KR101047599B1 - Laser irradiation apparatus and laser cutting line width control method using the same - Google Patents

Abstract

Provided are a laser irradiation apparatus and a laser cutting line width adjusting method using the same. The disclosed laser irradiation apparatus includes a light source supply unit, a lens module having a laser beam supplied from the light source supply unit, and a plurality of adjustment lenses arranged in a row and a transfer rail connected to and fixed to enable translational movement of the adjustment lenses. And adjusting the separation distance between the adjustment lenses to form a circular laser spot to match the focus at the processing point on the workpiece, and then moving the adjustment lens of any one of the plurality of adjustment lenses along the transfer rail. The circular laser spot formed at the processing point may be extended to produce a linear laser processing spot.

After the laser light component is focused in a single spot on a processing part requiring peeling, the control lens of any one of the plurality of adjusting lenses constituting the lens module is moved to extend in a vertical direction with respect to a single spot formed on the processing part. It is possible to create a laser processing spot of the line type to achieve a variety of laser processing line widths.

Laser, light source, adjustable lens, focus, rail, spot, line width

Description

Laser Irradiating Apparatus and The Method for Controlling Laser Cutting Linewidth using the same}

The present invention relates to a laser irradiation apparatus and a laser processing line width adjusting method using the same, and more particularly, to increase the optical density of a laser light component irradiated to a processing portion to remove a portion formed on the workpiece. In particular, a laser irradiation apparatus for forming a line-shaped laser spot at the processing site and laser processing using the same in the process of moving any one of the lenses after matching the focus of each of the lenses arranged in a line with the processing site It relates to a line width adjustment method.

BACKGROUND In recent years, electronic components are plated more and more in the process of mounting components required for miniaturization and precision. For example, in the case of the connector product, the soldering is applied to the PCB board in order to improve the solderability by using gold plating with good affinity with lead, and the female / pin of the pin is physical. In the state of contact with the to improve the electrical conductivity. On the other hand, as the size of electronic products decreases, connector pins also inevitably become smaller. As a result, side effects in which lead is attached to the contact portions of the male / female pins during the soldering process result in an increase in the resistance of the product, resulting in a defect. Cases are frequent. In order to prevent such a problem, by peeling a gold plating of a certain part to reveal a nickel layer having low affinity with lead, a process of increasing the stability of the product by distinguishing the soldering part from the contact part is being added. Ni-Barrier). Various methods are used in the industry to implement the Ni-Barrier, which will be briefly described below. First, there is an ink masking method that prevents gold plating from a portion where ink is deposited by drawing a line with ink in a predetermined region by plating before plating, and a method of preventing plating by attaching a fine tape to a predetermined region. The above pre-plating treatment methods require a separate process of removing ink or tape after plating and are difficult to apply to minute processing parts.

In the post-plating treatment, the outermost layer of the workpiece is peeled off by irradiating the laser to a certain area by the force of the irradiated laser. Unlike the masking method, no additional post-process is required and the diameter of several micrometers or less is achieved by the lens. Laser spots can be made with

However, in the conventional laser irradiation method, since peeling occurs only when laser light of a certain energy density or more is used, there is a limit to widen the width of the Nikel Barrier. In order to increase the width of the Nikel Barrier, the laser beam can be irradiated with two branches at the same time to create a double width, which also requires twice the power, which inevitably increases the price of the laser generator and the cost of managing the equipment. 2 times. In addition, the Nikel Barrier width, once determined, is very difficult to widen or narrow before changing equipment, and the conventional laser processing method adopts angle-based positioning method, which makes it difficult to precisely adjust the position of the lens and products. As the distance from and to the angle varies, the machining quality is slightly different for each machining position. In other words, if the height of the product is changed, there is a difficulty in refocusing and resetting the lens each time.

In order to solve the above problems, after generating a circular laser processing spot by matching the horizontal and vertical focus of the laser light component passing through the plurality of adjustment lenses at the site requiring processing, any one Laser irradiation apparatus and laser processing line width control using the same to form a laser processing spot in the form of a line by linearly extending the laser processing spot through the process of moving the adjustment lens to remove a wide range of thin film at the processing site It is an object to provide a method.

Laser irradiation apparatus according to an aspect of the present invention provided to achieve the above object is a light source supply unit; And a lens module in which laser light supplied from the light source supply unit is incident, and a plurality of adjustment lenses arranged in a line and a transfer rail fixed to each other so as to allow translational movement of the adjustment lenses. The circular laser spot is formed at the processing point by adjusting one of the plurality of adjusting lenses along the transfer rail after adjusting the separation distance therebetween so as to form a circular laser spot at the processing point on the workpiece. It is characterized in that to produce a linear laser processing spot by stretching the laser spot.

The adjustment lens may include a first adjustment lens having a predetermined curvature in a first direction and a second adjustment lens having a predetermined curvature in a second direction and spaced apart from the first adjustment lens on the transport rail.

The first direction indicates a direction in which the lens module is parallel to the conveying direction of the workpiece, and the second direction indicates a direction in which the laser light emitted from the lens module processes the linear laser spot on the workpiece. Can be represented.

The laser irradiation apparatus may further include an expansion and contraction structure connected to each of the plurality of adjustment lenses, and the distance between the adjustment lenses may be adjusted by individually controlling the expansion and contraction structures.

Generating the linear laser processing spot may be possible by moving the first adjustment lens along the transfer rail based on the processing point where the plurality of adjustment lenses are in focus.

The laser irradiation apparatus may further include a laser energy homogeneous device which makes the overall energy distribution of the laser light cross section irradiated from the light source supply unit uniform.

Laser processing line width adjusting method according to another aspect of the present invention provided to achieve the above object is (a) the step of the laser light incident on the lens module having a plurality of adjustment lenses from the light source supply, (b) the Adjusting a focus in a first direction of the laser light by using a first adjustment lens among a plurality of adjustment lenses, (c) using the second adjustment lens among the plurality of adjustment lenses, adjusted in step (b) Adjusting the focus in the second direction to match the focus in the first direction, (d) the circular shape formed in step (c) by moving the first adjustment lens while the second adjustment lens is fixed Extending a focal laser spot in the first direction to form a linear focal laser spot, and (e) determining whether the linear focal laser spot meets a predetermined reference value; Characterized in that it comprises a step.

When the predetermined reference value is met, the plated material may be peeled off the workpiece using the linear focus laser spot.

The first adjustment lens has a predetermined curvature in the first direction, and the second adjustment lens has a predetermined curvature in the second direction.

The first direction indicates a direction in which the lens module is parallel to the conveying direction of the workpiece, and the second direction indicates a direction in which laser light emitted from the lens module processes a linear laser processing spot on the workpiece. Can be defined to represent.

The laser processing apparatus of the present invention described above moves the adjustment lens of any one of the plurality of adjustment lenses constituting the lens module after the laser light component is focused in a single spot on the processing portion requiring peeling, and the processing portion is moved. By generating a laser processing spot of the line type extending in the vertical direction with respect to a single spot formed in the to be able to achieve a variety of laser processing line widths.

The present invention has the advantage that the peeling process on the workpiece to be carried out with a certain quality through the process of moving each of the adjustment lens constituting the lens module in a constant distance between the processing site and the laser processing device. do.

The above objects, features and other advantages of the present invention will become more apparent by describing the preferred embodiments of the present invention in detail with reference to the accompanying drawings. Hereinafter, a laser irradiation apparatus and a laser cutting line width adjusting method using the same according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 is a schematic view showing an overall configuration of a laser irradiation apparatus according to the present invention, FIG. 2 is a schematic view showing the inside of the laser irradiation apparatus, FIG. 3 is a longitudinal direction of the laser light component through the first adjustment lens of the lens module 4 is a conceptual view showing a process of focusing on, FIG. 4 is a conceptual view showing a process of focusing in a horizontal direction of a laser light component through a second adjusting lens among the lens modules, and FIG. 5 is a focus through first and second adjusting lenses. 6 is a conceptual view showing a coincidence state, FIG. 6 is a conceptual view showing a linear laser processing spot formed at a focus coincidence position by moving a first adjustment lens after focus is matched in FIG. 5, and FIG. 7 is laser energy. Graph showing the energy distribution of the laser light component using a homogenizer, and FIG. 8 is a time-series method of the laser processing line width adjusting method according to the present invention. It is a flow chart.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Hereinafter, for convenience of description, a three-dimensional coordinate system is illustrated on the drawings, and the X-axis, the Y-axis, and the Z-axis are respectively defined and described. The X-axis direction indicates that the lens module 110 may approach or move away from the workpiece 1 along the longitudinal rail 12 of the guide rail 10, and the Y-axis direction indicates that the lens module 110 guides. It indicates that the rail 10 can move in parallel to the conveying direction of the workpiece 1 along the horizontal rail 14, the Z-axis direction is the laser light 140 irradiated from the lens module 110 to the workpiece ( 1) processing of the linear laser processing spot 142 in the vertical direction.

First, using FIG. 1 and FIG. 2, the whole structure of the laser irradiation apparatus 100 of this invention is examined. A lens module 110 having a plurality of adjustment lenses 122 and 132, a light source supply unit 20 for supplying laser light to the lens module 110, and a lens module 110 to be generally transported in the X-axis or Y-axis direction. The guide rail 10 is provided. The laser light 140 irradiated from the light source supply unit 20 undergoes a process of adjusting focus by the plurality of adjustment lenses 122 and 132 in the lens module 110 and is linear in the Z-axis direction on the workpiece 1. The laser processing spot 142 is formed.

The lens module 110 may include a plurality of individual lens units, but preferably includes a pair of lens units 120 and 130. The first lens unit 120 may include a first connecting lens 122, a first lens fixing frame 121 into which the first adjusting lens 122 is fitted, and a first connector directly connected to the first lens fixing frame 121. 125, and a first stretchable structure 124 connected to the first connecting member 125 and capable of stretching, and consequently, a translational movement of the first lens fixing frame 121. Similarly to the case of the first lens unit 120, the second lens unit 130 also includes the second adjustment lens 132, the second lens fixing frame 131, the first connector 135, and the second expansion and contraction. The structure 134 is provided. The first lens fixing frame 121 and the second lens fixing frame 131 are respectively connected to the first rail guide 126 and the second rail guide 136 at the bottom, and the rail guides 126 and 136 are transport rails 102. ) Can be translated. The conveying rail 102 may be arranged in a plurality of conveying rails 103 and 104 structure arranged side by side, but the number thereof is not limited.

The lens module 110 includes a housing 105 accommodating the lens parts 120 and 130 and a support 101 coupled to a lower end of the housing 105. The support 101 is disposed on the guide rail 10 composed of the longitudinal rail 12 and the transverse rail 14 to move freely on the XY plane, thereby facilitating the two-dimensional movement of the lens module 110. .

Here, the step of forming a linear laser processing spot 142 of a predetermined range on the workpiece 1 using the laser processing apparatus 100 in the X-axis direction along the longitudinal axis 12 of the guide rail 10 After moving the lens module 110 to the workpiece (1) as a whole to adjust the expansion and contraction structure (124,134) to adjust the separation distance between the lens fixing frame (121,131) to require processing on the workpiece (1) The focus of the site can be matched. In an embodiment of the present invention by peeling the gold, a conductive material plated on the electronic product to expose the nickel to make a nickel barrier to increase the stability of the product to be the main point.

Hereinafter, a process of forming the focal laser spots 129 and 139 formed by overlapping and collecting the laser light components incident from the light source supply unit 20 will be described with reference to FIGS. 3 and 4.

First, as shown in FIG. 3, the first incident light 123 that passes through the first adjustment lens 122 from the light source supply unit 20 gradually decreases in the horizontal direction and gradually decreases in the vertical direction after being transmitted. To form a first focal laser spot 129. The first incident light 123 may be divided into a state in which the first light vertical component 127 and the first light horizontal component 128 are divided. The first light vertical component 127 controls the first adjustment lens 122. As the inclination changes over time, they are collected together, and the first light transverse component 128 is formed in the same direction as it is. The above process is possible because the first adjusting lens 122 has a shape of a cylindrical lens having a constant radius of curvature with respect to the Z axis. Eventually, it can be seen that the first focal laser spot 129 has a flat bar shape in the horizontal direction.

Referring to FIG. 4, the second incident light 133 passing through the second adjustment lens 132 from the light source supply unit 20 maintains a constant size in the Z-axis direction and becomes smaller in the Y-axis direction after being transmitted. To form a second focal laser spot 139. The second incident light 133 may be divided into a state in which the second light horizontal component 137 and the second light vertical component 128 are divided. The second light horizontal component 137 controls the second adjustment lens 132. As the inclination changes over time, they are collected and the second longitudinal components 138 are formed in the same direction. The above process is possible because the second adjusting lens 132 has a cylindrical lens shape having a constant radius of curvature with respect to the Y-axis direction. Eventually, it can be seen that the second focal laser spot 139 has a shape of a bar shape flat in the longitudinal direction.

In FIG. 5, incident light 123 and 133 passing through the first and second adjustment lenses 122 and 132 while adjusting the separation distance d between the first and second adjustment lenses 122 and 132 by adjusting the stretchable structures 124 and 134. The first and second focal laser spots 129 and 139 formed at each other. This results in the creation of a fine circular laser spot. That is, the surface of the incident light component initially formed on the first adjustment lens 122 and the second adjustment lens 132 is reduced in size in the Y-axis and Z-axis directions. The density of energy is increased.

FIG. 6 illustrates a process of changing the circular laser spot set in FIG. 5 to a linear laser spot by extending in the Z-axis direction. When the separation distance between the first and second adjustment lenses 122 and 132 is changed from d to d 'by fixing the second adjustment lens 132 and moving the first adjustment lens 122, the first and second focusing laser spots The first focal laser spot 129 ′ is reset at a position spaced further away from the distance 129, 139. Here, a linear laser processing spot of a type in which an existing minute circular laser spot is extended in the Z-axis direction by the gap between the first optical vertical components 127 in the existing first focal laser spot 129 is increased vertically. Results in a change to (142). That is, the point where the linear laser processing spot 142 is formed in FIG. 6 is formed at the same position as the point where the first and second focusing laser spots 129 and 139 coincide in FIG. 5. It is located in the to proceed the peeling of the plated portion.

In this process, in the process of irradiating the linear laser processing spot 142 on the workpiece 1 to be removed, there is an advantage in that the pattern width to be processed can be changed by precisely adjusting the interval between the plurality of adjustment lenses. In other words, the energy to be irradiated is concentrated to improve the processing efficiency. Here, in the method of performing the plating removal process using the conventional circular or elliptical laser light, the range that can be realized using a single spot is about 200 μm at maximum, but the linear laser processing spot 142 as in the present invention is used. Using the plating removal process, it is possible to implement a single spot to the range of 500㎛ or more. In addition, in the method of controlling the machining position by adjusting the angle as in the related art, there is a limitation in that the machining quality is different for each machining position by changing the distance from the workpiece, but in the present invention, the linear movement method is used. By maintaining a constant interval between the lens module 110 and the workpiece 1, it is possible to maintain a uniform processing quality at all times.

On the other hand, the laser irradiation device 100 of the present invention may further include a laser energy homogeneous device (not shown). Referring to FIG. 7, at 42, the energy distribution of the laser beam cross section is a Gaussian distribution having a high central portion and a low peripheral portion. When the beam is peeled off, the center portion of the plating line is deeply dug and the periphery is poorly peeled off. Referring to reference numeral 44 to solve such a problem, in the present invention, the entire energy distribution of the laser beam cross section is made uniform by using a laser energy homogenizer.

Hereinafter, a laser cutting line width adjusting method using the laser irradiation apparatus according to the present invention will be described with reference to FIG. 8. First, laser light is incident from the light source supply unit 20 to the entrance hole 106 formed in the lens module 110 (S11). By adjusting the first elastic structure 124 to move the first lens unit 120 on the conveyance rail 102 to adjust the focus in the Z-axis direction (S12), and to adjust the second elastic structure 134 The second lens unit 130 adjusts the focus in the Y-axis direction by moving on the transfer rail 102 (S13). Through the combination of the steps S11 and S12, it is possible to form a fine circular focus laser spot at the point where the focus points of the first and second adjustment lenses 122 and 132 match (S14). Thereafter, the second adjustment lens 132 extends the circular focus laser spot formed in step S13 in the longitudinal direction through the process of moving the first adjustment lens 122 in a fixed state (S15). Here, the order of steps S12 and S13 may be reversed, and the steps S12, 13, and 14 may be simultaneously performed.

Next, a process of checking whether the line width of the laser light 140 formed on the workpiece 1 corresponds to the preset reference line width is performed (S16). If it is determined in step S16 that the reference line width is met, the plated material in a predetermined region on the workpiece 1 is peeled off (S17), and if it does not meet the reference line width, the process of adjusting the processing line width is performed again in step S15.

As described above, the laser processing line width adjusting method of the present invention moves the adjustment lens of any one of the plurality of adjustment lenses constituting the lens module after the laser light component is focused in a single spot on the processing portion requiring peeling. By generating a laser processing spot of the line type extending in the vertical direction with respect to a single spot formed in the processing site it is possible to achieve a variety of laser processing line widths.

While preferred embodiments of the present invention have been described above, the present invention is not limited to the above-described specific embodiments. That is, those skilled in the art to which the present invention pertains can make many changes and modifications to the present invention without departing from the spirit and scope of the appended claims, and all such appropriate changes and modifications are possible. Equivalents should be considered to be within the scope of the present invention.

1 is a schematic view showing the overall configuration of a laser irradiation apparatus according to the present invention,

2 is a schematic view of the inside of the laser irradiation apparatus set to be visible;

3 is a conceptual view showing a process of focusing in the Z-axis direction of the laser light component through the first adjustment lens of the lens module,

4 is a conceptual diagram illustrating a process of focusing a laser light component in a Y-axis direction through a second adjusting lens of the lens module;

5 is a conceptual view showing a state in which focus is matched through the first and second adjustment lenses;

FIG. 6 is a conceptual view showing a linear laser processing spot formed at a focal spot by moving a first adjusting lens after focus is matched in FIG. 5;

7 is a graph illustrating an energy distribution of laser light components using a laser energy homogenizer, and

8 is a flowchart illustrating a method for adjusting the laser processing line width according to the present invention in a time series manner.

<Description of the symbols for the main parts of the drawings>

10: guide rail 20: light source supply unit

100: laser irradiation device 101: support

102: transfer rail 110: lens module

120: first lens unit 121: first lens fixing frame

122: first adjusting lens 123: first incident light

124: first stretchable structure 125: first connector

126: first rail guide 127: first light longitudinal component

128: first light horizontal component 129: first focus laser spot

130: second lens unit 131: second lens fixing frame

132: second adjusting lens 133: second incident light

134: second stretchable structure 135: second connecting body

136: second rail guide 137: second light horizontal component

138: second light vertical component 139: second focus laser spot

140: laser light 142: linear laser processing spot

Claims (10)

A light source supply unit; And And a lens module having a laser beam supplied from the light source supply unit, and having a plurality of adjustment lenses arranged in a line and a transport rail connected to and fixed to allow translational movement of the adjustment lenses. After adjusting the separation distance between the adjustment lens to form a circular laser spot to match the focus point at the processing point on the workpiece, and then move the adjustment lens of any of the plurality of adjustment lenses along the conveying rail to the processing point The laser irradiation apparatus, characterized in that to form a linear laser processing spot by stretching the circular laser spot formed. The method of claim 1, The adjustment lens may include a first adjustment lens having a predetermined curvature in a first direction and a second adjustment lens having a predetermined curvature in a second direction and spaced apart from the first adjustment lens on the conveyance rail. Probe device. 3. The method of claim 2, The first direction indicates a direction in which the lens module is parallel to the conveying direction of the workpiece, and the second direction indicates a direction in which the laser light emitted from the lens module processes the linear laser spot on the workpiece. It defines by showing, The laser irradiation apparatus characterized by the above-mentioned. 3. The method of claim 2, And a stretchable structure respectively connected to the plurality of adjustment lenses, wherein the distance between the adjustment lenses can be adjusted by individually controlling the stretched structure. The method of claim 4, wherein The generating of the linear laser processing spot may be performed by moving the first adjustment lens along the transfer rail based on the processing point where the focus points of the plurality of adjustment lenses coincide. The method of claim 5, And a laser energy homogeneous device which makes the overall energy distribution of the laser light cross section irradiated from the light source supply unit uniform. (a) injecting laser light into the lens module including the plurality of adjustment lenses from the light source supply unit; (b) adjusting a focus in a first direction of the laser light by using a first adjustment lens among the plurality of adjustment lenses; (c) adjusting the focus in the second direction to match the focus in the first direction adjusted in the step (b) by using a second adjustment lens among the plurality of adjustment lenses; (d) extending the linear focus laser spot by extending the circular focus laser spot formed in the step (c) in the first direction by moving the first adjustment lens while the second adjustment lens is fixed. Forming; And (e) determining whether the linear focal laser spot meets a predetermined reference value. The method of claim 7, wherein The method of controlling the laser beam width, characterized in that when the material meets the set reference value, the plated material on the workpiece can be peeled off using the linear focus laser spot. The method of claim 8, And the first adjustment lens has a predetermined curvature in a first direction, and the second adjustment lens has a certain curvature in a second direction. The method of claim 9, The first direction indicates a direction in which the lens module is parallel to the conveying direction of the workpiece, and the second direction indicates a direction in which the laser light emitted from the lens module processes the linear laser spot on the workpiece. The laser processing line width adjustment method characterized by defining as showing.

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