KR101003651B1 - Liquid crystal display device and fabricating method thereof - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display device capable of removing an unfilled liquid crystal region and a method of manufacturing the same. An image display unit formed with pixels of the gate line, a gate TCP having a first gate signal transmission line electrically connected to one side of the gate line, mounted with a gate driver IC, and electrically connected to the gate driver IC, and the data line A data TCP electrically connected to one side of the data driver IC, a data driver IC mounted thereon, and a second gate signal transmission line electrically connected to the data driver IC; and data supplying image information and a gate control signal to the data TCP. A PCB formed on the first substrate and electrically connecting the first gate signal transmission line and the second gate signal transmission line to the data PCB. And a dummy column spacer formed along the periphery of the image display unit and a LOG wiring for supplying the gate control signal supplied to the gate TCP through the first gate signal transmission wiring. Provided is a liquid crystal display device in which 1LOG wiring is formed of a transparent electrode pattern.

Description

Liquid crystal display and its manufacturing method {LIQUID CRYSTAL DISPLAY DEVICE AND FABRICATING METHOD THEREOF}

1 is a cross-sectional view of a conventional liquid crystal display device.

2 is a view showing a part of a liquid crystal display device according to the present invention;

3 is a cross-sectional view taken along line II ′ of FIG. 2;

4A to 4D show a manufacturing process of the liquid crystal display according to the present invention, showing a process cross section taken along the line II ′ of FIG. 2.

*** Explanation of symbols for main parts of drawing ***

113,213: gate insulating film 115,215: protective film

123,223: dummy column spacer 137,237: 1LOG wiring

137a: first gate signal transmission wiring 137b: second gate signal transmission wiring

138,238: 2nd LOG wiring 138a, 238a: 1st contact hole

138b and 238b: Second contact hole 150: Data PCB

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display device, and more particularly, to liquid crystal filling, which is caused by a step of line on glass (LOG) wirings mounted on a liquid crystal display panel when the liquid crystal layer is formed by a dropping method. The present invention relates to a liquid crystal display device capable of preventing the generation of regions.

In general, a liquid crystal display device displays a desired image by individually supplying data signals according to image information to liquid crystal cells arranged in a matrix form, and adjusting a light transmittance of the liquid crystal cells. to be.

Accordingly, a liquid crystal display device includes a liquid crystal display panel in which liquid crystal cells in pixel units are arranged in a matrix form; And a driving circuit for driving the liquid crystal cells.

The liquid crystal display panel includes a color filter substrate and a thin film transistor array substrate, which face each other at a predetermined interval, and are spaced apart from each other by the color filter substrate and the thin film transistor array substrate. It consists of.

The driving circuit includes a gate driver for supplying a scan signal to the liquid crystal display panel and a data driver for supplying image information. The gate driver and the data driver are integrated into a plurality of integrated circuits (ICs). .

The data driver ICs and the gate driver ICs are respectively mounted on a tape carrier package (TCP) and connected to a liquid crystal display panel using a tap automated bonding (TAB) method or chip on glass. chip on glass (hereinafter referred to as COG) is mounted on the liquid crystal display panel.                         

The data driver ICs and gate driver ICs mounted on the TCP and connected to the liquid crystal display panel in a tab manner are input from the outside through signal lines mounted on a printed circuit board (PCB) connected to the TCP. Control signals are supplied.

Meanwhile, data driver ICs and gate driver ICs mounted on the liquid crystal display panel using the COG method are externally connected through line on glass (LOG) wires mounted on the thin film transistor array substrate of the liquid crystal display panel. Input control signals are supplied. Recently, even when the data driver ICs or the gate driver ICs are connected to the liquid crystal display panel in a tap method, a technique for removing PCBs by mounting LOG wirings on the liquid crystal display panel is provided. With the development, the liquid crystal display device can be further thinned.

In particular, the gate PCB is removed by mounting LOG wirings on the liquid crystal display panel for gate driving ICs requiring fewer signals than the data driving ICs.

In the liquid crystal display device configured as described above, the liquid crystal is not filled in the corner region due to the step of the LOG wiring.

In more detail, as the liquid crystal display panel is enlarged, in order to overcome the disadvantages of the liquid crystal dipping method or the liquid crystal vacuum injection method and the liquid crystal injection method, a liquid crystal layer forming method using the liquid crystal dropping method is proposed. It is proposed recently. The liquid crystal dropping method does not inject the liquid crystal by the pressure difference between the inside and the outside of the panel, but directly drops and dispenses the liquid crystal onto the substrate, and uniformly spreads the liquid crystal dropped by the bonding pressure of the panel. The liquid crystal layer is formed by distribution. The liquid crystal dropping method has an advantage in that the liquid crystal layer of the large area liquid crystal display device can proceed very quickly because the liquid crystal is directly dropped on the substrate for a short time.

On the other hand, when the panel is bonded together, the bubbles remaining inside the panel must be effectively discharged to uniformly form the liquid crystal layer throughout the panel.

However, when the LOG wiring is formed on the liquid crystal display panel, bubbles may not be properly released due to the step of the LOG wiring.

1 is a cross-sectional view of a liquid crystal panel in which a corner region of the liquid crystal display panel passes, in particular, a LOG wiring. As shown in the drawing, the liquid crystal display panel 1 includes a first substrate 10 and a second substrate 20; And a liquid crystal layer 30 filled therebetween. In addition, they may be divided into an image display unit displaying an actual image and a dummy unit not displaying an image. A black matrix 21 is formed along the image display unit, and a dummy column spacer 23 is formed on the black matrix 21. Is formed. The dummy column spacer 23 is formed to prevent the liquid crystal from being contaminated, and a column spacer for maintaining a cell gap is also formed in the image display unit.

In addition, although not shown in detail in the drawings, a plurality of gate lines and data lines are formed to cross each other in the image display part of the first substrate 10, and the pixel includes a thin film transistor and a pixel electrode at an intersection thereof. Are individually provided and arranged in a matrix form.

The liquid crystal layer is formed on the image display unit of the second substrate 20 together with the color filter layers of red, green, and blue colors separated and applied to each pixel by a black matrix, and the pixel electrodes provided in the thin film transistor array substrate 10. The common electrode is formed in the electric field.

Meanwhile, the LOG wiring 21 is formed on the first substrate 10, and the gate insulating film 13 and the protective film 15 are formed on the LOG substrate 11, and the LOG wiring 11 is formed when the gate electrode and the gate line are formed. The dummy column spacer 23 formed in the region corresponding to the LOG wiring 11 is formed on the black matrix 21 of the second transparent substrate 20.

However, when the liquid crystal layer 30 is formed by the dropping method, since the gap between the dummy column spacer 23 and the LOG wiring 11 is very narrow, bubbles cannot be discharged smoothly. Therefore, the liquid crystal moved near the LOG wiring 11 (the arrow shown in the drawing) does not move completely to the edge area, and the liquid crystal returns to the inside of the image display part due to the step of the LOG wiring 11. Will occur.

Accordingly, an object of the present invention is to provide a liquid crystal display device and a method of manufacturing the same, which can eliminate a liquid crystal unfilled region of a liquid crystal display panel.

According to an aspect of the present invention, there is provided an image display unit including a plurality of pixels formed by first and second substrates, data lines and gate lines arranged vertically and horizontally on the first substrate, and the gate line. A gate TCP electrically connected to one side of the gate driver, a gate driver IC mounted thereon, and a first gate signal transmission line electrically connected to the gate driver IC, and electrically connected to one side of the data line; And a data TCP having a second gate signal transmission wiring electrically connected to the data driver IC, a data PCB for supplying image information and a gate control signal to the data TCP, and a first PCB formed on the first substrate. And electrically connecting the first gate signal transmission line and the second gate signal transmission line, and applying a gate control signal supplied from the data PCB to a first gate. A liquid crystal display comprising a LOG wiring for supplying a gate TCP through a signal transmission wiring, and a dummy column spacer formed along the periphery of the image display unit, wherein a first LOG wiring in a region corresponding to the dummy column spacer is formed of a transparent electrode pattern. Provide a display device.

In this case, the second LOG wiring except for the region corresponding to the dummy column spacer is formed of a gate electrode material, and further includes a gate insulating film and a protective film formed on the second LOG wiring. The transparent column pattern corresponding to the dummy column spacer (the first LOG wiring) is formed on the passivation layer and is connected to the second LOG wiring through the gate insulating layer and the first and second contact holes formed on the passivation layer.

The second substrate includes a color filter formed on the image display unit, a black matrix formed along the outer edge of the image display unit, and a dummy column spacer formed on the black matrix.                     

In addition, according to the present invention, first and second substrates having an image display unit defined therein, and dummy column spacers formed along the outer edge of the image display unit, and gate lines formed in the image display unit of the first substrate and arranged in a first direction A gate insulation layer formed on an outer surface of the image display unit of the first substrate and having a region removed from a region corresponding to the dummy column spacer, and a gate insulating layer formed on the entire surface of the first substrate including the gate line and the first LOG line; A data line arranged on a gate insulating film of the image display part in a second direction and forming a plurality of pixels together with the gate line to form an image display part, a protective film formed on an entire surface of the substrate including the data line, and the gate First and second contact holes formed in the insulating film and the protective film to expose a portion of the first LOG wiring, and dummy column spacers through the first and second contact holes. Is constructed by electrically connecting the first wiring 1LOG remove the corresponding region including the first wiring 2LOG.

And a gate TCP electrically connected to one side of the gate line, a gate driver IC mounted thereon, and a first gate signal transmission line electrically connected to the gate driver IC, and electrically connected to one side of the data line. And a data driver IC mounted thereon, electrically connected to the data driver IC, and further comprising a second gate signal transmission wiring electrically connected to the first gate signal transmission wiring through first and second LOG wiring. .

And a black matrix formed on the edge of the image display part of the second substrate, wherein the dummy column spacer is formed on the black matrix.

In addition, the present invention includes preparing a first and a second substrate, forming a gate line and a first LOG wiring arranged in a first direction on the first substrate, the first LOG wiring and a gate line Forming a gate insulating film on an entire surface of the first substrate, forming a data line arranged in a second direction on the gate insulating film, and forming a plurality of pixels together with the gate line to form an image display unit; Forming a protective film on the entire surface of the substrate including the data line, patterning the gate insulating film and the protective film to form first and second contact holes exposing the first LOG wiring, and an image of the first substrate Forming a pixel electrode on the display unit, forming a second LOG wiring electrically connecting the first LOG wiring through the first contact hole and the second contact hole, and other than the image display unit of the first substrate; Forming a dummy column spacer on the edge, dropping the liquid crystal onto any one of the first and second substrates, and bonding the first and second substrates together to form an image display unit of the first and second substrates. A liquid crystal layer is formed over the entire surface of the liquid crystal layer, and a bubble between the first and second substrates is discharged through a spaced area between the second LOG wiring and the dummy column spacer.

As described above, the present invention forms a LOG wiring passing through the region where the dummy column spacer is formed by the transparent electrode pattern, and increases the separation space of the region, thereby creating a passage through which bubbles can normally escape when forming the liquid crystal layer. Accordingly, the liquid crystal unfilled region can be removed. That is, in general, the LOG wiring is formed of a gate electrode material, but the transparent electrode pattern is formed together in the pixel electrode forming process in the region where the dummy column spacer is formed, and is about 1/5 the thickness of the gate electrode material. Have                     

Accordingly, the separation space as much as the thickness of the LOG wiring in the dummy column spacer region is reduced as compared with the conventional art. When the liquid crystal layer is formed by the dropping method, bubbles can be smoothly discharged through the separation region. Therefore, the liquid crystal unfilled region can be removed.

Hereinafter, the liquid crystal display device according to the present invention will be described in more detail with reference to the accompanying drawings.

FIG. 2 schematically shows a liquid crystal display device according to the present invention, and in particular, shows a part of the corner region of the liquid crystal display panel.

As shown in the figure, the liquid crystal display device 100 includes a plurality of data TCPs 130 connected between the liquid crystal display panel 100a and one long side of the liquid crystal display panel 100a and the data PCB 150. and; A plurality of gate TCPs 140 connected to one side of the liquid crystal display panel 100a; Data driver ICs 135 mounted on the data TCPs 130, respectively; The gate driver ICs 145 are respectively mounted on the gate TCPs 140.

The liquid crystal display panel 100a is formed by opposing the thin film transistor array substrate 110 and the color filter substrate 120 to face each other at predetermined intervals, and a liquid crystal layer (not shown) is formed at the intervals therebetween. do.

One short side and one long side of the thin film transistor array substrate 110 protrude from the color filter substrate 120, and a gate pad portion and a data pad portion are provided in the protruding region of the thin film transistor array substrate 110. In addition, an image display unit 121 in which pixels are arranged in a matrix form is provided in an area where the thin film transistor array substrate 110 and the color filter substrate 120 face each other.

A plurality of gate lines are horizontally arranged in the thin film transistor array substrate 110 of the image display unit 121 and connected to the gate pad unit, and a plurality of data lines are vertically arranged and connected to the data pad unit. Accordingly, the gate lines and the data lines cross each other, and pixels having the thin film transistor and the pixel electrode at the intersection thereof are separately provided and arranged in a matrix form.

The color filter substrate 120 of the image display unit has a red, green, and blue color filter layer separated and applied to each pixel by a black matrix and a pixel electrode provided in the thin film transistor array substrate 110 together with an electric field in the liquid crystal layer. A common electrode is formed.

In addition, a column column spacer (not shown) is formed in the image display unit 121 to maintain a cell gap, and a dummy column column spacer 123 is formed inside the seal pattern 125 in the dummy region outside the image display unit. . In addition, another black matrix (not shown) is formed on the color filter substrate 120 corresponding to the dummy column spacer 123. The seal pattern 125 bonds the thin film transistor array substrate 110 and the color filter substrate 120, and the dummy column spacer 123 serves to prevent the liquid crystal from being contaminated by the seal pattern 125. do.

Meanwhile, the gate pad part and the data pad part provided in the protruding area of the thin film transistor array substrate 110 are formed to correspond to the image display part 121, and one side short side and one long side of the thin film transistor array substrate 110 are provided. LOG wirings 137 are formed in the corner region B at the corner region where the control signals and the driving voltages are supplied to the gate driver ICs 140.

The data TCP 130 is provided with input pads 130a and output pads 130b electrically connected to the data driver IC 135.

The input pads 130a of the data TCP 130 are electrically connected to the data PCB 150, and the output pads 130b are electrically connected to the data pad portion of the thin film transistor array substrate 110.

In particular, the first data TCP 130 is further formed with a first gate transmission wiring 137a electrically connected to the LOG wirings 137 mounted on the thin film transistor array substrate 110. The first gate transfer wiring 137a transmits gate control signals and gate driving voltages supplied from the timing controller and the power supply unit to the LOG wirings 137 via the data PCB 150.

The data driver ICs 135 convert image information, which is a digital signal, into an analog signal and supply the same to the data lines of the liquid crystal display panel 100a.

Meanwhile, gate driver ICs 145 are mounted on the gate TCP 140, and second gate signal transfer wirings 130b and output pads 140a electrically connected to the gate driver ICs 145 are formed. do.

The second gate signal transmission wirings 137b are electrically connected to the first gate signal transmission wirings 137a by a LOG wiring 137 mounted on the thin film transistor array substrate 110, and the output pads 140a may be electrically connected to the first gate signal transmission wirings 137a. It is electrically connected to the gate pad portion of the thin film transistor array substrate 110.

The gate driver ICs 145 scan signals, that is, gates in response to gate control signals and gate driving voltages applied through the LOG wirings 137 and the first and second gate signal transmission wirings 137a and 137b. The high voltage signal Vgh is sequentially supplied to the gate lines. In addition, the gate driver ICs 145 supply the gate low voltage signal Vgl to the gate lines when the gate high voltage signal Vgh is not supplied.

On the other hand, the LOG wirings 137 are normally supplied from a power supply such as a gate high voltage signal Vgh, a gate low voltage signal Vgl, a common voltage signal Vcom, a ground signal GND, and a power voltage signal Vdd. The DC voltage signals and the gate control signals supplied from the timing controller such as the gate start pulse GSP, the gate shift clock GSC, and the gate enable signal GOE are separately supplied.

The LOG wirings 137 as described above are patterned and formed simultaneously in the process of forming gate lines and gate electrodes on the thin film transistor array substrate 110. However, the LOG wiring 138 passing through the dummy column spacer 123 is formed of a transparent electrode pattern. Hereinafter, for convenience of explanation, the LOG wiring 137 formed of a region except for the dummy column spacer 123, that is, the gate electrode material is referred to as a first LOG wiring, and the LOG wiring of the transparent electrode pattern passing through the dummy column spacer 123 is provided. Reference numeral 138 is referred to as the second LOG wiring.

The second LOG wiring 138 electrically connects the first LOG wiring 137 removed from the dummy column spacer 123, and particularly, the first and second contact holes exposing one side of the first LOG wiring 137. Connection via 138a, 138b.                     

On the other hand, the first LOG wiring 137 is formed of a gate electrode material such as Mo / AlNd, has a thickness of about 2500Å or more, the second LOG wiring 138 is formed of a transparent conductive material such as ITO or IZO, It has a thickness of about 400Å or less.

Therefore, since the thickness of the second LOG wiring 138 corresponding to the dummy column spacer 123 is reduced by about 2000 mm, the thin film transistor array substrate 110 and the dummy column on which the second LOG wiring 138 is formed are reduced. The separation distance between the color filter substrates 120 on which the spacers 123 are formed increases. Therefore, when the liquid crystal layer is formed by the dropping method, since bubbles can be smoothly escaped through the separation region, the liquid crystal is also applied to the corner region B of the liquid crystal display panel 100a in which the liquid crystal unfilled region has conventionally occurred. The layer can be formed normally.

That is, as shown in the enlarged view of the corner region B of the liquid crystal display panel 100a, the second LOG wiring 138 passing through the dummy column spacer 123 is formed of the first and second contact holes 138a and 138b. The first LOG wiring 137, which is partially removed from the dummy column spacer 123 region, is electrically connected to each other.

3 is a cross-sectional view taken along line II ′ in the enlarged view of FIG. 2. As shown in the drawing, a first LOG wiring 137 is formed on a first substrate 110 ′, and the first LOG wiring ( The gate insulating layer 113 and the passivation layer 115 are stacked on the entire surface of the first substrate 110 ′ including the 137.

Meanwhile, a black matrix 122 is formed on the second substrate 120 ′ along the outside of the image display unit, and a dummy column spacer 123 is formed on the black matrix 122. At this time, although not shown in the figure, a column spacer for maintaining a cell gap is formed in the image display unit.

A second LOG wiring 138 connecting the first LOG wiring 137 is formed on the first substrate 110 ′ corresponding to the dummy column spacer 123, and the first LOG wiring 137 is formed as a gate insulating layer. By removing the portion 113 and the passivation layer 115, the first LOG wiring 137 is connected through the first and second contact holes 138a and 138b exposing a portion of the first LOG wiring 137.

As mentioned above, the first LOG wiring 137 is formed together when the gate electrode and the gate line are formed, and the second LOG wiring 138 is formed together when the pixel electrode or the gate pad and the data pad are formed. The process for forming the wiring 138 is not added separately.

4A to 4C show the manufacturing process of the liquid crystal display device according to the present invention, and in particular, show the process cross section of the thin film transistor array substrate of FIG.

First, as shown in FIG. 4A, a transparent first substrate 210 ′ is prepared, and then AlNd, Cu, Ti, Cr, Al, Mo, Ta, Al alloy, etc., are prepared on the first substrate 210 ′. After depositing a metal through a sputtering method, it is patterned to form a first LOG wiring 237. In this case, a gate electrode and a gate line are formed in the image display unit, and a gate pad extending from the gate line is formed together. In this case, the first LOG wiring 237 is formed in a region other than the dummy column spacer region, and a disconnection region of the first LOG wiring 237 is formed in the dummy column spacer region.                     

Subsequently, as shown in FIG. 4B, SiNx, SiOx, or the like is deposited on the entire surface of the first substrate 210 ′ including the first LOG wiring 237 and the gate line by plasma CVD to form a gate insulating film 213. To form.

Next, although not shown in the drawing, after forming a semiconductor layer on the gate electrode of the image display unit, the source / drain electrodes on the semiconductor layer, the data line crossing the gate line and the data line Form an extended data pad. In this case, a plurality of pixels are defined by the gate line and the data line, and the plurality of pixels form an image display unit.

Subsequently, a passivation layer 215 is formed on the entire surface of the substrate including the data line (not shown). In this case, since no data material is formed in the corner region of the liquid crystal display panel, the passivation layer 215 is formed on the gate insulating layer 213.

Subsequently, as shown in FIG. 4C, a portion of the gate insulating layer 213 and a passivation layer 215 is removed to expose a portion of the first LOG wiring 237 and the first contact hole 238a and the second contact. The hole 238b is formed. In this case, a gate contact hole and a data contact hole exposing the gate pad and the data pad are also formed.

Next, as illustrated in FIG. 4D, a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO) is deposited on the entire surface of the passivation layer 215, and then patterned. The second LOG wiring 238 may be formed to electrically connect the first LOG wiring 237 removed from the dummy column spacer region through the contact holes 238a and 238b. In this case, a pixel electrode is formed in the image display unit, and a transparent electrode pattern connected to each other through the gate contact hole and the data contact hole is formed on the gate pad and the data pad. The transparent electrode pattern is formed to be connected to an external driving circuit, and in particular, is connected to a gate TCP and a data TCP.

As described above, the present invention can reduce the LOG wiring step in this area by forming the LOG wiring passing through the dummy column spacer area formed outside the image display part in a transparent pattern such as ITO. Therefore, the basic concept of the present invention is to increase the cell gap of this area by reducing the thickness of the LOG wiring passing through the dummy column spacer. This increase in the cell gap allows the bubbles in the image display unit to be smoothly discharged to the dummy portion when the liquid crystal layer is formed by the dropping method, thereby preventing the liquid crystal unfilled region from occurring.

In addition, the embodiment of the present invention provides a liquid crystal display device in which a pixel electrode and a common electrode are formed on different substrates, but the present invention may be applied to a liquid crystal display device in which the pixel electrode and the common electrode are formed on the same substrate. It is possible to include all the liquid crystal display devices where the LOG wiring passes through the dummy column spacer.

As described above, according to the present invention, in the liquid crystal display device having a dummy column spacer formed on the outer edge of the image display unit of the liquid crystal display panel, and having a LOG wiring passing through the dummy column spacer, the separation between the dummy column spacer and the LOG wiring. By increasing the distance, bubbles remaining in the image display part can be effectively escaped when forming the liquid crystal layer by the dropping method, thereby removing the liquid crystal unfilled region.                     

Therefore, there is an effect of eliminating image quality defects occurring in the liquid crystal unfilled region, and the effect of improving the image quality of the liquid crystal display panel.

Claims (10)

First and second substrates; An image display unit on which the plurality of pixels are formed by data lines and gate lines arranged vertically and horizontally on the first substrate; A gate TCP electrically connected to one side of the gate line, having a gate driver IC mounted thereon, and having a first gate signal transmission wiring electrically connected to the gate driver IC; A data TCP electrically connected to one side of the data line, having a data driver IC mounted thereon, and having a second gate signal transmission wiring electrically connected to the data driver IC; A data PCB for supplying image information and a gate control signal to the data TCP; A gate control signal formed on the first substrate and electrically connecting the first gate signal transmission line and the second gate signal transmission line to the gate TCP through the first gate signal transmission line. LOG wiring to supply; And And a dummy column spacer formed along the periphery of the image display unit, wherein the first LOG wiring of a region corresponding to the dummy column spacer is formed of a transparent electrode pattern. The liquid crystal display of claim 1, wherein the second LOG wiring except for a region corresponding to the dummy column spacer is formed of a gate electrode material. The liquid crystal display device according to claim 2, further comprising a gate insulating film and a protective film formed on the second LOG wiring. 4. The second LOG wiring of claim 3, wherein the transparent electrode pattern corresponding to the dummy column spacer is formed on the passivation layer, and the first and second contact holes are formed on the gate insulating layer and the passivation layer. Liquid crystal display, characterized in that connected. The method of claim 1, wherein the second substrate, A color filter formed in the image display unit; A black matrix formed along the outer edge of the image display unit; And And a dummy column spacer formed on the black matrix. First and second substrates having an image display unit defined therein, and dummy column spacers formed along an outer edge of the image display unit; A gate line formed in the image display part of the first substrate and arranged in the first direction; A first LOG wiring formed outside the image display part of the first substrate, wherein a region corresponding to the dummy column spacer is removed; A gate insulating film formed on an entire surface of the first substrate including the gate line and the first LOG wiring; A data line arranged in a second direction on the gate insulating film of the image display unit and forming a plurality of pixels together with the gate line to form an image display unit; A protective film formed on an entire surface of the substrate including the data line; First and second contact holes formed in the gate insulating layer and the passivation layer to expose a portion of the first LOG wiring; And a second LOG wiring electrically connecting the first LOG wiring removed to the area corresponding to the dummy column spacer through the first and second contact holes. The method of claim 6, A gate TCP electrically connected to one side of the gate line, having a gate driver IC mounted thereon, and having a first gate signal transmission wiring electrically connected to the gate driver IC; A second gate electrically connected to one side of the data line, mounted with a data driver IC, electrically connected to the data driver IC, and electrically connected to the first gate signal transmission wiring through first and second LOG wiring; The liquid crystal display device further comprises a signal transmission wiring. The liquid crystal display of claim 6, further comprising a black matrix formed on the edge of the image display part of the second substrate, wherein the dummy column spacer is formed on the black matrix. Preparing first and second substrates; Forming a gate line and a first LOG line arranged in a first direction on the first substrate; Forming a gate insulating film on an entire surface of the first substrate including the first LOG wiring and the gate line; Forming a data line on the gate insulating layer in a second direction and forming a plurality of pixels together with the gate line to form an image display unit; Forming a protective film on an entire surface of the substrate including the data line; Patterning the gate insulating layer and the passivation layer to form first and second contact holes exposing the first LOG wiring; Forming a pixel electrode on an image display unit of the first substrate, and forming a second LOG wiring electrically connecting a first LOG wiring through the first contact hole and the second contact hole; Forming a dummy column spacer on an outside of the image display unit of the first substrate; Dropping liquid crystal onto either the first substrate or the second substrate; And The first substrate and the second substrate are bonded to each other to form a liquid crystal layer over the entire surface of the image display part of the first and second substrates, and through the spaced area between the second LOG wiring and the dummy column spacer, the first and second substrates. Method of manufacturing a liquid crystal display device characterized in that the bubbles between the discharge. The method of claim 9, wherein the second LOG wiring is formed of a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO).

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