KR101041654B1 - Amplifier for using in hybrid fiber coaxial network and method for changing pad therein - Google Patents

Abstract

The present invention relates to an amplifier and a method for replacing a pad during maintenance in the amplifier to block a service interruption state occurring during a pad replacement operation provided in the amplifier for maintenance of a hybrid fiber coaxial (HFC) network.

To this end, the amplifier of the present invention includes a board equipped with a connector that receives a plurality of pads and electrically connects the pads to each other, and a second pad to be replaced is inserted into the connector while the first pad is inserted through the connector. And both the first and second pads are electrically connected to the substrate. When the first pad is separated from the connector, the second pad is electrically connected to the substrate.

Accordingly, the present invention can block the service interruption state due to the replacement of the pad (PAD) during the signal check for maintenance, and can increase the work efficiency of the operator by allowing the signal check work to work during the day regardless of the time zone Make sure

HFC, PAD, Transmission Network, Maintenance

Description

AMPLIFIER FOR USING IN HYBRID FIBER COAXIAL NETWORK AND METHOD FOR CHANGING PAD THEREIN}

The present invention relates to an amplifier for use in a hybrid fiber coaxial (HFC) network, and more particularly, to an amplifier and a method for replacing a pad in the amplifier for preventing a service interruption state occurring during a pad replacement operation mounted in the amplifier. will be.

In general, the HFC network is composed of optical fiber and coaxial cable, which uses optical cables to broadcast stations and optical network units (ONU) and coaxial cables from optical stations to subscribers. It is a broadband transmission network that can transmit data. The HFC network can transmit data for the Internet, cable TV, crime prevention, disaster prevention, remote meter reading, and automatic control. Recently, IPTV services have been provided using such HFC networks.

This configuration of the HFC network can be shown as shown in FIG.

Referring to FIG. 1, the distribution sensor 120 receives data to be transmitted from the ISP 100 and a program provider (PP) 110 through the router 122 and the CMTS 126 to receive an optical transceiver ( 124 to the ONU (130). Then, the ONU 130 converts the transmitted optical signal into an RF signal and transmits it to the trunk bridge amplifiers (TBA) 140 and 142 through a coaxial transmission network. At this time, the ONU 130 converts the optical signal transmitted through the optical cable to the original RF signal on the downward side, and then amplifies the optical signal to a coaxial cable by amplifying the signal with an appropriate size through the RF amplification module. In addition, the upstream side converts the RF signal applied from the front end amplifier into an optical signal and transmits the optical signal.

The amplifiers (TBAs) 140 and 142 amplify the RF signals for compensating the signal loss according to the distance of the coaxial line and maintain the required level. The amplifier 140 is an trunk distribution amplifier used for a coaxial line and is used to distribute two or more signals. In this case, the pads PAD are mounted on the amplifiers 140 and 142 as elements that lower the RF signal with excessive RF signal strength.

Thereafter, the RF signals transmitted from the amplifiers 140 and 142 are transmitted to the cable modem 172 or the set top box STB of the subscriber's premises 170 through the distributor 150 and the brancher 160 to be connected to the PC 174. Or TV.

On the other hand, during the maintenance work for the HFC transmission network configured as described above, the signal check operation occupies a large portion.

Specifically, in the HFC transmission network as described above, each ONU, TBA, such as the equipment has its own input signal level is set, and when transmitting the signal from the distribution center 120 is calculated in consideration of this input signal level The signal level is transmitted at the set level.

In general, the distribution center 120 transmits a high transmission signal level in consideration of signal loss occurring when a signal is transmitted through a line.

As a result, a case where the signal level input to the ONU 130 and the amplifiers (TBAs) 140 and 142 is higher than a predetermined unique input level occurs, and the ONU 130 and the amplifiers (TBAs) 140 and 142 are generated. The pad PAD is mounted inside to attenuate the input signal level to an appropriate level.

That is, the corresponding pads are mounted according to how many dB the input signal needs to be lowered. For example, when the input signal level is 5dB higher than the preset input signal level, the pad may be lowered by 5dB.

At this time, the proper pad is checked through the signal check operation to determine how many dB the level should be lowered, and the appropriate pad is mounted according to the confirmed result.

After the appropriate pad is mounted, if the input signal level is constantly input to the equipment, there is no need to replace the pad separately.

However, since equipment such as ONU 130 and amplifiers (TBAs) 140 and 142 are installed outdoors as shown in FIG. 1, the input signal level is constantly input due to external environmental influences such as climate. Will not be.

Accordingly, PAD replacement is frequently performed through signal checks.

Then, referring to Figures 2 and 3 with respect to the current PAD replacement operation method, the pad (PAD) is mounted in the interior of the amplifier (TBA) (140, 142) as shown in Figure 2 (200, 210, 220, 230, 240, 250, 260, 270).

Currently, one pad PAD is mounted on the substrate as shown in FIG. 3A, and when the pad PAD is to be replaced, the pad PAD is detached from the substrate as shown in FIG. After replacing the pad to be replaced by mounting on the board.

However, even when only one of the pads is replaced in this way, the input signal is infinite and the service is interrupted.

As a result, workers are working at dawn in order to prevent service interruption, and such a dawning job has a problem in that safety accidents are not only large, but also work efficiency of workers is reduced.

In addition, as the IPTV service is gradually expanded in recent years, the signal inspection work for each equipment is increasing more and more in the HFC network, so there is an urgent need for technology development to solve the above problems.

Accordingly, an aspect of the present invention is to provide an amplifier and a method of replacing a pad in the amplifier to block a service interruption state due to a pad replacement when a signal is checked for maintenance in an HFC network.

In addition, the present invention provides an amplifier and a method for replacing the pads in the amplifier that can increase the work efficiency of the operator by performing the signal check operation for maintenance in the HFC network during the day regardless of the time zone .

According to an embodiment of the present invention, an amplifier includes a substrate for mounting component elements, at least one pad PAD that attenuates a signal input level among the component elements, and the at least one component. And a connector configured to receive a pad and electrically connect the pad to the board, and to replace the pad when the at least one pad is inserted into the connector. Electrically connecting to the substrate together, and separating the at least one connected pad from the connector to replace the pad.

In addition, the amplifier according to another embodiment of the present invention includes a substrate for mounting the component elements, at least one pad to attenuate the signal input level of the component elements, and accommodates the at least one pad to the substrate And a switch for connecting one pad of the at least one pad and the substrate to each other, wherein the pad is replaced when the pad is replaced with the at least one pad inserted in the connector. And inserting in and electrically connecting to the substrate together with the at least one pad, and switching the switch to the pad to be replaced to electrically connect the pad to be replaced to the substrate.

In addition, according to the embodiments of the invention, the connector includes a plurality of pad inserts for inserting the at least one pad, and a board mounting pin for mounting the pad inserted in the pad insert to the substrate, The at least one pad is inserted into the connector through the pad inserting portion, and the inserted pad and the substrate are electrically connected to each other via the substrate mounting pin.

In addition, the present invention provides a pad replacement method provided in the amplifier for use in a hybrid fiber coaxial (HFC) network, the process of having a substrate equipped with a connector for receiving a plurality of pads and electrically connecting them to the substrate, When the second pad to be replaced is inserted into the connector while the first pad is inserted into the substrate through the connector, both the first pad and the second pad are electrically connected to the substrate; When the pad is separated from the connector, the second pad is electrically connected to the substrate.

In addition, in the pad replacement method provided in the amplifier used in the hybrid fiber coaxial (HFC) network according to another embodiment of the present invention, the connector and the pad of the plurality of pads to receive and electrically connect it to the substrate A pad having a pad and a substrate having a switch for connecting the substrate to each other; a pad to be replaced with the switch using the switch while a plurality of pads are inserted into the substrate through the connector; When a switching operation is performed such that the substrate is connected, the pad connected to the switch may be electrically connected to the substrate.

According to the present invention described above, there is an advantage that can block the service interruption state due to the replacement of the pad (PAD) during the signal check for maintenance in the HFC network.

As a result, the HFC network can perform the maintenance of the signal check for maintenance during the day regardless of time of day, thereby bringing a significant effect to increase the worker's work efficiency.

DETAILED DESCRIPTION A detailed description of preferred embodiments of the present invention will now be described with reference to the accompanying drawings. It should be noted that the same components in the figures represent the same numerals wherever possible. Specific details are set forth in the following description, which is provided to provide a more thorough understanding of the present invention. In describing the present invention, when it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted.

Hereinafter, the present invention will be described with respect to a method for blocking a service interruption state generated in the process of separating the pad (PAD) mounted on the substrate when replacing the pad (PAD) when checking the signal in the HFC network. The term "pad" (PAD) described below is a device that appropriately lowers an RF signal with excessive RF signal strength, and is not limited to a device used in a specific kind of equipment.

Next, a dual pad configuration for mounting on the amplifier will be described with reference to FIG. 4.

First, referring to FIG. 4A, at least one pad 410 inserted into the PCB substrate by being inserted through the connector 400 and the at least one inserting portion 402 according to the present invention is mounted on the PCB board. 420).

In this case, the connector 400 includes a plurality of pad inserting parts 402 capable of mounting pads and a board mounting pin 404 for mounting on a PCB board. Although the pad inserting portion 402 of the connector 400 illustrated in FIG. 4 is configured to mount two pads, the pad inserting portion 402 may be manufactured to insert two or more pads. In addition, the board mounting pins 404 of the connector 400 may be formed in the same number as the number of pins required when the existing pad is mounted on the PCB board, the shape of the separate PCB board does not need to be changed.

That is, the connector 400 according to the present invention is a medium for accommodating a plurality of pads and electrically connecting them to the PCB substrate.

The pads 410 and 420 may be inserted into the connector 400 as shown in FIG. 4B.

Then, let's look at how to replace the pads on the PCB substrate using the dualized pads as described above.

Referring to FIG. 2, first, a board and a connector 400 are connected to each other through a board mounting pin 404 in the amplifier shown in FIG. 2, and a 4dB pad is inserted through the pad inserting portion 402. Assume that it is a state. At this time, the mounting state may be shown as shown in FIG. That is, one side of the pad is inserted into the open state through the pad inserting portion 402 and the other side of the pad inserting portion 402 is inserted into the pad.

In addition, it is assumed that the operator should attenuate the current amplifier level by 6 dB through signal check, and to replace the current 4 dB pad by 10 dB pad to attenuate 6 dB.

Then, the operator inserts the 10dB pad to be replaced through the inserting portion 402 while the 4dB pad is inserted through the inserting portion 402 of the connector 400 so that both the 4dB pad and the 10dB pad are electrically connected to the PCB substrate. To be connected. At this time, the mounting state may be shown as shown in (b) of FIG. That is, one side of the pad inserter 402 is inserted into the 4dB pad, the other side is inserted into the 10dB pad.

As such, when the two pads are electrically connected to the PCB board, the two pads may be parallel to each other, thereby causing an impedance change to cause electrical distortion. However, since the pad is not completely open when the pad is replaced, the service is not disconnected.

In the state in which both the 4dB pad and the 10dB pad are electrically connected to the PCB substrate as described above, the operator separates the 4dB pad, which is an existing pad, from the connector 400.

At this time, the mounting state may be shown as shown in (c) of FIG. That is, one side of the pad insertion section 402 is inserted into the 10dB pad, the other side is in the open state.

By doing so, even if the pad for attenuating the amplifier's level is reduced by 6 dB, the service disconnection state does not occur as before, and the replacement work can be performed.

When the 4dB pad is replaced with the 10dB pad by the pad replacement method as described above, the frequency response characteristics in the replacement process may be illustrated in FIG. 6.

Referring to FIG. 6, when only the 4dB pad is inserted into the connector 400, the frequency response is shown as (a), and when both the 4dB pad and the 10dB pad are inserted, the frequency response is shown as (b). see. Subsequently, when the 4dB pad is separated from the connector 400 and only 10dB pad is inserted into the connector 400, the frequency response characteristic as shown in (c) is shown. In other words, it can be seen that the input level of the amplifier is changed from 32.153dB to 25.990dB, which is attenuated by 6dB.

As described above, the attenuator pads are configured in parallel to prevent the signal from being blocked when the signal strength is controlled by the attenuator pad. In this case, the parallel attenuator pad equivalent circuit may be illustrated as shown in FIG.

A resistance value and an input / output value constituting the attenuator pad will be described with reference to FIG. 7A.

R1, R2, and R3 of FIG. 7A may be defined as in Equation 1 below.

Where L is the level value (dB) to be attenuated, Zin is the input impedance (ohms), and Zout is the output impedance (ohms).

In the above-described embodiment of the present invention, an example in which the pad is dualized through the connector 400 may be mounted on the board. However, a plurality of pads may be mounted on the board and the pad and the PCB board switched using a switch may be electrically connected. It can also be implemented so that

As described above, an amplifier used in a hybrid fiber coaxial (HFC) network for switching pads using a switch includes a substrate for mounting component elements, at least one pad, and at least one pad for mounting a pad. A connector having an insertion portion and a substrate mounting pin for mounting on the substrate, and a switch for switching one of the pads and the substrate to be connected to each other. In this case, the switch may use a rotary switch.

In addition, when the substrate mounting pin is inserted into a position for mounting the pad in the amplifier, and the switch is switched to one pad using the switch while the at least one pad is inserted into the connector, the switched one pad and The substrate may be electrically connected.

In addition, when the pad is to be replaced as described above, the pad may be electrically connected to the substrate by switching the switch so that one pad to be electrically connected to the substrate is connected to the substrate.

Although the embodiments of the present invention have been described above with reference to the accompanying drawings, those skilled in the art to which the present invention pertains may implement the present invention in other specific forms without changing the technical spirit or essential features thereof. I can understand that.

Therefore, it should be understood that the above-described embodiments are provided so that those skilled in the art can fully understand the scope of the present invention. Therefore, it should be understood that the embodiments are to be considered in all respects as illustrative and not restrictive, The invention is only defined by the scope of the claims.

1 is a schematic diagram of a typical HFC network;

2 is an internal configuration diagram of an amplifier used in ONU or TBA equipment constituting a general HFC network,

3 is a view for explaining a method of replacing a pad mounted in the amplifier according to the prior art,

4 is a view showing a dualized pad according to an embodiment of the present invention;

5 is a view for explaining a method of replacing a pad using a dualized patch according to an embodiment of the present invention,

6 is a graph showing a frequency response characteristic according to the pad replacement operation of FIG.

<Description of the symbols for the main parts of the drawings>

410, 420: pad 400: connector

402: pad insertion portion 404: substrate mounting pin

Claims (6)

In the amplifier used for the hybrid fiber coaxial (HFC) network, A substrate for mounting component elements, At least one pad PAD that attenuates the signal input level of the component elements; A connector for receiving the at least one pad and electrically connecting the substrate; Inserting a pad to be replaced when the pad is replaced with the at least one pad inserted into the connector, and electrically connecting the pad to the substrate together with the at least one pad, and connecting the at least one pad connected in parallel An amplifier for use in an HFC network characterized by being separated from the connector. In the amplifier used for the hybrid fiber coaxial (HFC) network, A substrate for mounting component elements, At least one pad of the component elements attenuating a signal input level; A connector which receives the at least one pad and electrically connects the substrate; A switch connecting one pad of the at least one pad and the substrate to each other, Inserting a pad to be replaced when the pad is replaced with the at least one pad inserted into the connector, electrically connecting the pad to the substrate together with the at least one pad, and switching the switch to the pad to be replaced And electrically connecting the pad to be replaced to the substrate. The method of claim 1 or 2, wherein the connector, A plurality of pad inserting parts capable of inserting the at least one pad; Including a substrate mounting pin for mounting the pad inserted into the pad inserting portion on the substrate, The at least one pad is inserted into the connector through the pad inserting unit, the amplifier is used in the HFC network, characterized in that the inserted pad and the substrate is electrically connected via the substrate mounting pin. delete delete delete

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