeposition.

 When microvia "V1" has grown toward the upper surface 1a of the thin film substrate 1, a "cup" is formed and deposition stops.

1F also shows that one of the through-hole related vias " V1 " is now attached by one or two materials having electrical conducting properties and attached to opposite surfaces of the thin film substrate as circuitry. It can be electrically interconnected.

FIG. 1F shows that in this aspect, the gold foil film 1g is evaporated with respect to the upper surface 1a and the copper film 1h is attached thereon.

Requisite circuitry on the top side (and bottom side) can now be made by isotopic wet etching.

Here, in FIG. 2, the inductor coil is attached to the upper surface 1a of the thin film substrate and has the first essential conductive wires labeled "L1", "L3" and "L5", and only five vias are shown. The first mandatory conductive wire is attached to the opposite direction surface 1b of the thin film substrate and provides the "L2", "L4" to provide a series connection of vias "V1", "V2" to "V5". And a second conductive wire labeled "L6".

Here, FIG. 3 shows the vias together with the circuits "L3" and "L5" of the upper side 1a, in principle, with the circuit "L4" of the lower side 1b shown interconnected in the manner shown in FIG. The appearance of "V2", "V3" and "V4" is shown.

All conductive wires on the upper side 1a, all microvias penetrating through the thin film substrate, and all conductive wires on the lower side 1b are formed of one and the same metal material.

Description of the Proposed Embodiment

Predicates and specific terms used in the following description of the proposed embodiment of the present invention, which have important characteristics related to the present invention and are clarified by FIGS. I would like to stress as an introduction to the introduction that it was chosen with the intention of clarifying this.

However, the expressions selected herein are not to be viewed as being limited to the terms used and selected herein, and each term so selected is also the same or generally to enable the achievement of the same or substantially the same purpose and / or technical effect. It should be construed to include all technical equivalents that operate in the same manner.

Thus, in Fig. 4, the present invention is generally embodied by the presently proposed embodiment together with the proposed processing methods of the present invention shown in more detail in Figs. The basic conditions and requirements for the present invention are schematically illustrated along with the important features or features related to the invention.

Thus, the present invention is in principle based on the method taught in FIGS. 1 to 3 for other technical fields and applications, from which it serves as a detector in an application for gas metering. Various adaptations are necessary to enable the provision of one or more electrical circuit devices, which are suitable and will be illustrated below with thermocouples.

In that regard, the present invention is directed to a plurality of first real nano-tracks 1e shown here in three, labeled as "V10", "V30" and "V50", as shown in Figure 1E. , For the formation of a plurality of first microvias, to be filled with a first material M1 having good electrical properties.

However, in the present invention, the plurality of second real nano-tracks 1e shown here are excellent electrical power for forming a plurality of second microvias represented by "V20", "V40" and "V50". It must be filled with a second material M1 having properties, which also must be covered and masked with the first vias " V10 ", " V30 " and " V50 " 2 teach or suggest that real nano-tracks can be made under conditions that must be exposed for access by the second material (M2).

Methods and processing steps in this regard are shown and described in more detail in FIGS. 8, 9 and 10 and described in more detail below.

An important point associated with the thermocouple 100 in the embodiment described according to the invention is that the first and second materials M1 and M2 of the first and second microvias are hot 10a and cold. (10b) have different electrical-thermal properties from one another to form one or more co-ordinated or separated electrical thermocouples that impart electromotive force (EMP) to the temperature difference between the joints. To be chosen.

 In this regard, the present invention is based on the fact that different metals have different electro-thermal properties when the ends are joined in a state where there is a temperature difference from one another.

Thus, the present invention is based on the known experiments which enable the determination of the desired thermoelectric properties between the preferred materials.

The electrically conductive materials 10a and 10b, surface-applied to the thin film substrate 10 and coated on both sides of the thin film substrate 10, are formed by the formed electrical circuits L10, L30, L50. 1 of the first microvias "V10", "V30" and "V50" in which the material M1 is disposed, with the second microvias "V20", "V40" and "V50" in which the second material M2 is disposed. It is distributed and / or adapted to enable electrical interconnection.

The first microvia “V10” included in the series connection and the last microvia “V50” included in the series connection are combined to form an electrical thermocouple 100 connected in series via connections 101 and 102. do.

In addition to FIG. 2, FIG. 4 shows only a short portion of the inductance or a short section of the electrical thermocouple 100 in accordance with the present invention, wherein a very large number of microvias form each other to form the thermocouple 100. It should be understood that they can be connected in series and to be connected.

4 does not prevent the formation of a plurality of individual thermocouples connected in series to the same thin film material 1.

There is nothing preventing the parallel connection of a plurality of such individual thermocouples 100 connected in series.

The processed thin film substrate 10 of the electrical thermocouple 100 shown in FIG. 4 is suitable for inclusion as a signal receiver in a detector suitable for spectral analysis.

The surface portion 10a of the electrical thermocouple 100 may be repeated on the thin film substrate 10, as indicated by reference 10a ', whereby two electrical thermocouples 100 and 100' And on the same thin film substrate 10, wherein the thermocouples 100 and 100 'may be used for different light rays or light waves, respectively, during spectral analysis, in which case the thermocouple 100 may be appropriately measured. It is apparent to those skilled in the art that the thermocouple 100 ′ can be used for measurement, and that the thermocouple 100 ′ can be used as a reference measurement, and through the connection wires an electrical value-calculating circuit of the type originally known. Two signals to the calculating circuit are used.

Within the scope of the present invention according to FIG. 4, the outer surface 10a or selected portions of the entire thin film substrate 10 as bulk material, as well as the conditions for using specific microvias for different metals interconnected as electrical thermocouples. In order to make the conditions for forming circuit devices and other electrical circuits of the already known type inside the thin film substrate, they must be treated with a high specific gravity accelerated ion "J".

By virtue of the invention and application described herein, the kinetic energy given to the particles or ions is determined by at least 80% of the particles to ensure that the bonded microvias are connected flawlessly through the thin film substrate. It needs to be selected to completely penetrate the selected thickness of the thin film substrate 10.

Since the present invention is based on the possibility for series connection of a plurality of microvias having the same or different material to each other, surface-related circuits formed for microvias that pass completely up or down to the surface and provide electrical contact. Such serial connection of through-hole related microvias via surface-related circuitry is required to be certain.

In addition, according to the present invention, the real nano-track can be formed by a masking or tenting process (the result of which is a combination of pieces of embroideries on a surface area associated with the thin film substrate). Compared.], And in that case, the plurality of selected first real nano-tracks is filled with the first electrically conductive material by selected treatment and by masking to form the first microvia.

A second plurality of selected real nano-tracks must also be filled with a second electrically conductive material, by selected treatment and by masking, to form a second microvia, wherein the first via and the second via are one Of electrical thermocouples and / or to provide desirable properties when interconnected to one circuit device.

Accordingly, the present invention also provides that a plurality of first microvias and a plurality of second microvias may be applied to one of two surfaces of a thin film substrate by masking or tenting, for forming a conductive wire and a circuit of the present invention. To be electrically interconnected by an applied electrically conductive material.

In addition, a plurality of first microvias and a plurality of second microvias are attached to the other one of the two surfaces of the thin film substrate by masking or tenting to form the conductive wire or circuit of the present invention. It also teaches that they must be electrically interconnected by electrically conductive materials.

It is also possible to provide transverse circuitries through other microvias inside the thin film substrate in order to be able to include the vias as circuits of other electrical circuit devices, at the same time as the formation of the conductive wires and circuits.

The thin film substrate 10 is selected from a plastic material and is given a thickness between 200 and 30 μm, preferably between 120 and 50 μm, and in this way provides an electrical thermocouple having the characteristics to be described in more detail below. Can provide.

More specifically, the thin film substrate 10 may be composed of an aromatic polymer material, which is etched in an alkaline and / or oxidizing wet environment while using a chemical agent for forming an open real nano-track.

More specifically, the kinetic energy should be chosen between 200 and 7000 MeV per ion, and ions with selected certainty, defined at least 80% herein, should be able to penetrate the thickness of the thin film substrate 10. do.

The nano-wires 1d occurring in the thin film substrate 10 may be formed by "coulomb" spikes and / or subsequent thermal transitions, which are described in more detail on page 18 of the aforementioned document.

The selected potential transverse nano-wires or nano-tracks 1d are treated in a known manner to form real nano-tracks across the thin film substrate 10 and for this treatment, sodium hypochlorite-containing or Potassium oxide-containing solutions can be used.

In addition, the real transverse open nano-track 1e should be able to be pretreated with ethanol or the like to wet the inner track surface.

In FIG. 5, a temperature-time-graph is shown for the temperature given to the hot joint of the thermoelectric coupling proposed for the detector of the spectral analysis and the temperature given to the cold joint, wherein the defined temperature difference "dT May be considered to depend on at least the following factors:

a) light density of light waves incident on the upper surface 10a,

b) the frequency of light density between two consecutive pulses,

c) upward gradient characteristics of light density,

d) the length "d" of the microvias across the thin film substrate 10,

e) the calculated thickness "t" of the microvia across the thin film substrate 10,

f) the distance between adjacent microvias where the distance between vias "V2" and "V3" is "a" and the distance between vias "V2" and "V4" is "a1" [FIG. 3],

g) heat transfer between the microvia and the bulk material,

h) selected materials of the bulk material or thin film substrate 10,

i) selected thermal conductivity from the lower surface 10b to the substratum 103,

j) the number of real nano-tracks connected in parallel in the formation of each microvia,

k) calculated thickness of the real nano-track.

4 illustrates and illustrates the use of a plurality of different parameters, each suitable for an electrical thermocouple.

It can be seen that the increase in the length "d" of the microvia "V10" and the other microvias can generally represent a large signal "V", but the increase in heat generated on the surface 10a may result in the surface 10b. It is quite natural that the thermal conduction to delay the temperature difference longer because it must travel longer distances.

Thick microvias or microvias consisting of an excessively large number of real nano-tracks increase the thermal conductivity of the surface 10b.

Multiple thinner microvias provide greater thermal conduction to the bulk material than thicker microvias having the same cross-sectional area. One thick single microvia gives a lower temperature gradient than a plurality of thin microvias.

Thin microvias give higher electrical resistance values than thick microvias.

Many microvias serially interconnected in the manner described above have a higher output signal than few microvias.

An additional parameter that can be imparted to the conditions of the electrical thermocouple is that the time-related nature of the light source or lamp used will affect the occurrence of temperature differences.

However, if the lamp is controlled via a pulse and thus the emitted light pulses of the selected frequency are given to the lamp, it is found that this frequency should be selected to appear for 0.1 seconds on the thin film substrate having a thickness "d" of 100 μm. lost.

Another condition is that the microvia must have a predetermined resistance value, where the value must be as low as possible, i.e. less than 100 kW, but the resistance of the electrical thermocouple up to or equal to 30-50 kW must be accepted. .

6 shows a time-dependent step of temperature difference, which can also be considered to represent an output signal from thermocouple 100.

In Fig. 7, a graph showing how the height dimension or thickness "d" of the thin film substrate is related to the output signal from the electrical thermocouple and the repetition frequency of the light source or lamp used.

The electrical thermocouple according to the present invention should consist of an even number of microvias or combined microvias, one half of which consists of a first material such as metal M1 and the other half of metal M2. It is preferably composed of a second material such as.

In summary, real nano-tracks and microvias should be as thin as possible in practice, and the metal materials used should have as poor a thermal conductivity as possible.

Pairs of materials M1 and M2 should have as large a Seebeck-effect, thermoelectric effect or electromotive force (EMF) as possible.

Within the scope of the present invention, in order to be able to construct various circuit arrangements using at least two different materials, the use of electrically complete conductive or semiconducting materials in the microvias and / or surface portions 10a and 10b may be used. Of course it is possible.

In the circuit formed along each of the surfaces 10a and 10b, it is possible to select a metal material different from the material used for the microvia.

In FIG. 8, three different metal materials M1; M2 and M3 are shown, while using at least two different metal materials to form a thermocouple or other circuit arrangement by means of a bulk material composed of a thin film. To this end, a plurality of processing steps "A"; The methods divided by "B" through "G" are shown in an order similar to that shown in FIG.

Thus, in Figure 8A, bulk material 80 in the form of a thin film material is exposed to radiation during the use of particles or ions 80a, and thus cross nano-wire 80b or potential nano-tracks. It is shown that 80b is formed.

Here, according to the prior art of the same processing step, the entire upper surface of the bulk material 80 is processed so that the nano-wires 80b are well distributed.

FIG. 8B shows that the nano-wires 80b formed in FIG. 8A are subjected to an etching process in a processing step to form a real nano-track 80d.

Here, the entire upper surface 80c is treated so that the bulk material 80 exhibits a dense perforation of the real nano-tracks 80d.

FIG. 8C shows that the metal layer 80e is formed in the additional processing step in the bulk material 80 treated according to FIG. 8B.

FIG. 8D shows a photo-resist, dry film 80f with one masking and one opening 80g to expose the three real nano-tracks 80h shown in the processing step. ) Is applied to the upper surface 80c.

By a processing step comprising electroplating, the metal material "M1" is attached so that the same material fills the nano-track 80h and is distributed inside the opening 80g.

8D also shows that a resist 80i that acts as a masking layer or a protection film is applied to the metal layer 80e.

8E shows that, in the next processing step, the dry layer 80f is removed to expose three different real nano-tracks 80h ', a photoresist, dry layer having one opening 80g'. 80f'applied to the upper surface 80c.

By repeated treatment steps comprising electroplating, the metal material "M2" is applied to fill the nano-tracks 80h 'and to be distributed inside the openings 80g'.

8F shows that, like microvias, the dry layer 80f 'is removed in one treatment step to expose each of the filled nano-tracks 80h and 80h', and one opening 80k in the next treatment step. With a new photoresist with one masking, the dry layer 80j is attached to the upper surface 80c and attaches the metal material M3 which forms an essential circuit as indicated by "L10" via electroplating. To explain that.

8F also removes the metal layer 80e and the protective layer 80i 'in one treatment step, to expose each of the filled nano-tracks 80h and 80h', such as microvias, In the step, a new photoresist having one masking in the form of one opening 80k ', the dry layer 80j', is attached to form an essential circuit as indicated by " L30 " will be.

8G shows that in one processing step, the photoresist layers 80j and 80j 'are removed and thus circuitry on the upper side 80c and the lower side 80c' of the thin film material 80 electrically connected and connected to each other. And a circuit arrangement 100 having microvias.

In another embodiment, the metal material "M1"; "M2", "M3" and "M4" may be selected to have different properties from metal materials having the same electrical conducting properties, or from materials with different electrical conducting properties and / or materials with electrical semiconductor properties.

8G also shows that certain and selected real nano-tracks (80 m, 80 m ') not covered with metallic material can serve as air-ventilating and cooling ducts. .

In Figure 9, three different metal materials M1; M2 and M3 are shown, with a plurality of steps for forming a thermocouple or other circuit arrangement by means of a bulk material composed of a thin film using at least two different metal materials. "A"; The method of dividing by "B" through "F" is shown in an order similar to that shown in FIG.

Thus, FIG. 9A illustrates the use of particles or ions 80a to expose bulk material 80 in the form of a thin film material to irradiation, thereby forming transverse nano-wires 80b or potential nano-tracks 80b. Indicates.

Here, according to the prior art of the same processing step, the entire upper surface 80c of the bulk material 80 is processed so that the nano-wires 80b are well distributed.

FIG. 9B shows that the nano-wires 80b formed in FIG. 9A are covered with photoresist 80f through masking and openings 80g to form the selected real nano-tracks 80d, the process according to FIG. 9C. Etched in step.

Here, only selected portions of the upper surface 80c are processed so that the bulk material 80 exhibits selected perforation of the real nano-tracks 80d.

9B and 9C, the bulk material 80 is formed with a metal layer 80e in an additional processing step.

9D shows that in one processing step, a photoresist, dry layer 80f having one opening 80g, adheres to the top surface 80c to expose the three real nano-tracks 80h shown. Indicates that it is applied.

By a processing step comprising electroplating, the metal material "M1" is attached so as to fill the nano-track 80h and distribute it inside the opening 80g.

9E shows that in the next processing step, the dry layer 80f is removed and a photoresist having one opening 80g ', in order to expose the other three real nano-tracks 80h' shown; It shows that the dry layer 80f is applied to the upper surface 80c.

By a repeated processing step comprising electroplating, the metal material "M2" is attached so as to fill the nano-track 80h and distribute it inside the opening 80g '.

These are not shown since the processing steps described above in accordance with FIGS. 8F and 8G continue in FIG. 9F.

10 shows radiation from ions 80a such that only potential nano-tracks and nano-wires 80b are formed inside the surface section, and following the processing steps described above, form microvias. ) Is made by masking process or tenting.

Although the present invention has been described in connection with thermocouples, it is clear that the technique can be used for other detectors such as IR-detectors, movement detectors and the like.

It is to be understood that the invention is not limited to the specific embodiments illustrated above, but may be modified within the scope of the general spirit of the invention as described in the appended claims.

In particular, it should be considered that each unit shown may be combined with the other units shown within the scope of the present invention in order to obtain the desired technical functionality.

Claims (32)

A thin film substrate having a plurality of microvias penetrating a thin film substrate to form an electrical circuit, and processed to produce a printed circuit board (or board) electrically connected along the upper or lower surface of the thin film substrate, a; At least selected specific surface portions of the thin film substrate are treated with accelerated particles; b; At least some of the particles pass through the thin film substrate and cross the thin film substrate as the kinetic energy of the particles is determined so that the velocity and mass of the particles when they hit the selected surface portion are correlated. Wires (nano-wires) or latent nano-tracks are formed, c; The selected potential nano-tracks are processed to form real nano-tracks across the thin film substrate, d; The real nano-tracks are filled with a material having selected electrical conducting properties to form the through-hole microvias or vias, and e; The plurality of through-hole microvias or vias are attached to the top surface or the bottom surface of the thin film substrate and electrically interconnected by one or two materials having selected electrical conducting properties, and the plurality of first vias V10, The plurality of first real nano-tracks are filled with the first material M1 having the selected electrical characteristics to form V30 and V50, and the plurality of second vias V20, V40 and V60 are formed. A thin film substrate in which the second real nano-tracks of are filled with a second material (M2) having selected electrical properties, The first material M1 and the second material M2 of the first and second vias V10-V60 are selected to have different electrical characteristics, A material is surface-attached to the thin film substrate and coated on both sides of the thin film substrate to enable electrical interconnection of the first vias with the first material disposed thereon and the second vias with the second material disposed thereon, and In order to provide an electrical thermocouple or circuit arrangement, the first via (V10) included in the series connection and the last via (V60) included in the series connection are co-ordinated. Processed thin film substrate. The processed thin film substrate according to claim 1, wherein the thin film substrate processed to have a characteristic related to a thermocouple serves as a signal receiver of a detector for spectrum analysis. The processed thin film substrate of claim 1, wherein the accelerated particles during the “a” step are heavy acceleration ions. The processed thin film substrate of claim 1, wherein, during the “b” step, the kinetic energy given to the particles is determined such that at least 80% of the particles penetrate the thin film substrate. The processed thin film substrate of claim 1, wherein during the “c” step, the real nano-tracks are formed by a masking process. delete delete The method of claim 1, wherein during the “e” step, the plurality of first vias and the plurality of second vias are electrically interconnected by a material attached to one of the two surfaces of the thin film substrate through a masking process. And a connected thin film substrate. The method of claim 1, wherein during the “e” step, the plurality of first vias and the plurality of second vias are electrically connected by a material attached to the other of the two surfaces of the thin film substrate through a masking process. Wherein the thin film substrate has been interconnected. 2. The anisotropic material of claim 1, wherein during the " b " step, defined latent traversing nano-tracks are initially capable of chemical etching for formation of real nano-tracks. A processed thin film substrate, characterized in that it consists of bonded nano-wires formed inside a bulk material in the form of nano-wires of anisotropic material. The treated thin film substrate of claim 1, wherein the thin film substrate is selected from a plastic material and is given a thickness between 200 and 30 μm. 12. The method of claim 1 or 11, wherein the thin film substrate 10 comprises an alkaline or oxidizing wet environment using a chemical for the formation of open real nano-tracks. A processed thin film substrate, consisting of an aromatic polymer material, etched at. The processed thin film substrate of claim 1, wherein during the “b” step, the kinetic energy is selected to be between 200 Mev and 7000 MeV per ion. The processed thin film substrate of claim 1, wherein, during the “b” step, the nano-wires are formed by “Coulomb” explosions or through thermal transients. . The treated thin film substrate of claim 1, wherein during the step “c”, sodium hypochlorite-containing or potassium oxide-containing solution is used. The treated thin film substrate of claim 1, wherein the real nano-tracks formed during the “c” step are pretreated with ethanol, such as for wetting the inner track surface. Treatment of a thin film substrate processed to produce a printed circuit board (or board) having a plurality of microvias penetrating the thin film substrate to form an electrical circuit and electrically connected along the upper or lower surface of the thin film substrate. As a method, a; Treating at least selected specific surface portions of the thin film substrate with accelerated particles; b; At least some particles pass through the thin film substrate and cross the thin film substrate as the kinetic energy of the particles is determined by correlating the speed and mass of the particles when they hit the selected particular surface portion. Forming nano-wires or latent nano-tracks, c; Processing the selected potential nano-tracks to form real nano-tracks across the thin film substrate, d; Filling the real nano-tracks with a material having selected electrical conducting properties to form the through-hole microvias or vias, and e; The plurality of through-hole microvias or vias are electrically interconnected by one or two materials attached to the top surface or the bottom surface of the thin film substrate and having selected electrical conducting properties, and the plurality of first vias V10, The plurality of first real nano-tracks are filled with a first material M1 having a selected electrical characteristic so that the V30 and V50 are formed, and the plurality of second vias V20, V40 and V60 are formed. A method of treating a thin film substrate, the method comprising filling the second real nano-tracks with a second material (M2) having selected electrical properties. The first material M1 and the second material M2 of the first and second vias V10-V60 are selected to have different electrical characteristics, Distributing the material surface-attached to the thin film substrate and coated on both sides of the thin film substrate to enable electrical interconnection of the first vias disposed with the first material and the second vias disposed with the second material, and To provide an electrical thermocouple or circuit arrangement, the first via V10 included in the series connection and the last via V60 included in the series connection are co-ordinated. The processing method of a thin film substrate. 18. The method of claim 17, wherein the thin film substrate processed to have properties related to thermocouples serves as a signal receiver of a detector for spectrum analysis. 18. The method of claim 17, wherein the accelerated particles during the " a " step are heavy acceleration ions. 18. The method of claim 17, wherein during the " b " step, the kinetic energy given to the particles is determined such that at least 80% of the particles penetrate the thin film substrate. 18. The method of claim 17, wherein during the " c " step, the real nano-tracks are formed by a masking process. delete delete 18. The method of claim 17, wherein during the " e " step, the plurality of first vias and the plurality of second vias are electrically interconnected by a material attached to one of the two surfaces of the thin film substrate via a masking process. It is connected, The processing method of a thin film substrate. 18. The method of claim 17, wherein during the " e " step, the plurality of first vias and the plurality of second vias are electrically connected by a material attached to one of the two surfaces of the thin film substrate via a masking process. Characterized in that they are interconnected. 18. The anisotropic material of claim 17, wherein during the " b " step, defined latent traversing nano-tracks are initially capable of chemical etching for formation of real nano-tracks. A method for processing a thin film substrate, characterized in that it consists of bonded nano-wires formed inside a bulk material in the form of nano-wires of anisotropic material. 18. The method of claim 17, wherein the thin film substrate is selected from a plastic material and a thickness of between 200 and 30 mu m is given. 18. The method of claim 17, wherein the thin film substrate 10 is etched in an alkaline or oxidizing wet environment using a chemical for the formation of open real nano-tracks. A method of treating a thin film substrate, which is composed of an aromatic polymer material. 18. The method of claim 17, wherein during the " b " step, the kinetic energy is selected to be between 200 Mev and 7000 MeV per ion. 18. The process of claim 17, wherein during the " b " step, the nano-wires are formed by “Coulomb” explosions or through thermal transients. Way. 18. The method of claim 17, wherein during the " c " step, a sodium hypochlorite-containing or potassium oxide-containing solution is used. 18. The method of claim 17, wherein the real nano-tracks formed during step "c" are pretreated with ethanol, such as for wetting the inner track surface.

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