KR101017238B1 - Radiating heat apparatus for circuit board, LED lamp having thereof, Lighting apparatus euipped with LED lamp thereon - Google Patents

Abstract

The present invention is to mount the heat sink inclined at an angle, and by connecting the cover heat sink body to the basic heat sink body to form a cavity in a tunnel method, by increasing the fluidity of the air in the cavity to increase the heat dissipation efficiency of the circuit board heat sink It aims to provide.

The circuit board heat dissipation device according to the present invention is characterized in that it comprises a heat dissipation plate is mounted on the rear of the circuit board and the cavity is formed inside the both ends.

According to the present invention, it is possible to minimize the life, illuminance, and brightness deterioration of the light emitting diode by making excellent heat dissipation efficiency.

Heat Sink, Cover Heat Sink, Circuit Board, Light Emitting Diode (LED), Cavity

Description

Radiating heat apparatus for circuit board, LED lamp having, Lighting apparatus euipped with LED lamp thereon}

The present invention relates to a heat radiating device of a circuit board, a light emitting diode lamp having the same, and a lighting device equipped with the light emitting diode lamp.

In general, many components are mounted on a circuit board, and when the power is supplied, these components operate to generate heat. However, if such heat is not properly radiated, the component may malfunction due to heat, resulting in damage to the component. In particular, parts that emit light, such as light emitting diodes (LEDs), generate more heat than other parts, and thus damage due to heat is more serious.

In this regard, the present applicant has filed a patent registration (Patent No. 0849614) for the invention 'inventive device of a circuit board'.

1 is a perspective view of the patent invention.

The conventional heat dissipation device 10 is provided with a heat sink 20, the heat sink 20 is a flat plate shape. On one side of the heat sink 20, a circuit board 50, for example, a circuit board 50 on which the LED 60 is mounted is mounted. A plurality of heat dissipation ribs 30 are vertically formed on the other side of the heat dissipation plate 20. By forming the heat dissipation rib 30 in this way, the contact area with air | atmosphere can be expanded. And both sides of the heat sink 20 is formed with a coupling arm 40 vertically. On the other hand, the coupling arm 40 serves to fix the circuit board 50, the heat radiation pad 70, the heat sink 20 in the body of the device on which the circuit board 50 is mounted.

In the conventional heat dissipation device, power is supplied to the LEDs 60 of the circuit board 50 so that heat generated during light emission is conducted to the heat dissipation plate 20. The conducted heat is conducted to the heat dissipation rib 30 through the heat dissipation plate 20, thereby dissipating heat into the atmosphere.

As such, in the related art, a method of dissipating heat to the outside by providing a separate heat sink and attaching it to a circuit board has been mainly used. However, only the structure in which the heat sink is mounted has a disadvantage in that heat is difficult to be released smoothly and the heat dissipation effect does not meet expectations.

The present invention is to solve the above problems, by forming a cavity wrapped around the base heat sink body cover heat sink body, the heat dissipation device of the circuit board which can increase the heat dissipation efficiency, the light emitting diode lamp having the same, the light emitting diode lamp It is an object to provide a mounted lighting device.

In order to achieve the above object, the heat dissipation device of the circuit board according to the present invention is a device for dissipating heat of the circuit board, the heat dissipation plate is mounted on the rear surface of the circuit board, the inside of the cavity is formed with a cavity open at both ends Characterized in that it comprises a.

The heat dissipation plate may include a basic heat dissipation body mounted on a rear surface of the circuit board, and a cover heat dissipation body connected to both ends of the basic heat dissipation body to form the cavity.

The heat dissipation plate may further include two compartment heat dissipation bodies extending from the basic heat dissipation body and connected to the cover heat dissipation body, and the cavity may be divided into left, center, and right cavities respectively by the two compartment heat dissipation body. It is characterized by.

In addition, the central cavity is characterized in that the power supply for supplying power to the circuit board is provided.

In addition, the heat sink is characterized in that the plurality of heat radiation fins are formed to protrude.

In addition, the light emitting diode lamp according to the invention is characterized in that the heat dissipation device of the circuit board, the light emitting diode is mounted on the front surface of the circuit board.

In addition, the lighting apparatus according to the present invention includes the light emitting diode lamp, and the light emitting diode lamp is mounted so that the cavity is inclined with respect to a horizontal plane.

According to the present invention having the configuration as described above, by forming a cavity wrapped around the base heat sink body with a cover heat sink body and mounting the heat dissipation device so that the cavity is inclined with respect to the horizontal plane, and excellent heat dissipation efficiency, LED life, illuminance, brightness deterioration Can be minimized.

When the present inventors refer to the data obtained by the experiment to prove this, it can be seen that the temperature rises to about 68 ° in the case of the conventional heat dissipation device while the temperature rises to about 46.6 ° in the case of the present invention. Thus, it can be seen that the present invention maintains the temperature as low as approximately 21 ° when compared with the conventional invention.

In addition, as a result of the roughness experiment of the present invention and the conventional invention it can be seen that the present invention is approximately 225 (Lux) higher than the conventional invention. Therefore, the present invention can minimize degradation of durability, illuminance and brightness of the light emitting diode.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

3 and 4, the heat dissipation device of the circuit board according to the present invention includes a heat sink (110).

The heat sink 110 is provided with a basic heat sink body 120.

The center of the basic heat sink 120 is in the form of a flat plate, both sides are formed to be inclined downward with respect to the center of the basic heat sink 120. A plurality of heat sink fins 160 protrude from the basic heat sink body 120.

The basic heat sink 120 is mounted with a circuit board 111 on which electronic components and the like are mounted.

Heat generated from the circuit board 111 is conducted to the basic heat sink body 120 to radiate heat into the atmosphere. In this case, the heat dissipation fin 160 may be mounted on the basic heat dissipation plate 120, and the heat dissipation fin 160 may increase the contact area with the air to improve heat dissipation efficiency.

The cover heat sink body 130 is connected to the basic heat sink body 120 so that the cavity 150 is formed in a tunnel form. The heat dissipation fin 160 is formed to protrude from the cover heat sink 130.

The partition heat sink 140 is extended from the basic heat sink 120 and connected to the cover heat sink 130, and is provided with one or more. For example, as illustrated in FIG. 4, one partition heat sink 140 may be provided on both sides of the basic heat sink 120. A plurality of heat sink fins 160 are also formed to protrude from the partition heat sink body 140.

Heat from the circuit board 111 is not conducted only to the basic heat sink body 120, but heat is conducted to the entire heat sink 110. That is, heat is conducted to the cover heat dissipation body 130, the compartment heat dissipation body 140, and the heat dissipation fins 160 through the basic heat dissipation body 120.

The cavity 150 is divided into a left cavity 152, a central cavity 156, and a right cavity 154 by the partition heat sink 140, and a circuit board is provided in the central cavity 156. A power supply unit 159 for supplying power to the 111 is provided. As shown in FIG. 3, the cavity 150 penetrates through the heat sink 110 and is open at both ends.

7 shows a light emitting diode lamp according to the present invention in which a plurality of light emitting diodes 170 are mounted on a front surface of the circuit board 111.

8 illustrates a lighting apparatus in which the light emitting diode lamp according to the present invention is mounted to be inclined with respect to a horizontal plane. As shown in FIG. 8, when the heat sink 110 is inclined with respect to the horizontal plane (as a result, the cavity 150 is inclined with respect to the horizontal plane), the heat sink 110 is mounted on the support 180 to increase the heat radiation efficiency. have.

That is, the reason why the cavity 150 is formed by attaching the cover heat sink 130 to the basic heat sink 120 and the cavity 150 is inclined with respect to the horizontal plane is because of the hot air in the cavity 150 due to convection. This is to increase the fluidity.

In detail, when the heat conducted from each of the heat radiation fins 160 is radiated to the cavity 150, the heat radiated by the convection phenomenon moves upward from the bottom of the cavity 150.

In this case, since the cavity 150 is formed using the cover heat sink 130 in the present invention, the fluidity of the air is relatively increased as compared with the conventional heat sink without the cover heat sink 130.

This is related to Newton's law of cooling as follows.

For reference, if Newton's law of cooling is expressed as a formula,

dT / dt = -k (T-S)

Where T is the temperature of the object, S is the temperature around the object, and k is a constant obtained as the initial condition.

When this is applied, the temperature reduction rate (heat dissipation rate) of the circuit board 111 is proportional to the temperature difference between the temperature of the circuit board 111 and the cavity 150. In the present invention, due to the increased air flow in the cavity 150, an atmosphere at a temperature lower than the air temperature in the cavity 150 enters the cavity 150 quickly. Therefore, since the air in the cavity 150 quickly cools and the temperature difference between the temperature of the circuit board 111 and the temperature of the cavity 150 is maintained relatively larger than before, the temperature decrease rate of the circuit board 111 is It is relatively faster.

In order to prove this, the inventor of the present invention performed an experiment comparing with the heat dissipation device 110 of the circuit board 111 and the heat dissipation device of the conventional circuit board according to the present invention.

For reference, the test conditions used were circuit boards equipped with the same number of light emitting diodes (LEDs), and the heat dissipation area of the heat sink was formed to be the same, and the change of temperature and illuminance was measured while the ambient temperature was also formed to be the same. It was. In addition, the conventional heat dissipation device and the heat dissipation device are arranged to be equally inclined at a predetermined angle with respect to the horizontal plane.

Table 1

5 and 6 are graphs showing the experimental results of [Table 1].

As shown in FIG. 5, when looking at the temperature change with time, the temperature of the conventional heat sink is increased to approximately 68 ° after 20 hours, whereas the temperature of the heat sink of this embodiment is increased to 46.6 ° after 20 hours. Able to know. Therefore, when comparing the heat sink of the present embodiment with the heat sink of the present embodiment, it can be seen that the heat sink of this embodiment is about 21 ° lower than the conventional invention. In other words, the present embodiment is approximately 21 ° lower than the conventional heat dissipation efficiency than the conventional heat sink is proved through the experimental results.

In addition, as shown in FIG. 6, when the illumination intensity of the light emitting diode is changed over time, after 23 hours from the first measurement time, the light emitting diode mounted on the heat sink is approximately 3260 (Lux) to 2936 (Lux). While 324 (lux) is reduced, it can be seen that the light emitting diode mounted on the heat sink of this embodiment is only about 200 (lux) reduced from 3360 (Lux) to 3161 (Lux). That is, it was found that the light intensity change of the light emitting diode mounted on the heat sink of the present embodiment is small.

Therefore, the heat dissipation plate of the present embodiment has a higher heat dissipation efficiency than the conventional heat dissipation plate. Thus, it is proved through the experimental result that the heat dissipation plate has an excellent effect in preventing degradation of the light emitting diode roughness.

1 is a perspective view showing a conventional heat dissipation device.

2 is a cross-sectional view of the heat dissipation device of FIG. 1.

3 is a perspective view showing a heat radiation device of the circuit board according to the present invention.

4 is a cross-sectional view II-II of the heat dissipation device of the circuit board according to the present invention.

5 and 6 are graphs showing the results of experimenting with the heat dissipation device of the conventional circuit board and the heat dissipation device of the circuit board according to the present invention.

7 is a perspective view showing a light emitting diode lamp according to the present invention.

8 is a side view showing a lighting apparatus according to the present invention.

<Explanation of symbols for the main parts of the drawings>

110: heat sink 120: basic heat sink

130: cover heat sink body 140: compartment heat sink body

160: heat radiation fins

Claims (7)

In a device for dissipating heat of a circuit board, A heat sink mounted on a rear surface of the circuit board and having a cavity formed at both ends thereof; The heat sink is a heat dissipation device of a circuit board having a basic heat sink body mounted on the rear of the circuit board and a cover heat sink body connected to both ends of the basic heat sink body to form the cavity. delete In claim 1, The heat sink further includes two compartment heat sink bodies extending from the basic heat sink body and connected to the cover heat sink body, wherein the cavity is divided into left, center, and right cavity parts by the two compartment heat sink bodies, respectively. Radiator. 4. The method of claim 3, And a power supply unit for supplying power to the circuit board in the central cavity. The method of claim 1 or 3, The heat dissipation device of the circuit board is formed with a plurality of heat dissipation fins protruding from the heat sink. A light emitting diode lamp comprising a heat dissipation device of a circuit board according to any one of claims 1, 3, and 4, wherein a light emitting diode is mounted on a front surface of the circuit board. An illumination device comprising the light emitting diode lamp according to claim 6, wherein the light emitting diode lamp is mounted such that the cavity is inclined with respect to a horizontal plane.

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