KR101038233B1 - method and system for fabricating and handling fine structure - Google Patents

Abstract

In the chip packaging method, first, a chip is provided. Thereafter, the fluid containing the chip is selectively cured to form a package of the chip. Thereafter, the chip on which the package is formed is moved along a groove-shaped or protrusion-shaped rail provided in the fluid pipe.

Description

Method and system for fabricating and handling fine structure

The present disclosure generally relates to microstructure generation and processing systems and methods, and more particularly to chip packaging methods and systems.

In the integrated circuit industry, cost effective packaging of small chips is very important. Currently commercially produced radio frequency identification (RFID) and LED (light emitting deivces) chip sizes are less than 200μm. Pick and place methods are used in the production of these small chips, but with high cost and low throughput. Thus, there is a need for new processes that are cost effective and have high productivity.

According to one embodiment, a chip packaging method is disclosed. In a chip packaging method, the chip is first provided. Thereafter, the fluid containing the chip is selectively cured to form a package of the chip. Thereafter, the chip on which the package is formed is moved along a groove-shaped or protrusion-shaped rail provided in the fluid pipe.

According to another embodiment, a chip packaging system is provided. The chip packaging system includes a fluid tube, a camera, a processor, and a light projection apparatus. There is a photocurable fluid inside the fluid tube. The camera photographs a chip located in the fluid tube. The processor determines a shape of light suitable for packaging the chip according to the image photographed by the camera. The light projecting device provides light having the determined shape to the fluid tube.

According to another embodiment, a packaged chip is provided. The packaged chip has a chip, a package, and a guide. The package is formed by curing the photocurable fluid. The guide is formed by curing the photocurable fluid and has a groove shape or a protrusion shape.

Hereinafter, exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. However, the technology of the present disclosure is not limited to the embodiments described herein and may be embodied in other forms. However, the embodiments introduced herein are provided to ensure that the disclosed content is thorough and complete, and that the spirit of the present disclosure is sufficiently conveyed to those skilled in the art. In the drawings, widths, thicknesses, or shapes of structures are enlarged in order to clearly express various layers (or layers), regions, and shapes. The drawings have been described at the point of view of the observer, and in cases where parts such as layers, films, regions, etc. are expressed as being “above or above” other parts, in addition to being “on or directly above,” another in the middle Includes parts if present.

1 is a diagram for describing a chip packaging method according to an exemplary embodiment. Referring to FIG. 1, a chip is first provided (S110). The chip is, for example, a microchip. Herein, the microchip means a chip having an area of less than 1 mm ² . The microchip has, for example, a size of 100 μm × 100 μm × 20 μ. The chip is for example an LED chip, an RFID chip or a complementary metal-oxide semiconductor (CMOS) chip.

Thereafter, the chip containing the chip is selectively cured to form a package of the chip (S120). The fluid is for example a photocurable fluid. In this case, the package is formed by providing the fluid with light having a shape corresponding to the package. The photocurable fluid is, for example, polyethyleneglycol-diacrylate (PEG-DA). In addition to the formation of the package, a guide may be formed. The guide serves to prevent the chip from leaving the rail. The package and the guide may be formed at the same time, or may be sequentially generated at different times.

Thereafter, the chip is formed is moved along the rail provided in the fluid pipe (S130). The rail has a groove shape or a protrusion shape. For example, when the rail has a groove shape, the guide has a protrusion corresponding to the groove, and when the rail has a protrusion shape, the guide has a groove corresponding to the protrusion.

Thereafter, the chip on which the package is formed stops at the end of the rail (S140).

Thereafter, an additional chip having an additional package formed thereon moves along the rail and stops in contact with the chip having the package formed thereon (S150). By way of example, at least one of the package and the additional package has a spacer for increasing the spacing between the chip and the additional chip.

2 to 6 are diagrams illustrating each step of a specific implementation of the chip packaging method illustrated in FIG. 1, and FIGS. 2 to 6 correspond to steps S110 to S150 of FIG. 1, respectively.

2 (a) is a view showing the fluid tube 210, Figure 2 (b) is a view showing a chip 220 located inside the fluid tube 210, Figure 2 (c) is a chip 220 is a plan view of a fluid tube 210 located therein. Referring to FIG. 2, a chip 220 is provided inside the fluid tube 210. The photocurable fluid 230 is present in the fluid tube 210. The fluid pipe 210 has a rail 240 in the form of a groove. In the figure, a rail 240 having a rectangular cross section is shown, but is not limited thereto. By way of example, the cross section of the rail 240 may be triangular or semicircular. Envelope 250 of fluid tube 210 may be implemented using a variety of materials. In order to prevent curing of the photocurable fluid 230 around the envelope 250, the envelope 250 is, for example, an oxygen permeable material (eg, PDMS (Polydimethysiloxane)).

FIG. 3A is a view showing that the fluid tube 210 is provided with light, FIG. 3B is a view showing the shape 310 of light provided, and FIG. 3C is a package. 3D is a plan view of the fluid tube 210 in which the packaged chip 320 is located. Referring to FIG. 3, the package 330 is formed by providing light having a shape 310 corresponding to the package 330 to the fluid pipe 210 having the rails 240. Although an example in which light is provided from the opposite direction (from below) of the rail 240 is represented in the drawing, unlike the figure, light may be provided from the direction of the rail 240 (from the top). The package 330 is formed by curing the photocurable fluid 230. At the same time as the package 330 is formed, a guide 340 having a protrusion shape is also formed. The drawing shows a guide 340 having a rectangular cross section, but is not limited thereto. By way of example, the cross section of the guide 340 may be triangular or semicircular. The package 330 may not have a spacer as shown in the figure, and may have a spacer different from the figure. In this case, the spacer may protrude in a horizontal direction of the chip 220 (a direction parallel to the top or bottom surface of the chip). While light is provided to the fluid tube 210, the photocurable fluid 230 may flow and may be stopped.

4 is a plan view of a fluid tube 210 in which a packaged chip 320 is located. Referring to FIG. 4, the packaged chip 320 moves along the rail 240 by the flow of the photocurable fluid 230.

5 is a plan view of a fluid tube 210 in which a packaged chip 320 is located. Referring to FIG. 5, the packaged chip 320 stops at the end 510 of the rail 240.

6 is a plan view of a fluid tube 210 in which a packaged chip 320 is located. Referring to FIG. 6, the additional packaged chip 610 moves along the rail 240 to stop in contact with the packaged chip 320. The additional packaged chip 610 has an additional package 620 and an additional guide 630. Although not shown in the figure, the additional package 620 may have additional spacers.

FIG. 7 is a diagram for describing modifications of the chip packaging method described with reference to FIGS. 2 to 6. In FIGS. 7A and 7B, a rail has a protrusion shape and a guide has a groove shape. It is a figure for demonstrating an example, and FIG.7 (c) is a figure for demonstrating the 2nd modified example in which a package is provided with a spacer.

Referring to FIGS. 7A and 7B, which illustrate a first modification, the fluid pipe 720 includes a protrusion rail 710, and the packaged chip 740 has a groove guide 730. ). The fluid tube 720 having the protruding rail 710 may be used instead of the fluid tube having the groove-shaped rail 240 (see FIG. 3). The packaged chip 740 with the groove-shaped guide 730 can be used in place of the packaged chip (reference numeral 320 in FIG. 3) with the projection in the form of a guide (reference numeral 340 in FIG. 3). It may be used in place of an additional packaged chip (reference 610 in FIG. 6) with an additional guide in the form (reference 630 in FIG. 6). The packaged chip 740 with the groove shaped guide 730 includes the chip 750.

Referring to FIG. 7C, which shows a second modified example, the packaged chip 770 includes a spacer 760. Packaged chip 770 with spacer 760 may be used in place of packaged chip without reference spacer (320 in FIG. 3), and additional packaged chip without spacer (FIG. 6 shown in FIG. 6). May be used instead of the numeral 610. As illustrated, the spacer 760 may protrude in the horizontal direction of the chip 780.

FIG. 8 is a diagram illustrating examples of a packaged chip that is actually manufactured. FIG. 8A illustrates a packaged chip 810 having no spacer, and FIG. 8B illustrates a spacer 850. Is a diagram illustrating a packaged chip 860 with Referring to FIG. 8A, the packaged chip 810 includes a chip 820, a package 830, and a guide 840. Referring to FIG. 8B, the packaged chip 860 includes a chip 870, a package 880, and a guide 890. Package 880 has a spacer 850. The distance between the chip 870 and the adjacent chip 875 is determined by the length of the spacer 850.

9 is a view showing a manufacturing process of the fluid tube 210 shown in FIGS. Referring to FIG. 9, first, a silicon substrate 910 is prepared (FIG. 9A). Thereafter, a photoresist 920 is coated on the silicon substrate 910 (FIG. 9B). The photoresist 920 may be, for example, a SU-8 photoresist. Thereafter, the photoresist 920 is patterned to form a main channel layer 920 (FIGS. 9C and 9D). Patterning of the photoresist includes aligning the photomask 930 and performing exposure (FIG. 9C) and developing (FIG. 9D). Thereafter, an additional photoresist 920 ′ is coated over the silicon substrate 910 and the main channel layer 920 (FIG. 9E). Thereafter, the additional photoresist 920 'is patterned to form a rail layer 920' (FIGS. 9F and 9G). An additional photomask 930 'is used for patterning the additional photoresist 920'. Thereafter, the silicon substrate 910 on which the main channel layer 920 and the rail layer 920 'are formed is placed in the aluminum container 950, and the uncured thermosetting polymer (for example, the uncured PDMS 940) is silicon. Poured onto the substrate 910 (Fig. 9 (h)). Thereafter, the uncured PDMS 940 is converted into a cured PDMS 960 (FIG. 9 (i)). In order to cure the PDMS, the aluminum container 950 is placed on a 150 ° C. hot plate for 10 minutes or a suitable time. The hardened PDMS 960 is obtained by the two-layer mold fabrication process shown in FIGS. 9A to 9I.

A glass substrate 980 coated with PDMS 970 is prepared separately from the above process (process represented in FIGS. 9A to 9I) (FIG. 9J). Thereafter, the cured PDMS 960 obtained by the process represented in FIGS. 9A to 9I is combined with the PDMS 970 coated on the organic substrate 980 to provide a fluid with a rail 240. A tube 210 is formed (FIG. 5 (k)). PDMS 960 and 970 and glass substrate 980 make up the shell 250 of the fluid tube.

10 to 15 illustrate each step of another specific implementation of the chip packaging method illustrated in FIG. 1, wherein FIG. 10 corresponds to step S110 of FIG. 1, and FIGS. 11 and 12 correspond to step S120 of FIG. 1. 13 to 15 correspond to steps S130 to S150 of FIG. 1, respectively.

FIG. 10A illustrates a fluid tube 1010, and FIG. 10B illustrates a chip 1020 positioned inside the fluid tube 1010, and FIG. 10C illustrates a chip. 1020 is a plan view of the fluid tube 1010 located therein. Referring to FIG. 10, a chip 1020 is provided inside the fluid tube 1010. Inside the fluid tube 1010 is a photocurable fluid 1030. Fluid tube 1010 is divided into three regions. The rail 1040 is not formed in the first region 1012 of the three regions, and the thickness of the first region 1012 is H1. Thus, the depth of the photocurable fluid 1030 located in the first region 1012 is also H1. The rail 1040 is not formed in the second region 1014 of the three regions, and the thickness of the second region 1014 is H2. Thus, the depth of the photocurable fluid 1030 located in the second region 1014 is also H2. H2 is greater than H1. A rail 1040 is formed in the third region 1016 of the three regions. For example, in the third region 1016, the thickness of the region where the rail 1040 is not formed is H1, and the thickness of the region where the rail 1040 is formed is H2. Although a rail 1040 having a groove shape is illustrated in the drawing, as described above with reference to FIG. 7 and the description thereof, the rail 1040 may have a protrusion shape. In the figure, a rail 1040 having a rectangular cross section is illustrated, but is not limited thereto. Envelope 1050 of fluid tube 1010 may be implemented using a variety of materials. To prevent curing of the photocurable fluid 1030 around the sheath 1050, the sheath 1050 is, for example, an oxygen permeable material (eg, PDMS (Polydimethysiloxane)).

FIG. 11A is a view showing that the first region 1012 of the fluid tube 1010 is provided with light, and FIG. 11B is a view showing the shape 1110 of the light provided. 11 (c) is a view showing a packaged chip 1120, and FIG. 11 (d) is a plan view of a fluid tube 1010 in which the packaged chip 1120 is located. Referring to FIG. 11, the package 1130 is formed by providing light having a shape 1110 corresponding to the package 1130 to the first region 1012 of the fluid tube 1010. The package 1130 is formed by curing the photocurable fluid 1030. Although the package 1130 is not illustrated in the drawing, the package 1130 may be provided with a spacer, unlike the drawing. While light is provided to the first region 1012 of the fluid tube 1010, the photocurable fluid 1030 may flow or may be stopped. The packaged chip 1120 moves from the first region 1012 to the second region 1014 by the flow of the photocurable fluid 1030.

FIG. 12A is a view showing that the second region 1014 of the fluid tube 1010 is receiving light, and FIG. 12B is a view showing the shape 1210 of the light provided, and FIG. 12C illustrates a packaged chip 1220 on which a guide 1240 is formed, and FIG. 12D illustrates a plan view of a fluid tube 1010 in which the packaged chip 1220 is located. Referring to FIG. 12, the guide 1240 is formed by providing light having a shape 1210 corresponding to the guide 1240 to the second region 1014 of the fluid tube 1010. The guide 1240 is formed by curing the photocurable fluid 1030. Although a guide 1240 having a protrusion shape is illustrated in the drawing, as described above with reference to FIG. 7 and the description thereof, the guide 1240 may have a groove shape. The drawing shows a guide 1240 having a rectangular cross section, but is not limited thereto. While light is provided to the second region 1014 of the fluid tube 1010, the photocurable fluid 1030 may flow or may be stopped. The packaged chip 1220 moves from the second region 1014 to the third region 1016 by the flow of the photocurable fluid 1030. The guide 1240 of the packaged chip 1220 moved to the third region 1016 enters the rail 1040.

13 is a plan view of a fluid tube 1010 with a packaged chip 1220 located therein. Referring to FIG. 13, the packaged chip 1220 moves along the rail 1040 by the flow of the photocurable fluid 1030.

14 is a plan view of a fluid tube 1010 with a packaged chip 1220 located therein. Referring to FIG. 14, the packaged chip 1220 stops at the end 1410 of the rail 1040.

15 is a plan view of a fluid tube 1010 with packaged chips 1220 located therein. Referring to FIG. 15, the additional packaged chip 1510 moves along the rail 1040 and stops in contact with the packaged chip 1220. The additional packaged chip 1510 has an additional package 1520 and an additional guide 1530.

16 is a diagram illustrating examples of packaged chips actually manufactured. FIG. 16A illustrates a packaged chip 1610 in which no guide is formed. FIG. 16B illustrates a packaged chip 1622 having a guide 1620 formed thereon. 16C and 16D illustrate a packaged chip 1634 in which a guide 1632 is moved from an area where the rail 1630 is not formed to an area where the rail 1630 is formed. As shown in the figure, the inlet portion of the rail 1630, the inclined portion (1636) can be formed to easily enter the rail (1630). FIG. 16E illustrates a packaged chip 1641 formed with a guide moving along the rail 1640. FIG. 16F illustrates the packaged chip 1652 with the guide stopped at the end 1650 of the rail and the additional packaged chips 1654 with the additional guide formed.

17 is a diagram for describing a chip packaging system, according to an exemplary embodiment. Referring to FIG. 17, a chip packaging system includes a fluid tube 1710, a camera 1720, a processor 1730, and a light projection apparatus 1740. The chip packaging system may further include a reduction lens 1750, a beam splitter 1760, and an illuminator 1770.

Inside the fluid tube 1710 is a photocurable fluid 1712. The photocurable fluid 1712 may be cured by light provided by the light projection device 1740. The fluid pipe 1710 may be, for example, the fluid pipe 210 shown in FIG. 2 described above, the fluid pipe 720 shown in FIG. 7, or the fluid pipe 1010 shown in FIG. 10.

The camera 1720 photographs a chip injected into the fluid tube 1710. The camera 1720 provides the processor 1730 with an electrical signal corresponding to the captured image. When the guide is formed separately from the package, the camera 1720 may also provide an image of the packaged chip to the processor 1730. By way of example, camera 1720 includes an imaging lens 1722 and an image sensor 1724. The image lens 1722 receives light from the beam splitter 1760 and transmits the light to the image sensor 1724, and performs an image forming function on the image sensor 1724. The image sensor 1724 functions to form the electrical signal corresponding to the incident light.

The processor 1730 determines the shape of light suitable for packaging the chip according to the image photographed by the camera 1720. Processor 1730 may be, for example, a personal computer (PC) or notebook. When the guide is formed separately from the package, the processor 1730 may determine the shape of light suitable for the guide according to an image of the packaged chip provided by the camera 1720.

The light projection device 1740 provides the light having the determined shape to the fluid tube 1710. The light projection device 1740 may include, for example, a light source 1742 and a spatial light modulator 1744. The light source 1742 may be, for example, an ultraviolet light source or a visible light source. Light source 1742 may include, for example, an ultraviolet light source collimator 1746 and an ultraviolet filter 1748. The ultraviolet light source collimator 1746 performs a function of outputting parallel ultraviolet light. The ultraviolet light source collimator 1746 may include, for example, a 200W UV lamp (not shown) and a fiber-based light guiding system (not shown). The ultraviolet filter 1748 performs a function of selectively providing ultraviolet light to the spatial light modulator 1744 among the light provided by the ultraviolet light source collimator 1746. The spatial light modulator 1744 functions to modulate the light provided by the light source 1742 according to the signal provided by the processor 1730. The spatial light modulator 1744 may be, for example, a digital micromirror array manufactured in the form of a two-dimensional array as shown in the drawing. Unlike the drawing, the spatial light modulator 1744 may be manufactured in the form of a one-dimensional array, or may be manufactured using other methods such as a liquid crystal display (LCD) instead of a micromirror. Light modulation in the spatial light modulator 1744 is programmable. That is, the spatial light modulator 1744 may selectively transmit incident light of a desired pixel among the pixels included in the spatial light modulator 1744 to the fluid tube 1710 at a desired time.

The reduction lens 1750 reduces the light provided by the light projecting device 1740 and provides it to the fluid tube 1710. In one example, a 10x microscope objective is used to project the image of the light projection apparatus 1740 as the reduction lens 1750 at a demagnification factor of approximately 5 in the final object plane.

The beam splitter 1760 performs a function of transferring the modulated light provided from the light projecting device 1740 to the fluid tube 1710 via the reduction lens 1750. In addition, the beam splitter 1760 performs a function of transferring the image transmitted from the fluid tube 1710 via the reduction lens 1750 to the camera 1720. The beam splitter 1760 may be, for example, a half mirror as shown in the drawing.

An illuminator 1770 performs a function of providing illumination so that the camera 1720 may acquire an image of the fluid tube 1710. Cured and uncured photocurable liquids have only a small difference in refractive index, so it is desirable to use offaxis illumination to make the cured package visible.

FIG. 18 is a view for explaining an example of the operation of the processor 1730 of FIG. 17. FIG. 18A is a view showing an image of a photographed chip provided to the processor 1730, and FIG. ) Is a view showing the shape of light suitable for the package determined by the processor 1730. Referring to FIG. 18, the processor 1730 may use a shape 1820 obtained by expanding a region 1810 corresponding to a chip to a predetermined range as a shape of light suitable for a package.

FIG. 19 is a diagram for describing an example of an operation of the processor 1730 of FIG. 17, and FIG. 19A illustrates an image of a photographed packaged chip provided to the processor 1730. (b) shows the shape of light suitable for the guide determined by the processor 1730. Referring to FIG. 19, the processor 1730 may use a shape obtained by arranging the quadrangles 1920 on the outside of two mutually opposite sides of the region 1910 corresponding to a chip as a shape of light suitable for a package.

1 is a diagram for describing a chip packaging method according to an exemplary embodiment.

2 to 6 are diagrams illustrating each step of a specific implementation of the chip packaging method illustrated in FIG. 1.

FIG. 7 is a diagram for describing modifications of the chip packaging method described with reference to FIGS. 2 to 6.

8 is a diagram illustrating examples of packaged chips that are actually manufactured.

9 is a view showing a manufacturing process of the fluid tube 210 shown in FIGS.

10 to 15 are diagrams illustrating each step of another specific implementation of the chip packaging method illustrated in FIG. 1.

16 is a diagram illustrating examples of packaged chips actually manufactured.

17 is a diagram for describing a chip packaging system, according to an exemplary embodiment.

18 and 19 are diagrams for describing examples of the operation of the processor 1730 of FIG. 17.

Claims (20)

In the chip packaging method, (a) providing the chip; (b) forming a package of chips by selectively curing the fluid containing the chips; And (c) moving the chip on which the package is formed along a groove-shaped or protrusion-shaped rail provided in the fluid pipe; Method of providing. According to claim 1, And a guide is formed in the step (b) to prevent the chip from leaving the rail. The method of claim 2, The guide has a protrusion shape corresponding to the groove shape of the rail or a groove shape corresponding to the protrusion shape of the rail. The method of claim 2, And the step (b) is performed in the fluid conduit provided with the rails such that the package and the guide are formed simultaneously. According to claim 1, Step (b) is (b1) forming a package by selectively curing the fluid while the chip is in the fluid having a first depth; And (b2) selectively curing the fluid in a state where the chip in which the package is formed is contained in the fluid having a second depth, the second depth being greater than the first depth, thereby forming a guide; Way. 6. The method of claim 5, The steps (b1) and (b2) are performed in an area where the rail of the fluid pipe is not provided. The method according to claim 1 or 2, The chip is a microchip. The method according to claim 1 or 2, The chip is an LED chip, an RFID chip or a CMOS chip. The method according to claim 1 or 2, The fluid is a photocurable fluid and the package is formed by providing light to the fluid having a shape corresponding to the package. The method according to claim 1 or 2, (d) the chip forming the package is stopped at the end of the rail. The method of claim 10, (e) a further chip having an additional package formed thereon is moved along the rail to stop in contact with the chip having the package formed thereon. 12. The method of claim 11, At least one of the package and the additional package includes a spacer for increasing a distance between the chip and the additional chip. In a chip packaging system, A fluid tube, in which there is a photocurable fluid; A camera for photographing a chip located in the fluid tube; A processor configured to determine a shape of light applied to packaging of the chip according to an image photographed by the camera; And A light projection apparatus for providing the fluid tube with the determined shape Chip packaging system having a. The method of claim 13, The light projection device Light source; And And a spatial light modulator for modulating the light provided by the light source in accordance with the signal provided by the processor. The method of claim 13, And the fluid conduit comprises a grooved or protruding rail. The method of claim 15, Chip packaging in which a package and a guide are formed by the light provided in the fluid tube, wherein the guide has a protrusion shape corresponding to the groove shape of the rail or a groove shape corresponding to the protrusion shape of the rail. system. chip; A package formed on the chip by curing of a photocurable fluid; And A packaged chip formed in the package by curing the photocurable fluid, the package having a guide having a groove shape or a protrusion shape. 18. The method of claim 17, The chip is a packaged chip that is a microchip. 18. The method of claim 17, The chip is a packaged chip is an LED chip, RFID chip or CMOS chip. 18. The method of claim 17, The packaged chip comprises a spacer protruding in the horizontal direction of the chip.

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