KR101044447B1 - Smart bonding method of control box having metal case - Google Patents

Smart bonding method of control box having metal case Download PDF

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Publication number
KR101044447B1
KR101044447B1 KR1020100126684A KR20100126684A KR101044447B1 KR 101044447 B1 KR101044447 B1 KR 101044447B1 KR 1020100126684 A KR1020100126684 A KR 1020100126684A KR 20100126684 A KR20100126684 A KR 20100126684A KR 101044447 B1 KR101044447 B1 KR 101044447B1
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KR
South Korea
Prior art keywords
ground
control circuit
metal
line
panel
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KR1020100126684A
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Korean (ko)
Inventor
김선호
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김선호
주식회사 한국서지연구소
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Priority to KR1020100126684A priority Critical patent/KR101044447B1/en
Application granted granted Critical
Publication of KR101044447B1 publication Critical patent/KR101044447B1/en
Priority to PCT/KR2011/008747 priority patent/WO2012081840A2/en
Priority to EP11848092.0A priority patent/EP2654144A4/en
Priority to US13/323,969 priority patent/US20120147511A1/en

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    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
    • H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
    • H02B1/16—Earthing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • H01R4/66—Connections with the terrestrial mass, e.g. earth plate, earth pin
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
    • H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
    • H02B1/26—Casings; Parts thereof or accessories therefor
    • H02B1/30—Cabinet-type casings; Parts thereof or accessories therefor
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
    • H02H9/00—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection
    • H02H9/02—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess current

Abstract

PURPOSE: A smart bonding method of a control box with a metal case is provided to replace a ground line with a metal panel which is placed in the control box, thereby drastically reducing the amount of reactance components and skin effects. CONSTITUTION: A control circuit(20) is installed in a control box(1) including a metal box. A surge protector(30) for power is installed between a power line and the control circuit. A communication surge protector(40) is installed between a communication line and the control circuit. A surge protector(60) for a sensor is installed between a sensor line and the control circuit. The ground terminal of the surge protector for a sensor is bonded with a metal panel(10). Bonding units(21,31,41,51,61) are formed on the metal panel. A ground bonding unit(70) is formed on one side of the metal panel. The control circuit and the ground terminals of the surge protectors are bonded with the metal panel.

Description

금속제 함체를 구비한 제어반의 스마트 본딩공법{Smart Bonding Method of Control Box Having Metal Case}Smart Bonding Method of Control Box Having Metal Case

본 발명은 제어반 내에 설치되는 서지 보호기 간을 본딩하는 등전위 본딩공법에 관한 것으로서, 보다 상세하게는 각 서지 보호기를 제어반 내의 금속제 패널 상에 본딩함으로써 종래 접지선에 대한 리액턴스 성분을 현저하게 감소시키고 판넬의 넓은 면적에 의해 표피 효과를 감소시킴으로써 서지에 대한 전압강하를 줄여 서지 보호기 간의 등전위 본딩 효과를 배가시킬 수 있도록 하는 기술에 관한 것이다.
The present invention relates to an equipotential bonding method for bonding between surge protectors installed in a control panel, and more particularly, by bonding each surge protector on a metal panel in a control panel, significantly reducing the reactance component of the conventional ground wire and widening the panel. The present invention relates to a technique for reducing the voltage drop on a surge by reducing the skin effect by the area to double the effect of equipotential bonding between surge protectors.

공장, 플랜트 등 각종 설비에는 설비에 연결된 전기, 전자 기기들의 전력 공급 및 장비의 운전제어, 정보 전달 등을 위하여 제어반을 구비하고 있다. 이러한 제어반(100)은 함체 내부에 금속제 패널이 설치된 구조로서, 금속제 패널 내에 전기, 전자 기기들의 함체 전력 공급 및 장비의 운전제어, 정보 전달 등을 제어하기 위한 제어회로가 설치된다.Various facilities such as factories and plants are equipped with a control panel for power supply of electric and electronic devices connected to the facility, operation control of the equipment, and information transmission. The control panel 100 is a structure in which a metal panel is installed inside the enclosure, and a control circuit is installed in the metal panel to control enclosure power supply, operation control of equipment, and information transmission.

제어반은 통상적인 전자 기기들과 마찬가지로 서지 발생에 대한 위험에 노출되어 있으며, 서지 발생에 따른 기기 손상을 방지하기 위한 장치들이 구비되어 있다.The control panel is exposed to the risk of surge occurrence, like the conventional electronic devices, and is provided with devices for preventing the damage of the device due to the surge.

도 1은 종래 서지 보호기가 설치된 제어반의 내부 구조를 도시한 블럭도이다. 도 1에 도시된 바와 같이, 제어반(100)에는 제어회로(120)가 설치된 금속제 패널(110)이 구비되고, 외부로부터 인입되는 전원선, 통신선, 신호선, 센서선 등이 제어회로(120)에 연결되어 있다. 1 is a block diagram showing the internal structure of a control panel in which a conventional surge protector is installed. As shown in FIG. 1, the control panel 100 includes a metal panel 110 provided with a control circuit 120, and a power line, a communication line, a signal line, a sensor line, and the like drawn from the outside are provided in the control circuit 120. It is connected.

이러한 전원선, 통신선, 신호선, 센서선 등을 통해 유입되는 서지전류나 접지로부터 역류하는 서지전류에 의해 제어회로(120) 또는 각 선로를 통해 연결된 기기들이 손상될 수 있으므로 각 선로와 제어회로(120) 간에는 전원용 서지 보호기(130), 통신용 서지 보호기(140), 신호용 서지 보호기(150), 센서용 서지 보호기(160)가 설치되고, 각 서지 보호기(130 ~ 160)와 제어 회로(120)의 접지 단자는 접지선(170)을 통해 접지단자대(180)에 본딩하여 각 선로 및 기기 간이 등전위가 되도록 하는 등전위 본딩 방식이 활용되고 있다. Since the control circuit 120 or the devices connected through each line may be damaged by the surge current flowing through the power line, the communication line, the signal line, the sensor line, or the like, the surge current flowing back from the ground may damage each line and the control circuit 120. ), A surge protector 130 for communication, a surge protector 140 for communication, a surge protector 150 for a signal, a surge protector 160 for a sensor, and a ground of each surge protector 130 to 160 and the control circuit 120 are installed. An equipotential bonding method is used in which a terminal is bonded to the ground terminal block 180 through the ground line 170 so that each line and the device become equipotential.

이러한 등전위 본딩에 의해 제어회로와 선로 및 선로와 선로 간의 전위차가 방지되어 서지 발생 시에 서지 전류의 유입을 차단할 수 있게 된다. This equipotential bonding prevents the potential difference between the control circuit and the line and the line and the line, thereby preventing the inflow of the surge current in the event of a surge.

그러나, 이러한 제어반의 등전위 본딩 방식의 경우 제어 회로(120)와 각 서지 보호기(130 ~ 160)의 접지단자와 접지단자대(180) 간을 접지선(170)을 이용하여 연결함으로써 접지선의 서지 주파수(20KHz ~ 20MHz)에 대한 리액턴스 성분이 증가하고 접지선의 작은 단면적에 의한 표피효과가 크게 작용함으로써 서지에 대한 전압강하(즉, 전위차 발생)가 커서 서지 보호기 간의 등전위 본딩 효과가 크게 저하되는 문제점이 있다.However, in the case of the equipotential bonding method of the control panel, the surge frequency (20KHz) of the ground line is connected between the control circuit 120 and the ground terminal and the ground terminal block 180 of each surge protector 130 to 160 using the ground line 170. ~ 20MHz), the reactance component increases, and the skin effect due to the small cross-sectional area of the ground wire acts greatly, resulting in a large drop in voltage (that is, a potential difference), which greatly reduces the equipotential bonding effect between the surge protectors.

예를 들어, 통상의 60Hz의 상용 전원이 인가되는 경우에는 접지선(170)의 리액턴스가 수백 μm 정도로 매우 낮아 무시할 수 있는 수준이나, 1MHz의 서지전류가 흐르는 경우 접지선 1m의 리액턴스는 2πfL = 6.28 ×106 × 1.62 × 10-6 = 10.08 Ω 로서, 상당히 높아 서지 발생시에 접지선(170)의 리액턴스 성분으로 인해 각 서지 보호기 간에 전위차가 발생하여 등전원 본딩의 효과가 저하되는 문제가 발생하게 된다.For example, when a typical 60 Hz commercial power supply is applied, the reactance of the ground line 170 is very low, which may be negligible as a few hundred μm, but when 1 MHz of surge current flows, the reactance of 1 m of the ground line is 2πfL = 6.28 × 10 6 × 1.62 × 10 −6 = 10.08 Ω, which is quite high, and a potential difference occurs between the surge protectors due to the reactance component of the ground line 170 at the time of a surge, resulting in a problem that the effect of the equipotential bonding is lowered.

또한, 접지선을 일일이 연결해주어야 하므로 자재비가 증가하고 제어반의 케이블이 매우 지저분해지는 문제점도 있다.
In addition, since the ground wire must be connected to each other, the cost of materials increases and the cable of the control panel is very messy.

따라서, 본 발명은 상기와 같은 문제점을 해결하기 위해 안출된 것으로서, 본 발명의 목적은 각 서지 보호기를 접지 단자대에 연결하기 위해 사용하던 접지선을 제어반 내에 구비되는 금속제 패널로 대체함으로써 리액턴스 성분과 표피 효과를 현저하게 감소시킴으로써 서지 보호기 간의 등전위 본딩 효과를 배가시킬 수 있도록 하는 것이다.Accordingly, the present invention has been made to solve the above problems, and an object of the present invention is to replace the ground wire used to connect each surge protector to the ground terminal block with a metal panel provided in the control panel, the reactance component and the skin effect. It is possible to double the effect of equipotential bonding between surge protectors by remarkably reducing

본 발명의 다른 목적은 제어회로 및 각 서지 보호기와 접지 단자대 간을 연결하는 접지선이 요구되지 않음으로써 자재 비용을 감소시킬 수 있도록 하는 것이다.Another object of the present invention is to reduce the material cost by not requiring a grounding line connecting the control circuit and each surge protector with the ground terminal block.

상기와 같은 목적을 달성하기 위한 본 발명의 일 측면에 따르면, 금속제 함체를 구비한 제어반 내에 설치되는 적어도 하나의 서지 보호기의 접지단자를 인접한 금속 패널에 본딩하고, 본딩된 금속 패널의 일측을 접지에 연결하는 것을 특징으로 하는 금속제 함체를 구비한 제어반의 스마트 본딩공법이 제공된다.According to an aspect of the present invention for achieving the above object, the ground terminal of at least one surge protector installed in the control panel having a metal enclosure is bonded to the adjacent metal panel, and one side of the bonded metal panel to the ground Provided is a smart bonding method for a control panel having a metal enclosure, characterized in that for connecting.

여기서, 상기 금속 패널은 제어회로가 설치되는 금속제 패널이고, 상기 제어회로의 접지단자가 상기 금속제 패널에 본딩되는 것이 바람직하다.Here, the metal panel is a metal panel in which a control circuit is installed, and the ground terminal of the control circuit is bonded to the metal panel.

삭제delete

본 발명에 따르면, 제어반의 금속제 함체 또는 금속제 패널을 이용하여 각 서지 보호기 간을 등전위 본딩하여 기기와 선로 간 및 선로와 선로 간의 확실한 등전위를 보장함으로써 서지 유입에 따른 기기 손상을 미연에 방지할 수 있는 효과가 있다.According to the present invention, by ensuring the equipotential bonding between the device and the line and between the line and the line by equipotential bonding between each surge protector using a metal enclosure or a metal panel of the control panel, it is possible to prevent damage to the device due to surge inflow. It works.

또한, 제어회로 및 각 서지 보호기와 접지 단자대 간을 연결하는 접지선이 요구되지 않음으로써 자재 비용을 감소시킬 수 있는 효과도 있다.
In addition, the cost of the material can be reduced by eliminating the need for a ground line connecting the control circuit and each surge protector to the ground terminal block.

도 1은 종래 제어반 내부의 등전위 본딩 구조를 도시한 것이다.
도 2는 본 발명에 따른 제어반 내부의 등전위 본딩 구조를 도시한 것이다.1 illustrates an equipotential bonding structure in a conventional control panel.
Figure 2 shows an equipotential bonding structure inside the control panel according to the present invention.

이하에서는 첨부된 도면을 참조하여 본 발명의 바람직한 일 실시예를 상세하게 설명하기로 한다.
Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the present invention.

도 2는 본 발명에 따른 제어반 내부의 등전위 본딩 구조를 도시한 것이다.Figure 2 shows an equipotential bonding structure inside the control panel according to the present invention.

도 2를 참조하면, 본 발명에 따른 제어반 내부의 등전위 본딩 구조는 금속제 함체를 구비한 제어반(1) 내에 설치되는 제어회로(20), 전원선과 제어회로(20) 간에 설치되는 전원용 서지 보호기(30), 통신선과 제어회로(20) 간에 설치되는 통신용 서지 보호기(40), 신호선과 제어회로(20) 간에 설치되는 신호용 서지 보호기(40) 및 센서선과 제어회로(20) 간에 설치되는 센서용 서지 보호기(60)의 접지단자를 금속제 패널(10)에 본딩하여 금속제 패널(10) 상에 본딩부(21, 31, 41, 51, 61)를 형성하고, 금속제 패널(10)의 일측에 접지선을 접속하기 위한 접지 본딩부(70)를 형성한다. Referring to FIG. 2, the equipotential bonding structure in the control panel according to the present invention includes a control circuit 20 installed in the control panel 1 having a metal enclosure, and a surge protector 30 for power installed between the power line and the control circuit 20. ), A communication surge protector 40 installed between the communication line and the control circuit 20, a signal surge protector 40 installed between the signal line and the control circuit 20, and a sensor surge protector installed between the sensor line and the control circuit 20. The ground terminal of 60 is bonded to the metal panel 10 to form bonding portions 21, 31, 41, 51, and 61 on the metal panel 10, and a ground wire is connected to one side of the metal panel 10. The ground bonding part 70 is formed.

도 2에서는 하나의 금속제 패널(10)에 제어 회로(20) 및 각 서지 보호기(30 ~ 60)의 접지단자가 본딩되는 것을 예시하였으나, 그 외에, 각각 제어반(1)의 금속 함체의 각 패널과 금속제 패널 중 가장 인접한 부분에 본딩부를 형성하는 것도 가능함은 물론이다.In FIG. 2, the control circuit 20 and the ground terminals of the surge protectors 30 to 60 are bonded to one metal panel 10. In addition, each panel of the metal enclosure of the control panel 1 may be bonded to each other. It is of course possible to form the bonding portion in the nearest portion of the metal panel.

이와 같이 금속 함체에 구비된 금속 패널에 제어 회로(20) 및 각 서지 보호기(30 ~ 60)의 접지단자가 본딩되는 경우 제어 회로(20)와 각 서지 보호기(30 ~ 60)간 및 각 서지 보호기 간의 리액턴스가 종래 접지선에 비해 현저하게 감소되어 서지 유입시에도 실질적인 등전위를 이루게 되는 것이 장점이다. 이는 본딩부 간이 좁은 단면적의 도선으로 연결되지 않고 넓은 면적의 금속 패널로 연결되어 표피 효과가 매우 낮고 그에 따라 리액턴스가 매우 낮기 때문이다.As such, when the control circuit 20 and the ground terminal of each surge protector 30 to 60 are bonded to the metal panel provided in the metal enclosure, between the control circuit 20 and each surge protector 30 to 60 and each surge protector. It is an advantage that the reactance of the liver is significantly reduced compared to the conventional ground wire to achieve a substantial equipotential even when a surge is introduced. This is because the bonding portion is not connected by a narrow cross-sectional conductive wire but is connected by a large area metal panel so that the skin effect is very low and thus the reactance is very low.

접지 본딩부(70)에서 인출되는 접지선은 양호한 대지접지가 있는 경우에는 대지접지에 직접 연결될 수 있으며, 그 외에 접지가 없거나 불량한 접지가 있는 경우에는 인근에 위치하는 금속 구조물에 연결되는 것도 가능하다. 이때, 금속 구조물은 대지에 접하거나 대지에 대향하도록 위치하는 것이 바람직한데, 금속재 배관과 건물의 철골조 등의 금속 구조물은 지면에 근접하여 설치되므로 그 자체가 양호한 접지로서 기능을 하기 때문이다.The ground wire drawn out from the ground bonding part 70 may be directly connected to the ground ground when there is a good ground ground, or may be connected to a metal structure located nearby when there is no ground or there is a poor ground. At this time, the metal structure is preferably located so as to contact the earth or to face the earth, because the metal structure such as metal pipes and steel framework of the building is installed close to the ground because it functions as a good ground itself.

여기서, 금속 구조물은 송수관, 수도관, 가스관, 온수관, 급수관, 배수관, 전선관, 프레임, 기계의 골조, 건물의 골조, 설비의 함체, 지하관정의 그라우팅, 케이싱, 양정파이프, 소방용 급수파이프 등일 수 있으며, 본 발명에 의할 경우 접지본딩부(70)를 제어패널(10)에 형성하고, 접지본딩부(70)와 제어반(1)의 금속 함체 간을 접지선으로 연결하는 것도 가능할 것이다.
Here, the metal structure may be a water pipe, a water pipe, a gas pipe, a hot water pipe, a water pipe, a drain pipe, a conduit, a frame, a frame of a machine, a frame of a building, an enclosure of a facility, a grout of an underground pipe, a casing, a head pipe, a fire water supply pipe, and the like. In the case of the present invention, the ground bonding part 70 may be formed in the control panel 10, and the ground bonding part 70 and the metal enclosure of the control panel 1 may be connected by a ground line.

1 : 제어반 10 : 금속제 패널
20 : 제어회로 30 : 전원용 서지 보호기
40 : 통신용 서지 보호기 50 : 신호용 서지 보호기
60 : 센서용 서지 보호기 70 : 접지 본딩부
21, 31, 41, 51, 61 : 본딩부1: control panel 10: metal panel
20: control circuit 30: surge protector for power supply
40: Surge protector for communication 50: Surge protector for signals
60: surge protector for sensors 70: ground bonding portion
21, 31, 41, 51, 61: bonding unit

Claims (3)

금속제 함체를 구비한 제어반 내에 설치되는 적어도 하나의 서지 보호기의 접지단자를 인접한 금속 패널에 본딩하고, 본딩된 금속 패널의 일측을 접지에 연결하는 것을 특징으로 하는 금속제 함체를 구비한 제어반의 스마트 본딩공법.
Smart bonding method for a control panel with a metal enclosure, characterized in that the ground terminal of at least one surge protector installed in the control panel having a metal enclosure is bonded to an adjacent metal panel, and one side of the bonded metal panel is connected to the ground. .
제 1 항에 있어서,
상기 금속 패널은 제어회로가 설치되는 금속제 패널이고, 상기 제어회로의 접지단자가 상기 금속제 패널에 본딩되는 것을 특징으로 하는 금속제 함체를 구비한 제어반의 스마트 본딩공법.
The method of claim 1,
And the metal panel is a metal panel on which a control circuit is installed, and a ground terminal of the control circuit is bonded to the metal panel.
삭제delete
KR1020100126684A 2010-12-13 2010-12-13 Smart bonding method of control box having metal case KR101044447B1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020100126684A KR101044447B1 (en) 2010-12-13 2010-12-13 Smart bonding method of control box having metal case
PCT/KR2011/008747 WO2012081840A2 (en) 2010-12-13 2011-11-16 Smart bonding method for equipment including a remote control panel and a control panel having a metal case for underground wells
EP11848092.0A EP2654144A4 (en) 2010-12-13 2011-11-16 Smart bonding method for equipment including a remote control panel and a control panel having a metal case for underground wells
US13/323,969 US20120147511A1 (en) 2010-12-13 2011-12-13 Smart ground bonding method for facilities

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US20160037793A1 (en) * 2013-03-14 2016-02-11 Tech Corporation Co., Ltd. Production method for natural-extract beverage
CN114498099A (en) * 2022-01-18 2022-05-13 东莞市纳百川电子科技有限公司 Electric control type drainage grounding device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160037793A1 (en) * 2013-03-14 2016-02-11 Tech Corporation Co., Ltd. Production method for natural-extract beverage
CN114498099A (en) * 2022-01-18 2022-05-13 东莞市纳百川电子科技有限公司 Electric control type drainage grounding device

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