KR101048440B1 - Heat sink capable of variably mounting led module and illumination device using the same - Google Patents

Abstract

PURPOSE: A heat sink for variably mounting an LED module and an illumination apparatus using the same are provided to enhance the efficiency of heat dissipation through increasing an area contacted on a LED module by forming an imbedded path in the heat sink. CONSTITUTION: A plurality of radiation fins(110) disperses the high heat delivered from an LED module through an wide radiating area. A concave path(120) is formed for one or more LED modules to be inserted in the other side of a heat sink as well as for the light distribution location to be controlled in other side of the heat sink based on the movement of each LED module. The path is two-dimensionally formed to variously control the light distribution location of the LED module on the other side of the heat sink. A first LED module inlet hole(122) is formed for at last one LED module to be detachably inserted in the path. A guideline structure(140) is formed in at least one of the inner side, the outer side, and the lower side of the path.

Description

LED module variable mounting heat sink and lighting device using the same {HEAT SINK CAPABLE OF VARIABLY MOUNTING LED MODULE AND ILLUMINATION DEVICE USING THE SAME}

The present invention relates to a heat sink mounted with the LED module and a lighting device using the same. More particularly, the present invention relates to an LED module variable mounting type heat sink and a lighting device using the same, which variably change the position and number of LED modules and increase the heating area.

General lighting equipment such as fluorescent lamps and incandescent lamps generate heat and light together. However, in the case of light emitting diodes (LEDs), the light goes forward, but the heat is generated from the back and directed inside the module. If this heat is not released to the outside, it stays inside the module, which causes damage and deformation of parts such as LED chips and printed circuit boards (PCBs), which reduces the life of LED products.

1 is a perspective view showing a heat sink equipped with a conventional LED module. As shown in FIG. 1, a heat sink equipped with a conventional LED module is configured to transfer heat through a heat radiating fin 112 to radiate heat simply by placing the LED module 22 on the heat sink 12.

This conventional structure has a problem of reducing the lifetime of LED products by causing breakage and deformation of components such as LED chips and PCB () because the contact area for heat dissipation is narrow and heat dissipation is inefficient.

In addition, as shown in FIG. 1, the heat dissipation plate 12 has a problem in that the LED module 22 is fixed so that the number of the LED modules 22 and the light distribution direction are not easily adjusted. In particular, when adjusting the illuminance in a location or where a variable illuminance is required, the heat sink 12 in which the conventional LED module 22 is mounted may not be helpful.

Therefore, there is a need for an LED heat sink and a lighting device using the same, which can implement variable illumination while efficiently dissipating LED heat and can easily adjust the light distribution direction.

The present invention has been made by the necessity as described above, an object of the present invention is to provide a LED module variable mounting type heat sink and a lighting device using the same that can easily heat dissipation of the LED module and adjust the number and distribution of LED modules. There is.

In addition, an object of the present invention is to improve the efficiency of heat dissipation by increasing the contact area by forming a passage in which the LED module can be mounted variably on one surface of the heat sink, and to enable the variable coupling of the LED module, the number and light distribution The present invention provides an LED module variable mounting type heat sink and a lighting device using the same.

An object of the present invention as described above has a plurality of heat dissipation fins are formed on one surface and at least one LED module is inserted into the other surface is formed in the concave structure to be moved, the passage is based on the movement of each LED module The outer side is formed on the outside to adjust the light distribution position on the other side, the inner side facing the outer side and the bottom side connecting the outer side and the inner side is formed, the width of the passage to guide the movement It is achieved by providing an LED module variable mounting type heat sink, which is formed in a width corresponding to the maximum width of the module and has a locking jaw formed on at least one of the inner side, the outer side, and the bottom surface to prevent the LED module from falling off. Can be.

In addition, each LED module may be provided with a plurality of LED cells in the form of a chip.

The passage is preferably opened in the light distribution direction of each LED module.

In addition, the passage preferably has a portion of a circle formed by the outer side, the inner side, and the bottom in the form of a cross section.

In addition, the passage may have a cross-sectional shape in which the outer side and the inner side are symmetric with each other.

In addition, the inner side surface, the outer surface and the bottom surface is in contact with the outer surface of each LED module, the bottom surface may be formed with at least one fixing hole for fixing each LED module in the light distribution position.

At least one of the inner side and the outer side is preferably formed in a guide line structure for guiding the movement.

It is preferable that at least one side of the first LED module insertion port is connected to the passage from the outside for insertion mounting of the LED module.

The guide line structure forms a second LED module insertion hole made between one end and the other end, and the passage is preferably formed along the inner and outer sides of the guide line structure.

On the other hand, an object of the present invention is at least one LED module formed with a plurality of LED cells for light distribution; And a plurality of heat dissipation fins are formed on one surface, and a concave structure is formed so that at least one LED module is inserted and moved on the other surface, the passage being two-dimensionally on the other surface based on the movement of each LED module. The outer side is formed on the outside to adjust the light distribution position, the inner side facing the outer side and the bottom side connecting the outer side and the inner side, the width of the passage corresponding to the maximum width of the LED module to guide the movement It includes; LED module variable mounting type heat sink is formed in a width and the locking step is formed on at least one of the inner side, the outer side and the bottom to prevent the fall of the LED module;

 At least one LED module is formed on at least one side of the LED module variable mounting type heat sink is inserted through the first LED module insertion hole connected to the passage and the LED module variable, characterized in that the light distribution direction can be adjusted by movement It can be achieved by providing a lighting device using a mounted heat sink.

Each LED cell is preferably a chip on board LED cell.

In addition, the LED module variable mounting heat sink is preferably formed of a material selected from aluminum, copper and alloys thereof.

According to one embodiment of the present invention as described above, there is an effect of improving the efficiency of heat dissipation by increasing the contact area of the LED module by forming a buried passage in the heat sink.

In addition, by forming a passage through which the LED module can be variably mounted on one surface of the heat sink to enable the variable coupling of the LED module has the effect of controlling the number and light distribution direction.

1 is a perspective view showing a heat sink equipped with a conventional LED module;
Figure 2 is a perspective view showing a first embodiment of the present invention LED module variable mounting type heat sink,
3 is a cross-sectional view seen in the direction AA of FIG.
Figure 4 is a perspective view showing a second embodiment of the present invention LED module variable mounting type heat sink,
Figure 5a is a cross-sectional view showing a first modification of the concave structure passage of the configuration of the LED module variable mounting heat sink of the present invention,
Figure 5b is a cross-sectional view showing a second modification of the concave structure passage of the configuration of the LED module variable mounting heat sink of the present invention,
6 is a perspective view showing an embodiment of a lighting device using the present inventors LED module variable mounting type heat sink,
7 is a perspective view showing an LED module used in an embodiment of the present invention LED module variable mounting type heat sink.

<Configuration of the heat sink>

<J Example 1 >

Figure 2 is a perspective view showing a first embodiment of the LED module variable mounting heat sink of the present invention. As shown in FIG. 2, the first embodiment of the present invention includes a plurality of heat dissipation fins 110, a concave passage 120, a locking projection 130, and a guide line structure 140. In addition, a first LED module insertion hole 122 into which at least one LED module 20 is inserted and a second LED module insertion hole 124 formed at both ends of the guide line structure 140 are formed.

The first embodiment of the present invention inserts and combines at least one LED module 20 into the concave passage 120 so that the movement is guided along the concave passage 120 and at the same time the heat dissipation fin 110 is provided. It acts to efficiently heat the heat generated by the at least one LED module 20 through.

Hereinafter, each structure is explained in full detail with reference to FIG.

The plurality of heat dissipation fins 110 is a component necessary for dissipating high heat transmitted from the LED module 20 through a wide heat dissipation area and dissipating heat efficiently using convection of ambient air. It is formed on one surface of the heat sink at regular intervals and is made of a metal material (eg aluminum) with good thermal conductivity.

Concave passage 120 is formed so that at least one LED module 20 can be inserted into the other surface of the heat sink, but the light distribution position is adjusted two-dimensionally on the other surface based on the movement of each LED module 20. do. The LED module 20 is embedded in the passage 120 of the heat sink except for the light distribution direction.

That is, the width formed on the inner side and the outer side of the passage 120 is formed to correspond to the width of the LED module 20, the locking step 130 to prevent the fall of the LED module 20 to the upper side of the inner side As a result, the LED module 20 inserted into the passage 120 is embedded in the passage 120 of the heat sink except that the movement is guided along the passage 120.

In addition, the passage 120 is formed two-dimensionally to adjust the light distribution position of each LED module 20 on the other surface of the heat sink.

Here, when each LED module 20 is a cylindrical module, the passage 120 is formed in a width corresponding to the diameter of the circle, and the position of the locking step 130 is determined to correspond to the height of the cylindrical shape.

The inner side and the bottom of the passage 120 contact or approach the outer surface of the at least one LED module 20 to maximize the heat conduction area for heat dissipation. And it is preferable to form at least one fixing hole (not shown) in the bottom surface to be fixed in the adjusted light distribution position of the LED module 20.

The first LED module insertion hole 122 serves as an entrance and exit with the outside formed so that the at least one LED module 20 can be inserted into or detached from the passage 120. It can be formed anywhere on the side of the heat sink, but it is desirable to form it on only one of the heat sink sides to prevent unintentional detachment of the LED module 20.

The guide line structure 140 may be formed on at least one of an inner side surface, an outer side surface, and a bottom surface of the passage 120, but the first embodiment is a structure formed with a line structure having a predetermined thickness on the inner side surface. This is a structure for diversifying the arrangement, such as the case where a plurality of LED modules 20 are uniformly arranged on one surface of the heat sink.

That is, by forming one side of the passage 120 as the guide line structure 140, the passage 120 is formed on both sides with the guide line structure 140 at the center thereof, and thus, several LED modules 20 vary. Can be deployed.

Since the guide line structure 140 is formed, the configuration of the second LED module insertion hole 124 made by one end and the other end of the guide line structure 140 is required. The second LED module insertion hole 124 serves as an entrance and exit of the LED module 20 between the two passages 120 divided by the guide line structure 140.

Guide line structure 140 also has a locking step 130 is formed on the upper side, but the guide line structure 140 has a passage 120 to both sides, so the locking step 130 is formed on both sides.

The guide line structure 140 need not be one. That is, the guide line structure 140 may be superimposed so that a plurality of guide line structures 140 are formed side by side and the passages 120 are formed at both sides of the plurality of guide line structures 140.

The heat dissipation fin 110, the concave structure passage 120, the locking projection 130, and the guide line structure 140 of the heat dissipation plate are manufactured by melting a material selected from copper, aluminum, and an alloy thereof and injecting the same into a mold or a mold. It can be produced by die casting. In addition, manufacturing is possible through machining such as turning, milling and cutting.

3 is a cross-sectional view taken along the direction A-A of FIG. 2. As shown in Figure 3, the inner side of the passageway 120 has a locking jaw 130 is formed on the upper side, one side of the inner side is formed of a guide line structure 140 and the upper locking jaw ( It can be seen that 130) is formed.

The passage 120 may be modified to achieve the object of the present invention, a modification to the cross-sectional portion (P) will be described later with reference to Figures 5a and 5b.

<J 2 Example >

Figure 4 is a perspective view showing a second embodiment of the LED module variable mounting heat sink of the present invention. As shown in FIG. 4, the heat dissipation fin 111 is formed on one surface of the heat sink 11, and a concave passage 121 is formed on the other surface of the heat sink 11, and the LED module 20 is connected to the passage 121 from the outside. The first LED module insertion hole 123 that can be inserted is formed as in the first embodiment.

However, the locking jaw 131 is formed at both sides of the upper side of the concave passage 121 to prevent the LED module 20 to be inserted from being dropped from the guide line structure. 140 is absent, the side surface in the passage 121 serves to guide the movement of the LED module 20.

<Of concave structure passage Variant >

5A is a cross-sectional view showing a first modified example of the concave structure passage of the configuration of the LED module variable mounting type heat sink of the present invention, and FIG. 5B is a cross-sectional view showing a second modified example of the concave structure passage among the configurations of the LED module variable mounting type heat sink of the present invention. .

As shown in FIGS. 5A and 5B, the cross-section P illustrated in FIG. 3 may be disposed on the inner side (FIG. 5A) or the bottom surface (FIG. 5B) according to the shape of the LED modules 20a and 20b, respectively. 130a, 130b) to form a structure that can prevent falling during the movement, and further guide the movement.

<Lighting device>

Figure 6 is a perspective view showing an embodiment of a lighting device using the LED module variable mounting heat sink of the present invention. As shown in Figure 6, one embodiment of the present invention lighting device is composed of the LED module variable mounting heat sink 10 and the LED module 20 shown in FIG. Here, the same reference numerals are used for the same configuration as the configuration shown in FIG.

One embodiment of the present invention lighting device is inserted into the LED module 20 in the concave passage 120 through the first LED module insertion hole 122, and guides the movement through the guide line structure 140 Place the LED module 20 in the appropriate position. In addition, the LED module 20 may be disposed through the second LED module insertion hole 124.

In particular, as shown in FIG. 6, in one embodiment of the present invention, the number of LED modules 20 is adjusted according to the illuminance required for the application location, and the light distribution direction is changed through the arrangement of the LED modules 20. Act to be controlled.

In addition, the lighting device of the present invention may be connected to each LED module 20 from an external power source (not shown) to form a wire (not shown) for supplying current, which is the first and second LED module insertion holes 122 and 124. Via is installed along one side of the inner side of the passage (120). In addition, a hole (not shown) through which an electric wire may pass may be formed on the bottom of the passage 120.

7 is a perspective view showing an LED module used in an embodiment of the present invention LED module variable mounting type heat sink. As shown in FIG. 7, in the LED module 20, two or more LED cells 210 are disposed, and the LED cells 210 are chip-on-board (COB) type LED cells as semiconductor cells. Is manufactured by directly connecting and molding a gold wire on a printed circuit board (PCB). In addition, the connector 220 is a configuration for connecting a wire (not shown) connected to an external power source (not shown) to supply current to the plurality of LED cells 210.

However, the LED module 20 is not limited to the arrangement of the chip of the COB method, and should be inserted into the LED module variable mounting type heat sink 10, the case is manufactured in a shape that can be guided to move and prevent the fall. . Therefore, the LED module may be formed by forming a plurality of LED cells manufactured by LED packaging on a separate printed circuit board.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood that the invention may be practiced. Therefore, the embodiments described above are to be understood as illustrative and not restrictive in all aspects. In addition, the scope of the present invention is indicated by the appended claims rather than the detailed description above. Also, it is to be construed that all changes or modifications derived from the meaning and scope of the claims and their equivalent concepts are included in the scope of the present invention.

10, 11, 12: heat sink
20, 20a, 20b, 22: LED module
110, 111, 112: multiple heat sink fins
120, 121: passage
122, 123: first LED module insertion hole
124: second LED module insertion hole
130, 131, 130a, 130b: jamming jaw
140: guideline structure
210: LED cell
220: connector

Claims (12)

A plurality of heat dissipation fins are formed on one surface and at least one LED module is inserted and mounted on the other surface to form a concave passage so as to be moved.
The passage connects an outer side, an inner side facing the outer side, and an outer side and the inner side formed on the outside to adjust the light distribution position on the other surface based on the movement of each LED module. Is formed in the bottom,
The width of the passage is formed to have a width corresponding to the maximum width of the LED module to guide the movement and the locking step for preventing the fall of the LED module on at least one of the inner side, the outer side and the bottom surface. LED module variable mounting type heat sink, characterized in that is formed.
The method of claim 1,
LED module variable mounting type heat sink, characterized in that each LED module is provided with a plurality of chip-shaped LED cell.
The method of claim 1,
LED panel variable mounting heat sink, characterized in that the passage is open in the light distribution direction of each LED module.
The method of claim 1,
The passage is the LED module variable mounting heat sink, characterized in that the cross-sectional shape formed by the outer side, the inner side and the bottom portion is part of a circle.
The method of claim 1,
The passage has an LED module variable mounting heat sink, characterized in that the outer side and the inner side has a cross-sectional shape symmetrical with each other.
The method of claim 1,
The inner side surface, the outer surface and the bottom surface is in contact with the outer surface of each LED module,
The bottom surface of the LED module variable mounting heat sink characterized in that at least one fixing hole for fixing the respective LED module in the light distribution position.
The method of claim 1,
LED module variable mounting heat sink, characterized in that at least one of the inner side and the outer side is formed in a guide line structure for guiding the movement.
The method of claim 7, wherein
LED module variable mounting heat sink, characterized in that the first LED module insertion hole is connected to the passage from the outside for insertion mounting of the LED module on at least one side.
The method of claim 7, wherein
The guide line structure forms a second LED module insertion hole made between one end and the other end,
The passageway is a variable heat-mounting LED module, characterized in that formed along the inner and outer sides of the guide line structure.
At least one LED module having a plurality of LED cells configured to distribute predetermined light; And
A plurality of heat dissipation fins are formed on one surface and a concave structure is formed so that at least one LED module can be inserted and moved on the other surface, and the passage is formed on the other surface based on the movement of the respective LED modules. It is formed with an outer side formed on the outside to adjust the light distribution position in dimension, the inner side facing the outer side and the bottom surface connecting the outer side and the inner side, the width of the passage to guide the movement An LED module variable mounting type heat sink formed in a width corresponding to a maximum width of the LED module and having a locking step formed on at least one of the inner side, the outer side, and the bottom to prevent the LED module from falling off; Including,
The at least one LED module,
The LED module variable mounting heat sink is formed on at least one side of the LED module variable mounting heat sink is inserted through the first LED module insertion hole connected to the passage and the light distribution direction of the light can be adjusted by the movement. Used lighting device.
The method of claim 10,
Each LED cell is a lighting device using an LED module variable mounting type heat sink, characterized in that the chip-on-board LED cell.
The method of claim 10,
The LED module variable mounting heat sink is a lighting device using an LED module variable mounting heat sink, characterized in that formed of a material selected from aluminum, copper and alloys thereof.

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