KR101033012B1 - Oxygen generator, adjuster of oxygen concentration and scrubber apparatus having oxygen generator or adjuster of oxygen concentration - Google Patents

Abstract

The present invention relates to an oxygen generator, an oxygen concentration controller and a scrubber device having the same, and in particular, by connecting an oxygen generator or an oxygen concentration regulator to a CDA supply line and supplying oxygen to the scrubber device to reduce operating costs of the scrubber device, In addition, the present invention provides an oxygen generator, an oxygen concentration regulator, and a scrubber device having the same, which may contribute to initial investment and maintenance cost reduction. The present invention provides a supply of CDA from a CDA supply line and provides the supplied CDA to a membrane unit and / or a PSA unit so that oxygen is generated in the membrane unit and the PSA unit and filled in a buffer; Supplying the oxygen charged in the buffer to the burner of the scrubber device for burning, in which case the purity of the oxygen filled in the buffer is controlled by the control unit through an oxygen sensor; When the purity of the oxygen to be controlled is input to the control unit, the control unit transmits an output signal to the regulator, and provides an oxygen generator that adjusts and supplies the desired oxygen purity by controlling and supplying the CDA flow rate from the regulator to the buffer interior. do.

Scrubber, Oxygen Generator, Regulator, Burner, Membrane

Description

OXYGEN GENERATOR, ADJUSTER OF OXYGEN CONCENTRATION AND SCRUBBER APPARATUS HAVING OXYGEN GENERATOR OR ADJUSTER OF OXYGEN CONCENTRATION}

The present invention relates to an oxygen generator, an oxygen concentration controller and a scrubber device having the same, and in particular, by operating an oxygen generator or an oxygen concentration regulator in a CDA supply line and supplying oxygen to the scrubber device, the operating cost of the scrubber device is drastically reduced. In addition, the method of supplying 100% pure oxygen gas to the scrubber device can be achieved by applying an oxygen generator or an oxygen concentration regulator capable of adjusting the purity, that is, the oxygen concentration supplied to the scrubber device is 21% in the oxygen generator. By regulating and supplying it in the range of -99%, the gas treatment efficiency is maintained as before, and the generation of nitrogen oxides contained in the combustion gas subject to environmental regulation can be reduced to prevent environmental pollution and safety accidents in advance. Oxygen generator, oxygen concentration control The present invention provides a scrubber device having the same.

Generally, a scrubber burning device is used in a semiconductor manufacturing process, and the scrubber burning device needs to supply 100% pure oxygen gas. However, such a system has a problem that not only a lot of initial investment costs are generated but also a lot of maintenance costs. In addition, in the conventional scrubber burning apparatus, a method of directly supplying 100% pure oxygen gas also has a problem in that nitrogen oxide, which is a target of environmental regulation, is largely generated.

Therefore, in view of the above-mentioned problems, the present invention connects an oxygen generator or an oxygen concentration regulator to a CDA supply line and supplies oxygen to the scrubber device, thereby significantly reducing the operating cost of the scrubber device, In the method of supplying pure 100% oxygen gas, by applying an oxygen generator that can adjust the purity, that is, by adjusting the oxygen concentration supplied to the scrubber device in the range of 21% to 99% in the oxygen generator, gas treatment efficiency While maintaining the same as before, by reducing the generation of nitrogen oxides contained in the combustion gas subject to environmental regulations, it is possible to prevent environmental pollution and safety accidents in advance, and the oxygen generator that can contribute to reducing the initial investment and maintenance costs and equipped with Provided is a scrubber device.

The oxygen generator according to the present invention supplies CDA from a CDA supply line and provides the supplied CDA to a membrane unit and / or a PSA unit so that oxygen is generated in the membrane unit and the PSA unit and filled in a buffer; Supplying the oxygen charged in the buffer to a burner of the scrubber device for burning, in which case the purity of the oxygen filled in the buffer is controlled by the control unit through an oxygen sensor; When the purity of the oxygen to be controlled is input to the control unit, the control unit transmits an output signal to the regulator, thereby adjusting and supplying the CDA flow rate supplied from the regulator to the buffer, thereby adjusting the desired oxygen purity.

The membrane unit is configured with a hollow case, and the hollow fiber membrane for passing only oxygen is provided inside the case.

The inlet of the hollow fiber membrane is connected to the CDA supply line, the outlet is connected to the exhaust pipe of the scrubber device through the coupling through the case and connected to the exhaust pipe of the scrubber device, so that oxygen from the hollow fiber membrane can pass through one side of the case An oxygen exhaust pipe is connected through the oxygen supply pipe.

The PSA unit is provided with first and second adsorption towers, and the first and second adsorption towers are filled with an adsorbent to adsorb nitrogen and allow oxygen to pass therethrough.

Solenoid valves are provided at the inlets of the first and second adsorption towers to regulate the flow of air, and check valves are provided at the outlets of the first and second adsorption towers to prevent backflow of oxygen; An oxygen exhaust pipe located at the outlet of the check valve is connected to a buffer filled with oxygen, and a solenoid valve is provided at the outlet of the buffer and coupled to the oxygen supply pipe.

The oxygen concentration regulator according to the present invention supplies CDA to the buffer from the CDA supply line and oxygen to the buffer from the oxygen supply line; Supplying the oxygen charged in the buffer to a burner of the scrubber device for burning, in which case the purity of the oxygen filled in the buffer is controlled by the control unit through an oxygen sensor; When the purity of the oxygen to be controlled is input to the control unit, the control unit transmits an output signal to the regulator so that the regulator regulates the CDA flow rate supplied from the CDA supply line into the buffer or supplies the oxygen from the regulator. The desired oxygen purity can be adjusted by adjusting the flow rate of oxygen supplied from the line into the buffer.

The present invention is the exhaust pipe is formed in the upper portion, the drain pipe is formed in the middle, the combustion chamber is formed in the lower; A burner provided below the combustion chamber and connecting the process gas supply pipe and the fuel supply pipe; A remover provided above the combustion chamber to remove fine particles contained in combustion gas; A demister installed on the remover to remove moisture contained in the combustion gas passing through the remover; A water spray pipe mounted on the upper and lower sides of the eliminator and equipped with a water pump; And a water tank connecting the drain pipe and the water spray pipe, wherein the burner is provided with an oxygen generator or an oxygen concentration regulator in which an oxygen generator or an oxygen concentration regulator is connected to an oxygen supply pipe.

In the oxygen generator, the inlet of the membrane unit and the PSA unit is connected to the CDA supply line, and the oxygen supply pipe is connected to the outlet of the membrane unit and the PSA unit.

In the oxygen generator, a buffer is filled with oxygen to the oxygen supply pipe; A regulator is provided on top of the buffer and connected to the CDA supply line; An oxygen sensor is provided below the buffer; A control unit is connected to the regulator and the oxygen sensor.

In the oxygen concentration regulator, the oxygen supplying buffer is connected to the oxygen supply pipe; A CDA supply line and an oxygen supply line are connected to the upper portion of the buffer; An oxygen sensor is provided below the buffer; A control unit is connected to the regulator and the oxygen sensor; The regulator is connected to a CDA supply line or an oxygen supply line.

In the oxygen generator, the control unit transmits an operation command to the regulator based on the information transmitted from the oxygen sensor and supplies a part of air from the CDA supply line to the buffer so that the oxygen concentration in the buffer is 21% to 99%. Keep it in range.

In the oxygen concentration regulator, the control unit, by supplying an operation command to the regulator based on the information transmitted from the oxygen sensor to regulate the supply of CDA flow rate supplied from the CDA supply line to the buffer in the regulator or in the regulator The flow rate of oxygen supplied from the oxygen supply line into the buffer is controlled to maintain the oxygen concentration in the buffer in the range of 21% to 99%.

As described above, the present invention is a method of supplying oxygen to the scrubber device by connecting the oxygen generator or oxygen concentration regulator to the CDA supply line, significantly reducing the operating cost of the scrubber device rather than supplying 100% oxygen There is an effect that can be reduced.

In addition, since the oxygen concentration supplied to the scrubber device is adjusted and supplied in the range of 21% to 99% by an oxygen generator or an oxygen concentration controller, the generation of nitrogen oxides contained in the combustion gas is drastically reduced, and thus, environmental pollution and It also has the effect of preventing safety accidents in advance.

BRIEF DESCRIPTION OF THE DRAWINGS The above objects, features and advantages will become more apparent through the following examples in conjunction with the accompanying drawings. Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a view and an internal configuration diagram of a scrubber device having an oxygen generator according to an embodiment of the present invention, Figure 2 is a schematic configuration diagram of an oxygen generator according to an embodiment of the present invention, Figure 3 4 is a cross-sectional view of the scrubber device according to an embodiment of the present invention, Figure 4 is a state diagram of an oxygen generator according to an embodiment of the present invention.

2 to 4, an embodiment of the present invention will be described. First, a process gas generated in a process of fabricating a silicon wafer through a semiconductor device is toxic, flammable, and corrosive, and thus, such a process gas is typically used. By scrubbing while scrubbing through the scrubber device (2) is used to prevent serious environmental pollution and safety accidents in advance.

The oxygen generator or the oxygen concentration regulator according to the present invention can reduce the generation of nitrogen oxides subject to environmental regulation by applying an oxygen generator that can adjust the purity in the manner of supplying pure 100% oxygen gas in the scrubber burning apparatus. by either by an inexpensive CDA on the main stage mask than the oxygen (O ₂₎ in place of the way to supply oxygen directly provided and used to generate an oxygen (O _2), or adjusting the oxygen concentration it may contribute to the initial investment and maintenance cost savings.

In addition, as shown in Figure 2, the oxygen generator can be installed or directly attached to the rear side of the scrubber device can be provided in a small installation space, it is also possible to detachable. According to the present invention, there is no need for a separate oxygen supply line for directly supplying oxygen.

Oxygen generator according to an embodiment of the present invention supplies a clean dry air (CDA) from the CDA supply line 40 and the supplied CDA to the membrane unit 32 and / or PSA unit 34 to the membrane Oxygen is generated in the unit 32 and the PSA unit 34 and filled in the buffer 58; The oxygen charged in the buffer 58 is supplied to the burner 12 of the scrubber device 2 for burning, and in this case, the purity of the oxygen filled in the buffer is passed through an oxygen sensor (oxygen concentration sensor) 64. Controlled by the control unit 66; When the purity of the oxygen to be controlled is input to the control unit, the control unit transmits an output signal to the regulator 62, and adjusts and supplies the CDA flow rate from the regulator 62 into the buffer to adjust the desired purity of oxygen. Can be.

Here, the supply of the CDA is made of 4 ~ 10kg / cm ² , preferably 5 ~ 7kg / cm ² .

Looking at the general structure of the scrubber device (2), the scrubber device (2) has a tower-shaped housing (6) having an exhaust pipe (4) formed on top, the middle and the bottom of the housing (6) drain pipe ( 8) and combustion chamber 10 are formed, respectively.

A burner 12 is installed below the combustion chamber 10 to burn a process gas generated when a silicon wafer is manufactured. The burner 12 includes a process gas supply pipe 14, a fuel supply pipe 16, and an oxygen supply pipe 18. ) Are respectively connected.

A remover 20 is installed above the combustion chamber 10 to remove fine particles contained in the combustion gas, and a water spray tube 22 is disposed above and below the remover 20 to mount a water pump 24. The water spray pipe 22 and the drain pipe 8 are connected to the water tank 26.

In addition, a demister 28 for removing moisture contained in the combustion gas is installed near the exhaust pipe 4 at the upper portion of the remover 20.

An oxygen generator 30 for improving combustion efficiency by supplying oxygen to the burner 12 of the scrubber device 2 configured as described above is connected to the oxygen supply pipe 18.

The oxygen generator 30 is provided with a membrane unit 32 method and a pressure swing adsorption unit (PSA) 34 method, respectively, the membrane unit 32 or the PSA unit 34. Any one of them may be selected and installed.

A hollow case 36 is formed in the membrane unit 32 installed as described above, and a hollow fiber membrane 38 for passing only oxygen is installed in the case 36.

The inlet of the hollow fiber membrane 38 is connected to the CDA supply line 40, the outlet is drawn out to the outside through the case 36 is connected to the exhaust pipe 4 of the scrubber 2, the case ( One side of 36 is connected to the oxygen supply pipe 18 while the oxygen exhaust pipe 42 through which oxygen released from the hollow fiber membrane 38 passes through.

In other words, when CDA enters the input of the oxygen generator, it passes through the hollow fiber membrane 38 of the hollow fiber structure mounted in the buffer 58. Oxygen passes through the hollow fiber membrane 38 and passes out of the hollow fiber membrane, and nitrogen (N2) does not pass through the hollow fiber membrane and is discharged out of the buffer through the inside of the hollow fiber. Oxygen (O ₂ ) that has passed through the hollow fiber membrane is filled in the buffer. Then, the generated oxygen is supplied to the burner and burned.

In this case, a compressor (not shown) is connected to the CDA supply line 40 to maintain a constant level of compressed air.

Subsequently, the PSA unit 34 is provided with first and second adsorption towers 44 and 46. The first and second adsorption towers 44 and 46 are filled with a zeolite to adsorb nitrogen and oxygen. Is passed.

At the inlets of the first and second adsorption towers 44 and 46 installed as described above, a plurality of solenoid valves 48, 50, 52, and 54 are provided to control the flow of air, and the first and second adsorption towers ( At the outlets of 44 and 46, check valves 56 are provided to prevent backflow of oxygen.

An oxygen exhaust pipe 42 located at an outlet of the check valve 56 is connected to a buffer 58 filled with oxygen, and a solenoid valve 60 is installed at an outlet of the buffer 58 to supply an oxygen supply pipe 18. ) Is combined.

Specifically, while the compressed air in the first step passes through the first adsorption tower 44 filled with the adsorbent, nitrogen, which is a strong adsorption component, is adsorbed to the adsorbent, and oxygen, which is a weak adsorption component, is passed through the product gas. In the second process, when the first adsorption tower 44 is saturated with nitrogen, which is a strong adsorption component, the air supply to the first adsorption tower is completed, and compressed air is supplied to the second adsorption tower 46, and the same process as in the first adsorption tower is performed. Go through At the same time, the first adsorption tower under high pressure opens and depressurizes and desorption of nitrogen occurs. When the decompression is finished in the third step, the outlet is opened and oxygen of high pressure is introduced to clean the adsorption tower. The second adsorption tower continues to be supplied with compressed air and is processed until it is saturated with nitrogen. In the fourth process, when the second adsorption tower 46 is saturated with nitrogen, the inlet is closed and the process proceeds to the depressurization step. At the same time, the cleaned first adsorption tower 44 is supplied with compressed air again to generate oxygen. This series of processes is repeated to generate oxygen continuously.

In the upper portion of the buffer 58 installed as described above, a regulator 62 is installed to take out some air from the CDA supply line 40 and supply it to the buffer 58 to adjust the oxygen concentration. An oxygen sensor 64 is installed at a lower portion thereof, and a control unit 66 is connected to the regulator 62, the oxygen sensor 64, and the solenoid valves 48, 50, 52, 54, and 60.

At this time, in order to reduce the generation of nitrogen oxides (Nox) to be regulated by the environment, the oxygen concentration charged in the buffer 58 should be adjusted to an appropriate level, and accordingly the CDA supply line based on the information transmitted from the oxygen sensor 64 ( By supplying a part of the air of 40 to the buffer 58 through the regulator 62, a command is set in the control unit 66 so that the oxygen concentration can be maintained at a desired value between 21% and 99%.

On the other hand, the burner 12, the water pump 24 and the control unit 66 of the oxygen generator 30, etc. of the scrubber 2 is connected to the central control unit not shown.

Referring to the operation of the present invention configured as described above are as follows.

First, when the central control unit of the generally used scrubber (2) is turned on, the solenoid valve 60 installed on the outlet side of the buffer 58 is turned on by the command transmitted, and at the same time moved along the CDA supply line (40) The warm air is simultaneously supplied to the membrane unit 32 and the PSA unit 34.

As described above, the air introduced into the membrane unit 32 moves along the hollow fiber membrane 38 while being introduced into the case 36, and oxygen included in the moved air is moved from the hollow fiber membrane 38. It exits and moves to the inner space of the case 36, and then oxygen moves to the buffer 58 through the oxygen exhaust pipe 42.

At the same time, the remaining air and nitrogen (N ₂ ) which do not escape the hollow fiber membrane 38 are continuously moved while passing through the case 36 to the exhaust pipe 4 side of the scrubber 2 and then exhausted to the outside.

Subsequently, the air introduced into the PSA unit 34 passes through the solenoid valves 50 and 52 and passes through the first adsorption tower 44 or the second adsorption tower 46, where the nitrogen is adsorbed by the adsorbent. While only oxygen passes through the check valve 56 to the buffer 58.

When oxygen is charged into the buffer 58 as described above, the oxygen sensor 64 measures the oxygen concentration and transmits the oxygen concentration to the control unit 66. The control unit 66 has an oxygen concentration inside the buffer 58. Is determined to be 21% or less, the regulator 62 is turned off, and when it is determined that the oxygen concentration inside the buffer 58 is 99% or more, the regulator 62 is turned on so that a part of air from the CDA supply line 40 is buffered. (58) to be supplied internally.

Therefore, the oxygen concentration supplied to the combustion chamber 10 through the buffer 58 is always maintained in the range of 21% to 99%, and thus the combustion efficiency of the combustion chamber 10 is maintained at an optimum state, and combustion Nitrogen oxide (Nox) contained in the gas is minimized.

Subsequently, the concentration-adjusted oxygen is discharged from the buffer 58 and supplied to the burner 12 through the solenoid valve 60 and simultaneously supplied to the fuel supply pipe 16 (LNG or CH _4). Burner 12 is ignited by the heating to heat the combustion chamber (10).

At the same time, the water in the water tank 26 by the water pump 24 is moved along the water spray pipe 22 and sprayed to the eliminator 20, the water sprayed as described above falls and water through the drain pipe (8) After returning to the tank 26, the circulation process is supplied again.

The process gas generated in the process of manufacturing the silicon wafer as described above moves along the process gas supply pipe 14 and is supplied to the combustion chamber 10, where the process gas is burned in the combustion chamber 10 and rises in the form of combustion gas. It passes through the eliminator 20.

When the combustion gas passes through the eliminator 20, the fine combustion particles included therein are removed, and then the combustion gas passes through the demister 28 to remove moisture and then to the outside through the exhaust pipe 4. Exhausted.

Table 1 shows the efficiency test results of the oxygen generator according to the present invention.

N ₂
(LPM) LNG
(LPM) O ₂
(LPM) O ₂ concentration
(%) SiH ₄ Nitrogen Oxide (PPM) Inlet concentration
(PPM) Outlet Concentration (PPM) Processing efficiency (%) No No ₂
200
15 30 70 4,975.0 <* 10 > 99.9 Peak value: 20.3 Average value: 11.1 <* 10 15 45 70 4,975.0 <* 10 > 99.9 Peak value: 46.0 Average value: 24.0 <* 10 15 55 70 4,975.0 <* 10 > 99.9 Peak value: 40.4 mean value: 19.7 <* 10

Comparing the effect of applying the oxygen generator according to the present invention with and without the application, the oxygen concentration of about 30% per unit can be reduced by 70% of oxygen (O ₂ ) concentration based on the equipment using 30LPM, and also By reducing the oxygen concentration, it is possible to reduce the maintenance cost of about 1.2 million won per unit (210LPM-> 8.4 million won). Specifically, when the oxygen generator according to the present invention is not applied (one unit), the annual usage of oxygen is 15,768 m 3 and the annual usage of CDA is 2,628 m 3, and the cost thereof is about 2.2 million won. However, when the oxygen generator according to the present invention is applied (one unit), the annual usage of oxygen is 0 m 3 and the annual usage of CDA is 110,376 m 3, and the cost thereof is about 1 million won. In addition, the required cost may be further reduced according to the oxygen concentration and the usage amount.

Table 2 shows the specifications in the case where the oxygen generator of the present invention is applied in single and dual.

Small capacity Large capacity single Dual density 21-99% 21-99% 21-99% pressure
Air in 5 ~ 7k / ㎠
Up to 250L / min 5 ~ 7k / ㎠
500L / min Max 5 ~ 7k / ㎠
Up to 2100 L / min 0 ₂ OUT More than 2k / ㎠
40L / min More than 2k / ㎠
Up to 80 L / min More than 2k / ㎠
Up to 210L / min Air IN Dew Point -50 ℃ or less -50 ℃ or less -50 ℃ or less Working temperature -10 ℃ ~ 30 ℃ -10 ℃ ~ 30 ℃  -10 ℃ ~ 30 ℃

In addition, in the oxygen generator of the present invention, when the membrane method and the PSA method are compared, the former has 21 to 50% in the oxygen concentration, the latter is 21 to 99%, and the former is 3 to 4 years in life. Is 2 years, the former is suitable for small size, the latter is suitable for medium / large size, and in the operating condition, the former and the latter are 3 ~ 10kg / cm ² at room temperature. The latter uses the difference in the adsorption amount of the adsorbent, the former uses a constant discharge and concentration, the latter has a pulse in discharge and concentration in the case of small and medium-sized, and the operating temperature There is a small change in separation performance with temperature at 5 ~ 65 ℃. The latter is slightly degraded when temperature rises from -10 ℃ ~ 30 ℃, and the former has a high durability of the material against moisture. The poor little durability of the material for moisture.

As such, the process gas generated in the process of fabricating the silicon wafer is burned in the combustion chamber 10 of the scrubber apparatus 2 to remove toxic, flammable, corrosive, and the like of the process gas, and again removes the eliminator 20 and the demister. Purification by (28) prevents serious environmental pollution and safety accidents.

Instead of the above-described oxygen generator as described above it is possible to use an oxygen concentration regulator according to another embodiment of the present invention. In other words, instead of supplying 100% pure oxygen gas in the scrubber apparatus, by applying an oxygen concentration regulator capable of adjusting the purity, that is, the oxygen concentration supplied to the scrubber apparatus is in the range of 21% to 99% in the oxygen concentration regulator. By regulating and supplying the gas, the gas treatment efficiency is maintained as before, and the generation of nitrogen oxides contained in the combustion gas subject to environmental regulation can be reduced to prevent environmental pollution and safety accidents in advance, and to reduce initial investment cost and maintenance cost. Can contribute.

Hereinafter, an oxygen concentration regulator according to another embodiment of the present invention will be described. 5 is a configuration diagram showing a first example of the oxygen concentration regulator according to another embodiment of the present invention, Figure 6 is a configuration diagram showing a second example of the oxygen concentration regulator according to another embodiment of the present invention.

As shown in FIG. 5, a first example of an oxygen concentration regulator according to another embodiment of the present invention supplies CDA from a CDA supply line 40 to a buffer 58 'and an oxygen supply line to the buffer 58'. Oxygen is supplied from 40 '; The oxygen charged in the buffer 58 'is supplied to the burner 12 of the scrubber device 2 for burning. In this case, the purity of the oxygen filled in the buffer is controlled through the oxygen sensor 64. Controlled at); When the purity of the oxygen to be controlled is input to the control unit, the control unit transmits an output signal to the regulator 62, and the regulator 62 supplies the CDA supply line 40 into the buffer 58 '. It is possible to adjust the purity of the desired oxygen by supplying a regulated CDA flow rate. That is, oxygen is always added in the oxygen concentration controller, and the desired concentration is controlled by adjusting the amount of CDA supplied to the buffer.

As shown in FIG. 6, a second example of an oxygen concentration regulator according to another embodiment of the present invention supplies CDA from a CDA supply line 40 to a buffer 58 ″ and an oxygen supply line to the buffer 58 ″. Oxygen is supplied from 40 '; The oxygen charged in the buffer 58 "is supplied to the burner 12 of the scrubber device 2 for burning, and in this case, the purity of the oxygen filled in the buffer is controlled through the oxygen sensor 64. When the purity of the oxygen to be controlled is input to the control unit, the control unit transmits an output signal to the regulator 62 so that the regulator 62 receives the buffer (from the oxygen supply line 40 '). 58 ") The desired oxygen purity can be adjusted by adjusting the flow rate of oxygen supplied to the inside. That is, in the oxygen concentration controller CDA is always added, and the desired concentration is adjusted by adjusting the amount of oxygen supplied to the buffer.

With this configuration, by supplying the oxygen concentration supplied to the scrubber apparatus by adjusting the oxygen concentration controller in the range of 21% to 99%, the gas treatment efficiency is maintained as before and the generation of nitrogen oxides is reduced and the initial investment cost and maintenance cost are maintained. Can contribute to savings.

In addition, in the oxygen concentration regulator according to another embodiment of the present invention, all the information described in the oxygen generator can be applied to the oxygen concentration regulator. That is, an oxygen concentration regulator may be used in place of the oxygen generator in the scrubber device, as described in the oxygen generator.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the inventions. Will be clear to those who have knowledge of.

1 is a view and an internal configuration of a scrubber device provided with an oxygen generator according to an embodiment of the present invention.

2 is a schematic diagram of an oxygen generator according to an embodiment of the present invention.

3 is a cross-sectional view of the scrubber device according to an embodiment of the present invention.

4 is a state diagram of an oxygen generator according to an embodiment of the present invention.

5 is a configuration diagram showing a first example of an oxygen concentration regulator according to another embodiment of the present invention.

6 is a configuration diagram showing a second example of the oxygen concentration regulator according to another embodiment of the present invention.

* Description of the symbols for the main parts of the drawings *

2: scrubber device 6: housing

10: combustion chamber 12: burner

14: process gas supply line 16: fuel supply line

18: oxygen supply pipe 20: eliminator

22: water sprayer 28: Demister

30: oxygen generator 32: membrane unit

34: PSA unit 36: case

38: hollow fiber membrane 40: CDA supply line

40 ': oxygen supply line 44: first adsorption tower

46: second adsorption tower 58, 58 ', 58 ": buffer

62: regulator 64: oxygen sensor

Claims (14)

Supplying the CDA from the CDA supply line and providing the supplied CDA to at least one of a membrane unit and a PSA unit so that oxygen is generated in the membrane unit and the PSA unit and filled in a buffer; Supplying the oxygen charged in the buffer to a burner of the scrubber device for burning, in which case the purity of the oxygen filled in the buffer is controlled by the control unit through an oxygen sensor; Inputting the purity of the oxygen to be controlled to the control unit, the control unit transmits an output signal to the regulator, and adjusts and supplies the CDA flow rate supplied from the regulator into the buffer to adjust the desired oxygen purity; The membrane unit is configured with a hollow case, the case is provided with a hollow fiber membrane for passing only oxygen Oxygen generator. delete The method of claim 1, The inlet of the hollow fiber membrane is connected to the CDA supply line, the outlet is connected to the exhaust pipe of the scrubber device through the coupling through the case and connected to the exhaust pipe of the scrubber device, so that oxygen from the hollow fiber membrane can pass through one side of the case An oxygen exhaust pipe is connected through to the oxygen supply pipe Oxygen generator. The method of claim 1, The PSA unit is provided with first and second adsorption towers, and the first and second adsorption towers are filled with an adsorbent to adsorb nitrogen and allow oxygen to pass therethrough. Oxygen generator. The method of claim 4, wherein Solenoid valves are provided at the inlets of the first and second adsorption towers to regulate the flow of air, and check valves are provided at the outlets of the first and second adsorption towers to prevent backflow of oxygen; The oxygen exhaust pipe located at the outlet of the check valve is connected to the buffer is filled with oxygen, the outlet of the buffer is provided with a solenoid valve is coupled to the oxygen supply pipe Oxygen generator. The method of claim 1, The control unit transmits an operation command to the regulator based on the information transmitted from the oxygen sensor to supply a portion of air in the CDA supply line to the buffer, thereby maintaining the oxygen concentration in the buffer in the range of 21% to 99%. Oxygen generator. Supply CDA from a CDA supply line to a buffer and supply oxygen to the buffer from an oxygen supply line; Supplying the oxygen charged in the buffer to a burner of the scrubber device for burning, in which case the purity of the oxygen filled in the buffer is controlled by the control unit through an oxygen sensor; When the purity of the oxygen to be controlled is input to the control unit, the control unit transmits an output signal to the regulator so that the regulator regulates or supplies the CDA flow rate supplied from the CDA supply line into the buffer or supplies oxygen from the regulator. Regulating and supplying the flow rate of oxygen supplied from the line into the buffer to adjust the purity of the desired oxygen; The control unit transmits an operation command to a regulator based on information transmitted from an oxygen sensor to regulate and supply a CDA flow rate supplied from the CDA supply line to the buffer at the regulator, or to the regulator from the oxygen supply line at the regulator. Regulating and supplying the flow rate of oxygen supplied to the reactor to maintain the oxygen concentration in the buffer in the range of 21% to 99% Oxygen Concentrator. delete The exhaust pipe is formed in the upper portion, the drain pipe is formed in the middle, the combustion chamber is formed in the lower; A burner provided below the combustion chamber and connecting the process gas supply pipe and the fuel supply pipe; A remover provided above the combustion chamber to remove fine particles contained in combustion gas; A demister installed on the remover to remove moisture contained in the combustion gas passing through the remover; A water spray pipe mounted on the upper and lower sides of the eliminator and equipped with a water pump; And Water tank connecting the drain pipe and the water spray pipe Including, An oxygen generator or an oxygen concentration regulator is connected to an oxygen supply pipe to the burner. Scrubber device. 10. The method of claim 9, In the oxygen generator, the inlet of the membrane unit and the PSA unit is connected to the CDA supply line, and the oxygen supply pipe is connected to the outlet of the membrane unit and the PSA unit. Scrubber device. The method of claim 10, The oxygen generator, A buffer filled with oxygen is connected to the oxygen supply pipe; A regulator is provided on top of the buffer and connected to the CDA supply line; An oxygen sensor is provided below the buffer; The control unit is connected to the regulator and the oxygen sensor Scrubber device. 10. The method of claim 9, The oxygen concentration regulator, A buffer filled with oxygen is connected to the oxygen supply pipe; A CDA supply line and an oxygen supply line are connected to the upper portion of the buffer; An oxygen sensor is provided below the buffer; A control unit is connected to the oxygen sensor; A regulator is connected to the control unit; The regulator is connected to the CDA supply line or oxygen supply line Scrubber device. The method of claim 11, The control unit transmits an operation command to the regulator based on the information transmitted from the oxygen sensor to supply a portion of air in the CDA supply line to the buffer, thereby maintaining the oxygen concentration in the buffer in the range of 21% to 99%. Scrubber device. The method of claim 12, The control unit transmits an operation command to a regulator based on information transmitted from an oxygen sensor to regulate and supply a CDA flow rate supplied from the CDA supply line to the buffer at the regulator, or to the regulator from the oxygen supply line at the regulator. Regulating and supplying the flow rate of oxygen supplied to the reactor to maintain the oxygen concentration in the buffer in the range of 21% to 99% Scrubber device.

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